CN111215743A - Femtosecond laser two-photon micromachining device - Google Patents
Femtosecond laser two-photon micromachining device Download PDFInfo
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- CN111215743A CN111215743A CN202010174541.1A CN202010174541A CN111215743A CN 111215743 A CN111215743 A CN 111215743A CN 202010174541 A CN202010174541 A CN 202010174541A CN 111215743 A CN111215743 A CN 111215743A
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- laser
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- motion platform
- femtosecond laser
- photon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
Abstract
The invention relates to a femtosecond laser two-photon micromachining device, which comprises a controller; the five-dimensional motion platform is in communication connection with the controller; the femtosecond laser is arranged on the five-dimensional motion platform; an optical switch disposed on a laser propagation path of the femtosecond laser, blocking and opening laser propagation by moving; the three-dimensional motion platform is in communication connection with the controller; the sample table is arranged on the three-dimensional motion platform and used for placing a sample to be processed; the laser reflector is arranged on a laser propagation path of the femtosecond laser and used for changing the propagation direction of the laser and reflecting the laser to the sample; the focusing lens is arranged above the position, used for placing the sample, on the sample table and used for focusing laser; and the camera is arranged above the focusing lens. The femtosecond laser two-photon micromachining device can control the femtosecond laser to move, reduce the number of reflecting lenses and reduce the complexity of light path adjustment.
Description
Technical Field
The invention relates to a femtosecond laser two-photon micromachining device.
Background
In recent years, with the rapid development of micro-electro-mechanical systems, micro-nano electronic technologies and chip manufacturing technologies, how to prepare a stable microstructure on a substrate has received extensive attention. The technology has certain reference value for the manufacture of future micro-nano manufacturing technology, photoetching technology, devices with miniaturization, integration, functionalization and the like.
At present, most of common femtosecond laser two-photon micromachining systems adopt a titanium gem tunable laser, such as a femtosecond laser with the model of a Coherent company of Mira-900f and the wavelength of 780nm, and a uFAB micro-processing table provided by a Newport company is matched as a processing device of a microstructure, and by utilizing the relative motion of the micro-processing table and a laser focus, when two infrared photons meet at the focus, the energy generated just can polymerize and solidify the photoresist, so that a 3D microstructure is carved in the photoresist, and a fine microstructure pattern is prepared. However, such a titanium sapphire tunable laser is usually arranged on a large-scale working platform due to its large volume and heavy weight. Meanwhile, because the distance between the laser and the workbench is large, a plurality of groups of reflecting lens groups are needed to correct the light path, and the complexity and cost of light path adjustment are increased. In addition, in general, the strokes of the high-precision three-dimensional electric translation stage on the X and Y axes of the horizontal plane can be relatively large, but the movement stroke in the Z-axis direction of the height is often very small, so that a sample with the height of more than several millimeters is not easy to prepare.
Disclosure of Invention
The first technical problem to be solved by the present invention is to provide a femtosecond laser two-photon micromachining apparatus for controlling the femtosecond laser to move, reducing the number of reflecting mirrors, and reducing the complexity of optical path adjustment.
The second technical problem to be solved by the present invention is to provide a femtosecond laser two-photon micromachining apparatus capable of preparing a microstructure sample with a high height, in view of the above prior art.
The technical scheme adopted by the invention for solving the first technical problem is as follows: a femtosecond laser two-photon micromachining device is characterized in that: comprises that
A controller;
the five-dimensional motion platform is in communication connection with the controller;
the femtosecond laser is arranged on the five-dimensional motion platform;
the three-dimensional motion platform is in communication connection with the controller;
the sample table is arranged on the three-dimensional motion platform and used for placing a sample to be processed;
the laser reflector is arranged on a laser propagation path of the femtosecond laser and used for changing the propagation direction of the laser and reflecting the laser to the sample;
the focusing lens is arranged above the position, used for placing the sample, on the sample table and used for focusing laser;
and the camera is arranged above the focusing lens.
In order to increase the automation degree of the work, the laser switch of the femtosecond laser is electrically connected with the controller.
In order to better observe the processing condition of the microstructure under various light conditions, the microstructure chip also comprises an illumination light source group which can assist in illuminating the sample.
