CN111213225A - Device and method for linearly moving first and second moving bodies with respect to object - Google Patents

Device and method for linearly moving first and second moving bodies with respect to object Download PDF

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Publication number
CN111213225A
CN111213225A CN201880066585.3A CN201880066585A CN111213225A CN 111213225 A CN111213225 A CN 111213225A CN 201880066585 A CN201880066585 A CN 201880066585A CN 111213225 A CN111213225 A CN 111213225A
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scale
moving
distance
moving body
scale number
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CN111213225B (en
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瀬山耕平
歌野哲弥
野口勇一郎
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Shinkawa Ltd
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G05B19/195—Controlling the position of several slides on one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes

Abstract

The invention comprises the following steps: a first base body and a second base body (10, 20) which are guided by the guide rail and move linearly; a linear scale (33) provided with scales (34) at a predetermined pitch along the moving direction; and first and second encoder heads (17, 27) mounted on the first and second bases (10, 20); the first and second encoder heads (17, 27) are sequentially used to detect a first scale number B1(n) and a second scale number B2(n) where the first and second encoder heads (17, 27) are located while keeping the distance between the first and second encoder heads (17, 27) at a predetermined distance a and moving the first and second substrates (10, 20) along the guide rail, and the amount of movement of the first and second substrates (10, 20) is controlled in accordance with the ratio of the predetermined distance a to the distance A (n) on the scale between the first scale number B1(n) and the second scale number B2 (n).

Description

Device and method for linearly moving first and second moving bodies with respect to object
Technical Field
The present invention relates to an apparatus and a method for linearly moving a first moving body and a second moving body with respect to an object.
Background
For example, in the manufacture of semiconductor devices, many bonding apparatuses are used, such as a mounting apparatus for mounting electronic components such as a semiconductor die (die) on a substrate or another semiconductor die, and a wire-bonding apparatus for bonding wires (wires) to electrodes of the semiconductor die and electrodes of the substrate. The bonding apparatus includes a bonding head (bonding head) mounted on an XY table, a bonding arm (bonding arm) attached to the bonding head and configured to move a bonding tool (bonding tool) in an up-down direction, and a position detection camera attached to the bonding head and configured to detect a bonding position of a substrate. The center line of the bonding tool and the optical axis of the position detection camera are arranged at a predetermined offset distance (offset distance). In addition, after aligning the optical axis of the position detection camera with the bonding position, the bonding head is moved by a shift distance, and the center line of the bonding tool is moved to the bonding position to perform bonding in many cases.
On the other hand, if the bonding operation is continued, the offset distance changes due to a temperature increase. Therefore, even if the bonding head is moved by the offset distance after the optical axis of the position detection camera is aligned with the bonding position, the center line of the bonding tool may not be the bonding position. Therefore, a joining apparatus has been proposed which corrects the offset distance in the middle of the joining operation (see, for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent application laid-open No. 2001-203234
Disclosure of Invention
Problems to be solved by the invention
In many cases, a linear scale (linear scale) is used in the bonding apparatus to detect the amount of movement of the base (base) having the bonding head. In such a case, when the temperature of the bonding apparatus rises, the linear scale expands, and an error occurs in the amount of movement of the substrate that moves according to the scale of the linear scale. Further, since the temperature rises of the linear scale do not coincide, the amount of thermal expansion of the linear scale often varies depending on the location. Therefore, there is a problem that the accuracy of detecting the position of the bonding head is lowered, which lowers the mounting accuracy of the electronic component.
Therefore, an object of the present invention is to improve the moving accuracy of a moving body.
Means for solving the problems
The apparatus of the present invention linearly moves a first moving body and a second moving body with respect to an object, and is characterized by comprising: a first moving body that moves linearly guided by a rail; a second movable body linearly moved by being guided by the rail; a scale arranged along the track and provided with a plurality of scales at a predetermined pitch along the moving direction; a first detection unit that is disposed on the first movable body and detects a scale number of the scale; a second detection unit which is disposed on the second movable body and detects the scale number of the scale; and a control unit that moves the first and second moving bodies along the track while maintaining the distance between the first and second detection units at a predetermined distance, and that sequentially detects the first scale number at which the first detection unit is located and the second scale number at which the second detection unit is located by the first and second detection units, and that controls the amount of movement of the first and second moving bodies based on the ratio of the predetermined distance between the first and second detection units to the distance on the scale between the first scale number and the second scale number.
In the apparatus of the present invention, the first moving body and the second moving body are each a conveying mechanism that conveys the semiconductor die to an object, the object is a substrate on which the conveyed semiconductor die is mounted or another semiconductor die, and the apparatus may be an apparatus that mounts the semiconductor die on the object.
The apparatus of the present invention further includes a first drive unit that drives the first movable body and a second drive unit that drives the second movable body, and the control unit may drive either the first drive unit or the second drive unit to press one of the first movable body or the second movable body against the other, and simultaneously move the first movable body and the second movable body while maintaining the interval between the first detection unit and the second detection unit at a predetermined interval.
In the apparatus of the present invention, the control unit may calculate the position correction coefficient for each predetermined scale number from one end of the scale based on a ratio of the predetermined interval to a distance on the scale between the first scale number and the second scale number.
The apparatus of the present invention includes a distance detector that detects a distance from the reference position to the first movable body or the second movable body, and the control unit may move the first movable body and the second movable body by the reference distance while detecting the distance from the reference position by the distance detector while keeping the first detection unit and the second detection unit at a predetermined interval, detect a difference in scale number of the scale between before and after the first movable body and the second movable body are moved by the reference distance by the first detection unit or the second detection unit, and correct the movement amount based on the reference distance and the difference in scale number.
In the apparatus of the present invention: the control unit may move the first and second moving bodies by a reference distance based on the image of the position mark acquired by the first or second image acquiring unit, detect a scale number difference of the scale before and after the first or second moving body is moved by the first or second detecting unit, and correct the amount of movement based on the reference distance and the scale number difference.
The apparatus of the present invention may further include a mounting platform on which the electronic component is mounted, the rail being two linear rails extending in the X direction, the first moving body being a first gantry extending in the Y direction so as to straddle the mounting platform and having both ends guided by the two linear rails to move in the X direction, the second moving body being a second gantry extending in the Y direction so as to straddle the mounting platform in parallel with the first gantry and having both ends guided by the two linear rails to move in the X direction, the scale being arranged along one of the linear rails, the first detecting portion being mounted on an end portion of one side of the scale of the first gantry, the second detecting portion being mounted on an end portion of one side of the scale of the second gantry.
