CN111211385A

CN111211385A - Filter convenient to equipment

Info

Publication number: CN111211385A
Application number: CN202010117179.4A
Authority: CN
Inventors: 韦俊杰; 陈鹏; 李朝勇
Original assignee: Chongqing Siruichuang Porcelain Electric Technology Co ltd
Current assignee: Chongqing Siruichuang Porcelain Electric Technology Co ltd
Priority date: 2020-02-25
Filing date: 2020-02-25
Publication date: 2020-05-29

Abstract

The invention relates to the technical field of wireless communication, in particular to a filter convenient to assemble, which comprises a dielectric body and a bearing PCB (printed circuit board), wherein the dielectric body comprises a base body, and a first coupling hole, a second coupling hole and a second coupling ring are formed in the base body; the bearing PCB comprises a substrate, wherein a first bonding pad, a second bonding pad, a first metalized through hole, a second metalized through hole, a third coupling ring and a fourth coupling ring are arranged on the upper surface of the substrate, and the first coupling hole and the third coupling ring, and the first coupling ring and the third coupling ring are fixed in a welding coupling manner; and a third bonding pad corresponding to the first bonding pad and a fourth bonding pad corresponding to the second bonding pad are arranged on the lower surface of the substrate. The invention solves the problems that the filter assembly process is complex, the assembly efficiency and the yield are low, and the large-scale assembly and manufacture cannot be met in the traditional method.

Description

Filter convenient to equipment

Technical Field

The invention relates to the technical field of wireless communication, in particular to a filter convenient to assemble.

Background

Miniaturization is an inevitable trend of future mobile communication base stations, reliable conductive connection needs to be carried out between a base station filter and a bearing PCB, effective signal shielding needs to be carried out on input and output ends, and the difference of port size precision control causes different matching impedances, so that the performance consistency of the dielectric filter is influenced, and the difficulty and the cost of a manufacturing process are increased.

The traditional solution is to open two large metallized through holes at the port of the filter bearing the PCB, pass the coupling probe through the two metallized through holes and respectively insert the two metallized through holes into the two port coupling holes of the dielectric filter, and then use solder paste for welding; the terminal has extremely high requirements on the assembly length, the diameter size and the concentric precision of the coupling probe, solder paste is printed between the dielectric filter and the bearing PCB through a steel mesh, a layer of copper foil with fixed thickness is padded between the dielectric filter and the bearing PCB, and the three are subjected to SMT welding. The method can realize complex process, low efficiency and yield and can not meet the requirement of mass assembly and manufacturing.

Disclosure of Invention

The invention mainly aims to provide a filter convenient to assemble, and solves the problems that the filter is complex to assemble, low in assembly efficiency and yield and incapable of being assembled and manufactured in large batch in the traditional method.

In order to achieve the above object, the present invention provides a filter convenient for assembly, which includes a dielectric body and a carrier PCB, wherein the dielectric body includes a base body, the base body is provided with a first coupling hole and a second coupling hole, the first coupling hole is externally provided with a first coupling ring, and the second coupling hole is externally provided with a second coupling ring; the bearing PCB board comprises a substrate, wherein a first bonding pad and a second bonding pad are arranged on the upper surface of the substrate, a first metalized through hole corresponding to a first coupling hole is formed in the center of the first bonding pad, a second metalized through hole corresponding to a second coupling hole is formed in the center of the second bonding pad, a third coupling ring corresponding to the first coupling ring is arranged outside the first bonding pad, a fourth coupling ring corresponding to the second coupling ring is arranged outside the second bonding pad, and the first coupling hole, the third coupling ring, the first coupling ring and the third coupling ring are fixed in a welding coupling mode; and a third bonding pad corresponding to the first bonding pad and a fourth bonding pad corresponding to the second bonding pad are arranged on the lower surface of the substrate.

The working principle and the advantages of the invention are as follows:

1. the arrangement of the first metalized through hole and the second metalized through hole can realize the electrical communication between the first bonding pad and the third bonding pad and between the second bonding pad and the fourth bonding pad by utilizing the signal conductivity of the metalized through hole of the bearing PCB. Due to the high-precision characteristic of PCB manufacturing, the first metalized through hole at the center of the first bonding pad and the third bonding pad can be consistent with the first coupling hole in size and corresponding to the first coupling hole in position; the second metalized through hole in the center of the second bonding pad and the center of the fourth bonding pad can be consistent with the size and correspond to the position of the second coupling hole. The problem that the requirements of the terminal on the assembly length, the diameter size and the concentricity precision of the coupling probe are extremely high is solved, and the performance deterioration of the filter caused by the size and the assembly error of the coupling probe is prevented.

