CN111240384B - Scaling powder adjusting device and method - Google Patents

Scaling powder adjusting device and method Download PDF

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Publication number
CN111240384B
CN111240384B CN202010129287.3A CN202010129287A CN111240384B CN 111240384 B CN111240384 B CN 111240384B CN 202010129287 A CN202010129287 A CN 202010129287A CN 111240384 B CN111240384 B CN 111240384B
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concentration
soaking
tank
solder strip
solution
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CN111240384A (en
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张超
许光
李志远
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JA Xingtai Solar Co Ltd
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JA Xingtai Solar Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/082Flux dispensers; Apparatus for applying flux

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

The invention provides a scaling powder adjusting device and method. Wherein, scaling powder adjusting equipment is arranged in adjusting the scaling powder concentration that contains of soak solution in photovoltaic stringer's solder strip soaking groove, includes: the concentration detection device is used for detecting the measured value of the soldering flux in the solder strip soaking tank in real time; the control device receives a measured value detected by the concentration detection device and sends a control signal according to a comparison result of the measured value and a set concentration range; and the adjusting device is used for diluting or concentrating the soaking solution in the welding strip soaking tank according to the control signal. According to the soldering flux adjusting device, the concentration of the soldering flux can be detected in real time and automatically adjusted, so that shutdown caused by abnormal concentration of the soldering flux is avoided, and cost is saved.

Description

Scaling powder adjusting device and method
Technical Field
The invention relates to the photovoltaic field, in particular to scaling powder adjusting equipment and a scaling powder adjusting method.
Background
The concentration of the scaling powder contained in the soaking liquid in the solder strip soaking tank of the conventional photovoltaic series welding machine is often too high or too low, and the photovoltaic series welding machine is stopped for experimental confirmation after abnormality occurs, so that the photovoltaic series welding machine is stopped for a long time, is easy to cause abnormal enlargement, and wastes of manpower and material resources are caused.
Disclosure of Invention
In view of this, the present invention provides a soldering flux adjusting apparatus and method, which can perform real-time detection and automatic adjustment on the concentration of a soldering flux, thereby avoiding shutdown caused by abnormal concentration of the soldering flux and saving cost.
In order to solve the above technical problem, in one aspect, the present invention provides a scaling powder adjusting device for adjusting a concentration of a scaling powder contained in a soaking solution in a solder strip soaking tank of a photovoltaic series welding machine, including:
the concentration detection device is used for detecting the measured value of the soldering flux in the solder strip soaking tank in real time;
the control device receives a measured value detected by the concentration detection device and sends a control signal according to a comparison result of the measured value and a set concentration range;
and the adjusting device is used for diluting or concentrating the soaking solution in the welding strip soaking tank according to the control signal.
Further, the control device includes:
the comparator is used for comparing the measured value with the set concentration range to obtain a comparison result;
and the control signal generator is used for generating a corresponding control signal according to the comparison result so as to control the adjusting device to dilute or concentrate.
Further, the adjusting device includes:
a liquid storage tank for storing a soldering flux solution, the liquid storage tank being connected to the solder strip soaking tank through a regulating valve, the liquid storage tank opening or closing the regulating valve according to a control signal of the control device so as to be connected to or disconnected from the solder strip soaking tank,
and the heating device is used for heating or stopping heating the solder strip soaking tank according to the control signal of the control device.
Further, the flux adjusting apparatus further includes:
a liquid level feedback device for generating a liquid level feedback signal according to the liquid level of the soak solution in the solder strip soaking tank,
the control device is also used for controlling the regulating valve to be opened or closed according to the liquid level feedback signal.
Further, the concentration detection device is a densitometer.
Further, the concentration detection device performs automatic calibration every predetermined time.
On the other hand, the invention provides a soldering flux adjusting method for adjusting the soldering flux contained in a soaking solution in a solder strip soaking groove of a photovoltaic series welding machine, which comprises the following steps:
step S1, detecting the concentration of the soldering flux contained in the soaking solution in the solder strip soaking tank to obtain a measured value;
and step S2, comparing the measured value with a set concentration range, and adjusting the flux concentration according to the comparison result.
Further, the step S2 includes:
when the measured value is less than the lower limit value of the set concentration range, concentrating the solution in the solder strip soaking tank to increase the flux concentration,
when the measured value is larger than the upper limit value of the set concentration range, adding a soldering flux solution into the solder strip soaking groove to reduce the soldering flux concentration,
stopping the adjustment when the measured value is within the set temperature range.
