CN111239151A - Method for inspecting adhesive material and method for mounting semiconductor chip - Google Patents
Method for inspecting adhesive material and method for mounting semiconductor chip Download PDFInfo
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- CN111239151A CN111239151A CN201911191083.6A CN201911191083A CN111239151A CN 111239151 A CN111239151 A CN 111239151A CN 201911191083 A CN201911191083 A CN 201911191083A CN 111239151 A CN111239151 A CN 111239151A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/20—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for adding cards, coupons or other inserts to package contents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Mechanical Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention relates to a method for inspecting a sticker and a method for mounting a semiconductor wafer. A method for inspecting a pasted material and a method for incorporating a semiconductor wafer are provided, which can accurately judge whether or not the pasted material pasted to a wafer transport container accommodating a semiconductor wafer is pasted to a surface to be pasted, compared with the conventional method. The method is a method for inspecting whether or not a sticking object of a transparent wafer transport container is stuck to a surface to be stuck, the transparent wafer transport container being a container for storing and transporting a plurality of semiconductor wafers, the method comprising: an imaging step (step S11) of imaging at least the surface to be bonded of the wafer transport container under low illumination; an image processing step (step S12) of performing at least binarization processing on the obtained image; and a determination step (step S13) of determining whether or not the pasted material is pasted on the surface to be pasted, based on the image subjected to at least the binarization processing.
Description
Technical Field
The present invention relates to a method for inspecting a sticker and a method for mounting a semiconductor wafer.
Background
When manufactured semiconductor wafers such as silicon wafers are shipped and transported, a FOSB (Front Opening Shipping Box) is known as a wafer transport container for storing the semiconductor wafers (see, for example, patent documents 1 to 3). FOSB was standardized by SEMI specification M31.
FIG. 1 is an exploded perspective view showing an example of a conventional FOSB. The FOSB100 shown in the figure is a transparent container made of resin, and includes a container body 10 that can accommodate a plurality of semiconductor wafers W in parallel with each other, a lid 20 that is detachably fitted to an opening portion of the container body 10, and a door cushion (door shock) 30.
A plurality of pairs of left and right support pieces 12 are arranged at predetermined intervals in the vertical direction inside the container body 10, and a plurality of semiconductor wafers W are accommodated in parallel between the support pieces 12. The door damper 30 (also referred to as a "front retainer") includes a frame 32, an elastic piece 34, and a plurality of pairs of grooved blocks 36, and is detachably attached to the inside of the cover 20.
When the lid 20 is fitted to the container body 10, the end portions of the semiconductor wafer W are inserted into the groove portions of the pair of grooved blocks 36, and the grooved blocks 36 press and fix the semiconductor wafer W to the container body 10 by the elastic force of the elastic pieces 34. The FOSB100 containing the semiconductor wafer W is transported through all the routes such as a land route, an air route, and a sea route.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-353898;
patent document 2: japanese Kokai publication Nos. 2005-518318;
patent document 3: japanese patent application laid-open No. 2014-527721.
Fig. 2 shows a flow of a conventional method of loading semiconductor wafers W into the wafer transport container 100 that accommodates a plurality of semiconductor wafers W as described above before shipment. First, in step S1, the wafer transport container (product) 100 in which the plurality of semiconductor wafers W are accommodated is received. Next, in step S2, a label on which product information, laser marking information, or the like is displayed is attached to the wafer transport container 100.
Next, in step S3, it is visually checked whether or not the label is attached to the surface to be attached, and if the label is not attached to the surface to be attached, the label is peeled off and attached again to the surface to be attached. On the other hand, when the label is attached to the surface to be attached, in step S4, the wafer transport container 100 is placed in a transparent bag, and the desiccant is attached to the wafer transport container 100 through the transparent bag.
Next, in step S5, it is visually checked whether or not the drying agent is attached to the surface to be attached, and if the drying agent is not attached to the surface to be attached, the drying agent is peeled off and attached to the surface to be attached again, and if necessary, the inspection is performed again. On the other hand, when the desiccant is attached to the surface to be attached, the wafer transport container 100 is set in a bag such as an aluminum bag in step S6. After the mounting operation is completed, the semiconductor wafers W are shipped.
