CN111223789A - Lifting mechanism for chamber and semiconductor processing equipment - Google Patents
Lifting mechanism for chamber and semiconductor processing equipment Download PDFInfo
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- CN111223789A CN111223789A CN201811425388.4A CN201811425388A CN111223789A CN 111223789 A CN111223789 A CN 111223789A CN 201811425388 A CN201811425388 A CN 201811425388A CN 111223789 A CN111223789 A CN 111223789A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 66
- 238000009434 installation Methods 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 abstract 3
- 230000000712 assembly Effects 0.000 description 9
- 238000000429 assembly Methods 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/16—Sealings between relatively-moving surfaces
- F16J15/18—Sealings between relatively-moving surfaces with stuffing-boxes for elastic or plastic packings
- F16J15/181—Sealings between relatively-moving surfaces with stuffing-boxes for elastic or plastic packings for plastic packings
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a lifting mechanism for a chamber and semiconductor processing equipment. Elevating system includes first mounting, sharp module, cluster union piece, at least one lifting unit and at least one installed part, and first mounting is used for connecting cavity and sharp module respectively, concatenates the piece and connects respectively the installed part with sharp module, each the installed part still with correspond lifting unit's first end sealing connection, lifting unit's second end be used for with cavity liftable ground sealing connection, sharp module can drive cluster union piece goes up and down along vertical direction, with the via the installed part drives and corresponds lifting unit goes up and down along vertical direction. The straight line module only produces the assembly relation through first mounting and cavity, and other structure location in elevating system and the cavity are more accurate, and whole lifting unit concatenates on the connector of concatenating through the installed part that corresponds, can be so that elevating system's structure is modularization more, and it is more convenient to maintain, the debugging of being convenient for.
Description
Technical Field
The invention relates to the technical field of microelectronic processing, in particular to a lifting mechanism for a cavity and semiconductor processing equipment.
Background
Generally, a semiconductor processing apparatus includes a frame and a chamber mounted on the frame, wherein a support is disposed inside the chamber for supporting a substrate, and a lifting mechanism is disposed inside the chamber for performing different processes on the substrate at different process positions inside the chamber.
The lifting mechanism in the related art comprises a linear module and a lifting assembly, wherein the linear module is connected with a rack, one end of the lifting assembly extends into a cavity and is connected with a supporting piece, the other end of the lifting assembly is connected with the linear module through a series of intermediate pieces, and the lifting assembly is connected with the cavity in a sealing mode through a corrugated pipe.
Obviously, in the lifting mechanism with the above structure, the linear module should theoretically have a positioning relationship with the chamber, but actually be connected with the frame, the frame deformation is not easy to control and machine, the mounting and debugging operation of the lifting mechanism is difficult, and the positioning is inaccurate. In addition, the bellows used for sealing belongs to vulnerable parts, a chamber cover, a supporting part, a series of intermediate parts, various screws and the like need to be disassembled during maintenance, the maintenance work is large, and the risk of vacuum leakage is large.
Disclosure of Invention
The invention aims to solve at least one technical problem in the prior art and provides a lifting mechanism for a chamber and semiconductor processing equipment.
In order to achieve the above object, a first aspect of the present invention provides a lifting mechanism for a chamber, where the lifting mechanism includes a first fixing member, a linear module, a serial member, at least one lifting assembly, and at least one mounting member, the first fixing member is used to connect the chamber and the linear module, the serial member is connected to the mounting members and the linear module, each mounting member is further connected to a first end of the corresponding lifting assembly in a sealing manner, a second end of the lifting assembly is used to be connected to the chamber in a lifting and sealing manner, and the linear module can drive the serial member to lift in a vertical direction, so as to drive the corresponding lifting assembly to lift in the vertical direction via the mounting member.