2. The arrangement of the first coupling ring, the second coupling ring, the third coupling ring and the fourth coupling ring can enable a layer of copper foil with fixed thickness to be not required to be padded between the first coupling ring and the third coupling ring, and a layer of copper foil with fixed thickness to be not required to be padded between the second coupling ring and the fourth coupling ring, so that the connection reliability between the base station filter and the bearing PCB is improved, the process is simplified, the production and manufacturing efficiency is improved, and the yield is increased.

3. The bearing PCB is mature in processing technology and simple to realize, the consistency of the sizes of the coupling ports (the first coupling ring and the third coupling ring, and the second coupling ring and the fourth coupling ring) can be greatly improved, the welding assembly difficulty is reduced, the material quantity is reduced, and the production and manufacturing cost is reduced, so that the mass production is facilitated.

Further, the shapes of the first pad, the second pad, the third pad and the fourth pad include a circle, a regular square or other irregular polygon.

The opening is convenient, simple and practical.

Further, the shapes of the first coupling ring, the second coupling ring, the third coupling ring and the second coupling ring comprise circles, regular squares or other irregular polygons.

The opening is convenient, simple and practical.

Furthermore, a plurality of metalized shielding through holes surrounding the third coupling ring and the fourth coupling are formed in the substrate.

The arrangement of the metalized shielding through hole can form metal shielding, and prevent electromagnetic waves from leaking outwards firstly without being filtered by a filter.

Further, the cross-sectional shape of the metalized shielded via includes circular, oval, square, and polygonal.

The opening is convenient, simple and practical.

Further, the side walls of the metalized shielding via hole, the first metalized via hole and the second metalized via hole are all provided with metal layers.

The metalized shielding through holes of the metalized shielding through holes are used for forming metal columns, so that the annular metal columns form an electromagnetic shielding cover, and electromagnetic waves are prevented from leaking outwards before being filtered by the filter. And the metal layer of the first metalized via is used for electrically connecting the first pad and the third pad, and the metal layer of the second metalized via is used for electrically connecting the first pad and the second pad.

Further, the first coupling hole and the third coupling ring, and the first coupling hole and the third coupling are soldered by SMT solder paste.

And the SMT tin paste welding mode is adopted, so that the operation is simple and the connection is reliable.

Furthermore, the shapes of the green oil solder resist patterns arranged on the metalized top layer and the metalized bottom layer of the bearing PCB board comprise a circle, a regular square or an irregular polygon.

The liquid photosolder resist (commonly called green oil solder resist) is a protective layer, which is coated on the circuit and substrate of PCB printed circuit board without soldering, or used as solder resist. The purpose is to protect the formed circuit pattern for a long period of time.

Further, the material of the substrate includes a rockwell series material and a FR4 material.

Convenient material acquisition and reliable use.

Further, the cross-sectional shapes of the first and second metalized vias include circular, oval, square, and polygonal.

The arrangement of the first metalized through hole and the second metalized through hole in various shapes is convenient for meeting the design requirements of various PCB circuit boards.

Drawings

FIG. 1 is an isometric view of a filter that facilitates assembly according to an embodiment of the invention;

FIG. 2 is a front isometric view of a carrier PCB board;

FIG. 3 is a reverse isometric view of a carrier PCB board.

Detailed Description

The following is further detailed by way of specific embodiments:

reference numerals in the drawings of the specification include: the substrate comprises a base body 1, a first coupling hole 2-1, a second coupling hole 2-2, a first coupling ring 3-1, a second coupling ring 3-2, a substrate 4, a first bonding pad 5-1, a second bonding pad 5-2, a first coupling ring 6-1, a second coupling ring 6-2, a first metalized via 7-1, a second metalized via 7-2, a third bonding pad 8-1, a fourth bonding pad 8-2 and a metalized shielding via 9.

Example one

A filter for easy assembly, substantially as shown in figures 1 and 2, comprising a dielectric body and a carrier PCB.

As shown in fig. 1, the dielectric body includes a base 1, the base 1 is provided with a first coupling hole 2-1 and a second coupling hole 2-2 for coupling with a port of a filter, the first coupling hole 2-1 is externally provided with a first coupling ring 3-1, and the second coupling hole 2-2 is externally provided with a second coupling ring 3-2;

as shown in fig. 2 and 3, the carrier PCB includes a substrate 4, and the material of the substrate 4 includes rocky series material and FR4 material.