Preferably, the illumination light source group includes a first illumination light source for illuminating the sample from above and a second illumination light source for illuminating the sample from below.
Preferably, a first reflector capable of reflecting the illumination light of the first illumination light source to the sample from the upper part of the sample is arranged above the sample stage;
the sample stage is a transparent placing frame, and a second reflecting mirror capable of reflecting the illumination light of the second illumination light source to the sample from the lower part of the sample is arranged in the sample stage.
In order to better adjust the position of the laser and enable laser emitted by the laser to be better matched to complete processing work of a microstructure, the five-dimensional motion platform comprises a first motion platform capable of realizing linear motion in a three-dimensional direction and a second motion platform arranged on the first motion platform and capable of realizing rotation in a two-dimensional direction, and the first motion platform and the second motion platform are respectively in communication connection with the controller.
The technical scheme adopted by the invention for solving the second technical problem is as follows: the three-dimensional motion platform comprises a first driving mechanism capable of driving the sample stage to move back and forth, a second driving mechanism capable of driving the sample stage to move left and right, and a third driving mechanism capable of driving the sample stage to move up and down;
the third driving mechanism comprises a supporting body and a moving body, the supporting body is provided with a first guide plane which is obliquely arranged relative to the vertical direction, the moving body is provided with a second guide plane which is oppositely arranged relative to the first guide plane and is obliquely matched with the first guide plane, and the moving body can move up and down under the guide of the first guide plane. So also can guarantee the tiny displacement control in the vertical direction under the circumstances that increases the migration distance, and then improve the control accuracy of tiny displacement in the vertical direction.
Conveniently, the photoswitch is connected to a driver, and the driver is electrically connected to the controller.
Compared with the prior art, the invention has the advantages that: the femtosecond laser two-photon micromachining device can drive the laser to move by utilizing the five-dimensional motion platform, so that laser emitted by the laser can be more easily focused on a sample to be machined, a complex light path adjusting component is not required to be arranged to adjust a laser light path, the flexibility of laser adjustment is improved, and the complexity and cost of light path adjustment are reduced.
Drawings
Fig. 1 is a schematic structural diagram of a femtosecond laser two-photon micromachining apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a third driving mechanism in the embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1, the femtosecond laser two-photon micromachining apparatus in the present embodiment includes the following components.
The controller 1, typically a femtosecond laser two-photon micromachining apparatus, is equipped with a computer, and the controller 1 is built in a control circuit board of the computer.
The five-dimensional motion platform 2 comprises a first motion platform 21 capable of realizing linear motion in a three-dimensional direction and a second motion platform 22 arranged on the first motion platform 21 and capable of rotating in a two-dimensional direction, the first motion platform 21 and the second motion platform 22 are respectively in communication connection with the controller 1, the first motion platform 21 and the second motion platform 22 can adopt various existing motion platforms in the prior art, generally, motors are adopted in the first motion platform 21 and the second motion platform 22 to drive in each dimension direction, a control chip in each motor is in communication connection with the controller 1, so that the motion distance of each motor is precisely controlled, and finally, the position of the femtosecond laser 3 is adjusted to ensure that a laser path emitted by the femtosecond laser 3 can meet requirements. And the first motion platform 21 in this embodiment can realize linear motion on the X, Y, Z axis, that is, realize motion in the front-back, left-right, and up-down directions. The second motion stage 22 in this embodiment is capable of either X, Y rotational motion in the axis forming plane or Y, Z rotational motion in the axis forming plane.
The femtosecond laser 3 is arranged on the five-dimensional motion platform 2, and then the linear motion on the X, Y, Z axis is carried out under the drive of the five-dimensional motion platform 2, and the rotational motion on the X, Y axis forming plane or the rotational motion on the Y, Z axis forming plane can be carried out under the drive of the five-dimensional motion platform 2, so that the femtosecond laser 3 can focus and irradiate on a sample to be processed instead according to a set path.
And an optical switch 31 disposed on a laser propagation path of the femtosecond laser 3, wherein the optical switch 31 is connected to a driving terminal of a driver electrically connected to the controller 1. The controller controls the driver to realize the moving drive of the optical switch 31, thereby blocking and opening the laser propagation. The driver can be synchronously controlled by the high-speed motor controller 1 according to the processing requirement of the microstructure, so that the on-off control of the optical switch 31 is realized, the manual on-off operation of the optical switch is not needed, and the processing work of the microstructure is more precise and intelligent.