Optionally, each of the lifting assemblies comprises a lifting rod and an elastic sealing sleeve; wherein the content of the first and second substances,
the first end of the jacking rod is fixedly connected with the mounting piece, and the second end of the jacking rod is used for being connected with the chamber in a lifting manner;
the elastic sealing sleeve is sleeved outside the jacking rod, the first end of the elastic sealing sleeve is in sealing connection with the mounting part, and the second end of the elastic sealing sleeve is used for being in sealing connection with the chamber.
Optionally, the first end of the jacking rod is provided with a first positioning flange protruding outwards, the mounting part is provided with a positioning groove corresponding to the first end of the jacking rod, and the first positioning flange is fixedly arranged in the positioning groove.
Optionally, each of the lifting assemblies further comprises a sealing member filled between the elastic sealing sleeve and the mounting member to make the lifting assembly and the mounting member connected in a sealing manner.
Optionally, the elastic sealing sleeve has an inclined surface corresponding to an inner side wall at the first positioning flange, the mounting member has a mounting surface at a position corresponding to the inclined surface, the mounting surface and an outer peripheral surface of the first positioning flange together enclose a sealing space, and the sealing member is filled in the sealing space.
Optionally, the first end of the elastic sealing sleeve is provided with a flange protruding outwards, and the flange is connected with the mounting piece in a sealing mode.
Optionally, the resilient sealing sleeve is a bellows.
Optionally, the lifting mechanism further comprises a second fixing piece, the second fixing piece comprises a first horizontal mounting surface and a second horizontal mounting surface which are oppositely arranged in the thickness direction of the second fixing piece, and the first horizontal mounting surface is used for being attached to the bottom wall of the chamber;
first mounting includes the first connecting portion that extends along the horizontal direction, certainly first connecting portion buckle to vertical direction and extend the second connecting portion that forms and connect first connecting portion with the strengthening rib of second connecting portion, the upper surface of first connecting portion with the laminating of second horizontal installation face, the second connecting portion with sharp module fixed connection.
Optionally, the linear module includes a driving motor, a screw rod, a sliding block movably sleeved on the screw rod, and a coupling connecting the output shaft of the driving motor with the screw rod, the housing of the driving motor is fixedly connected with the second connecting portion, and the sliding block is fixedly connected with the serial connection piece.
Optionally, a second positioning flange is disposed on a side of the second connecting portion facing the driving motor, a housing of the driving motor is placed on the second positioning flange, and the housing is fixedly connected to the second connecting portion via a fastener.
In a second aspect of the present invention, a semiconductor processing apparatus is provided, which includes a frame, a chamber disposed on the frame, and at least one lifting mechanism, where the lifting mechanism is the lifting mechanism described above, and the first fixing member connects the chamber and the linear module, respectively.
According to the lifting mechanism and the semiconductor processing equipment, the linear module is fixedly connected with the chamber through the first fixing piece, so that the linear module is only assembled with the chamber through the first fixing piece, and the lifting mechanism and other structures (such as supporting pieces and the like) in the chamber are positioned more accurately. All lifting assemblies are connected in series on the serial connection piece through corresponding mounting pieces, so that the structure of the lifting mechanism is more modularized, and the maintenance is more convenient. The tandem connection piece is connected with the linear module, so that the linear module can drive the tandem connection piece to ascend and descend, each lifting assembly can be driven to ascend and descend, the connection structure between the lifting assembly and the linear module is further simplified, the structure is compact, and debugging is facilitated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a semiconductor processing apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a semiconductor processing apparatus according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a lift mechanism in a semiconductor processing apparatus according to a third embodiment of the present invention;
FIG. 4 is a partial schematic view of a lift mechanism of a semiconductor processing apparatus according to a fourth embodiment of the present invention at a resilient sealing sleeve;
FIG. 5 is a partial schematic view of a fifth embodiment of the present invention illustrating the connection between the lift pins and the mounting member of the lift mechanism in the semiconductor processing apparatus;
fig. 6 is a partial schematic view of a connection between a lifting mechanism linear module and a mounting member in a semiconductor processing apparatus according to a sixth embodiment of the present invention.