The method of the present invention is a method for linearly moving a first moving body and a second moving body with respect to an object, and is characterized by comprising: a step of preparing an apparatus including a first moving body that moves linearly by being guided by a rail, a second moving body that moves linearly by being guided by a rail, a scale that is arranged along the rail and provided with a plurality of scales at a predetermined pitch along a moving direction, a first detection section that is arranged on the first moving body, and a second detection section that is arranged on the second moving body; a scale number detection step of sequentially detecting a first scale number where the first detection unit is located and a second scale number where the second detection unit is located by the first detection unit and the second detection unit while moving the first moving body and the second moving body along the track by maintaining the interval between the first detection unit and the second detection unit at a predetermined interval; and a moving amount control step of controlling the moving amounts of the first and second moving bodies based on a ratio of a predetermined interval between the first and second detection units to a distance on the scale between the first and second scale numbers.
The method of the present invention may also comprise: and a correction coefficient calculation step of calculating a position correction coefficient for each predetermined scale number from one end of the scale based on a ratio of the predetermined interval to a distance on the scale between the first scale number and the second scale number.
In the method of the present invention, the apparatus may include a distance detector that detects a distance of the first mobile body or the second mobile body from the reference position, and the method may include: and a movement amount correction step of moving the first and second moving bodies by a reference distance while keeping the first and second detection units at a predetermined interval and detecting the distance from the reference position by the distance detector, and correcting the movement amount based on the reference distance and the scale number difference by detecting the scale number difference between the scale before and after the reference distance by the first and second detection units.
In the method of the present invention, the apparatus may include a reference member in which a position mark is disposed at a reference distance, a first image acquiring unit that is attached to the first moving body and acquires an image of the position mark, and a second image acquiring unit that is attached to the second moving body and acquires an image of the position mark, and the method may include: and a movement amount correction step of moving the first and second movable bodies by a reference distance based on the image of the position mark acquired by the first or second image acquisition means, detecting a scale number difference between the scale before and after the first and second movable bodies are moved by the first or second detection unit, and correcting the movement amount based on the reference distance and the scale number difference.
ADVANTAGEOUS EFFECTS OF INVENTION
The invention can improve the moving precision of the moving body.
Drawings
Fig. 1 is a system diagram showing a system configuration of a mounting device according to an embodiment.
Fig. 2 is a flowchart showing an operation of calculating a position correction coefficient of the linear scale of the mounting apparatus shown in fig. 1.
Fig. 3 is a graph showing changes in the positions of the first and second substrates with respect to the linear scale and changes in the position correction coefficient with respect to the linear scale in the operation shown in fig. 2.
Fig. 4 is a flowchart showing another operation of calculating the position correction coefficient of the linear scale of the mounting apparatus shown in fig. 1.
Fig. 5 is an explanatory diagram showing the relationship between the linear scale, the first base, the second base, and the reference member when the first base and the second base are moved by the reference distance.
Fig. 6 is a perspective view showing a structure of a flip chip bonding device according to another embodiment.
Fig. 7 is a plan view of the flip chip bonding device shown in fig. 6.
Fig. 8 is a side view showing the arrangement of the door frame and the linear scale of the flip chip bonding apparatus shown in fig. 6.
Fig. 9 is a sectional view showing a structure of a gate of the flip chip bonding apparatus shown in fig. 6.
Fig. 10 is a perspective view showing a state in which the first door frame and the second door frame are connected at a time in the flip chip bonding apparatus shown in fig. 6.
Detailed Description
< construction of mounting device >
Hereinafter, a mounting apparatus 70 for mounting the semiconductor die 15 on the substrate 19 or the like will be described as an example of an apparatus for linearly moving the first moving body and the second moving body with respect to the object. As shown in fig. 1, the mounting apparatus 70 of the present embodiment mounts the semiconductor die 15 on the substrate 19 or another semiconductor die as an object. The mounting device 70 includes: the first base 10 as a first moving body on which the first bonding head 13 and the first camera 16 as a first image pickup means are mounted, the second base 20 as a second moving body on which the second bonding head 23 and the second camera 26 as a second image pickup means are mounted, the linear scale 33, the control section 50, the laser distance detector 45, and the bonding stage 18 for suction-fixing the substrate 19 as an object. The mounting device 70 is, for example, a flip chip bonding device that mounts the semiconductor die 15 on the substrate 19 after being inverted, but may be a die bonding device that mounts the semiconductor die 15 on the substrate 19 without being inverted.
The first base 10 and the second base 20 are guided by a common guide rail 11 extending in the X direction, which is a linear direction, and linearly move in the X direction. The first and second bases 10 and 20 are provided with a first linear motor 12 as a first driving unit and a second linear motor 22 as a second driving unit, respectively, for driving the first and second bases 10 and 20 in the X direction.
The first bonding head 13 mounted on the first base 10 moves a first bonding tool 14, which is a mounting tool for vacuum-sucking the semiconductor die 15 and bonding the semiconductor die to the substrate 19, in the vertical direction, i.e., the Z direction. Reference numeral 13Z in fig. 1 denotes a center line of the first bonding head 13 in the Z direction. The first camera 16 takes an image of the substrate 19 from above and acquires an image thereof. Reference numeral 16z in fig. 1 denotes an optical axis of the first camera 16. The first bonding head 13 and the first camera 16 are mounted on the first base 10 so that the center line 13z and the optical axis 16z are separated from each other by a distance Δ H in the X direction. Similarly, the second bonding head 23 mounted on the second base 20 moves in the vertical direction, i.e., the Z direction, to a second bonding tool 24, which is a mounting tool for vacuum-sucking the semiconductor die 15 and bonding the semiconductor die to the substrate 19. Reference numeral 23Z in fig. 1 denotes a center line of the second bonding head 23 in the Z direction. The second camera 26 takes an image of the substrate 19 from above and acquires an image thereof. Reference numeral 26z in fig. 1 denotes an optical axis of the second camera 26. The second bonding head 23 and the second camera 26 are mounted on the second base 20 so that the central axis 23z and the optical axis 26z are separated by a distance Δ H in the X direction. The first base 10 and the second base 20 are a transfer mechanism for transferring the semiconductor die 15, which is adsorbed by the first bonding tool 14 and the second bonding tool 24, to the substrate 19.
