CN111220893B - Power supply daughter board and testing machine - Google Patents

Abstract

The invention provides a power supply sub-board and a testing machine, wherein the power supply sub-board comprises: the first power supply conversion module is used for converting a power supply into a primary working power supply; the multiphase power supply management module is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding biphase control signal; the third power supply conversion module is connected with the first power supply conversion module and the multiphase power supply management module and is used for converting the primary working power supply into a target working power supply under the control of the biphase control signal; the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small. The invention improves the current supply capability and the power supply effect.

Description

Power supply daughter board and testing machine

Technical Field

The invention relates to the technical field of semiconductor testing, in particular to a power supply daughter board and a testing machine.

Background

The tester is a special device for testing semiconductor elements to be tested and other finished products, and can realize measurement of various electrical parameters so as to detect the electrical functions of the integrated circuit chip. With the gradual enhancement of chip integration and the development of big data in recent years, the power consumption of the communication chip is larger and larger, and the total working current of the chip is more than 500A at present and is developing towards 1000A.

However, the power supply of the conventional tester is mainly directly supplied through the tester, and the propagation path of the power directly supplied by the tester is: tester-spring pin area-test board-socket-semiconductor device under test. For example, using UHC4 boards, the maximum supply current supported by a single channel of such boards is 40A, so the current supply capability is limited to the number of boards and the number of channels. Moreover, the card position of the tester is substantially fixed, which also limits the overall effectiveness of card power.

Therefore, the problem of how to improve the current supply capability and the power supply effect is a technical problem that needs to be solved by those skilled in the art.

Disclosure of Invention

The invention aims to provide a power supply daughter board and a testing machine, which can improve the current supply capacity and the power supply effect.

The technical scheme provided by the invention is as follows:

the invention provides a power supply daughter board, comprising: the system comprises a first power conversion module, a multiphase power management module and a plurality of third power conversion modules;

The first power supply conversion module is used for converting a power supply into a primary working power supply;

The multi-phase power supply management module is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding dual-phase control signal;

the third power supply conversion module is connected with the first power supply conversion module and the multi-phase power supply management module and is used for converting the primary working power supply into a target working power supply under the control of the dual-phase control signal;

the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small.

The invention also provides a testing machine, which comprises a testing board, wherein the power supply daughter board is arranged on the front surface of the testing board through a daughter board connecting piece, a spring needle guide plate and a socket are arranged on the front surface of the testing board, a semiconductor element to be tested is arranged on the socket in a surface mounting mode or an inserting mode, and the semiconductor element to be tested is connected with the spring needle guide plate through a spring needle; the power supply sub-board includes: the system comprises a first power conversion module, a multiphase power management module and a plurality of third power conversion modules;

The first power supply conversion module is used for converting a power supply into a primary working power supply;

The multi-phase power supply management module is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding dual-phase control signal;

the third power supply conversion module is connected with the first power supply conversion module and the multi-phase power supply management module and is used for converting the primary working power supply into a target working power supply under the control of the dual-phase control signal;

the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small.

The power supply sub-board and the testing machine provided by the invention can improve the current supply capacity and the power supply effect.

Drawings

The above features, technical features, advantages and implementation manners of a power daughter board and a tester will be further described in a clear and understandable manner by describing preferred embodiments with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of one embodiment of a power daughter board of the present invention;

FIG. 2 is a schematic diagram of another embodiment of a power daughter board according to the present invention;

FIG. 3 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 4 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 5 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 6 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 7 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 8 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 9 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 10 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 11 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 12 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 13 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 14 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 15 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 16 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 17 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 18 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 19 is a schematic view of another embodiment of a power daughter board of the present invention;

FIG. 20 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 21 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 22 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 23 is a schematic diagram of another embodiment of a power daughter board of the present invention;

FIG. 24 is a schematic diagram of another embodiment of a power daughter board of the present invention;

Fig. 25 is a schematic structural view of another embodiment of a power daughter board of the present invention.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will explain the specific embodiments of the present invention with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the invention, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.

For the sake of simplicity of the drawing, the parts relevant to the present invention are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.

In one embodiment of the present invention, as shown in fig. 1, a power daughter board 6 includes: a first power conversion module 10, a multiphase power management module 20 and a plurality of third power conversion modules 30;

A first power conversion module 10 for converting a power supply into a primary working power supply;

The multiphase power supply management module 20 is connected with the first power supply conversion module 10 and is used for accessing a primary working power supply and outputting a corresponding biphase control signal;

a third power conversion module 30 connected to the first power conversion module 10 and the multiphase power management module 20 for converting the primary working power into a target working power under the control of the biphase control signal;

the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small.

Specifically, the voltage value of the power supply source is greater than the voltage value of the primary working source is greater than the voltage value of the target working source, and the current value of the power supply source is less than the current value of the primary working source is less than the current value of the target working source.

After the power supply sub-board 6 is connected to a power supply source (for example, 48V-10A) which is a high-voltage low-current power supply, the power supply sub-board 6 firstly converts the power supply source into a primary working power source (for example, 12V-40A) which is a power supply source of a medium-voltage medium-current power supply, and then converts the primary working power source (for example, 12V-40A) into a target working power source (for example, 0.8V-600A) which is a low-voltage high-current power supply. The power supply sub-card can be installed at the proper position of the test board 2 at will, and the quantity of the power supply sub-card installed on the test board 2 can be set at will under the condition that the area of the test board 2 is allowed to be contained, so that the power supply of the semiconductor element 11 to be tested provided on the socket 7 can meet the working requirement, support higher working current, and promote the current supply capacity and the power supply effect.

In one embodiment of the present invention, a power daughter board 6 further includes:

An energized state control module, a connector;

the connector is connected with the power-on state control module and is used for being connected with the power supply provided by the testing machine or the independent power supply 3;

the power-on state control module is configured to control a state in which the power supply is input to the first power conversion module 10.