Description of the reference numerals
100: a lifting mechanism;
110: a first fixing member;
111: a first connection portion;
112: a second connecting portion;
112 a: a second locating flange;
113: reinforcing ribs;
120: a linear module;
121: a drive motor;
122: a lead screw;
123: a slider;
124: a coupling;
130: a serial connection piece;
140: a lifting assembly;
141: a jacking rod;
141 a: a first locating flange;
142: an elastic sealing sleeve;
142 a: an inclined surface;
142 b: a flange;
143: a seal member;
150: a mounting member;
151: a positioning groove;
152: a mounting surface;
160: a second fixing member;
200: a semiconductor processing apparatus;
210: a frame;
220: a chamber.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 to 6, a first aspect of the present invention relates to a lifting mechanism 100 for a chamber, the lifting mechanism 100 includes a first fixing member 110, a linear module 120, a serial connection member 130, two lifting assemblies 140, and two mounting members 150, but the lifting mechanism 100 may include other numbers of lifting assemblies 140 and mounting members 150, but it should be satisfied that the lifting assemblies 140 correspond to the mounting members 150 one by one. The first fixing member 110 is connected to the chamber 220 and the linear module 120, respectively. The serial connection member 130 connects each of the mounting members 150 and the linear module 120, respectively. Each mounting member 150 is also sealingly coupled to a first end of a corresponding lift assembly 140, and a second end of the lift assembly 140 is sealingly coupled to the chamber 220 in a liftable and lowerable manner. The linear module 120 can drive the serial connection member 130 to ascend and descend along the vertical direction, so as to drive the two installation members 150 connected in series with the serial connection member 130 to ascend and descend, and further drive the two ascending and descending assemblies 140 corresponding to the two installation members 150 to ascend and descend.
Specifically, as shown in fig. 2, the linear module 120 is fixedly connected to the chamber 220 through the first fixing member 110, that is, the linear module 120 is assembled with the chamber 220 only through the first fixing member 110, such that the lifting mechanism 100 is more accurately positioned with respect to other structures (e.g., supporting members, etc.) in the chamber 220. All the lifting assemblies 140 are connected in series to the connecting member 130 through the corresponding mounting members 150, so that the structure of the lifting mechanism 100 is more modular and the maintenance is more convenient. The connecting piece 130 is connected with the linear module 120, so that the linear module 120 can drive the connecting piece 130 to ascend and descend, and further drive each lifting component 140 to ascend and descend, the connecting structure between the lifting components 140 and the linear module 120 is further simplified, the structure is compact, and debugging is facilitated.
The specific structure of the linear module 120 is not limited, and for example, the linear module 120 may be an electric cylinder structure, and the electric cylinder structure includes a driving motor, a lead screw, and a coupling for connecting an output shaft of the driving motor and the lead screw shaft. Of course, the linear module 120 may be other driving structures besides the structure that can be an electric cylinder, such as a hydraulic cylinder or an air cylinder.
As shown in fig. 2, 3 and 4, the lifting assembly 140 includes a lifting rod 141 and an elastic sealing sleeve 142. The first end of the lifting rod 141 is fixedly connected to the mounting member 150, the second end of the lifting rod 141 is connected to the chamber 220 in a liftable manner, and during actual installation, the chamber 220 is generally provided with an installation hole (not shown), and the second end of the lifting rod 141 extends into the chamber through the installation hole (a gap is formed between the lifting rod 141 and the installation hole, so that the lifting rod 141 can move up and down along the installation hole), and is connected to the support plate located inside the chamber, so as to drive the support plate to move up and down. The elastic sealing sleeve 142 is sleeved outside the lifting rod 141, a first end of the elastic sealing sleeve 142 is connected with the mounting member 150 in a sealing manner, and a second end of the elastic sealing sleeve 142 is connected with the chamber 220 in a sealing manner.