A first encoder head 17 as a first detection unit is provided at the substantial center of the first base 10, and a second encoder head 27 as a second detection unit is provided at the substantial center of the second base 20. Reference numerals 17a and 27a in fig. 1 denote the center line of the first encoder head 17 and the center line of the second encoder head 27, respectively.
A common linear scale 33 extending in the X direction, which is the moving direction of the first substrate 10 and the second substrate 20, is disposed at a position facing the first encoder head 17 and the second encoder head 27. The linear scale 33 is engraved with a plurality of scales 34 at a prescribed pitch p. The first encoder head 17 and the second encoder head 27 optically read the scale 34 and detect the scale number on the linear scale 33.
The bonding stage 18 vacuum-adsorbs the substrate 19.
The laser distance detector 45 is disposed at a position away from the bonding stage 18, and detects the distance in the X direction from the reference position of the first substrate 10 or the second substrate 20 by the laser. The laser distance detector 45 can detect the distance of the first and second substrates 10 and 20 from the reference position in the X direction, regardless of the change in length of the linear scale 33 caused by the change in temperature of the mounting device 70.
As shown in fig. 1, the first linear motor 12, the second linear motor 22, the first bonding head 13, and the second bonding head 23 are connected to the control unit 50, and operate in accordance with a command from the control unit 50. The first encoder head 17 and the second encoder head 27 are connected to the control unit 50, and the detected data of the scale number of the linear scale 33 is input to the control unit 50. The first camera 16, the second camera 26, and the laser distance detector 45 are also connected to the control unit 50, and data of images captured by the first camera 16 and the second camera 26 and the movement distance of the first substrate 10 or the second substrate 20 in the X direction detected by the laser distance detector 45 are input to the control unit 50.
The control unit 50 is a computer including a Central Processing Unit (CPU) for performing information processing therein and a memory for storing an operation program and data, and adjusts the X-direction position or the movement amount of the first substrate 10 and the second substrate 20.
< basic action of mounting device >
The basic operation of the mounting device 70 shown in fig. 1 will be briefly described. The control unit 50 images a mark indicating the bonding position of the substrate 19 by the first camera 16, analyzes the captured image, and detects a positional difference Δ c between the position of the bonding center and the optical axis 16 z. Then, the first substrate 10 is moved in the X direction by the first linear motor 12 in the total value share of the deviation amounts Δ H and Δ c. Thereby, the center line 13z of the first bonding head 13 can be aligned with the bonding center. Then, the control unit 50 lowers the first bonding tool 14 by the first bonding head 13 to bond the semiconductor die 15 to the bonding position of the substrate 19. The same applies to the operation when the semiconductor die 15 is bonded to the substrate 19 by the second bonding head 23.
< calculating operation (calculating method) > < position correction coefficient k (n) of linear scale of mounting device
Next, the operation of calculating the position correction coefficient k (n) of the linear scale 33 will be described with reference to fig. 2 to 3. When the linear scale 33, the first base 10, or the second base 20 thermally expands, an error may occur when the first base 10 or the second base 20 is moved from the reference position of the mounting device 70 to the predetermined position. Therefore, the operation (calculation method) of calculating the position correction coefficient of the linear scale 33 will be described below.
As shown in step S101 of fig. 2, the control unit 50 initially sets n to 1. Next, the control unit 50 sets the first base 10 to the movement start position B (0) at the left end shown in fig. 3. Then, the control unit 50 moves the second base 20 leftward to bring the left end of the second base 20 into contact with the right end of the first base 10. As a result, as shown in fig. 3, the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is a predetermined distance "a".
Then, the control unit 50 drives the first linear motor 12 located on the rear side (left side in fig. 3) in the moving direction (right direction in fig. 3) in the right direction to move the first base 10 to the right side in the X direction. At this time, since the first base 10 presses the second base 20 and moves to the right side in the X direction, the second base 20 moves to the right side in the X direction together with the first base 10. Since the first base 10 and the second base 20 are held in contact with each other, the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is maintained at the predetermined distance "a". Then, as shown in step S102 of fig. 2 and fig. 3, the control unit 50 aligns the center line 17a of the first encoder head 17 with the first scale number B1(1) of the linear scale 33. Then, in step S103 of fig. 2, the control unit 50 detects the position of the first base 10 in the X direction at this time as a reference position by the laser distance detector 45.
Next, as shown in step S104 of fig. 2, the control section 50 reads the second scale number B2(1) of the linear scale 33 where the center line 27a of the second encoder head 27 is located, by the second encoder head 27. Then, the control unit 50 proceeds to step S105 of fig. 2, and calculates the distance a (1) between the second scale mark B2(1) and the first scale mark B1(1) on the linear scale 33 by the following (expression 1). The distance a (1) is also the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 detected by the linear scale 33.
A (1) ═ B2(1) -B1 (1) ] × p … … (formula 1)
In (formula 1), p is the pitch of the scale marks 34 of the linear scale 33.
Then, the control unit 50 proceeds to step S106 of fig. 2, and calculates the position correction coefficient k (1) of the linear scale 33 by the following (expression 2). The position correction coefficient k (1) is a ratio of a predetermined interval a between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 to a distance a (1) between the second scale number B2(1) and the first scale number B1(1) on the linear scale 33.
k (1) ═ a/a (1) … … (formula 2)
Step S105 and step S106 in fig. 2 constitute a correction coefficient calculation step.
Then, the control unit 50 proceeds to step S107 in fig. 2, and moves the first base 10 by a predetermined scale number Δ B in the X direction by the first linear motor 12 so that the center line 17a of the first encoder head 17 is aligned with the second scale number B2(1) ═ B1(1) + Δ B. At this time, since the second substrate 20 moves in the X direction in a state of being in contact with the first substrate 10, the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is maintained at the predetermined distance a.
Next, the control unit 50 proceeds to step S108 of fig. 2 and stores B1(1) + Δ B in B1 (2). If n does not reach nend, the control unit 50 proceeds to step S110 in fig. 2, increments n by 1, and returns to step S104 in fig. 2 as n +1 being 2. Here, nend is the number of movements required for the first substrate 10 to move to the end position, and the first scale number B1(nend) represents the scale number of the linear scale 33 at which the center line 17a of the first encoder head 17 is located when the first substrate 10 moves to the end position. Step S104, step S107 to step S110 in fig. 2 constitute a scale number detection step.