Specifically, the semiconductor device under test 11 includes a wafer under test, a chip under test, and the like. As shown in fig. 23, the testing machine includes a testing board 2 and a testing head 0, a pogo pin area 01 of the testing head 0 is connected with the testing board 2 through a cable 4, a connecting piece 5 is connected with a pogo pin guide board through the cable 4, and the testing head 0 is provided with the pogo pin area 01. The power supply daughter board 6 is mounted on the front surface of the test board 2 through the daughter board connecting piece 5, the front surface of the test board 2 is provided with the spring needle guide plate 8 and the socket 7, the back surface of the test board 2 is connected with the spring needle guide plate 8 of the test board 2 through the spring needle area 01, the spring needle guide plate 8 plays a role in placing the body of the semiconductor element 11 to be tested, and the test board 2 fixes the power supply daughter board 6 on the front surface of the test board 2 through the reinforcement. The semiconductor element 11 to be tested is mounted on the socket 7 in a patch mode or a plug-in mode, and the semiconductor element 11 to be tested is electrically connected with the spring pin guide plate 8 through the spring pin 12. Methods for mounting chips in a patch manner and in a socket manner are well known in the art and will not be described in detail herein.

As shown in fig. 23, a schematic diagram of a power supply scenario is shown, in which a power supply provided by a testing machine is connected to a power output interface of the testing machine through a connector, and the power propagation path of the scenario is as follows: tester- & gt test board 2- & gt daughter board connector 5- & gt power supply daughter board 6- & gt daughter board connector 5- & gt test board 2- & gt socket 7- & gt semiconductor element 11 to be tested.

As shown in another power supply scenario of fig. 24, the testing machine includes a testing board 2, an independent power source 3 is connected with the testing board 2 through a cable 4, a connector 5 is connected with a pogo pin guide plate 8 through the cable 4, and a pogo pin area 01 is provided on the testing head 0. The power supply daughter board 6 is mounted on the front surface of the test board 2 through the daughter board connecting piece 5, the front surface of the test board 2 is provided with a spring needle guide plate 8 and a socket 7, the spring needle guide plate 8 plays a role in placing a body of a semiconductor element 11 to be tested, and the test board 2 fixes the power supply daughter board 6 on the front surface of the test board 2 through the reinforcement. The semiconductor element 11 to be tested is mounted on the socket 7 in a patch mode or a plug-in mode, and the semiconductor element 11 to be tested is electrically connected with the spring pin guide plate 8 through the spring pin 12. The connector is directly connected with the independent power supply 3 to be connected with the power supply provided by the independent power supply 3. Power supply propagation path for this scenario: independent power supply 3, test board 2, daughter board connector 5, power supply daughter board 6, daughter board connector 5, test board 2, socket 7 and semiconductor element 11 to be tested.

If the power supply provided by the independent power supply 3 is connected, the power supply does not depend on the electric quantity resource of the testing machine, and particularly, the burden of the testing machine is reduced under the condition that the electric quantity resource of the testing machine is relatively tense.

The power-on state control module can control whether the power supply connected through the connector is input to the first power conversion module 10 through transmission according to the on-off state of the power-on state control module, namely, can control whether the power supply provided by the testing machine or the independent power supply 3 is input to the first power conversion module 10. The power-on state control module plays a role of a switch, so that the input state of the power supply is controlled, power can be supplied to the semiconductor element 11 to be tested when power is required to be supplied to the semiconductor element to be tested for testing, and the power-on state control module is convenient and fast to use.

In one embodiment of the present invention, the power-on state control module includes: the on-off control unit and the protection control unit;

the on-off control unit is connected with the connector and the protection control unit and is used for accessing the power supply input by the connector;

The protection control unit is connected with the on-off control unit and is used for controlling the conducting state of the first power conversion module 10 according to the detected voltage or current value and controlling the state of the power supply input to the first power conversion module 10 according to the conducting state.

Preferably, as shown in fig. 2, the on-off control unit includes: the device comprises a resistor, a capacitor, a patch fuse (F1), a zero ohm resistor, an N-type MOS tube, a voltage stabilizing diode and a transient suppression diode;

the first end of the patch fuse (F1) is connected with a direct current power interface of the connector;

the second end of the patch fuse (F1) is connected with the first end of the first resistor (R76), the drain electrodes of the first N-type MOS tube (TR 3) and the second N-type MOS tube (TR 4) respectively;

The second end of the first resistor (R76) is respectively connected with the first end of the second resistor (R80), the anode of the first zener diode (D7), the source electrodes of the first N-type MOS tube (TR 3) and the second N-type MOS tube (TR 4);

The grid electrode of the second N-type MOS tube (TR 4) is correspondingly connected with the first ends of the third resistor (R78) and the fourth resistor (R77) respectively;

the second ends of the second resistor (R80), the third resistor (R78) and the fourth resistor (R77) are respectively connected with a power return interface (RTN) of the connector, the cathode of the first zener diode (D7) and the second end of the first charging capacitor (C118);

The cathode of the first zener diode (D7) is connected with the first end of the first charging capacitor (C118), the first N-type MOS tube (TR 3), the grid electrode of the second N-type MOS tube (TR 4) and the first end of the second resistor (R80);

The anode of the first zener diode (D7) is respectively connected with the cathode of the transient suppression diode (D8), the first end of the first capacitor (C119), the first end of the first zero ohm resistor (R84), and the sources of the protection control unit, the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6);

the sources of the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are connected with the first end of the second charging capacitor (C120), and the second end of the second charging capacitor (C120) is connected with the anode of the first zener diode (D7);

The second end of the first zero ohm resistor (R84) is connected with the second end of the first capacitor (C119) and then connected with the protection control unit;

the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are connected with the common grid electrode and the protection control unit;

Drains of the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are respectively connected with anodes of the transient suppression diode (D8) and then connected with the protection control unit.

Specifically, the model of the patch fuse (F1) is 0456030.ER, the model of the N-type MOS tube is STH180N10F3-2, the model of the voltage stabilizing diode is BZX84C12LT1G, and the model of the transient suppression diode (D8) is 1.5SMC200A-E3/57T.

After the connector is connected to a testing machine or a power supply provided by the independent power supply 3, once the current passing through the patch fuse (F1) is higher than the fusing current of the patch fuse (F1), the patch fuse (F1) automatically fuses and cuts off the current to protect the safety of the power supply daughter board 6. And because the grid voltage of the N-type MOS tube is larger than the source voltage, namely, the grid-source voltage difference is larger than a certain value, the N-type MOS tube is conducted, and according to the first N-type MOS tube (TR 3), the second N-type MOS tube (TR 4), the grid-source voltages of the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) control the state that power supply electricity is input to the protection control unit.