Specifically, as shown in fig. 4, a first end of the lifting rod 141 may be fixedly connected to the mounting member 150 by a bolt or a screw, a second end of the lifting rod 141 is inserted into the chamber 220 and is connected to the chamber 220 in a liftable manner, and in order to isolate the vacuum environment inside the chamber 220 from the atmosphere, the elastic sealing sleeve 142 may be used for sealing, and two ends of the elastic sealing sleeve 142 are respectively connected to the chamber 220 and the mounting member 150 in a sealing manner. During the process, the linear module 120 drives the serial connection member 130 to move up and down, so as to drive the lifting rod 141 to move up and down, and further drive a support (not shown) in the chamber 220 to move up and down, wherein the support is generally used for placing a substrate to be processed.
It should be noted that, the specific structure of the elastic sealing sleeve 142 is not limited, for example, the elastic sealing sleeve 142 may be a bellows structure. In addition to the bellows structure, the elastic sealing sleeve 142 may be another device having elasticity and capable of achieving sealing.
As shown in fig. 4 and 5, the first end of the lifting rod 141 is provided with a first positioning flange 141a protruding outward, the mounting member 150 is provided with a positioning groove 151 at a position corresponding to the first end of the lifting rod 141, and the first positioning flange 141a is fixedly disposed in the positioning groove 151, for example, the first positioning flange 141a may be fixed by a transition or interference fit with the positioning groove 151, and for example, the first positioning flange 141a may also be fixedly disposed in the positioning groove 151 by a screw, and so on. In this way, by using the positioning relationship between the first positioning flange 141a and the positioning groove 151, the positioning of the lifting rod 141 and the mounting member 150 can be achieved, so that the positioning between the lifting mechanism 100 and the chamber 220 can be improved more accurately.
As shown in fig. 4 and 5, the lifting assembly 140 further includes a sealing member 143, and the sealing member 143 may be an O-ring or the like, and may be filled between the elastic sealing sleeve 142 and the mounting member 150, so as to enable the lifting assembly 140 to be connected with the mounting member 150 in a sealing manner.
As shown in fig. 5, in order to improve the sealing effect, the inner sidewall of the elastic sealing sleeve 142 corresponding to the first positioning flange 141a may be formed with an inclined surface 142a, and the mounting member 150 has a mounting surface 152 at a position corresponding to the inclined surface 142 a. Thus, the inclined surface 142a, the mounting surface 152 and the outer peripheral surface of the first positioning flange 141a together define a sealing space, and the formed sealing space is a triangular sealing space in which the sealing material 143 is filled.
As shown in fig. 4 and 5, in order to further improve the sealing effect between the lifting assembly 140 and the mounting member 150, the first end of the elastic sealing sleeve 142 is provided with a flange 142b protruding outward, and the flange 142b is sealingly connected to the mounting member 150. To further enhance the sealing effect, a plurality of threaded holes may be provided to simultaneously penetrate the flange 142b and the mounting member 150, and bolts may be screwed into the threaded holes, so that the lifting assembly 140 and the mounting member 150 are sealingly and fixedly connected.
As shown in fig. 2, the lifting mechanism 100 further includes a second fixing member 160, and the second fixing member 160 includes a first horizontal mounting surface (as shown in fig. 3, an upper surface of the second fixing member 160) and a second horizontal mounting surface (as shown in fig. 3, a lower surface of the second fixing member 160) oppositely disposed along a thickness direction thereof, and the first horizontal mounting surface is attached to the bottom wall of the cavity 220. The first fixing member 110 includes a first connecting portion 111 extending along a horizontal direction, a second connecting portion 112 formed by bending and extending the first connecting portion 111 in a vertical direction, and a reinforcing rib 113 connecting the first connecting portion 111 and the second connecting portion 112, and the strength of the first connecting portion 111 and the strength of the second connecting portion 112 can be effectively ensured by the reinforcing rib 113. The upper surface of the first connecting portion 111 is attached to the second horizontal mounting surface, and the second connecting portion 112 is fixedly connected to the linear module 120. Preferably, the first connecting portion 111, the second connecting portion 112 and the reinforcing rib 113 may be formed at one time.