In this manner, the controller 50 linearly moves the first substrate 10 and the second substrate 20 by the predetermined scale number Δ B of the linear scale 33 in the X direction, and sequentially detects the first scale number B1(n) of the linear scale 33 where the center line 17a of the first encoder head 17 is located and the second scale number B2(n) of the linear scale 33 where the center line 27a of the second encoder head 27 is located by the first encoder head 17 and the second encoder head 27. Then, the control unit 50 repeatedly calculates the position correction coefficient k (n) of the linear scale 33, which is the ratio of the predetermined distance a between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 to the distance a (n) between the second scale number B2(n) and the first scale number B1(n) on the linear scale 33. In this way, the control unit 50 can calculate the position correction coefficient k (n) for each predetermined scale number Δ B from one end of the linear scale 33, and as shown in the graph of fig. 3, calculate the position correction coefficient k (n) for the linear scale 33 for each scale number B (n) of the linear scale 33.
In this case, when the linear scale 33, the first base 10, and the second base 20 do not thermally expand at normal temperature, if the first scale number B1(1) with n equal to 1 is 0 and the second scale number B2(1) is 10 as shown in fig. 3, the linear scale will not thermally expand at normal temperature, and the first scale number B1(1) and the second scale number B2(1) will not thermally expand at normal temperature
A(1)＝[B2(1)－B1(1)]×p＝[10－0]×p
The scale p is a 10,
k (1) ═ a/a (1) ═ 1.0.
At the position where n is 2, the linear scale 33 thermally expands, but the predetermined interval a between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is regarded as constant. In this case, the pitch p of the scale 34 of the linear scale 33 becomes p' (> p) due to thermal expansion. When the center line 17a of the first encoder head 17 is aligned with the first scale number B1(2) at n 2, i.e., 20, the scale number between the second scale number B2(2) and the first scale number B1(2) is less than 10, for example, 9, which is the scale number when thermal expansion does not occur. Therefore, the distance a (2) between the second scale mark B2(2) and the first scale mark B1(2) on the linear scale 33 or the distance a (2) between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 detected by the linear scale 33 is a (2) × a (2) [ (B2 (2) -B1 (2) ] × p
Scale × p ═ 9.
On the other hand, since the predetermined distance a between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is 10 steps × p without changing, k (2) ═ a/a (2) (10 steps × p)/(9 steps × p) > 1.0.
When the linear scale 33 is extended by thermal expansion in this way, the position correction coefficient k (n) becomes a number larger than 1.0. On the other hand, when the linear scale 33 contracts at a temperature lower than the normal temperature, the position correction coefficient k (n) becomes a number smaller than 1.0.
When the linear scale 33 is not thermally expanded, the first substrate 10 is moved in the X direction by a predetermined scale number Δ B, and the first substrate 10 is moved in the X direction by Δ B × p. When the linear scale 33 thermally expands or contracts, the moving distance of the first substrate 10 is corrected to be Δ B × p × k (n) by the thermal expansion or contraction. In the case where the linear scale 33 is thermally expanded, k (n) is larger than 1.0, and therefore the moving distance of the first substrate 10 and the second substrate 20 is larger than Δ B × p, and in the case where the linear scale 33 is contracted, k (n) is smaller than 1.0, and therefore the moving distance of the first substrate 10 and the second substrate 20 is smaller than Δ B × p. The distance of movement of the first substrate 10 from the initial position to the end position is a distance obtained by integrating Δ B × p × k (n) from n to 1 to nend.
When n reaches nend, the control unit 50 proceeds to step S111 in fig. 2, and calculates the total movement distance La of the first substrate 10 by the following (expression 3).
La ═ Σ [ Δ B × p × k (n) ] … … (formula 3)
La calculated by the above equation (3) is a total moving distance of the first substrate 10 in consideration of the thermal expansion of the linear scale 33, with the predetermined interval a between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 being constant. However, the predetermined interval a also changes due to thermal expansion of the first substrate 10 and the second substrate 20. Therefore, the position correction coefficient k (n) is corrected in consideration of the thermal expansion amount at the predetermined interval a as follows.
The control unit 50 proceeds to step S112 of fig. 2, detects the end position of the first base 10 by the laser distance detector 45, proceeds to step S113 of fig. 2, and calculates the movement distance Lc from the reference position to the end position of the first base 10 detected by the laser distance detector 45.
The control unit 50 proceeds to step S114 in fig. 2, and corrects the position correction coefficient k (n) by the following equation (4) to ka (n).
ka (n) ═ k (n) x [ La/Lc ] … … (formula 4)
The controller 50 stores the corrected position correction coefficient ka (n) in the memory. As shown in fig. 3, the corrected position correction coefficient ka (n) is a distribution of the position correction coefficient ka (n) of the linear scale 33 of scale number b (n) in consideration of the change of the predetermined interval a due to thermal expansion, or a map of the position correction coefficient ka (n). Steps S111 to S114 in fig. 2 constitute a correction coefficient correction step.
The control unit 50 corrects the position of the center line 17a of the first encoder head 17 detected by using the linear scale 33 as follows, using the corrected position correction coefficient ka (n). When the scale number of the linear scale 33 detected by the first encoder head 17 is B100 and B100 is Δ B × m + j, the control unit 50 controls the encoder to perform the above-described operation
L100＝[ΣΔB×ka(n)×p](n＝1～m)+ ka (m +1) × j × p, the distance L100 from the scale number 0 to the center line 17a of the first encoder head 17 is calculated, and the first base 1 is controlled0, amount of movement or distance of movement.
That is, the control unit 50 corrects the moving distance L100B of the first encoder head 17 from the scale mark 0 to the scale mark B100 detected by the linear scale 33 in the case of no correction to (Δ B × m + j) × p to [ Σ Δ B × ka (n) × p ] L100 using the corrected position correction coefficient ka (n)](n＝1～m)+ ka (m +1) × j × p (movement amount correction step), and controls the movement amount or movement distance of the first base 10 on which the first encoder head 17 is mounted (movement amount control step). Similarly, the moving distance of the second substrate 20 on which the second encoder head 27 is mounted is corrected, and the moving distance of the second substrate 20 is controlled.