Preferably, as shown in fig. 3, the protection control unit includes: a hot plug controller (U8), a resistor, a Schottky barrier diode and a Schottky mounting diode;

The power input pin (pin number 1) of the hot plug controller (U8) is respectively connected with the second ends of the second resistor (R80), the third resistor (R78) and the fourth resistor (R77), the anode of the first zener diode (D7) and the first control pin (pin number 10) of the hot plug controller (U8);

An under-voltage locking output pin (pin number is 2) of the hot plug controller (U8), and an over-voltage locking output pin (pin number is 3) is respectively connected with second ends of a second resistor (R80), a third resistor (R78) and a fourth resistor (R77);

An undervoltage locking output pin (pin number 2), an overvoltage locking output pin, a second control pin (pin number 4), a negative voltage power supply pin (pin number 5) and a timing control pin (pin number 6) of the hot plug controller (U8) are respectively connected with a first interface (1) and a second interface (2) of the Schottky mounting diode (D10);

a third control pin (pin number 8) of the hot plug controller (U8) is respectively connected with a first end of a fifth resistor (R99), an anode of a Schottky barrier diode (D9), gates of a third N-type MOS tube (TR 5) and a fourth N-type MOS tube (TR 6), and a second end of the fifth resistor (R99) and a cathode of the Schottky barrier diode (D9) are respectively connected with a first interface (1) and a second interface (2) of a Schottky mounting diode (D10);

the first interface (1) and the second interface (2) of the Schottky mounting diode (D10) are respectively connected with the anode of the first zener diode (D7);

a fourth control pin of the hot plug controller (U8) is respectively connected with the second end of the first zero ohm resistor (R84) and the second end of the first capacitor (C119);

The power output pin (pin number 9) of the hot plug controller (U8) is connected with the drains of the third interface (3), the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) of the Schottky mounting diode (D10) so as to control the output state of the power supply according to the on-off state of the power supply.

Specifically, the hot plug controller (U8) is provided with a Schottky barrier diode (D9) of RB520S30T1G, and the Schottky mounting diode (D10) is provided with a PDS5100H-13. The negative voltage supply pin (pin number 5) of the hot plug controller (U8) is connected to a negative supply (typically-48V). The hot plug controller (U8) can control the surge current, and the influence on other circuits in the testing machine is minimized, so that possible accidental reset is prevented. When the detected voltage value is lower than a preset undervoltage threshold value, the undervoltage locking output pin (pin number is 2) turns off the hot plug controller (U8). When the detected voltage value is higher than the preset overvoltage threshold value, the overvoltage locking output pin (pin number 3) turns off the hot plug controller (U8), so that the system is protected from the influence of sudden short circuit of a load (here, the socket 7 arranged on the test board 2 and the semiconductor element 11 to be tested in the socket), and transient protection is provided for the whole system.

When the first N-type MOS transistor (TR 3), the second N-type MOS transistor (TR 4), the third N-type MOS transistor (TR 5) and the fourth N-type MOS transistor (TR 6) are turned on, and the hot plug controller (U8) detects that no overvoltage or undervoltage phenomenon occurs, a power supply is output to the first power conversion module 10 through a power output pin (pin number is 9). The output of the power supply to the first power conversion module 10 is terminated once any one of the above conditions is not satisfied.

When the power supply is connected, the first N-type MOS tube (TR 3), the second N-type MOS tube (TR 4), the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are blocked by internal pull-down current at a third control pin (pin number is 8). When the working voltage (VCC-VEE) of the hot plug controller (U8) reaches a threshold value, a capacitor connected with a timing control pin (pin number is 6) is charged, and the first N-type MOS tube (TR 3), the second N-type MOS tube (TR 4), the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are kept cut off. When the voltage of the capacitor connected with the timing control pin (pin number 6) reaches a voltage higher than the voltage at the negative voltage power supply pin (pin number 5), and the working voltage (VCC-VEE) of the hot plug controller (U8) reaches a preset starting voltage threshold, the first N-type MOS tube (TR 3), the second N-type MOS tube (TR 4), the third N-type MOS tube (TR 5) and the fourth N-type MOS tube (TR 6) are conducted, and the third control pin (pin number 8) charges the second charging capacitor. During power-on, along with the increase of the voltage on a power output pin (pin number 9) relative to the ground, a hot plug controller (U8) monitors drain currents and power consumption of a first N-type MOS tube (TR 3), a second N-type MOS tube (TR 4), a third N-type MOS tube (TR 5) and a fourth N-type MOS tube (TR 6), so that large surge current is prevented from being caused when the first connector is connected to a power supply for hot plug operation, and components on the power supply daughter board 6 are protected.

As shown in fig. 4, 5, 6 and 7, the first power conversion module 10 includes: a transformer (U11), a step-down voltage regulator (U7), a voltage regulator (D1), a voltage regulator diode, a photoelectric coupler, a board-to-board connector (J106) and an RC filter unit;

The third interface (3) of the transformer (U11) is connected with a power output pin of the hot plug controller (U8) to be connected with a power supply, and the first interface (1) of the transformer (U11) is connected with a power input pin of the hot plug controller (U8);

the second interface (2) of the transformer (U11) is respectively connected with the second end of the second capacitor (C174), the second end of the third capacitor (C105) and the positive power input pin (pin number is 1) of the voltage-reducing voltage stabilizer (U7);

the fourth interface (4) of the transformer (U11) is respectively connected with the fourth capacitor (C175), the fifth capacitor (C104), the first end of the sixth capacitor (C49) and the negative power input pin (pin number 4) of the step-down voltage stabilizer (U7);

The switch control pin (pin number 2) of the step-down voltage stabilizer (U7) is respectively connected with the second end of the sixth capacitor (C49), the first interface (1) of the board-to-board connector (J106), the third interface (3) and the fourth interface (4) of the first photoelectric coupler (U13);

The second capacitor is connected in series with the fourth capacitor and then grounded, and the third capacitor is connected in series with the fifth capacitor and then grounded;

The circuit protection pin (pin number is 3) of the step-down voltage stabilizer (U7) is respectively connected with the cathode of the first voltage stabilizer (D1) and the third interface (3) of the second photoelectric coupler (U12);

The anode of the first voltage stabilizing regulator (D1) is respectively connected with the anode of the second voltage stabilizing diode (D6), the third interface (3) of the first photoelectric coupler (U13) and the second interface (2) of the board-to-board connector (J106);