Problems to be solved by the invention
As described above, in the flow of the conventional method for mounting the semiconductor wafer W as shown in fig. 2, whether or not a sticker such as a label or a desiccant is attached to a surface to be attached is determined by visual confirmation by a worker. Therefore, the wafer transport container 100 with the adhesive material stuck to the wrong surface may be overlooked.
Disclosure of Invention
Therefore, an object of the present invention is to provide a method for inspecting a pasted object and a method for incorporating a semiconductor wafer, which can accurately determine whether or not the pasted object pasted on a wafer transport container accommodating a semiconductor wafer is pasted on a surface to be pasted, compared with the conventional method.
Means for solving the problems
The main structure of the present invention for solving the above problems is as follows.
[1] A method for inspecting a stuck object, which is a method for inspecting whether or not the stuck object is stuck to a surface to be stuck in a transparent wafer transport container for storing and transporting a plurality of semiconductor wafers, the method comprising:
an imaging step of imaging at least the surface to be bonded of the wafer transport container under low illumination;
an image processing step of performing at least binarization processing on the obtained image; and
and a determination step of determining whether or not the sticker is stuck to the surface to be stuck based on the image subjected to at least the binarization process.
[2] The method of inspecting a adherend according to the above [ 1 ], wherein the imaging step is performed under an illuminance of 50 lux or more and 300 lux or less.
[3] The method of inspecting a sticker according to any one of [ 1 ] and [ 2 ], wherein the determination step includes a position determination step of determining whether or not the sticker is disposed in a predetermined area on the surface to be pasted.
[4] The method of inspecting a sticker according to any one of the above [ 1 ] to [ 3 ], wherein the determination step includes an orientation determination step in which a determination is made as to whether or not the sticker is to be stuck in a predetermined direction.
[5] The method of inspecting a sticker according to any one of the above [ 1 ] to [ 4 ], wherein the sticker is a label.
[6] The method of inspecting a sticker according to any one of the above [ 1 ] to [ 4 ], wherein the sticker is a desiccant, the wafer transport container is housed in a transparent bag, and the desiccant is attached to the wafer transport container via the transparent bag.
[7] A method of mounting a semiconductor wafer,
attaching a label to a wafer transport container housing a plurality of semiconductor wafers, determining whether the label is attached to a surface to which the label is to be attached by the method according to any one of [ 1 ] to [ 6 ],
when it is determined that the label is attached to the surface to which the label is to be attached, after the wafer transport container is set in a transparent bag, a desiccant is attached to the wafer transport container via the transparent bag, and whether or not the desiccant is attached to the surface to which the label is to be attached is determined by the method according to any one of the above [ 1 ] to [ 6 ],
and when the desiccant is determined to be attached to the surface to which the desiccant is to be attached, the wafer transport container is loaded in a predetermined bag.
Effects of the invention
According to the present invention, it is possible to accurately determine whether or not a material to be bonded to a wafer transport container accommodating a semiconductor wafer is bonded to a surface to be bonded, as compared with the conventional case.
Drawings
FIG. 1 is an exploded perspective view of an example of a conventional FOSB.
Fig. 2 is a flow chart of a conventional semiconductor wafer mounting method.
Fig. 3 is a flow of an inspection method of a sticker according to the present invention.
Fig. 4 shows an example of an image of a label (label), (a) shows an image before binarization processing, and (b) shows an image after binarization processing.
Fig. 5 shows an example of an image of a drying agent, where (a) shows an image before binarization processing and (b) shows an image after binarization processing.
Fig. 6 is a flow chart of a method of mounting a semiconductor wafer according to the present invention.
Detailed Description
(method of inspecting adherend)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 3 shows a flow of an inspection method of a sticker according to the present invention. A method for inspecting a sticker according to the present invention is a method for inspecting whether or not a sticker is attached to a surface to be attached to a transparent wafer transport container 100, the transparent wafer transport container 100 being a container for storing and transporting a plurality of semiconductor wafers W, the method comprising: an imaging step (step S11) of imaging at least the surface to be bonded of the wafer transport container 100 under low illumination; an image processing step (step S12) of performing at least binarization processing on the obtained image; and a determination step (step S13) of determining whether or not the object to be pasted is pasted to the surface to be pasted, based on the image subjected to at least the binarization processing.