Further, the dilution is performed by adding a flux solution to the solder ribbon dipping bath, and the concentration is performed by heating the solder ribbon dipping bath to partially volatilize a solvent.
Further, the flux adjusting method also comprises the following steps:
step S3, detecting the liquid level of the soak solution in the solder strip soaking tank to obtain a measured liquid level;
and step S4, comparing the measured liquid level with a set liquid level range, and determining to add or stop adding the soldering flux solution into the solder strip soaking tank according to the comparison result.
Further, the concentration of the soldering flux contained in the soaking liquid in the solder strip soaking groove is determined by detecting the density in the solder strip soaking groove.
The technical scheme of the invention at least has one of the following beneficial effects:
the scaling powder adjusting equipment comprises a concentration detection device, a control device and an adjusting device, and can detect the concentration of the scaling powder in real time and automatically adjust the concentration of the scaling powder, so that the shutdown caused by abnormal concentration of the scaling powder is avoided, and the cost is saved;
furthermore, the soldering flux adjusting equipment also comprises a liquid level feedback device which can automatically adjust the liquid level of the soaking liquid in the solder strip soaking tank;
furthermore, the concentration detection device performs automatic calibration every preset time, so that the error detection of the concentration of the soldering flux caused by the abnormality of a machine table of the concentration detection device can be avoided.
Drawings
FIG. 1 is a schematic view of a flux conditioning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a flux conditioning apparatus according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method of flux conditioning according to an embodiment of the invention.
Reference numerals:
100. a concentration detection device; 200. a control device; 300. an adjustment device; 310. a liquid storage tank; 320. a heating device; 400. a solder strip soaking tank; 1000. flux adjusting equipment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
Next, a flux adjusting apparatus according to an embodiment of the present invention will be described first with reference to fig. 1.
As shown in fig. 1, a flux adjusting apparatus 1000 according to the present invention for adjusting a flux concentration contained in a dip solution in a solder ribbon dip tank 400 of a photovoltaic stringer includes: concentration detection apparatus 100, control apparatus 200, and adjustment apparatus 300.
The concentration detection device 100 is used for detecting the measured value of the soldering flux in the solder strip soaking tank 400 in real time.
In fact, the soak solution in the solder strip soaking tank 400 continuously volatilizes the solvent due to the higher working temperature, and the concentration of the effective components of the soak solution continuously changes along with the prolonging of the service life, so that the concentration of the effective components is detected and adjusted based on the detection result, the quality stability of the solder strip in the welding process can be maintained, and the yield and the like are improved.
Alternatively, the concentration detection apparatus 100 is a densitometer or the like. The soaking solution mainly comprises the soldering flux and the solvent, so that the soldering flux part is relatively stable, but the solvent part is easy to volatilize, the concentration of the soldering flux in the soaking solution can be measured by detecting the density of the whole soaking solution, and the method is simple, convenient, visual and low in analysis cost.
For example, the detection unit of the concentration detection device 100 is immersed in the dipping solution in the solder ribbon dipping bath 400 to detect the measured value of the flux.
Therefore, the measured value of the soldering flux can be accurately obtained, and a basis is provided for subsequent adjustment of the concentration of the soldering flux.
Preferably, the concentration detection device 100 performs automatic calibration every predetermined time, or the concentration detection device 100 detects that the flux concentration variation value is smaller than a set concentration variation value within a predetermined time (for example, the flux concentration variation value is 0 within 30 minutes), and then an alarm is given to perform detection and confirmation manually.
This can prevent erroneous detection of the flux concentration due to an abnormality (for example, a halt) of the concentration detection device 100.
The control device 200 receives the measured value detected by the concentration detection device 100 and sends out a control signal according to the comparison result of the measured value and the set concentration range;
alternatively, the control device 200 may be a PLC (programmable logic controller) or a one-chip microcomputer based control device 200.
The set concentration range is a concentration range in which the concentration of the soldering flux meets the use requirement, for example, the solder strip is soaked in the soaking solution in the set concentration range, and the subsequent welding has a good effect (for example, after the solder strip is welded with the battery piece, the drawing force is good, and no cold joint exists).
According to some embodiments of the present invention, the control device 200 comprises a comparator and a control signal generator.