In the lifting mechanism 100 with the structure of the embodiment, the second fixing member 160 can be welded to the bottom wall of the cavity 220, and the second horizontal mounting surface is subjected to finish machining, so that a higher flatness can be achieved, and thus when the upper surface of the first connecting portion 111 of the first fixing member 110 is attached and fixed to the second horizontal mounting surface (for example, the upper surface and the second horizontal mounting surface can be attached and fixed by a positioning pin and a fixing bolt), the whole lifting mechanism 100 and other structures in the cavity 220 can be positioned more accurately.
As shown in fig. 2 and 6, the linear module 120 includes a driving motor 121, a lead screw 122, a slider 123 movably sleeved on the lead screw 122, and a coupler 124 for connecting an output shaft of the driving motor 121 with the lead screw 122. The housing of the driving motor 121 is fixedly connected to the second connecting portion 112, and the slider 122 is fixedly connected to the serial connection member 130.
Specifically, as shown in fig. 2 and 6, a side of the second connecting portion 112 facing the driving motor 121 is provided with a second positioning flange 112a, a housing of the driving motor 121 is placed in the second positioning flange 112a, and the housing is fixedly connected to the second connecting portion 112 via bolts. Through placing the shell in second location flange 112a, except can realizing that driving motor and second connecting portion 112 realize the location, second location flange 112a can also effectively bear the weight of driving motor 121 to can avoid the bolt between the two to receive the shearing, improve the joint strength and the life of bolt. The sliding block 123 can be fixedly connected with the serial connection piece 130 through a positioning pin and a bolt, and the positioning pin can realize positioning of the sliding block 123 and the serial connection piece 130, prevent the bolt between the sliding block 123 and the serial connection piece 130 from being sheared, and improve connection strength and service life of the bolt.
In addition, when the elastic sealing sleeve 142 is maintained, only the fixed connection structures (positioning pins, bolts and the like) between the elastic sealing sleeve 142 and the mounting member 150 and the lifting rod 141 need to be disassembled, and complex components such as the chamber cover and the mounting member 150 do not need to be disassembled, so that the disassembly, the assembly and the maintenance are convenient.
In a second aspect of the present invention, as shown in fig. 1 to 6, a semiconductor processing apparatus 200 is provided, which includes a frame 210, a chamber 220 disposed on the frame 210, and at least one lifting mechanism 100, wherein the lifting mechanism 100 employs the aforementioned lifting mechanism 100, and the first fixture 110 is connected to the chamber 220 and the linear module 120, respectively.
The semiconductor processing apparatus 200 of the present embodiment has the aforementioned lifting mechanism 100, and the linear module 120 is fixedly connected to the chamber 220 through the first fixing member 110, that is, the linear module 120 is only assembled with the chamber 220 through the first fixing member 110, so that the lifting mechanism 100 and other structures (such as a support member, etc.) in the chamber 220 are more accurately positioned. All the lifting assemblies 140 are connected in series to the connecting member 130 through the corresponding mounting members 150, so that the structure of the lifting mechanism 100 is more modular and the maintenance is more convenient. The connecting piece 130 is connected with the linear module 120, so that the linear module 120 can drive the connecting piece 130 to ascend and descend, and further drive each lifting component 140 to ascend and descend, the connecting structure between the lifting components 140 and the linear module 120 is further simplified, the structure is compact, and debugging is facilitated.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. The utility model provides a lifting mechanism for cavity, its characterized in that, lifting mechanism includes first mounting, sharp module, cluster union piece, at least one lifting unit and at least one installed part, first mounting is used for connecting respectively the cavity with sharp module, the cluster union piece connects respectively the installed part with sharp module, each the installed part still with correspond lifting unit's first end sealing connection, lifting unit's second end be used for with cavity liftable ground sealing connection, sharp module can drive the cluster union piece goes up and down along vertical direction, with the via the installed part drives and corresponds lifting unit goes up and down along vertical direction.