As described above, in the conventional method for inspecting a sticker that relies on visual confirmation by an operator, there is a possibility that the sticker may be overlooked even when the sticker is stuck to an incorrect surface due to human error (human error). Therefore, the present inventors have discussed a method of inspection without relying on an operator, and as a result, have conceived to perform inspection by capturing an image of a surface of the wafer transport container 100 to which a sticker is to be attached by an imaging device and analyzing the captured image.
However, it was found that it is difficult to identify the label or the drying agent when the image of the surface of the wafer carrier container 100 to which the label is attached is taken. The results of the discussion by the inventors are known because: since the surface of the semiconductor wafer W is mirror-polished, a background or an operator is reflected on the surface of the wafer W or light from the illumination is reflected when imaging is performed in a bright environment after the illumination is turned on.
Therefore, the present inventors have intensively studied a method for suppressing reflection of a background or reflection of light from illumination at the time of imaging as described above. As a result, the present inventors have found that it is extremely effective to perform imaging of the wafer transport container 100 under low illumination, and have completed the present invention. Hereinafter, each step will be explained.
First, in step S11, at least the surface of the wafer transport container 100 to which the sticker is to be attached is imaged under low illumination (imaging step).
The object to be inspected in the present invention is a sticker to be attached to the wafer conveyance container 100 during the mounting work of the semiconductor wafer W, and examples thereof include a label and a desiccant. As the label, there are a product label showing product information such as a part number (part number) or a shipment lot number, a laser mark sheet showing information of a laser mark (laser mark), a barcode label showing product information, and the like, and the kind of label to be attached differs depending on the specification. Further, which label is attached to which surface may vary depending on the specification, and a position (area) on the surface may be designated. In this way, the types and arrangement of labels to be attached are various, and the variety thereof causes a large human error by the operator.
In addition, in order to protect the semiconductor wafer W from moisture caused by moisture in the air during transportation of the semiconductor wafer W, the desiccant is attached to the wafer transport container 100 after the wafer transport container 100 is placed in the transparent bag as described above.
In the present invention, it is important to perform the imaging step under low illumination. This can greatly suppress reflection or reflection of the background as described above. Specifically, the imaging step is preferably performed under an illuminance of 50 lux or more and 300 lux or less. This makes it possible to further suppress reflection or reflection of the background, and to more easily detect the attached object. The imaging step is most preferably performed under an illuminance of 120 lux.
The illuminance in the imaging step can be adjusted by using a device capable of finely adjusting the brightness as, for example, an illumination device. In addition, when the brightness of the illumination device cannot be adjusted, the brightness can be adjusted by adjusting the light incident from the illumination device to the wafer transport container 100 to be imaged by using, for example, a shade.
The imaging step can be performed by arranging an imaging device such as a CCD camera upstream of a line (line) that houses the wafer transport container 100 in the transparent bag when the sticker is a label. In the case where the paste is a desiccant, the paste can be applied by disposing an imaging device between the line in which the wafer transport container 100 is housed in the transparent bag and the line downstream of the line in which the wafer transport container 100 is housed in the aluminum bag.
Next, in step S12, at least binarization processing (image processing step) is performed on the image obtained in step S11. The threshold value used for the binarization processing can be determined appropriately based on the distribution of the obtained luminance values by acquiring, for example, luminance value information of each pixel in the image. In addition, the threshold value for detecting the label or the desiccant can be empirically determined by applying binarization processing to a plurality of images in advance, and binarization processing can be performed using the determined threshold value. Further, the binarization processing can be performed by using a threshold value at which the resolution (resolution) is the maximum by a discriminant analysis method or the like.
Fig. 4 shows an example of an image of a label, (a) shows an image before binarization processing, and (b) shows an image after binarization processing. Since the label is often displayed in white as a key, the label is displayed in white as compared with the surrounding area as shown in fig. 4, whereas the area around the label is displayed in black.
Fig. 5 shows an example of an image of a drying agent, where (a) shows an image before binarization processing and (b) shows an image after binarization processing. Since the desiccant is often white, the desiccant is displayed white as compared with the surroundings, whereas the area around the label is displayed darker. Although a white area exists in fig. 5 in addition to the area of the drying agent, the presence or absence of the drying agent can be determined in step S13 described later based on information such as the size and shape of the label.
Further, other appropriate processing such as differentiation processing may be performed in addition to the binarization processing to facilitate detection of the label in the image.