The comparator is used for comparing the measured value with a set concentration range to obtain a comparison result;
for example, the PLC is connected to the concentration detecting device 100 and reads the measured value, and the comparator may be integrated in the PLC, that is, the comparator is a PLC main body and a program, and the PLC runs the program, and the PLC can compare the measured value with the set concentration range, thereby obtaining the comparison result.
The comparison result may be that the measured value is in the set concentration range, the measured value is greater than the upper limit value of the set concentration range, and the measured value is less than the lower limit value of the set concentration range.
It should be noted that the above is only an optional example, and the comparator may be integrated in the concentration detection apparatus 100, and the concentration detection apparatus 100 compares the measured value with the set concentration range and sends the comparison result to the control apparatus 200, which should be understood to be within the scope of the present invention.
The control signal generator is used for generating a corresponding control signal according to the comparison result so as to control the adjusting device 300 to dilute or concentrate.
For example, the control signal generator is connected to the adjusting device 300, generates corresponding control signals according to different comparison results, and sends the control signals to the adjusting device 300, so as to control the adjusting device 300 to dilute or concentrate the soaking solution.
The adjusting device 300 dilutes or concentrates the soak solution in the solder strip soaking tank 400 according to the control signal.
According to some embodiments of the present invention, the conditioning device 300 includes a liquid storage tank 310 and a heating device 320.
Wherein the liquid storage tank 310 is used for storing a flux solution, the liquid storage tank 310 is connected to the solder strip dipping bath 400 through a regulating valve (or a flow controller), and the liquid storage tank 310 opens or closes the regulating valve according to a control signal of the control device 200, thereby being connected to or disconnected from the solder strip dipping bath 400.
For example, the control device 200 is connected to the liquid storage tank 310 (which may be the main body of the liquid storage tank 310 or just the regulating valve of the liquid storage tank 310),
when the control device 200 sends a liquid adding control signal (or a control signal for opening the regulating valve) according to the fact that the measured value of the soldering flux is larger than the upper limit of the set concentration range, the liquid storage tank 310 opens the regulating valve according to the liquid adding control signal of the control device 200, so that the liquid storage tank 310 is communicated with the solder strip soaking tank 400, the soldering flux solution in the liquid storage tank 310 flows into the solder strip soaking tank 400, so that the soaking liquid in the solder strip soaking tank 400 is diluted,
when the control device 200 sends out a liquid adding stop control signal (which can also be a control signal for closing the regulating valve) within a set concentration range according to the measured value of the soldering flux, the liquid storage tank 310 closes the regulating valve according to the liquid adding stop control signal of the control device 200.
The heating device 320 is used for heating or stopping heating the solder strip soaking bath 400 according to the control signal of the control device 200.
Alternatively, heating or stopping heating may be achieved by a heating switch or a heating controller of the heating device.
It should be noted that the above is only an optional example, and the heating device 320 may also directly heat the soaking solution (e.g., the heating device 320 is directly placed in the soaking solution), which should be understood to be within the scope of the present invention.
For example, the control device 200 is connected to the heating device 320. The control device 200 may be connected to the main body of the heating device 320, or may be connected to only the heating switch of the heating device 320.
When the measured value of the soldering flux is smaller than the lower limit of the set concentration range, the control device 200 sends a heating control signal (or a heating switch control signal is turned on), and the heating device 320 turns on the heating switch according to the heating control signal of the control device 200, so as to heat the solder strip soaking tank 400, and thus concentrate the soaking solution in the solder strip soaking tank 400.
When the control device 200 sends out the heating stop control signal within the set concentration range according to the measured value of the soldering flux, the heating device 320 turns off the heating switch according to the heating stop control signal of the control device 200.
Therefore, the concentration of the soldering flux can be detected in real time and automatically adjusted, so that the shutdown caused by abnormal concentration of the soldering flux is avoided, and the cost is saved.
According to some embodiments of the present invention, the soldering flux adjusting apparatus 1000 further comprises a liquid level feedback device for generating a liquid level feedback signal according to the liquid level of the soaking liquid in the solder strip soaking tank 400, and the control device 200 is further configured to control the regulating valve to open or close according to the liquid level feedback signal.
Wherein the feedback signal is any one of the measurement liquid level is higher than the upper limit of the set liquid level range, the measurement liquid level is lower than the lower limit of the set liquid level range or the measurement liquid level is in the set liquid level range.
