CN111230314A - Machining process for drill point with two-dimensional code - Google Patents
Machining process for drill point with two-dimensional code Download PDFInfo
- Publication number
- CN111230314A CN111230314A CN202010022866.8A CN202010022866A CN111230314A CN 111230314 A CN111230314 A CN 111230314A CN 202010022866 A CN202010022866 A CN 202010022866A CN 111230314 A CN111230314 A CN 111230314A
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- Prior art keywords
- dimensional code
- drill point
- drill
- parameters
- laser
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Numerical Control (AREA)
Abstract
The invention relates to the technical field of drill point processing, in particular to a processing technology of a drill point with a two-dimensional code, which comprises the following steps: a. the mounting mechanism is used for mounting the lantern ring at the positions, close to the two ends of the drill bit, of the drill bit; b. inputting related marking parameters and two-dimensional code parameters into a laser, and driving a corresponding two-dimensional code into the upper end surface of the drill point by the laser according to the marking parameters and the two-dimensional code parameters; c. and detecting and reading the two-dimensional code on the drill point, and binding the detection information with the two-dimensional code after reading the code. According to the processing technology of the drill point with the two-dimensional code, the two-dimensional code is printed on the drill point, the use condition of the drill point is objectively monitored, waste is reduced, and cost is reduced.
Description
Technical Field
The invention relates to the technical field of drill point processing, in particular to a processing technology of a drill point with a two-dimensional code.
Background
Drilling refers to the operation of using a drill to form a hole in a solid material, but the drilling does not occur by itself, but requires work from a drill bit to make the hole in the solid material. In the process of drilling the drill point, the drill point of the drill point is firstly contacted with a solid material and gradually abraded along with the increase of the drilling times, so that the length of the drill point is continuously shortened. Generally, the conventional drill point is judged whether to be reusable or not by human eyes, so that the judgment is subjective, and the drill point is discarded and discarded under the condition that the drill point can be reused many times, which undoubtedly increases the cost.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide the processing technology of the drill point with the two-dimension code.
The invention is realized by the following technical scheme:
a processing technology of a drill point with a two-dimensional code comprises the following steps:
a. the mounting mechanism is used for mounting the lantern ring at the positions, close to the two ends of the drill bit, of the drill bit;
b. inputting related marking parameters and two-dimensional code parameters into a laser, and driving a corresponding two-dimensional code into the upper end surface of the drill point by the laser according to the marking parameters and the two-dimensional code parameters;
c. and detecting and reading the two-dimensional code on the drill point, and binding the detection information with the two-dimensional code after reading the code.
Wherein, before step a, the method further comprises the step a': and placing a plurality of drill points in the jig so that the plurality of drill points are arranged in a plurality of rows.
Wherein the step b comprises:
b1. starting a laser;
b2. calling marking parameters and two-dimensional code parameters by software;
b3. adjusting the focal length and the XY axis position of the laser;
b4. and the laser drives a corresponding two-dimensional code into the upper end surface of the drill point.
Wherein the b2 step comprises:
b21. coding the two-dimensional code to set the filling density;
b22. setting a layer for the two-dimensional code image to adjust the processing image of the two-dimensional code;
b23. and carrying out adaptive debugging on the marking parameters.
Wherein the step c comprises:
c1. the manipulator grabs the coded drill point and conveys the drill point to a detection position of a CCD detection device;
the CCD detection device automatically photographs and identifies the drill point and records the detection information of the drill point;
c3. and the manipulator grabs the detected drill point, conveys the drill point to a code reader for code reading, and binds the detection information of the drill point with the two-dimensional code on the drill point.
The invention has the beneficial effects that:
the waste is reduced, and the cost is reduced: according to the processing technology of the drill point with the two-dimensional code, the service life of the drill point is objectively monitored, the situation that the drill point can be used but discarded and scrapped is avoided, waste is reduced, the cost is reduced, and meanwhile great help is brought to the application and management and control of the drill point research frequency.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
The embodiment provides a processing technology with a two-dimensional code drill point, which comprises the following steps:
a. the mounting mechanism is used for mounting the lantern ring at the position, close to the non-two ends of the drill bit, of the drill bit;
b. inputting related marking parameters and two-dimensional code parameters into a laser, and driving a corresponding two-dimensional code into the upper end surface of the drill point by the laser according to the marking parameters and the two-dimensional code parameters;
c. and detecting and reading the two-dimensional code on the drill point, and binding the detection information with the two-dimensional code after reading the code.