Next, in step S13, it is determined whether or not the pasted object is pasted on the surface to be pasted, based on the image subjected to at least the binarization processing obtained in step S12 (determination step). In the image obtained in step S12, the brightness value of the image changes sharply in the vicinity of the outline of the sticker such as a label or a desiccant. Therefore, the region of the attached object in the image can be detected by using the change in the luminance value.
Specifically, luminance value information of each pixel in the image after the binarization processing is acquired, a pixel having a difference from the luminance value of an adjacent pixel exceeding a predetermined threshold value is detected, and a region estimated to be a region of the sticker is obtained. Then, a database of the type of label, display content, size, shape, surface to be attached, and position on the surface, etc. can be prepared in advance, and whether or not the attached object is attached to the surface of the wafer transport container 100 to be attached can be determined based on the size of the area of the attached object estimated as described above, etc.
When the position (area) on the surface to which the sticker is to be attached is determined in advance, it is also possible to determine whether or not the sticker is placed at the position (area) by specifying the position on the surface (position determination step). If it is determined that the position of the sticker is wrong, the sticker can be peeled off and attached again in the area, and if necessary, a re-inspection can be performed.
When the direction of the pasted object is determined in advance, it is possible to determine whether or not the pasted object is pasted in the predetermined direction based on the shape of the pasted object or the information (for example, characters or numerals) of the pasted object region in the binarized image, and based on the direction (orientation determination step). If it is determined that the direction of the sticker is wrong, the sticker can be peeled off and re-pasted in the correct direction, and if necessary, re-inspection can be performed.
(method of mounting semiconductor wafer)
Next, a method of mounting a semiconductor wafer according to the present invention will be described. Fig. 6 shows a flow of a method of mounting a semiconductor wafer according to the present invention. In the semiconductor wafer mounting method according to the present invention, a label is attached to a wafer carrier container accommodating a plurality of semiconductor wafers (step S22), and whether or not the label is attached to a surface to which the label is to be attached is determined by the above-described method for inspecting an attached object according to the present invention (steps S23 to S25). Then, it is characterized in that: when it is determined that the label is attached to the surface to which the label is to be attached, the desiccant is attached to the wafer carrier through the transparent bag after the wafer carrier is housed in the transparent bag (step S26), whether or not the desiccant is attached to the surface to which the desiccant is to be attached is determined by the method for inspecting a sticker according to the present invention (steps S27 to S29), and when it is determined that the desiccant is attached to the surface to which the desiccant is to be attached, the wafer carrier is housed in a predetermined bag (step S30). Hereinafter, each step will be explained.
First, in step S21, the wafer conveyance container 100 accommodating a plurality of semiconductor wafers is received.
Next, in step S22, a label on which product information, laser marking information, or the like is recorded is attached to the wafer transport container 100. The label may be attached by a machine or by an operator.
The following steps S23 to S25 correspond to the steps S11 to S13 of the method for inspecting a sticker according to the present invention, and the description thereof is omitted. These steps S23 to S25 can be used to determine whether or not the label is attached to the surface to which the label is to be attached. If it is determined that the label is not attached to the surface to be attached, the label can be peeled off and attached to the surface to be attached again, and if necessary, the inspection can be performed again.
On the other hand, if it is determined that the label is attached to the surface to be attached, the process proceeds to step S26, where the wafer transport container 100 is placed in a transparent bag, and the desiccant is attached to the wafer transport container 100 through the transparent bag. The drying agent may be attached by a machine, or by an operator.
The following steps S27 to S29 correspond to the steps S11 to S13 of the method for inspecting a sticker according to the present invention, and the description thereof is omitted. These steps S27 to S29 can be used to determine whether or not the desiccant is attached to the surface to which the desiccant is to be attached. If it is determined that the drying agent is not attached to the surface to be attached, the drying agent can be peeled off and attached to the surface to be attached again, and if necessary, the inspection can be performed again.
On the other hand, if it is determined that the desiccant is attached to the surface to be attached, the process proceeds to step S30, and the wafer transport container 100 is loaded in a predetermined bag. As the predetermined pocket, an aluminum pocket, a transparent moisture-proof pocket, or the like can be used in order to block moisture without affecting the wafer quality. This completes the built-in operation. The semiconductor wafer W loaded therein is shipped and transported to a predetermined destination.