For example, the liquid level feedback device generates a liquid level feedback signal according to the liquid level of the soaking liquid in the solder strip soaking tank 400; the control device 200 controls the regulating valve to open or close according to the liquid level feedback signal, in other words, the control device 200 closes the regulating valve according to the liquid level feedback signal that the measured liquid level is higher than the upper limit of the set liquid level range, so that the soldering flux solution in the liquid storage tank 310 cannot flow into the solder strip soaking tank 400; the control device 200 opens the regulating valve according to the liquid level feedback signal that the measured liquid level is lower than the lower limit of the set liquid level range, so that the soldering flux solution in the liquid storage tank 310 flows into the solder strip dipping tank 400.
From this, can carry out the liquid feeding to welding strip soaking groove 400 automatically, guarantee the liquid level of soak in the soaking groove to improve the soaking effect of welding strip, avoided the soak not enough to lead to welding to take local bad, cause follow-up battery piece and weld the welding between the area unusual.
In addition, the authority of the control device 200 for controlling the opening or closing of the regulating valve according to the liquid level feedback signal can be set to be greater than the authority of the regulating device 300 for diluting the soaking solution in the solder strip soaking tank 400 according to the control signal, namely, the liquid level of the soaking solution in the solder strip soaking tank 400 is preferentially ensured. For example, when the open and close regulator valve signals occur simultaneously (e.g., there is an upper limit for the steep water concentration value to be greater than the set concentration range that requires the regulator valve to be opened and a lower limit for the steep water level to be greater than the set level range that requires the regulator valve to be closed), the regulator valve is closed. At this time, an alarm can be given to remind people to carry out manual treatment.
From this, can carry out the liquid level control of soak solution and the concentration control of scaling powder in coordination, avoid equipment conflict to appear, guarantee that equipment is stable and make the soaking effect of solder strip better.
Referring now to fig. 2, a flux adjusting apparatus 1000 according to an embodiment of the present invention is illustrated.
The flux adjusting apparatus 1000 includes a PLC (control device 200), a liquid storage tank 310, a concentration detecting device 100, and a heating device 320.
The flux adjustment apparatus 1000 operates specifically as follows:
when the concentration detection device 100 detects that the measured value of the soldering flux in the soaking tank is within the set concentration range, the concentration detection device 100 does not respond;
when the concentration detection device 100 detects that the concentration of the soldering flux in the solder strip soaking groove 400 is larger than the upper limit value of the set concentration range, sending an over-high concentration signal to the PLC, receiving the over-high concentration signal of the concentration detection device 100 by the PLC, sending a liquid adding control signal (a control signal for adding a soldering flux solution to the soaking groove) to the liquid storage tank 310, receiving the liquid adding control signal by the liquid storage tank 310, opening the regulating valve, flowing the soldering flux solution into the solder strip soaking groove 400 until the concentration detection device 100 detects that the concentration of the soldering flux in the solder strip soaking groove 400 is within the set concentration range, sending a normal concentration signal to the PLC again, receiving the normal concentration signal by the PLC, sending a liquid adding stop control signal to the liquid storage tank 310, receiving the liquid adding stop control signal by the liquid storage tank 310, and closing the regulating valve;
when the concentration detection device 100 detects that the concentration of the soldering flux in the solder strip soaking tank 400 is smaller than the lower limit value of the set concentration range, a concentration too low signal is sent to the PLC, the PLC receives the concentration too low signal of the concentration detection device 100, and sends a heating control signal (heating the solder strip soaking tank 400) to the liquid storage tank 310, the heating switch is turned on by the heating device 320, and the solder strip soaking tank 400 is heated until the concentration detection device 100 detects that the concentration of the soldering flux in the solder strip soaking tank 400 is within the set concentration range, a concentration normal signal is sent to the PLC again, the PLC receives the concentration normal signal of the concentration detection device 100, and sends a heating stop control signal to the heating device 320, and the heating stop control signal is received by the heating device 320 and the heating switch is turned off.
In addition, the solder strip soaking tank 400 and the liquid storage tank 310 are also integrated with a liquid level feedback device, and the PLC controls the regulating valve of the liquid storage tank to open or close according to a liquid level feedback signal sent by the liquid level feedback device of the solder strip soaking tank 400, so that the liquid storage tank 310 is communicated or disconnected with the solder strip soaking tank 400, and the liquid level of the soaking liquid in the solder strip soaking tank 400 is regulated.