As described above, the mounting apparatus 70 according to the present embodiment linearly moves the first base 10 and the second base 20 by the predetermined scale number Δ B in the X direction while keeping the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 in the X direction at the predetermined distance a, sequentially detects the scale numbers by the first encoder head 17 and the second encoder head 27 to create a map of the position correction coefficients ka (n) of the linear scale 33, and corrects the moving distance of the first encoder head 17 and the second encoder head 27 based on the map of the created position correction coefficients ka (n), thereby improving the position detection accuracy of the first bonding head 13, the second bonding head 23, the first camera 16, and the second camera 26 and suppressing the reduction in the mounting accuracy of the electronic component.
In the present embodiment, the first base 10 is brought into contact with the second base 20, the first base 10 is driven in the X direction by the first linear motor 12, the first base 10 is pressed against the second base 20 by the first base 10, the first base 10 and the second base 20 are kept in contact, the second base 20 is moved in the X direction together with the first base 10, and the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 is kept at the predetermined distance a. For example, the first substrate 10 and the second substrate 20 may be once connected by the connecting member, and the distance between the center line 17a of the first encoder head 17 and the center line 27a of the second encoder head 27 may be maintained at the predetermined distance "a".
< Another calculation action (calculation method) > < position correction coefficient k (n) of linear scale of mounting device
Next, another operation of calculating the position correction coefficient k (n) of the linear scale in the mounting device 70 according to the present embodiment will be described with reference to fig. 4 and 5. The same operations as those described with reference to fig. 2 and 3 are denoted by the same step numbers, and the description thereof is omitted.
The operation shown in fig. 3 moves the first substrate 10 and the second substrate 20 by a predetermined scale Δ B, detects the movement scale number of the linear scale 33 by the first encoder head 17 and the second encoder head 27 to calculate each position correction coefficient k (n), detects the scale when the first substrate 10 is moved by the reference distance Lr while detecting the position of the first substrate 10 by the laser distance detector 45, and corrects the position correction coefficient k (n) based on the result. The calculation of each position correction coefficient k (n) is the same as that described above with reference to fig. 2 and 3, and therefore, the description thereof is omitted.
The control unit 50 repeatedly executes steps S101 to S110 of fig. 4 to calculate k (n), and then proceeds to step S201 of fig. 4.
In step S201 of fig. 4, as shown in fig. 5, the control unit 50 aligns the first substrate 10 at a predetermined first position (reference position). Then, the control unit 50 detects the scale number b(s) of the linear scale 33 on which the first encoder head 17 is located when the first substrate 10 is located at the first position, by the first encoder head 17. Further, the control unit 50 detects a first distance from the laser distance detector 45 to the first substrate 10 by the laser distance detector 45. Then, the control unit 50 moves the first substrate 10 and the second substrate 20 by the reference distance Lr in the X direction by the same method as described above with reference to fig. 2 and 3 while detecting the distance to the first substrate 10 by the laser distance detector 45. When the first substrate 10 and the second substrate 20 move by the reference distance Lr and the first substrate 10 reaches the second position, the control unit 50 detects the scale number b (e) of the linear scale 33 at the second position by the first encoder head 17. The control unit 50 calculates a scale number difference NB of the linear scale 33 when the first substrate 10 moves the reference distance Lr, based on a difference (b (e) -b (s)) between the scale number b(s) at the first position and the scale number b (e) at the second position (b (e) -b (s)).
When the scale number difference NB is detected, the control unit 50 proceeds to step S202 in fig. 4 to correct the position correction coefficient k (n) by the following equation 5.
ka (n) ═ k (n) × [ NB × p ]/Lr … … (formula 5)
As in the above-described embodiment, the control unit 50 corrects the position of the center line 17a of the first encoder head 17 or the position of the center line 27a of the second encoder head 27 detected by the linear scale 33 using the corrected position correction coefficient ka (n). The movement distance of the first encoder head 17 and the second encoder head 27 detected by the linear scale 33 is corrected using the corrected position correction coefficient ka (n) (movement amount correction step), and the movement amount or movement distance of the first substrate 10 and the second substrate 20 to which the first encoder head 17 and the second encoder head 27 are attached is controlled (movement amount control step).
Like the operation described above with reference to fig. 2 and 3, this operation can improve the position detection accuracy of the first bonding head 13, the second bonding head 23, the first camera 16, and the second camera 26, and suppress a decrease in the mounting accuracy of the electronic component. In the above description, the scale numbers of the linear scale 33 when the first substrate 10 is located at the first position and the second position are detected by the first encoder head 17, but the scale numbers of the linear scale 33 when the second substrate 20 is located at the first position and the second position may be detected by the second encoder head 27.
Next, other operations in step S201 and step S202 in fig. 4 will be described.
As shown in fig. 5, the mounting device 70 of the present embodiment includes a first reference member 61 in which a position mark Ms is disposed at a first position, and a second reference member 62 in which a position mark Me is disposed at a second position.
In step S201 of fig. 4, the control section 50 aligns the optical axis 16z of the first camera 16 with the position of the position mark Ms of the first reference member 61, and detects the scale number b (S) of the linear scale 33 at the first position by the first encoder head 17. Then, the control unit 50 moves the first substrate 10 and the second substrate 20 until the optical axis 16z of the first camera 16 reaches the position of the position mark Me while acquiring an image by the first camera 16. Then, when the optical axis 16z of the first camera 16 reaches the second position of the position mark Me, the scale number b (e) of the linear scale 33 is detected by the first encoder head 17. Then, the control unit 50 calculates a scale number difference NB of the linear scale 33 when the first and second substrates 10 and 20 have moved the reference distance Lr, based on the difference between the scale number b(s) at the first position and the scale number b (e) at the second position (b (e) -b (s)).
Similarly to the above operation, when the control unit 50 detects the scale number difference NB, the routine proceeds to step S202 in fig. 4, and corrects the position correction coefficient k (n) by the following equation 5.
ka (n) ═ k (n) × [ NB × p ]/Lr … … (formula 5)
As described above, similarly to the above-described operation, the position detection accuracy of the first bonding head 13, the second bonding head 23, the first camera 16, and the second camera 26 can be improved, and the reduction in the mounting accuracy of the electronic component can be suppressed. In the above description, the scale numbers of the linear scale 33 when the first substrate 10 is located at the first position and the second position are detected by the first encoder head 17, but the scale numbers of the linear scale 33 when the second substrate 20 is located at the first position and the second position may be detected by the second encoder head 27.