2. The lift mechanism of claim 1, wherein each lift assembly comprises a lift rod and a resilient sealing sleeve; wherein the content of the first and second substances,
the first end of the jacking rod is fixedly connected with the mounting piece, and the second end of the jacking rod is used for being connected with the chamber in a lifting manner;
the elastic sealing sleeve is sleeved outside the jacking rod, the first end of the elastic sealing sleeve is in sealing connection with the mounting part, and the second end of the elastic sealing sleeve is used for being in sealing connection with the chamber.
3. The lifting mechanism as claimed in claim 2, wherein the first end of the lifting rod is provided with a first positioning flange protruding outwards, the mounting member is provided with a positioning groove corresponding to the first end of the lifting rod, and the first positioning flange is fixedly arranged in the positioning groove.
4. The lift mechanism of claim 3, wherein each lift assembly further comprises a seal that fills between the resilient seal sleeve and the mount to sealingly couple the lift assembly to the mount.
5. The lift mechanism as claimed in claim 4, wherein the inner side wall of the elastic sealing sleeve corresponding to the first positioning flange has an inclined surface, the mounting member has a mounting surface at a position corresponding to the inclined surface, the mounting surface and the outer peripheral surface of the first positioning flange together define a sealing space, and the sealing member is filled in the sealing space.
6. The lift mechanism of claim 4, wherein the first end of the resilient sealing sleeve is provided with an outwardly projecting flange that sealingly engages the mounting member.
7. The lift mechanism of any one of claims 2 to 6, wherein the resilient sealing sleeve is a bellows.
8. The lifting mechanism according to any one of claims 1 to 6, further comprising a second fixing member including a first horizontal mounting surface and a second horizontal mounting surface oppositely arranged in a thickness direction thereof, wherein the first horizontal mounting surface is used for being attached to the bottom wall of the chamber;
first mounting includes the first connecting portion that extends along the horizontal direction, certainly first connecting portion buckle to vertical direction and extend the second connecting portion that forms and connect first connecting portion with the strengthening rib of second connecting portion, the upper surface of first connecting portion with the laminating of second horizontal installation face, the second connecting portion with sharp module fixed connection.
9. The lifting mechanism according to claim 8, wherein the linear module comprises a driving motor, a lead screw, a sliding block movably sleeved on the lead screw, and a coupling connecting an output shaft of the driving motor with the lead screw, a housing of the driving motor is fixedly connected with the second connecting portion, and the sliding block is fixedly connected with the tandem connection member.
10. The lifting mechanism according to claim 9, wherein a side of the second connecting portion facing the driving motor is provided with a second positioning flange, a housing of the driving motor is placed on the second positioning flange, and the housing is fixedly connected with the second connecting portion via a fastener.
11. A semiconductor processing apparatus, comprising a frame, a chamber disposed on the frame, and at least one lifting mechanism, wherein the lifting mechanism is the lifting mechanism of any one of claims 1 to 10, and the first fixing member connects the chamber and the linear module, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811425388.4A CN111223789B (en) | 2018-11-27 | 2018-11-27 | Lifting mechanism for chamber and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811425388.4A CN111223789B (en) | 2018-11-27 | 2018-11-27 | Lifting mechanism for chamber and semiconductor processing equipment |
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| CN111223789A true CN111223789A (en) | 2020-06-02 |
| CN111223789B CN111223789B (en) | 2024-04-26 |
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| CN104451586A (en) * | 2013-09-18 | 2015-03-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying-platform lifting apparatus, reaction chamber and plasma processing equipment |
| CN106548970A (en) * | 2015-09-23 | 2017-03-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lowering or hoisting gear and semiconductor processing equipment |
| CN108389821A (en) * | 2018-05-04 | 2018-08-10 | 成都华聚科技有限公司 | A kind of wafer individually picks and places and precise positioning mechanism with MASK |
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| CN111223789B (en) | 2024-04-26 |
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