The soldering flux adjusting device 1000 automatically operates in the operation process, the purpose of soldering flux concentration detection and adjustment can be achieved without the participation of manpower, and the problems of long-time shutdown, abnormal amplification, manpower and material resource waste and detection hysteresis caused by abnormal soldering flux concentration are solved.
In addition, as shown in fig. 3, an embodiment of the present invention further provides a method for adjusting a flux, including:
step S1, detecting the concentration of the soldering flux contained in the soaking solution in the solder strip soaking tank to obtain a measured value;
optionally, the concentration of the flux contained in the solder strip soaking bath is determined by detecting the density in the solder strip soaking bath.
And step S2, comparing the measured value with a set concentration range, and adjusting the flux concentration according to the comparison result.
According to some embodiments of the invention, step S2 includes:
when the measured value is less than the lower limit value of the set concentration range, concentrating the solution in the solder strip soaking tank to increase the flux concentration,
optionally, the concentration is performed by heating the solder ribbon soak tank to partially volatilize the solvent.
When the measured value is larger than the upper limit value of the set concentration range, adding a soldering flux solution into the solder strip soaking groove to reduce the soldering flux concentration,
optionally, the diluting is performed by adding a flux solution to the solder ribbon dip tank.
Stopping the adjustment when the measured value is within the set temperature range.
Therefore, the concentration of the soldering flux can be detected in real time and adjusted, the shutdown caused by abnormal concentration of the soldering flux is avoided, and the cost is saved.
According to some embodiments of the invention, the flux conditioning method further comprises:
step S3, detecting the liquid level of the soak solution in the solder strip soaking tank to obtain a measured liquid level;
and step S4, comparing the measured liquid level with a set liquid level range, and determining to add or stop adding the soldering flux solution into the solder strip soaking tank according to the comparison result.
From this, can add or stop adding scaling powder solution to welding strip soaking groove, guarantee the liquid level of soak in the soaking groove to improve the soak effect of welding strip, avoided the soak not enough to lead to welding strip local bad, cause follow-up battery piece and weld the welding between the area unusual.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
The various features, aspects, and advantages of the present invention may also be embodied in the various aspects described in the following clauses, which may be combined in any combination:
1. a scaling powder adjusting device is used for adjusting the concentration of scaling powder contained in a soaking solution in a solder strip soaking tank of a photovoltaic series welding machine, and comprises:
the concentration detection device is used for detecting the measured value of the soldering flux in the solder strip soaking tank in real time;
the control device receives a measured value detected by the concentration detection device and sends a control signal according to a comparison result of the measured value and a set concentration range;
and the adjusting device is used for diluting or concentrating the soaking solution in the welding strip soaking tank according to the control signal.
2. The flux regulating apparatus of clause 1, the control device comprising:
the comparator is used for comparing the measured value with the set concentration range to obtain a comparison result;
and the control signal generator is used for generating a corresponding control signal according to the comparison result so as to control the adjusting device to dilute or concentrate.
3. The flux conditioning apparatus of clause 2, the conditioning device comprising:
a liquid storage tank for storing a soldering flux solution, the liquid storage tank being connected to the solder strip soaking tank through a regulating valve, the liquid storage tank opening or closing the regulating valve according to a control signal of the control device so as to be connected to or disconnected from the solder strip soaking tank,
and the heating device is used for heating or stopping heating the solder strip soaking tank according to the control signal of the control device.
4. The flux conditioning apparatus of clause 2, further comprising:
a liquid level feedback device for generating a liquid level feedback signal according to the liquid level of the soak solution in the solder strip soaking tank,
the control device is also used for controlling the regulating valve to be opened or closed according to the liquid level feedback signal.
5. The flux regulating apparatus of clause 1, wherein the concentration detecting device is a densitometer.
6. The flux adjusting apparatus of clause 5, wherein the concentration detection device is automatically calibrated at predetermined intervals.
7. A scaling powder adjusting method is used for adjusting scaling powder contained in a soaking solution in a solder strip soaking groove of a photovoltaic series welding machine, and comprises the following steps:
step S1, detecting the concentration of the soldering flux contained in the soaking solution in the solder strip soaking tank to obtain a measured value;
and step S2, comparing the measured value with a set concentration range, and adjusting the flux concentration according to the comparison result.