The present embodiment exhibits the same effects as those of the above-described embodiments.
In the embodiment described above, the first substrate 10 and the second substrate 20 are moved by the reference distance Lr by aligning the optical axes 16z and 26z of the first camera 16 and the second camera 26 with the position marks Ms and Me, but the position correction coefficient k (n) may be corrected by the following method.
The first substrate 10 is moved to a position where the position mark Ms enters the field of view of the first camera 16, an image of the position mark Ms is captured, and the distance d1 between the optical axis 16z of the first camera 16 and the position mark Ms is detected. In addition, the scale number b(s) of the linear scale 33 is detected by the first encoder head 17. Then, the first substrate 10 is moved to a position where the position mark Me enters the field of view of the first camera 16, an image of the position mark Me is detected by the first camera 16, and the distance d2 between the optical axis 16z of the first camera 16 and the position mark Me is detected. Then, a distance in consideration of the distance d1, the distance d2 in the reference distance Lr is acquired as the approximate reference distance Lr 1. In addition, the scale number b (e) of the linear scale 33 is detected by the first encoder head 17.
Then, the position correction coefficient k (n) is corrected by the following equation (6) based on the scale number difference NB ═ b (b) (e) -b (s)) and the approximate reference distance Lr 1.
ka (n) ═ k (n) × [ NB × p ]/Lr1 … … (formula 6)
< construction of mounting device of other embodiment >
Next, the structure of the flip chip bonding apparatus 200 as another mounting apparatus will be described with reference to fig. 6 to 9.
As shown in fig. 6, the flip chip bonding apparatus 200 of the present embodiment includes: a main frame table 111; a first gantry (gantry frame)120A and a second gantry 120B supported on the main frame 111 and extending in parallel in the Y direction; a first mounting head 170A and a second mounting head 170B supported by the first gantry 120A and the second gantry 120B; a first X-direction linear motor 135A and a second X-direction linear motor 135B that drive the first gantry 120A and the second gantry 120B in the X direction; a first Y-direction linear motor 155A and a second Y-direction linear motor 155B that drive the first mounting head 170A and the second mounting head 170B in the Y direction; a sub-frame 180 disposed apart from the main frame 111; and a first Y-direction load bearing member 154A and a second Y-direction load bearing member 154B mounted on the sub-mount 180, wherein one ends of the first Y-direction stator 150A and the second Y-direction stator 150B of the first Y-direction linear motor 155A and the second Y-direction linear motor 155B are connected to the first Y-direction load bearing member 154A and the second Y-direction load bearing member 154B via a first connecting member 153A and a second connecting member 153B. The X direction and the Y direction are directions orthogonal to each other on a horizontal plane, and in the present embodiment, a direction in which the first gantry 120A and the second gantry 120B extend as shown in fig. 1 is described as the Y direction, and a direction orthogonal thereto is described as the X direction. The Z direction is a vertical direction perpendicular to the XY plane.
As shown in fig. 1, the main frame 111 is a frame having a rectangular plane, and the mounting platform 110 is mounted on the upper surface thereof. The mounting platform 110 vacuum-adsorbs a substrate 19 on which a semiconductor die is mounted. Two linear guide rails 112 are provided in parallel with each other near two opposite sides of the upper surface of the main frame table 111. As shown in fig. 6 to 8, a first slider 126A and a second slider 126B are movably attached to the linear guide 112 in the X direction. Further, the first leg 123A and the second leg 123B of the first gantry 120A and the second gantry 120B are respectively attached to the sliders 126A and 126B of the two linear guides 112. That is, the first gantry 120A and the second gantry 120B extend in the Y direction so as to straddle the main frame base 111, and the leg portions 123A and 123B at both ends are attached to the sliders 126A and 126B, respectively, and are supported so as to be movable in the X direction by the linear guide 112 attached to the main frame base 111.
As shown in fig. 6, the flip chip bonding apparatus 200 according to the present embodiment includes a sub-mount 180 that is spaced apart from the main mount 111 so as to surround the main mount 111. The subframe 180 is a frame composed of a column 181, a column 182, and a beam 184. As shown in fig. 6 and 8, the beam 184 extending in the X direction is provided with the X direction stator 130 of the first X direction linear motor 135A and the second X direction linear motor 135B. As shown in fig. 8, the X-direction stator 130 is formed by arranging permanent magnets 132 facing each other with a space left above a support plate 131. In the space between the permanent magnets 132 of the X-direction stator 130, the first X-direction movable element 140A of the first X-direction linear motor 135A and the second X-direction linear motor 135B and the first coil 142A and the second coil 142B of the second X-direction movable element 140B are arranged. The first coil 142A and the second coil 142B are fixed to the first base plate 141A and the second base plate 141B on the upper side, the first base plate 141A and the second base plate 141B are fixed to the first plate 125A and the second plate 125B by bolts or the like, and the first plate 125A and the second plate 125B are attached to the front ends of the first arm 124A and the second arm 124B extending from the first leg 123A and the second leg 123B of the first gantry 120A and the second gantry 120B. Therefore, the X-direction movable elements 140A and 140B of the X-direction linear motors 135A and 135B move in the X direction together with the gantries 120A and 120B.
As shown in fig. 1, the X-direction stator 130 is provided with a first X-direction movable element 140A and a second X-direction movable element 140B. The X-direction stator 130 is combined with the first X-direction movable element 140A and the second X-direction movable element 140B to form a first X-direction linear motor 135A and a second X-direction linear motor 135B, respectively.
As shown in fig. 6, a linear scale 192 of a linear encoder 190 linearly extending in the X direction is attached to the side surfaces of the main frame table 111 on the first X direction movable element 140A and the second X direction movable element 140B side, and a first encoder head 193A and a second encoder head 193B of the linear encoder 190 are attached to the tips of a first handle (lug)191A and a second handle 191B of an L shape extending from the first X direction movable element 140A and the second X direction movable element 140B to the main frame table 111 side. In this manner, the first encoder head 193A and the second encoder head 193B are mounted on the end portions of the first gantry 120A and the second gantry 120B on the side of the linear scale 192.