The first interface (1) and the second interface (2) of the first photoelectric coupler (U13) are respectively connected through a seventh capacitor (C171);

a first negative power supply output pin (pin number 5) and a second negative power supply output pin (pin number 6) of the step-down voltage stabilizer (U7) are respectively connected with the first RC filter unit, and the second RC filter unit is connected with the first primary working power supply (V_12V0_DP1) and the second primary working power supply (V_12V0_IN);

The first positive power supply output pin (pin number 7) and the second positive power supply output pin (pin number 8) of the step-down voltage stabilizer (U7) are respectively connected with the first interface (1) of the second photoelectric coupler (U12), the first RC filter unit and the second RC filter unit to output a first primary working power supply (V_12V0_DP1) and a second primary working power supply (V_12V0_IN);

The second interface (2) of the second photoelectric coupler (U12) is grounded digitally, and the fourth interface (4) of the second photoelectric coupler (U12) is connected with the cathode of the second zener diode (D6).

Specifically, as shown in fig. 6, the dashed area is a first RC filtering unit, and the area except for the dashed area and U7 in fig. 6 is a second RC filtering unit. The transformer (U11) is connected with the first power supply conversion module 10 to be connected with a power supply, the output voltage is reduced through the first photoelectric coupler (U13) and the second photoelectric coupler (U12), and the voltage value and the current value of the first primary working power supply (V_12V0_DP1) and the second primary working power supply (V_12V0_IN) are kept stable.

In one embodiment of the present invention, as shown in fig. 8, 9, 10, 11, 12, 13, 14, 15 and 16, the second power conversion module includes: a monitor (U9), a DC-DC converter, and a power converter;

The power input pin (with the pin number of VIN) of the first DC-DC converter (CB 1) is connected to the first primary working power supply (V_12V0_DP1), and the power output pin (with the pin number of VOUT) of the first DC-DC converter (CB 1) outputs a first intermediate power supply (V_5V0_DP1);

a power input pin (with a pin number of VIN) of the second DC-DC converter (CB 2) is connected to the first primary working power supply (V_12V0_DP1), and a power output pin (with a pin number of VOUT) of the second DC-DC converter (CB 2) outputs a second intermediate power supply (V_3V3_DP1);

The POWER supply control pins (with pin numbers PG_POWER) of the first DC-DC converter (CB 1) and the second DC-DC converter (CB 2) are respectively connected with the POWER supply input pins (with pin numbers 35) of the first POWER supply converter (U01-01S) and the second POWER supply converter (U01-01S);

the first control pins (with pin numbers PG) of the first DC-DC converter (CB 1) and the second DC-DC converter (CB 2) are respectively connected with the first control pins (with pin numbers 23) of the first power converter (U01_01S) and the second power converter (U01_01S);

the enabling control pins (with the pin number of EN) of the first DC-DC converter (CB 1) and the second DC-DC converter (CB 2) are respectively connected with the enabling control pins (with the pin number of 22) of the first power converter (U01_01S) and the second power converter (U01_01S);

The positive analog input pin (pin number 10) of the monitor (U9) is connected to the second primary working power supply (V_12V0_IN), and the analog input pin (pin number 8) and the negative analog input pin (pin number 9) of the monitor (U9) are respectively connected to the first primary working power supply (V_12V0_DP1);

The power input pin (pin number 6) of the monitor (U9) is connected with the serial data pin (pin number 4) of the monitor (U9) through the first sampling resistor (R108), and then is connected with the second intermediate power supply (V_3V3_DP1);

The power input pin (pin number 6) of the monitor (U9) is connected with the serial clock pin (pin number 5) of the monitor (U9) through the second sampling resistor (R109), and then is connected with the second intermediate power supply (V_3V3_DP1).

Specifically, the second intermediate power supply (v_3v3_dp1) provides a chip working power supply for the monitor (U9), so that the monitor (U9) monitors the shunt voltage drop and the working voltage in the loop, and then periodically reads the loop current value and the loop voltage value obtained by monitoring according to the clock signal, thereby facilitating real-time monitoring of whether the generated primary working power supply accords with the required current range and the voltage range. The first DC-DC converter (CB 1) and the first power converter (U01_01S) are used for cooperatively monitoring the current value and the voltage value in a loop where the first sampling resistor (R108) is located, and the input first primary working power supply (V_12V0_DP1) is subjected to voltage drop conversion to output a first intermediate power supply (V_5V0_DP1). Similarly, the second DC-DC converter (CB 2) and the second power converter (U02_01S) are used for cooperatively monitoring the current value and the voltage value in the loop where the second sampling resistor (R109) is located, and the input first primary working power supply (V_12V0_DP1) is subjected to voltage drop conversion to output a second intermediate power supply (V_3V3_DP1).

In one embodiment of the present invention, as shown in fig. 19, 20, 21, 22, the multiphase power management module 20 includes: the digital PWM multiphase controller (U5), a resistor, a capacitor, a current limiting resistor, an adapter (SN), an N-type field effect transistor, a patch capacitor, a light emitting diode and a plurality of zero ohm resistor pairs;

the voltage detection pin (with the pin number of 27) and the plug detection cathode (with the pin number of 28) of the digital PWM multiphase controller (U5) are respectively connected with the power output pins (with the pin number of VOUT) of a plurality of adapters (SN);

A first power input pin (pin number 54) of the digital PWM multiphase controller (U5) is connected to a second intermediate power supply (V_3V3_DP1);

the PHASE input pins (with pin numbers of 29, 30, 31, 32, 33, 34, 35, 36, 37 and 38) of the digital PWM multiphase controller (U5) are connected with the PHASE control pins (IOUT_PHASE_A/B) of the adapter (SN) and then connected with an A PHASE regulation signal (IOUT_ PHASEN _A) output by the third power supply conversion module;

Or the PHASE input pins (with pin numbers of 29, 30, 31, 32, 33, 34, 35, 36, 37 and 38) of the digital PWM multiphase controller (U5) are connected with the PHASE control pins (IOUT_PHASE_A/B) of the adapter (SN) and then connected with the B PHASE regulation signal (IOUT_ PHBSEN _B) output by the third power supply conversion module;