8. The method of flux regulation as defined in clause 7, wherein the step S2 includes:
when the measured value is less than the lower limit value of the set concentration range, concentrating the solution in the solder strip soaking tank to increase the flux concentration,
when the measured value is larger than the upper limit value of the set concentration range, adding a soldering flux solution into the solder strip soaking groove to reduce the soldering flux concentration,
stopping the adjustment when the measured value is within the set temperature range.
9. The flux adjustment method of clause 7, wherein the diluting is performed by adding a flux solution to the solder ribbon dip tank, and the concentrating is performed by heating the solder ribbon dip tank to partially volatilize a solvent.
10. The method of flux regulation of clause 7, further comprising the steps of:
step S3, detecting the liquid level of the soak solution in the solder strip soaking tank to obtain a measured liquid level;
and step S4, comparing the measured liquid level with a set liquid level range, and determining to add or stop adding the soldering flux solution into the solder strip soaking tank according to the comparison result.
11. The method of flux regulation as set forth in clause 7, determining the concentration of flux contained in a soak solution in the solder ribbon soak tank by detecting the density in the solder ribbon soak tank.

Claims (5)

1. The utility model provides a scaling powder adjusting device for adjust the scaling powder concentration that soak solution contained in the solder strip soaking bath of photovoltaic stringer, its characterized in that includes:
the concentration detection device is used for detecting the measured value of the soldering flux in the solder strip soaking tank in real time;
the control device receives a measured value detected by the concentration detection device and sends a control signal according to a comparison result of the measured value and a set concentration range;
the adjusting device is used for diluting or concentrating the soaking liquid in the welding strip soaking tank according to the control signal;
wherein the control device includes:
the comparator is used for comparing the measured value with the set concentration range to obtain a comparison result;
the control signal generator is used for generating a corresponding control signal according to the comparison result so as to control the adjusting device to dilute or concentrate;
the adjusting device comprises:
a liquid storage tank for storing a soldering flux solution, the liquid storage tank being connected to the solder strip soaking tank through a regulating valve, the liquid storage tank opening or closing the regulating valve according to a control signal of the control device so as to be connected to or disconnected from the solder strip soaking tank,
the heating device is used for heating or stopping heating the solder strip soaking groove according to the control signal of the control device, and the soldering flux adjusting equipment further comprises:
a liquid level feedback device for generating a liquid level feedback signal according to the liquid level of the soak solution in the solder strip soaking tank,
the control device is also used for controlling the regulating valve to open or close according to the liquid level feedback signal,
the control device controls the opening or closing authority of the regulating valve to be larger than the authority of the regulating device for diluting the soaking liquid in the welding strip soaking groove according to the control signal according to the liquid level feedback signal.
2. The flux conditioning apparatus of claim 1, wherein said concentration detecting device is a densitometer.
3. The flux conditioning apparatus of claim 2, wherein said concentration detection means is automatically calibrated at predetermined intervals.
4. A scaling powder adjusting method is used for adjusting scaling powder contained in a soaking solution in a solder strip soaking tank of a photovoltaic series welding machine, and is characterized by comprising the following steps:
step S1, detecting the concentration of the soldering flux contained in the soaking solution in the solder strip soaking tank to obtain a measured value;
step S2, comparing the measured value with the set concentration range, adjusting the flux concentration according to the comparison result,
when the measured value is less than the lower limit value of the set concentration range, concentrating the solution in the solder strip soaking tank to increase the flux concentration,
when the measured value is larger than the upper limit value of the set concentration range, adding a soldering flux solution into the solder strip soaking groove to reduce the soldering flux concentration,
stopping the adjusting when the measured value is within the set concentration range;
wherein the dilution is performed by adding a flux solution to the solder ribbon soak tank, and the concentration is performed by heating the solder ribbon soak tank to volatilize a solvent portion;
step S3, detecting the liquid level of the soak solution in the solder strip soaking tank to obtain a measured liquid level;
step S4, comparing the measured liquid level with a set liquid level range, determining to add or stop adding the soldering flux solution into the solder strip soaking tank according to the comparison result,
and setting the permission of stopping adding the soldering flux solution according to the measurement liquid level to be greater than the permission of diluting the soaking solution in the solder strip soaking groove according to the measurement value of the soldering flux.
5. The method of claim 4, wherein the concentration of the flux in the solder ribbon dip tank is determined by detecting the density in the solder ribbon dip tank.
CN202010129287.3A 2020-02-28 2020-02-28 Scaling powder adjusting device and method Active CN111240384B (en)

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