As shown in fig. 6 and 9, the first and second mounting heads 170A and 170B are supported by the first and second gantries 120A and 120B. As shown in fig. 9, the first mounting head 170A and the second mounting head 170B accommodate a Z-direction moving mechanism that moves up and down a first shaft and a second shaft 172A, to which the first mounting tool 173A and the second mounting tool 173B are attached at the tips, in the Z direction. The Z-direction moving mechanism moves the first mounting tool 173A and the second mounting tool 173B up and down, and presses the semiconductor die 15 against the substrate 19, and the substrate 19 is fixed to the mounting stage 110 by suction. A space is provided inside the first and second door frames 120A and 120B, and two first and second linear rails 127A and 127B extending in the Y direction are provided on both sides of the inner surface. First and second sliders 175A and 175B are respectively attached to linear guides 127A and 127B, and suspension members 174A and 174B for mounting heads 170A and 170B are respectively attached to sliders 175A and 175B.
< calculating operation (calculating method) > < position correction coefficient k (n) of linear scale of mounting device
Next, the operation of calculating the position correction coefficient k (n) of the linear scale 192 will be described with reference to fig. 10 and 2 to 3. When the linear scale 192 thermally expands, an error may occur when the first and second door frames 120A and 1202B are moved from the reference position of the flip chip bonding apparatus 200 to a predetermined position. Therefore, the operation (calculation method) of calculating the position correction coefficient of the linear scale 192 will be described below.
As shown in fig. 10, the first mast 120A is set to the initial position, and the second mast 120B is moved in the X direction to a position adjacent to the first mast 120A. In turn, the first mast 120A is connected to the second mast 120B by the connecting member 122. Thus, the distance between the center of the first encoder head 193A and the center of the second encoder head 193B becomes a predetermined distance a shown in fig. 3. Then, as shown in step S101 of fig. 2, the control unit 50 initially sets n to 1.
Next, the control unit 50 drives the first X-direction linear motor 135A to move the first gantry 120A and the second gantry 120B in the X direction. At this time, since the first gantry 120A and the second gantry 120B are connected via the connecting member 122, the interval between the center of the first encoder head 193A and the center of the second encoder head 193B is maintained at the predetermined interval a. Then, as shown in step S102 of fig. 2 and fig. 3, the control unit 50 aligns the center of the first encoder head 193A with the first scale number B1(1) of the linear scale 192. Then, in step S103 of fig. 2, the control unit 50 detects the position of the first gantry 120A in the X direction at this time as a reference position by the laser distance detector 45.
As described above with reference to fig. 2 and 3, the controller 50 linearly moves the first and second gantries 120A and 120B by the predetermined scale number Δ B of the linear scale 192 in the X direction, and sequentially detects the first scale number B1(n) of the linear scale 192 where the center of the first encoder head 193A is located and the second scale number B2(n) of the linear scale 192 where the center of the second encoder head 193B is located by the first and second encoder heads 193A and 193B. Then, the control unit 50 repeats the following operations: the position correction coefficient k (n) of the linear scale 192 is calculated as the ratio of the predetermined distance a between the center of the first encoder head 193A and the center of the second encoder head 193B to the distance a (n) between the center of the first encoder head 193A and the center of the second encoder head 193B detected by the linear scale 192. Thus, the position correction coefficient k (n) of the linear scale 192 for each scale number b (n) of the linear scale 192 can be calculated from the graph of fig. 3.
In addition, as described above with reference to fig. 4 and 5, the control unit 50 may correct the position correction coefficient k (n) and ka (n) calculates the corrected position correction coefficient.
As described above, in the flip chip bonding apparatus 200 according to the present embodiment, while keeping the X-direction interval between the center of the first encoder head 193A and the center of the second encoder head 193B at the predetermined interval a, the first gantry 120A and the second gantry 120B are linearly moved by the predetermined scale number Δ B in the X direction, the first encoder head 193A and the second encoder head 193B sequentially detect the scale numbers to create a map of the position correction coefficient ka (n) of the linear scale 192, and the positions of the encoder heads 193A and 193B are corrected based on the map of the created position correction coefficient ka (n), so that the position detection accuracy of the mounting heads 170A and 170B can be improved, and the reduction in the mounting accuracy of the electronic components can be suppressed.
In the embodiment described above, the first gantry 120A and the second gantry 120B are connected by the connecting member 122, and the X-direction interval between the center of the first encoder head 193A and the center of the second encoder head 193B is maintained at the predetermined interval a, but as in the embodiment described above with reference to fig. 2 and 3, the X-direction interval between the center of the first encoder head 193A and the center of the second encoder head 193B may be maintained at the predetermined interval a by bringing the first gantry 120A into contact with the second gantry 120B.
The embodiments of the present invention have been described by taking the mounting apparatus 70 and the flip chip bonding apparatus 200 as examples, but the present invention is not limited to the flip chip bonding apparatus or the die bonding apparatus, and can be applied to various apparatuses. For example, the present invention can be applied to wire bonding apparatuses, industrial robots, and transfer apparatuses. The present invention is applicable to all devices without being limited to the field of objects to be transported or mounted, the size of the objects, and the technical field of the objects.
Description of the symbols
10. 20: base body
11: guide rail
12. 22: linear motor
13. 23: joint head
13z, 23z, 17a, 27 a: center line
14. 24: joining tool
15: semiconductor bare chip
16. 26: camera with a camera module
16z, 26 z: optical axis
17. 27: encoder head
18: joint platform
19: substrate
33. 192: linear scale
34: scale division
45: laser distance detector
50: control unit
61. 62: reference member
70: mounting device
110: mounting platform
111: main frame platform
120A, 120B: door frame
122. 153A, 153B: connecting member
123A, 123B: foot part
124A, 124B: arm(s)
125A, 125B: flat plate
126A, 126B: slider
112. 127A, 127B: linear guide rail
130: x-direction stator
131: supporting plate
132: permanent magnet
135A, 135B: x-direction linear motor
140A, 140B: x-direction movable element
141A, 141B: base plate
142A, 142B: coil
150A, 150B: y-direction stator
155A, 155B: y-direction linear motor
170A, 170B: mounting head
172A, 172B: shaft
173A, 173B: mounting tool
175A, 175B: slider
180: secondary support
181. 182: column
184: beam
190: linear encoder
191A, 190B: handle
193A, 193B: encoder head
200: flip chip bonding device

Claims (13)

1. An apparatus for linearly moving a first moving body and a second moving body with respect to an object, comprising:
the first moving body linearly moves by being guided by a rail;
the second movable body that moves linearly guided by the rail;
a scale arranged along the track and provided with a plurality of scales at a predetermined pitch along a moving direction;
a first detection unit that is disposed on the first movable body and detects a scale number of the scale;
a second detection unit that is disposed on the second movable body and detects a scale number of the scale; and
and a control unit that moves the first and second moving bodies along the track while maintaining a predetermined distance between the first and second detection units, detects a first scale number in which the first detection unit is located and a second scale number in which the second detection unit is located sequentially by the first and second detection units, and controls the amount of movement of the first and second moving bodies based on a ratio of the predetermined distance between the first and second detection units to a distance on a scale between the first scale number and the second scale number.