Specifically, before step a, the method further comprises step a': and placing a plurality of drill points in the jig so that the plurality of drill points are arranged in a plurality of rows.
Wherein the step b comprises:
b1. starting a laser;
b2. calling marking parameters and two-dimensional code parameters by software;
b3. adjusting the focal length and the XY axis position of the laser;
b4. and the laser drives a corresponding two-dimensional code into the upper end surface of the drill point.
Specifically, the step b2 includes:
b21. coding the two-dimensional code to set the filling density;
b22. setting a layer for the two-dimensional code image to adjust the processing image of the two-dimensional code;
b23. and carrying out adaptive debugging on the marking parameters.
Specifically, the step c includes:
c1. the manipulator grabs the coded drill point and conveys the drill point to a detection position of a CCD detection device;
the CCD detection device automatically photographs and identifies the drill point and records the detection information of the drill point;
c3. and the manipulator grabs the detected drill point, conveys the drill point to a code reader for code reading, and binds the detection information of the drill point with the two-dimensional code on the drill point.
In this embodiment, the CCD detection device employs a kirschner brand camera and is used in cooperation with related detection software, and the two-dimensional code reading device employs a deli code reader (model number Matrix 220385-010).
It should be noted that, in the prior art, there is also a mode in which mechanical engraving is automatically controlled by a computer, and a high-strength alloy cutter head performs contact processing on a two-dimensional code on a drill point; meanwhile, in consideration of cost, the drill point used in the embodiment is not made of stainless steel with high purity, and the drill point is made of 420J2 steel handle or tungsten steel, so that the two-dimensional code is oxidized after the drill point for processing the two-dimensional code in the mode is used for a period of time, and the code reader cannot accurately read parameters of the two-dimensional code in the subsequent use process, thereby affecting use.
Therefore, in the embodiment, the mode of fiber laser marking is adopted, and the step b2 is adopted, so that the two-dimensional code marked by the method cannot be oxidized, and the subsequent use of the drill point is ensured. Specifically, the values of the marking parameters are as follows: the speed is 2000 mm/s or 800-.
In addition, in step b3, when the focal length of the laser is adjusted, since the light beams emitted by the laser are all parallel, it is necessary to focus the parallel light beams. In the embodiment, the QF lens is mainly adopted for focusing, QF is the laser context of a focusing system, different QF lenses have different focal lengths and different marking effects and ranges, an imported high-performance focusing system is selected for the fiber laser marking machine, the focal length F of the lens in standard configuration is 160mm, and the effective scanning range is phi 110 mm. When the focal length of the laser is adjusted, the QF lens is firstly adjusted, then the marking distance of the lens is manually adjusted, and the principle of adjusting the laser context of a focusing system and then adjusting the marking distance is adopted.
Specifically, the drill point performs CCD detection and code reading recording simultaneously, and the detection result of the CCD can be bound with the information of the two-dimensional code during code reading, so that the effect of monitoring the use state of the drill point is achieved.
Compared with the traditional drill point management and control, the drill point can objectively monitor the service life of the drill point, avoids the situation that the drill point can be used but discarded and scrapped, reduces waste and cost, and is also greatly helpful for the application and management and control of the drill point research frequency.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. The machining process of the drill point with the two-dimensional code is characterized by comprising the following steps of:
a. the mounting mechanism is used for mounting the lantern ring at the positions, close to the two ends of the drill bit, of the drill bit;
b. inputting related marking parameters and two-dimensional code parameters into a laser, and driving a corresponding two-dimensional code into the upper end surface of the drill point by the laser according to the marking parameters and the two-dimensional code parameters;
c. and detecting and reading the two-dimensional code on the drill point, and binding the detection information with the two-dimensional code after reading the code.
2. The machining process of the two-dimensional code drill point according to claim 1, characterized in that: before step a, further comprising step a': and placing a plurality of drill points in the jig so that the plurality of drill points are arranged in a plurality of rows.