The PHASE output pins (with pin numbers of 14, 13, 12, 11, 10, 9, 8, 7, 6 and 5) of the digital PWM multiphase controller (U5) are respectively connected with the third power conversion module after isolating the output PHASE control signals (PWM_ PHASEN _DP1) through corresponding zero ohm resistance pairs to obtain A-PHASE PWM control signals (PWM_ PHASEN _A) and B-PHASE PWM control signals (PWM_ PHASEN __ B) which are respectively input to the A-PHASE pin (PWM_PHASE_A) and the B-PHASE pin (PWM_PHASE_B) of the corresponding adapter (SN);

The first power input pin (VCC) and the second power input pin (VIN) of the adapter (SN) are respectively connected into a first intermediate power supply (V_5V0_DP1) and a first primary working power supply (V_12V0_DP1);

The phase detection pin (pin number 53) of the digital PWM multiphase controller (U5) is connected with the overcurrent detection pins (pin number ISEN_REF) of the plurality of adapters (SN);

a first control pin (pin number 52) of the digital PWM multiphase controller (U5) is connected with first ends of an eighth capacitor (C93) and a sixth resistor (R28) respectively and then connected with a first primary working power supply (V_12V0_DP1);

A second control pin (pin number 50) of the digital PWM multiphase controller (U5) is connected with first ends of a ninth capacitor (C94) and a seventh resistor (R29) respectively and then connected with a first primary working power supply (V_12V0_DP1);

an eighth capacitor (C93), a ninth capacitor (C94), a sixth resistor (R28) and a seventh resistor (R29) are grounded to the digital ground;

A third control pin (with a pin number of 51) of the digital PWM multiphase controller (U5) is connected with a first control pin (with a pin number of TOUT) of the plurality of adapters (SN);

A fourth control pin (pin number 18), a fifth control pin (pin number 20), a sixth control pin (pin number 22), a seventh control pin (pin number 48), an eighth control pin (pin number 17), a ninth control pin (pin number 49), a tenth control pin (pin number 19), an eleventh control pin (pin number 21), a twelfth control pin (pin number 15) and a thirteenth control pin (pin number 16) are respectively connected with corresponding current limiting resistors and then connected with a second intermediate power supply (V_3V3_DP1);

a fourteenth pin (pin number 21) of the digital PWM multiphase controller (U5) is connected with the first polarity capacitor and then connected with the digital ground.

Preferably, as shown in fig. 17, 18, 19, 21 and 22, the third power conversion module 30 includes: a plurality of two-phase voltage stabilizer groups; the two-phase voltage stabilizer group comprises an A-phase switching voltage stabilizer and a B-phase switching voltage stabilizer; the number of the two-phase voltage stabilizer group, the number of the adapter (SN) and the number of the zero ohm resistor pairs are the same;

the first power input pins (pin numbers 25, 26, 27, 28, 29, 30) of the biphase voltage stabilizer group are connected to the filtered first primary working power supply (V_12V0_DP1);

a second power input pin (pin number is 3) of the biphase voltage stabilizer group is connected to a first intermediate power supply (V_5V0_DP1);

The detection control pin (with the pin number of 36) of the biphase voltage stabilizer group is connected with the first control pin (with the pin number of TOUT) of the corresponding adapter (SN);

The high impedance input pin (pin number 39) of the two-phase voltage regulator set is connected with the overcurrent detection pin (ISEN_REF) of the corresponding adapter (SN);

the PWM control pin (pin number 34) of the A-PHASE switching regulator is connected with the A-PHASE control pin (PWM_PHASE_A) of the corresponding adapter (SN) and then connected with the A-PHASE PWM control signal, and the PWM control pin (pin number 34) of the B-PHASE switching regulator is connected with the B-PHASE control pin (PWM_PHASE_B) of the corresponding adapter (SN) and then connected with the B-PHASE PWM control signal;

The regulation control pin (with the pin number of 1) of the two-phase voltage stabilizer group is connected with the power output pin (with the pin number of VOUT) of the corresponding adapter (SN);

The PHASE control pin (IOUT_PHASE_A/B) of the adapter (SN) is connected into the A PHASE regulation signal (IOUT_ PHASEN _A) output by the PHASE control pin (pin number 38) of the A-PHASE switching regulator or the B PHASE regulation signal (IOUT_ PHASEN _B) output by the PHASE control pin (pin number 38) of the B-PHASE switching regulator;

The voltage driving control pin (with the pin number of VDRV) and the enabling control pin (with the pin number of EN) of the biphase voltage stabilizer group are connected into a first primary working power supply (V_12V0_DP1) after being short-circuited;

the phase control pin (pin number 32) of the A-phase switching regulator is short-circuited with the bootstrap control pin (pin number 33) of the A-phase switching regulator;

The phase control pin (pin number 32) of the B-phase switching regulator is in capacitance short circuit with the bootstrap control pin (pin number 33) of the B-phase switching regulator;

The power switch control pins (pin number 10, pin number 11, pin number 12, pin number 13, pin number 14, pin number 15, pin number 16, pin number 17, pin number 18 and pin number 19) of the dual-phase voltage stabilizer group are connected with the inductor and then output corresponding target working power sources (0.75V-1V).

Specifically, N is a natural number, where N is greater than 1 and less than a preset value, and the preset value is the minimum value of the number of the two-phase voltage stabilizer groups and the number of phase output pins of the digital PWM multiphase controller.

When the digital PWM multiphase controller (U5) receives the a-phase regulation signal (iout_ PHASEN _a) or the B-phase regulation signal (iout_ PHASEN _b), the a-phase switching regulator and the B-phase switching regulator in the current biphase voltage regulator set output the a-phase regulation signal (iout_ PHASEN _a) and the B-phase regulation signal (iout_ PHASEN _b), respectively, the phase output pins (pins 14, 13, 12, 11, 10, 9, 8, 7, 6, 5) of the digital PWM multiphase controller (U5) can be triggered to output corresponding phase control signals, the phase control signals are input from the first ends of the corresponding zero ohm resistor pairs, and the second ends of the zero ohm resistor pairs output the corresponding a-phase PWM control signals (pwm_ PHASEN _a) and B-phase PWM control signals (pwm_ PHASEN __ B), respectively. The a-PHASE control pin (pwm_phase_a) and the B-PHASE control pin (pwm_phase_b) of the adapter (SN) connected to the current two-PHASE voltage regulator set input the a-PHASE PWM control signal (pwm_ PHASEN _a) and the B-PHASE PWM control signal (pwm_ PHASEN __ B) to the PWM control pin (pin number 34) of the a-PHASE switching voltage regulator and the PWM control pin (pin number 34) of the B-PHASE switching voltage regulator, respectively, and the two-PHASE voltage regulator set generates the corresponding target operating power supply.