2. The apparatus according to claim 1, wherein the first moving body and the second moving body are each a transfer mechanism that transfers a semiconductor die to the object,
the object is a substrate or other semiconductor die for mounting the carried semiconductor die, and
the device is a device that mounts the semiconductor die to the object.
3. The apparatus of claim 1 or 2, further comprising:
a first driving unit configured to drive the first movable body; and
a second driving unit configured to drive the second movable body; and is
The control unit drives either the first drive unit or the second drive unit to press one of the first moving body and the second moving body against the other, and simultaneously moves the first moving body and the second moving body while maintaining the interval between the first detection unit and the second detection unit at the predetermined interval.
4. The apparatus according to claim 1 or 2, wherein the control unit calculates a position correction coefficient for each predetermined scale number from one end of the scale based on the predetermined interval and a ratio of a distance on the scale between the first scale number and the second scale number.
5. The apparatus according to claim 1, comprising a distance detector that detects a distance of the first mobile body or the second mobile body from a reference position,
the control unit moves the first and second moving bodies by a reference distance while keeping the first and second detection units at the predetermined interval and detecting a distance from the reference position by the distance detector, and detects a scale number difference of the scale between before and after moving the first and second moving bodies by the reference distance by the first or second detection unit,
and correcting the moving amount according to the reference distance and the scale number difference.
6. The apparatus of claim 1:
a reference member in which a position mark is disposed at a reference distance;
a first image acquisition unit that is mounted on the first movable body and acquires an image of the position mark; and
a second image acquisition unit that is mounted on the second movable body and acquires an image of the position mark;
the control unit moves the first and second moving bodies by the reference distance based on the image of the position mark acquired by the first or second image acquisition unit, and detects a scale number difference of the scale before and after the first and second moving bodies are moved by the first or second detection unit,
and correcting the moving amount according to the reference distance and the scale number difference.
7. The apparatus of claim 1 or 2 or 5 or 6, comprising a mounting platform for mounting electronic parts,
the tracks are two linear rails extending in the X direction,
the first moving body is a first gantry extending in the Y direction so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the second moving body is a second gantry extending in the Y direction in parallel with the first gantry so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the scale is arranged along one of the linear guides,
the first detection part is arranged at the end part of one side of the scale of the first portal,
the second detection part is arranged at the end part of one side of the scale of the second portal.
8. The apparatus of claim 3, comprising a mounting platform for mounting the electronic part,
the tracks are two linear rails extending in the X direction,
the first moving body is a first gantry extending in the Y direction so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the second moving body is a second gantry extending in the Y direction in parallel with the first gantry so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the scale is arranged along one of the linear guides,
the first detection part is arranged at the end part of one side of the scale of the first portal,
the second detection part is arranged at the end part of one side of the scale of the second portal.
9. The apparatus of claim 4, comprising a mounting platform for mounting the electronic part,
the tracks are two linear rails extending in the X direction,
the first moving body is a first gantry extending in the Y direction so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the second moving body is a second gantry extending in the Y direction in parallel with the first gantry so as to straddle the mounting platform, and having both ends guided by the two linear guide rails to move in the X direction,
the scale is arranged along one of the linear guides,
the first detection part is arranged at the end part of one side of the scale of the first portal,
the second detection part is arranged at the end part of one side of the scale of the second portal.
10. A method for linearly moving a first moving body and a second moving body with respect to an object, comprising the steps of:
a step of preparing an apparatus including the first moving body that moves linearly by being guided by a rail, the second moving body that moves linearly by being guided by the rail, a scale that is arranged along the rail and provided with a plurality of scales at a predetermined pitch along a moving direction, a first detection unit that is arranged on the first moving body, and a second detection unit that is arranged on the second moving body;
a scale number detection step of sequentially detecting a first scale number where the first detection unit is located and a second scale number where the second detection unit is located by the first detection unit and the second detection unit while moving the first moving body and the second moving body along the track with a predetermined distance between the first detection unit and the second detection unit maintained; and
a moving amount control step of controlling moving amounts of the first and second moving bodies based on a ratio of the predetermined interval between the first and second detection units to a distance on a scale between the first and second scale numbers.
11. The method of claim 10, comprising: and a correction coefficient calculation step of calculating a position correction coefficient for each predetermined scale number from one end of the scale based on a ratio of the predetermined interval to a distance on the scale between the first scale number and the second scale number.
12. The method according to claim 10, wherein the apparatus includes a distance detector that detects a distance of the first mobile body or the second mobile body from a reference position, and
the method comprises the following steps: a movement amount correction step of moving the first and second moving bodies by a reference distance while keeping the first and second detection units at the predetermined interval and detecting a distance from the reference position by the distance detector, and correcting the movement amount based on the reference distance and the scale number difference by detecting a scale number difference between the scale before and after the first and second moving bodies are moved by the reference distance by the first and second detection units.
13. The method according to claim 10, wherein the apparatus comprises a reference member in which a position mark is disposed at a reference distance, a first image acquisition mechanism that is mounted on the first moving body and acquires an image of the position mark, and a second image acquisition mechanism that is mounted on the second moving body and acquires an image of the position mark, and
the method comprises the following steps: a movement amount correction step of moving the first and second movable bodies by the reference distance based on the image of the position mark acquired by the first or second image acquisition means, detecting a scale number difference of the scale before and after the movement of the first and second movable bodies by the first or second detection unit, and correcting the movement amount based on the reference distance and the scale number difference.
CN201880066585.3A 2017-08-28 2018-08-28 Device and method for linearly moving first and second moving bodies with respect to object Active CN111213225B (en)

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CN111213225B (en) 2023-07-18
US11469125B2 (en) 2022-10-11
KR20200040877A (en) 2020-04-20
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WO2019044816A1 (en) 2019-03-07
TWI688016B (en) 2020-03-11

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