And the three-dimensional motion platform 4 is in communication connection with the controller 1. The three-dimensional motion platform 4 comprises a first driving mechanism capable of driving the sample stage 5 to move back and forth, a second driving mechanism capable of driving the sample stage 5 to move left and right, and a third driving mechanism 41 capable of driving the sample stage 5 to move up and down, namely the three-dimensional motion platform 4 can drive the sample stage 5 to move on an X, Y, Z axis. Usually, each driving mechanism is driven by a motor, and a control chip in the motor in each driving mechanism is in communication connection with the controller 1, so that the three-dimensional motion platform 4 is in communication connection with the controller 1, the three-dimensional motion platform 4 is controlled to move under the control of the controller 1, and the sample stage 5 on the three-dimensional motion platform 4 is driven to move, so that the sample is moved to a position to be processed by the laser. As shown in fig. 2, the third driving mechanism 41 in this embodiment includes a supporting body 411 and a moving body 412, the supporting body 411 has a first guide plane that is disposed obliquely with respect to the vertical direction, the moving body 412 has a second guide plane that is disposed opposite to the first guide plane and has an inclination matching the first guide plane, and the moving body 412 can move up and down under the guidance of the first guide plane, that is, the vertical motion in the up-down direction is changed into the oblique motion in the upward-inclined direction with respect to the vertical direction, so that the control of the minute displacement in the vertical direction can be ensured while the moving distance is increased, and the control accuracy of the minute displacement in the vertical direction is improved. Meanwhile, in the embodiment, the Z-direction stroke can be increased to 10mm on the premise of ensuring that the precision is better than 0.15um, and the defects of short Z-direction stroke and high control difficulty of the conventional two-photon micro-processing platform are overcome.
And the sample table 5 is arranged on the three-dimensional motion platform 4 and used for placing a sample to be processed. The sample stage 5 in this embodiment is a transparent placing rack.
And a laser mirror 6 disposed on a laser propagation path of the femtosecond laser 3 for changing a propagation direction of the laser light to reflect the laser light onto the sample. In this embodiment, the laser emitted by the laser can be irradiated on the laser reflector 6 in the horizontal direction, and the laser reflector 6 is inclined by 45 ° relative to the vertical direction, so that the laser emitted by the laser can be reflected and irradiated on the sample in the vertical direction.
And a focusing lens 7 disposed above a position on the sample stage 5 where the sample is placed, for focusing the laser light. The focusing lens 7 is arranged below the laser reflector 6, and the laser reflected by the laser reflector 6 is focused on the sample through the focusing action of the focusing lens 7.
The camera 8 is arranged above the focusing lens 7, and the camera 8 can shoot microstructure sample images in the processing process and then transmit the microstructure sample images to a computer, so that processing personnel can check the processing conditions in real time.
And the illumination light source group is used for assisting in illuminating the sample, so that the camera 8 can clearly shoot the microstructure sample image in the processing, and the processing condition of the microstructure can be monitored by the staff conveniently. The illumination light source group includes a first illumination light source 91 for illuminating the sample from above and a second illumination light source 92 for illuminating the sample from below. A first reflector 911 is disposed above the sample stage 5 to reflect the illumination light from the first illumination light source 91 from above the sample onto the sample. In this embodiment, the light from the first illumination light source 91 propagates in the horizontal direction, and the first reflector 911 is disposed above the laser reflector 6 and is inclined at 45 ° with respect to the vertical direction, so that the horizontally propagating light is emitted and then the illuminated light is irradiated on the sample from above the sample stage 5. The sample stage 5 is provided with a second reflecting mirror 921 for reflecting the illumination light from the second illumination light source 92 from below the sample to the sample. Similarly, the light from the second illumination light source 92 is horizontally transmitted, and the second reflecting mirror 921 is disposed to be inclined at 45 ° with respect to the vertical direction, so that the horizontally transmitted light is emitted to illuminate the sample from below the sample stage 5.