The first zero ohm resistor pair includes a second zero ohm resistor (R35) and a third zero ohm resistor (R36). The first a-PHASE switching regulator and the first B-PHASE switching regulator in the first two-PHASE voltage regulator respectively output a first a-PHASE regulation signal (iout_phase 1_a) and a B-PHASE regulation signal (iout_phase 1_b), a first PHASE output pin (pin number 14) of the trigger digital PWM multiphase controller (U5) outputs a corresponding first PHASE control signal number (pwm_phase 1_dp1), the first PHASE control signal number (pwm_phase 1_dp1) is input from first ends of a first zero ohm resistor pair, namely a second zero ohm resistor (R35) and a third zero ohm resistor (R36), and a second end of the first zero ohm resistor pair respectively outputs a first a-PHASE PWM control signal (pwm_phase 1_a) and a first B-PHASE PWM control signal (pwm_phase 1__ B). The first a-PHASE PWM control signal (pwm_phase 1_a) is input to the PWM control pin (pin number 34) of the a-PHASE switching regulator through the first converter (S1), and the first B-PHASE PWM control signal (pwm_phase 1__ B) is input to the PWM control pin (pin number 34) of the B-PHASE switching regulator through the first converter (S1). And after the first biphase voltage stabilizer receives the corresponding A or B phase PWM control signal, outputting a corresponding target working power supply according to the duty ratio of the A or B phase PWM control signal.

Based on the above embodiment, as shown in fig. 23, the main operation principle of the power supplied by the tester is as follows:

the testing machine supplies a high-voltage low-current power supply (for example, 48V-10A) to the power supply sub-board 6, the first power supply conversion module 10 of the power supply sub-board 6 firstly converts the power supply into a medium-voltage medium-current power supply (for example, 12V-40A), then converts the primary working power supply into a low-voltage high-current power supply (for example, 0.8V-600A) through the third power supply conversion module of the power supply sub-board 6, then the power supply sub-board 6 transmits the target working power supply to the testing board 2 again through the connecting piece 5, and the testing board 2 is responsible for supplying the power supply to the semiconductor element 11 to be tested.

Based on the above embodiment, as shown in fig. 24, the main operation principle of the power supply by the independent power source 3 is as follows:

The independent power supply 3 supplies a high-voltage low-current power supply (for example, 48V-10A) to the power supply sub-board 6, the first power conversion module 10 of the power supply sub-board 6 firstly converts the power supply into a medium-voltage medium-current power supply (for example, 12V-40A), then converts the primary power supply into a low-voltage high-current power supply (for example, 0.8V-600A) through the third power conversion module of the power supply sub-board 6, and then the power supply sub-board 6 transmits the target power supply to the test board 2 again through the connecting piece 5, and the test board 2 is responsible for supplying the power supply to the semiconductor element 11 to be tested.

By this embodiment, the power supply by using the power sub-board 6 is not limited by the board card position of the test board 2, and better power supply performance can be achieved. The power supply sub-boards 6 can be placed at proper positions of the test board 2 according to the needs, and the number of the power supply sub-boards 6 can be selected according to the needs, and can be 4 or even 8. As shown in fig. 25, an example of a power board 6 is shown, and the main working principle is that the buck regulator (U7) at the upper left side of fig. 25 is responsible for converting 48V into 12V (the power board 6 converts high voltage and low current into medium voltage and medium current), the first power converter U01_01s and the second power converter U02_01s in the second power conversion module convert to obtain an intermediate working power supply to supply the intermediate working power to the digital PWM multiphase controller (U5), the digital PWM multiphase controller (U5) is used for managing the dual-phase regulator set to generate a power state, and then the dual-phase regulator set (including un_01p and un_02p) is used for converting the 12V power supply into a target working power supply required by the semiconductor device 11 to be tested, so as to support converting and outputting the target working power supply in the range of 0.75V-1V. The voltage value of the power supply source is larger than the voltage value of the primary working power source, the voltage value of the intermediate working power source is larger than the voltage value of the target working power source, and the current value of the power supply source is smaller than the current value of the primary working power source, the voltage value of the intermediate working power source is smaller than the current value of the target working power source.

Through the embodiment, the power supply daughter board 6 supplies power to the semiconductor element 11 to be tested, so that the burden of the tester is reduced, higher working current can be supported, the tester resources are not depended, and particularly under the condition that the tester resources are relatively tense, the current supply capability and the power supply effect are improved. In addition, the installation positions and the number of the power supply sub-boards 6 can be configured and selected according to the needs, so that the power supply is more flexible, better power supply performance is realized, and the current supply capacity and the power supply effect are improved.

An embodiment of the invention, a testing machine, including the test board 2, the power daughter board 6 of any of the above-mentioned embodiments is installed on the front of the said test board 2 through the daughter board connecting piece 5, the front of the said test board 2 has spring needle guide 8 and socket 7, the semiconductor component 11 to be tested is installed on the said socket 7 through the way of the paster or way of the grafting, the semiconductor component 11 to be tested is connected with said spring needle guide 8 through the spring needle 12;

The power supply sub-board 6 includes: a first power conversion module 10, a second power conversion module, a multiphase power management module 20 and a plurality of third power conversion modules 30;

A first power conversion module 10 for converting a power supply into a primary working power supply;

The multiphase power supply management module 20 is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding biphase control signal;

A third power conversion module 30 connected to the first power conversion module 10 and the multiphase power management module 20 for converting the primary working power into a target working power under the control of the biphase control signal; the voltage values are sequentially from big to small: the power supply, the primary working power supply, the intermediate working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small.

It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.