3. The machining process of the two-dimensional code drill point according to claim 1, wherein the step b comprises the following steps:
b1. starting a laser;
b2. calling marking parameters and two-dimensional code parameters by software;
b3. adjusting the focal length and the XY axis position of the laser;
b4. and the laser drives a corresponding two-dimensional code into the upper end surface of the drill point.
4. The machining process of the two-dimensional code drill point as claimed in claim 3, wherein the step b2 comprises the following steps:
b21. coding the two-dimensional code to set the filling density;
b22. setting a layer for the two-dimensional code image to adjust the processing image of the two-dimensional code;
b23. and carrying out adaptive debugging on the marking parameters.
5. The machining process of the two-dimensional code drill point according to claim 1, wherein the step c comprises the following steps:
c1. the manipulator grabs the coded drill point and conveys the drill point to a detection position of a CCD detection device;
the CCD detection device automatically photographs and identifies the drill point and records the detection information of the drill point;
c3. and the manipulator grabs the detected drill point, conveys the drill point to a code reader for code reading, and binds the detection information of the drill point with the two-dimensional code on the drill point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010022866.8A CN111230314A (en) | 2020-01-09 | 2020-01-09 | Machining process for drill point with two-dimensional code |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010022866.8A CN111230314A (en) | 2020-01-09 | 2020-01-09 | Machining process for drill point with two-dimensional code |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111230314A true CN111230314A (en) | 2020-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010022866.8A Pending CN111230314A (en) | 2020-01-09 | 2020-01-09 | Machining process for drill point with two-dimensional code |
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| Country | Link |
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| CN (1) | CN111230314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382540A (en) * | 2021-04-26 | 2021-09-10 | 深圳市迪尔泰科技有限公司 | PCB feeding and discharging control method, system, equipment and storage medium |
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| JP2008250714A (en) * | 2007-03-30 | 2008-10-16 | Jfe Steel Kk | Production management method for seamless steel pipe |
| CN102472712A (en) * | 2009-07-24 | 2012-05-23 | 旭硝子株式会社 | Glass member quality control method and quality control device, and glas member with mark |
| CN103917930A (en) * | 2011-11-02 | 2014-07-09 | 新日铁住金株式会社 | Steel tube production control method |
| CN108372964A (en) * | 2018-01-04 | 2018-08-07 | 大族激光科技产业集团股份有限公司 | A kind of precisely identification labeling marking system |
| CN108422090A (en) * | 2018-02-10 | 2018-08-21 | 大族激光科技产业集团股份有限公司 | A kind of laser mark printing device and method |
| CN209746559U (en) * | 2019-05-29 | 2019-12-06 | 昆山冉洲自动化科技有限公司 | Automatic carving two-dimensional code and code reading mechanism for acoustic products |
-
2020
- 2020-01-09 CN CN202010022866.8A patent/CN111230314A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008250714A (en) * | 2007-03-30 | 2008-10-16 | Jfe Steel Kk | Production management method for seamless steel pipe |
| CN102472712A (en) * | 2009-07-24 | 2012-05-23 | 旭硝子株式会社 | Glass member quality control method and quality control device, and glas member with mark |
| CN103917930A (en) * | 2011-11-02 | 2014-07-09 | 新日铁住金株式会社 | Steel tube production control method |
| CN108372964A (en) * | 2018-01-04 | 2018-08-07 | 大族激光科技产业集团股份有限公司 | A kind of precisely identification labeling marking system |
| CN108422090A (en) * | 2018-02-10 | 2018-08-21 | 大族激光科技产业集团股份有限公司 | A kind of laser mark printing device and method |
| CN209746559U (en) * | 2019-05-29 | 2019-12-06 | 昆山冉洲自动化科技有限公司 | Automatic carving two-dimensional code and code reading mechanism for acoustic products |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382540A (en) * | 2021-04-26 | 2021-09-10 | 深圳市迪尔泰科技有限公司 | PCB feeding and discharging control method, system, equipment and storage medium |
| CN113382540B (en) * | 2021-04-26 | 2023-01-31 | 深圳市迪尔泰科技有限公司 | PCB feeding and discharging control method, system, equipment and storage medium |
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