Industrial applicability
According to the present invention, whether or not a material to be stuck to a wafer carrier container accommodating a semiconductor wafer is stuck to a surface to be stuck can be determined more accurately than in the related art, and therefore, the present invention is useful in the semiconductor wafer manufacturing industry.
Description of reference numerals
10 Container body
12 support piece
20 cover body
30-door buffer
32 frame body
34 elastic sheet
36 grooved block
100 FOSB (wafer transport container)
W a semiconductor wafer.
Claims (13)
1. A method for inspecting a stuck object, which is a method for inspecting whether or not the stuck object is stuck to a surface to be stuck in a transparent wafer transport container for storing and transporting a plurality of semiconductor wafers, the method comprising:
an imaging step of imaging at least the surface to be bonded of the wafer transport container under low illumination;
an image processing step of performing at least binarization processing on the obtained image; and
and a determination step of determining whether or not the sticker is stuck to the surface to be stuck based on the image subjected to at least the binarization process.
2. The method of inspecting a sticker according to claim 1, wherein the imaging step is performed under an illuminance of 50 lux or more and 300 lux or less.
3. The method according to claim 1 or 2, wherein the determination step includes a position determination step of determining whether or not the sticker is disposed in a predetermined area on the surface to be pasted.
4. The method of inspecting a sticker according to claim 1 or 2, wherein the determination step includes an orientation determination step in which a determination is made as to whether or not the sticker is to be attached in a predetermined direction.
5. The method of inspecting a sticker according to claim 3, wherein the determination step includes an orientation determination step in which a determination is made as to whether or not the sticker is attached in a predetermined direction.
6. The method of inspecting a sticker according to claim 1 or 2, wherein the sticker is a label.
7. The method of inspecting a sticker according to claim 3, wherein the sticker is a label.
8. The method of inspecting a sticker according to claim 4, wherein the sticker is a label.
9. The method of inspecting a sticker according to claim 1 or 2, wherein the sticker is a desiccant, the wafer transport container is housed in a transparent bag, and the desiccant is attached to the wafer transport container via the transparent bag.
10. The method of inspecting a sticker according to claim 3, wherein the sticker is a desiccant, the wafer transport container is housed in a transparent bag, and the desiccant is attached to the wafer transport container via the transparent bag.
11. The method of inspecting a sticker according to claim 4, wherein the sticker is a desiccant, the wafer transport container is housed in a transparent bag, and the desiccant is attached to the wafer transport container via the transparent bag.
12. The method of inspecting a sticker according to claim 5, wherein the sticker is a desiccant, the wafer transport container is housed in a transparent bag, and the desiccant is attached to the wafer transport container via the transparent bag.
13. A method of mounting a semiconductor wafer,
a method for determining whether or not a label is attached to a surface to which a plurality of semiconductor wafers are to be attached by attaching the label to a wafer transport container housing the semiconductor wafers according to any one of claims 1 to 12,
when it is determined that the label is attached to the surface to which the label is to be attached, after the wafer transport container is placed in a transparent bag, a desiccant is attached to the wafer transport container via the transparent bag, and whether or not the desiccant is attached to the surface to which the desiccant is to be attached is determined by the method according to any one of claims 1 to 12,
and when the desiccant is determined to be attached to the surface to which the desiccant is to be attached, the wafer transport container is loaded in a predetermined bag.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-221935 | 2018-11-28 | ||
| JP2018221935A JP7074036B2 (en) | 2018-11-28 | 2018-11-28 | Inspection method for patches and interior method for semiconductor wafers |
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| Publication Number | Publication Date |
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| CN111239151A true CN111239151A (en) | 2020-06-05 |
| CN111239151B CN111239151B (en) | 2023-04-28 |
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| CN201911191083.6A Active CN111239151B (en) | 2018-11-28 | 2019-11-28 | Method for inspecting adhesive article and method for mounting semiconductor wafer |
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| Country | Link |
|---|---|
| JP (1) | JP7074036B2 (en) |
| CN (1) | CN111239151B (en) |
| TW (1) | TWI773933B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2020088218A (en) | 2020-06-04 |
| TW202020808A (en) | 2020-06-01 |
| TWI773933B (en) | 2022-08-11 |
| CN111239151B (en) | 2023-04-28 |
| JP7074036B2 (en) | 2022-05-24 |
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