Claims (9)

1. A power daughter board, comprising: the system comprises a first power conversion module, a multiphase power management module and a plurality of third power conversion modules;

The first power supply conversion module is used for converting a power supply into a primary working power supply;

The multi-phase power supply management module is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding dual-phase control signal;

the third power supply conversion module is connected with the first power supply conversion module and the multi-phase power supply management module and is used for converting the primary working power supply into a target working power supply under the control of the dual-phase control signal;

the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the reverse order of the current value from large to small and the voltage value from large to small;

The power daughter board further includes: an energized state control module, a connector;

The connector is connected with the power-on state control module and is used for being connected with the power supply provided by the testing machine or the independent power supply;

the power-on state control module is used for controlling the state of the power supply input to the first power supply conversion module;

the power-on state control module includes: the on-off control unit and the protection control unit;

The on-off control unit is connected with the connector and used for accessing the power supply input by the connector;

The protection control unit is connected with the on-off control unit and used for controlling the conducting state of the first power supply conversion module according to the detected voltage or current value and controlling the state of the power supply input to the first power supply conversion module according to the conducting state.

2. The power daughter board of claim 1, wherein the on-off control unit comprises: the device comprises a resistor, a capacitor, a patch fuse, a zero ohm resistor, an N-type MOS tube, a voltage stabilizing diode and a transient suppression diode;

The first end of the patch fuse is connected with a direct current power interface of the connector;

the second end of the patch fuse is connected with the first end of the first resistor, the drain electrodes of the first N-type MOS tube and the second N-type MOS tube respectively;

The second end of the first resistor is connected with the first end of the second resistor, the anode of the first zener diode and the sources of the first N-type MOS tube and the second N-type MOS tube respectively;

the grid electrode of the first N-type MOS tube is correspondingly connected with the first ends of the third resistor and the fourth resistor respectively;

The second ends of the second resistor, the third resistor and the fourth resistor are respectively connected with a power return interface of the connector, the cathode of the first zener diode is connected, and the second end of the first charging capacitor is connected;

The cathode of the first zener diode is connected with the first end of the first charging capacitor, the first N-type MOS tube, the grid electrode of the second N-type MOS tube and the first end of the second resistor;

the anode of the first voltage stabilizing diode is respectively connected with the cathode of the transient suppression diode, the first end of the first capacitor, the first end of the first zero ohm resistor, the protection control unit, the sources of the third N-type MOS tube and the fourth N-type MOS tube;

the sources of the third N-type MOS tube and the fourth N-type MOS tube are connected with the first end of the second charging capacitor, and the second end of the second charging capacitor is connected with the anode of the first zener diode;

The second end of the first zero ohm resistor is connected with the second end of the first capacitor and then connected with the protection control unit;

the third N-type MOS tube and the fourth N-type MOS tube share a grid and are connected with the protection control unit;

And the drains of the third N-type MOS tube and the fourth N-type MOS tube are respectively connected with the anode of the transient suppression diode and then connected with the protection control unit.

3. The power daughter board of claim 2, wherein the protection control unit comprises: a hot plug controller, a resistor, a schottky barrier diode and a schottky mount diode;

The power input pin of the hot plug controller is respectively connected with the second ends of the second resistor, the third resistor and the fourth resistor, the anode of the first zener diode and the first control pin of the hot plug controller;

The under-voltage locking output pin of the hot plug controller is respectively connected with the second ends of the second resistor, the third resistor and the fourth resistor;

the under-voltage locking output pin, the over-voltage locking output pin, the second control pin and the negative voltage power supply pin of the hot plug controller are respectively connected with the first interface and the second interface of the Schottky mounting diode;

The third control pin of the hot plug controller is respectively connected with the first end of the fifth resistor, the anode of the Schottky barrier diode and the grid electrodes of the third N-type MOS tube and the fourth N-type MOS tube, and the second end of the fifth resistor and the cathode of the Schottky barrier diode are respectively connected with the first interface and the second interface of the Schottky mounting diode;

The first interface and the second interface of the Schottky mounting diode are respectively connected with the anode of the first voltage stabilizing diode;

the fourth control pin of the hot plug controller is connected with the second end of the first capacitor and the first zero ohm resistor respectively;

and a power output pin of the hot plug controller is connected with the third interface of the Schottky mounting diode, the third N-type MOS tube and the drain electrode of the fourth N-type MOS tube, so that the output state of the power supply is controlled according to the on-off state of the power supply.

4. The power daughter board of claim 3, wherein the first power conversion module comprises: the device comprises a transformer, a step-down voltage stabilizer, a voltage stabilizing regulator, a voltage stabilizing diode, a photoelectric coupler, a board-to-board connector and an RC filter unit;

The third interface of the transformer is connected with the power output pin of the hot plug controller, and the first interface of the transformer is connected with the power input pin of the hot plug controller;

the second interface of the transformer is respectively connected with the second end of the second capacitor, the second end of the third capacitor and the positive power input pin of the step-down voltage stabilizer;

The fourth interface of the transformer is respectively connected with the first ends of the fourth capacitor, the fifth capacitor and the sixth capacitor and the negative power input pin of the step-down voltage stabilizer;

The switch control pin of the step-down voltage stabilizer is respectively connected with the second end of the sixth capacitor, the first interface of the board-to-board connector, the third interface and the fourth interface of the first photoelectric coupler;

the second capacitor is connected in series with the fourth capacitor and then grounded, and the third capacitor is connected in series with the fifth capacitor and then grounded;

The circuit protection pin of the step-down voltage stabilizer is connected with the cathode of the first voltage stabilizer and the third interface of the second photoelectric coupler respectively;

The anode of the first voltage stabilizing regulator is respectively connected with the anode of the second voltage stabilizing diode, the third interface of the first photoelectric coupler and the second interface of the board-to-board connector;

the first interface and the second interface of the first photoelectric coupler are respectively connected through a seventh capacitor;

The first negative power supply output pin and the second negative power supply output pin of the buck voltage regulator are respectively connected with the first RC filter unit and the second RC filter unit to output a first primary working power supply and a second primary working power supply;

The first positive power supply output pin and the second positive power supply output pin of the step-down voltage stabilizer are respectively connected with a first interface of the second photoelectric coupler, the first RC filter unit and the second RC filter unit to output a first primary working power supply and a second primary working power supply;

And a second interface of the second photoelectric coupler is grounded, and a fourth interface of the second photoelectric coupler is connected with a cathode of the second zener diode.

5. The power daughter board of any one of claims 1-4, further comprising: a second power conversion module;

the second power supply conversion module is connected with the first power supply conversion module and the multiphase power supply management module and is used for converting the primary working power supply into an intermediate working power supply to supply power to the multiphase power supply management module.