When the femtosecond laser two-photon micromachining device is used, the five-dimensional motion platform 2 can be firstly utilized to adjust the position of the femtosecond laser 3, so that a laser path emitted by the femtosecond laser 3 can meet the requirement, and the laser emitted by the femtosecond laser 3 can be focused on a sample on the sample stage 5. And then the three-dimensional motion platform 4 is used for driving the sample stage 5 to move so as to realize the processing of the microstructure. The laser light path can be adjusted without arranging a complex light path adjusting component, so that the flexibility of laser adjustment is improved, and the complexity and cost of light path adjustment are reduced. In addition, the femtosecond laser two-photon micro-processing device in the invention can use a small femtosecond laser 3, for example, the femtosecond laser 3 with the volume less than 500mm x 400mm x 100mm and the weight of the laser host less than 15 kg can be used.
Claims (7)
1. A femtosecond laser two-photon micromachining device is characterized in that: comprises that
A controller (1);
the five-dimensional motion platform (2) is in communication connection with the controller (1);
the femtosecond laser (3) is arranged on the five-dimensional motion platform (2);
an optical switch (31) provided on a laser propagation path of the femtosecond laser (3) to block and open laser propagation by moving;
the three-dimensional motion platform (4) is in communication connection with the controller (1);
the sample table (5) is arranged on the three-dimensional motion platform (4) and is used for placing a sample to be processed;
a laser reflector (6) arranged on the laser propagation path of the femtosecond laser (3) and used for changing the propagation direction of the laser and reflecting the laser to the sample;
the focusing lens (7) is arranged above the position, used for placing the sample, on the sample table (5) and used for focusing laser;
and a camera (8) arranged above the focusing lens (7).
2. The femtosecond laser two-photon micromachining apparatus according to claim 1, wherein: also included is a set of illumination sources capable of assisting in illuminating the sample.
3. The femtosecond laser two-photon micromachining apparatus according to claim 2, wherein: the illumination light source group includes a first illumination light source (91) for illuminating the sample from above and a second illumination light source (92) for illuminating the sample from below.
4. The femtosecond laser two-photon micromachining apparatus according to claim 3, wherein: a first reflector (911) capable of reflecting the illumination light of the first illumination light source (91) to the sample from the upper part of the sample is arranged above the sample stage (5);
the sample table (5) is a transparent placing frame, and a second reflecting mirror (921) capable of reflecting the illumination light of the second illumination light source (92) to the sample from the lower part of the sample is arranged in the sample table (5).
5. A femtosecond laser two-photon micromachining apparatus according to any one of claims 1 to 4, wherein: the five-dimensional motion platform (2) comprises a first motion platform (21) capable of realizing linear motion in a three-dimensional direction and a second motion platform (22) which is arranged on the first motion platform (21) and capable of rotating in a two-dimensional direction, and the first motion platform (21) and the second motion platform (22) are in communication connection with the controller (1) respectively.
6. A femtosecond laser two-photon micromachining apparatus according to any one of claims 1 to 4, wherein: the three-dimensional motion platform (4) comprises a first driving mechanism capable of driving the sample table (5) to move back and forth, a second driving mechanism capable of driving the sample table (5) to move left and right, and a third driving mechanism (41) capable of driving the sample table (5) to move up and down;
the third driving mechanism (41) comprises a supporting body (411) and a moving body (412), wherein the supporting body (411) is provided with a first guide plane which is obliquely arranged relative to the vertical direction, the moving body (412) is provided with a second guide plane which is oppositely arranged relative to the first guide plane and is matched with the first guide plane in inclination, and the moving body (412) can move up and down under the guidance of the first guide plane.
7. A femtosecond laser two-photon micromachining apparatus according to any one of claims 1 to 4, wherein: the optical switch (31) is connected to a driver, and the driver is electrically connected with the controller (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010174541.1A CN111215743A (en) | 2020-03-13 | 2020-03-13 | Femtosecond laser two-photon micromachining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010174541.1A CN111215743A (en) | 2020-03-13 | 2020-03-13 | Femtosecond laser two-photon micromachining device |
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| Publication Number | Publication Date |
|---|---|
| CN111215743A true CN111215743A (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010174541.1A Pending CN111215743A (en) | 2020-03-13 | 2020-03-13 | Femtosecond laser two-photon micromachining device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111215743A (en) |
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2020
- 2020-03-13 CN CN202010174541.1A patent/CN111215743A/en active Pending
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