6. The power daughter board of claim 5, wherein the second power conversion module comprises: the system comprises a monitor, a DC-DC converter and a power supply converter;

The power input pin of the first DC-DC converter is connected with a first primary working power supply, and the power output pin of the first DC-DC converter outputs a first intermediate power supply;

the power input pin of the second DC-DC converter is connected with the first primary working power supply, and the power output pin of the second DC-DC converter outputs a second intermediate power supply;

the power supply control pins of the first DC-DC converter and the second DC-DC converter are respectively connected with the power supply input pins of the first power supply converter and the second power supply converter;

The first control pins of the first DC-DC converter and the second DC-DC converter are respectively connected with the first control pins of the first power converter and the second power converter;

The enabling control pins of the first DC-DC converter and the second DC-DC converter are respectively connected with the enabling control pins of the first power converter and the second power converter;

the positive analog input pin of the monitor is connected with a second primary working power supply, and the analog input pin and the negative analog input pin of the monitor are respectively connected with a first primary working power supply;

the power input pin of the monitor is connected with the serial data pin of the monitor through the first sampling resistor and then is connected with the second intermediate power supply;

And a power input pin of the monitor is connected with a serial clock pin of the monitor through a second sampling resistor, and then is connected with the second intermediate power supply.

7. The power daughter board of claim 6, wherein the multi-phase power management module comprises: the digital PWM multiphase controller comprises a resistor, a capacitor, a current limiting resistor, an adapter, an N-type field effect transistor, a patch capacitor, a light emitting diode and a plurality of zero ohm resistor pairs;

the voltage detection pins and the plug detection cathodes of the digital PWM multiphase controller are respectively connected with the power output pins of the plurality of adapters;

A first power input pin of the digital PWM multiphase controller is connected to the second intermediate power supply;

The phase input pin of the digital PWM multiphase controller is connected with the phase control pin of the adapter and then connected with an A phase regulation signal or a B phase regulation signal output by the third power conversion module;

The phase output pins of the digital PWM multiphase controller isolate the output phase control signals through corresponding zero ohm resistor pairs to obtain A phase PWM control signals and B phase PWM control signals, and the A phase PWM control signals and the B phase PWM control signals are respectively input to the A phase pins and the B phase pins of the corresponding adapter and then are connected with the third power conversion module;

a first power input pin and a second power input pin of the adapter are respectively connected to the first intermediate power supply and the first primary working power supply;

the phase detection pins of the digital PWM multiphase controller are connected with the overcurrent detection pins of the plurality of adapters;

A first control pin of the digital PWM multiphase controller is connected with first ends of an eighth capacitor and a sixth resistor respectively and then connected with a first primary working power supply;

A second control pin of the digital PWM multiphase controller is connected with first ends of a ninth capacitor and a seventh resistor respectively and then connected with a first primary working power supply;

The eighth capacitor, the ninth capacitor, the sixth resistor and the seventh resistor are connected with digital ground;

The third control pins of the digital PWM multiphase controller are connected with the first control pins of the plurality of adapters;

A fourth control pin, a fifth control pin, a sixth control pin, a seventh control pin, an eighth control pin, a ninth control pin, a tenth control pin, an eleventh control pin, a twelfth control pin and a thirteenth control pin of the digital PWM multiphase controller are respectively connected with corresponding current limiting resistors and then connected to the second intermediate power supply;

And a fourteenth pin of the digital PWM multiphase controller is connected with the first polarity capacitor and then connected with the digital ground.

8. The power daughter board of claim 7, wherein the third power conversion module comprises: a plurality of two-phase voltage stabilizer groups; the two-phase voltage stabilizer group comprises an A-phase switching voltage stabilizer and a B-phase switching voltage stabilizer; the numbers of the two-phase voltage stabilizer group, the adapter and the zero ohm resistor pairs are the same;

a first power input pin of the biphase voltage stabilizer group is connected with a first primary working power supply after filtering;

A second power input pin of the two-phase voltage stabilizer group is connected to the first intermediate power supply;

the detection control pin of the biphase voltage stabilizer group is connected with the first control pin of the corresponding adapter;

the high-impedance input pin of the biphase voltage stabilizer group is connected with the overcurrent detection pin of the corresponding adapter;

The PWM control pin of the A-phase switching voltage stabilizer is connected with the A-phase control pin of the corresponding adapter and then connected with the A-phase PWM control signal, and the PWM control pin of the B-phase switching voltage stabilizer is connected with the B-phase control pin of the corresponding adapter and then connected with the B-phase PWM control signal;

The adjusting control pin of the biphase voltage stabilizer group is connected with the power output pin of the corresponding adapter;

The phase control pin of the adapter is connected with an A phase regulation signal output by the phase control pin of the A phase switching regulator or a B phase regulation signal output by the phase control pin of the B phase switching regulator;

the voltage driving control pin and the enabling control pin of the biphase voltage stabilizer group are connected into a first primary working power supply after being short-circuited;

the phase control pin of the A-phase switching regulator is in short circuit with the bootstrap control pin of the A-phase switching regulator;

The phase control pin of the B-phase switching regulator is in capacitance short circuit with the bootstrap control pin of the B-phase switching regulator;

and the power switch control pin of the biphase voltage stabilizer group is connected with the inductor to output a corresponding target working power supply.

9. A testing machine comprising a testing head, characterized in that the power daughter board according to any one of claims 1 to 8 is mounted on the front surface of the testing board through a daughter board connector, the front surface of the testing board is provided with a spring pin guide plate and a socket, the semiconductor element to be tested is mounted on the socket in a patch mode or an inserting mode, and the semiconductor element to be tested is connected with the spring pin guide plate through a spring pin;

The power supply sub-board includes: the system comprises a first power conversion module, a multiphase power management module and a plurality of third power conversion modules;

The first power supply conversion module is used for converting a power supply into a primary working power supply;

The multi-phase power supply management module is connected with the first power supply conversion module and is used for accessing the primary working power supply and outputting a corresponding dual-phase control signal;

the third power supply conversion module is connected with the first power supply conversion module and the multi-phase power supply management module and is used for converting the primary working power supply into a target working power supply under the control of the dual-phase control signal;

the voltage values are sequentially from big to small: the power supply, the primary working power supply and the target working power supply are arranged in the order from large to small, and the current value is opposite to the order from large to small.