The upper surface of the substrate 4 is provided with a first bonding pad 5-1 and a second bonding pad 5-2, the center of the first bonding pad 5-1 is provided with a first metalized through hole 7-1 with the size, the size and the position corresponding to the first coupling hole 2-1, and the center of the second bonding pad 5-2 is provided with a second metalized through hole 7-2 with the size, the size and the position corresponding to the second coupling hole 2-2. The shapes of the first metalized via 7-1 and the second metalized via 7-2 are applicable to circles, ellipses, regular squares and irregular polygons, and the cross-sectional shapes of the first metalized via 7-1 and the second metalized via 7-2 are both circles in the embodiment.

The sidewalls of the first and second metalized vias 7-1 and 7-2 are plated with a metal layer.

A third coupling ring corresponding to the first coupling ring 3-1 is arranged outside the first bonding pad 5-1, a fourth coupling ring corresponding to the second coupling ring 3-2 is arranged outside the second bonding pad 5-2, the first coupling hole 2-1 and the third coupling ring are welded through SMT (surface mount technology) solder paste, and the second coupling hole 2-2 and the fourth coupling ring are welded through SMT solder paste. The shapes of the first coupling ring 3-1, the second coupling ring 3-2, the third coupling ring and the second coupling ring 3-2 are suitable for a circle, a regular square or other irregular polygons, and in the embodiment, the shapes of the first coupling ring 3-1, the second coupling ring 3-2, the third coupling ring and the second coupling ring 3-2 are circular.

The lower surface of the substrate 4 is provided with a third bonding pad 8-1 with the size, the size and the position corresponding to the first bonding pad 5-1, and is also provided with a fourth bonding pad 8-2 with the size, the size and the position corresponding to the second bonding pad 5-2. The shapes of the first bonding pad 5-1, the second bonding pad 5-2, the third bonding pad 8-1 and the fourth bonding pad 8-2 comprise circles, regular squares or other irregular polygons, and the shapes of the first bonding pad 5-1, the second bonding pad 5-2, the third bonding pad 8-1 and the fourth bonding pad 8-2 are all circles in the embodiment.

The shape of the green oil solder mask pattern arranged on the metallization top layer and the metallization bottom layer of the bearing PCB board comprises a circle, a regular square or an irregular polygon, and in the embodiment, the shape of the green oil solder mask pattern is a circle.

Example two

The difference between the second embodiment and the first embodiment is that the substrate 4 is provided with a plurality of metalized shielding vias 9 which surround the third coupling ring and are uniformly arranged, and is further provided with a plurality of metalized shielding vias 9 which surround the fourth coupling ring and are uniformly arranged. The sidewalls of the metalized shielded vias 9 are also plated with a metal layer. The cross-sectional shape of the metalized shielded via 9 includes circular, oval, regular square, and irregular polygonal. In this embodiment, the cross-sectional shape of the metalized shielded via 9 is circular.

The foregoing is merely an example of the present invention, and common general knowledge in the field of known specific structures and characteristics is not described herein in any greater extent than that known in the art at the filing date or prior to the priority date of the application, so that those skilled in the art can now appreciate that all of the above-described techniques in this field and have the ability to apply routine experimentation before this date can be combined with one or more of the present teachings to complete and implement the present invention, and that certain typical known structures or known methods do not pose any impediments to the implementation of the present invention by those skilled in the art. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims

1. A filter for ease of assembly, comprising: the PCB comprises a dielectric body and a bearing PCB, wherein the dielectric body comprises a base body, a first coupling hole and a second coupling hole are formed in the base body, a first coupling ring is arranged outside the first coupling hole, and a second coupling ring is arranged outside the second coupling hole; the bearing PCB board comprises a substrate, wherein a first bonding pad and a second bonding pad are arranged on the upper surface of the substrate, a first metalized through hole corresponding to a first coupling hole is formed in the center of the first bonding pad, a second metalized through hole corresponding to a second coupling hole is formed in the center of the second bonding pad, a third coupling ring corresponding to the first coupling ring is arranged outside the first bonding pad, a fourth coupling ring corresponding to the second coupling ring is arranged outside the second bonding pad, and the first coupling hole, the third coupling ring, the first coupling ring and the third coupling ring are fixed in a welding coupling mode; and a third bonding pad corresponding to the first bonding pad and a fourth bonding pad corresponding to the second bonding pad are arranged on the lower surface of the substrate.

2. The easy-to-assemble filter of claim 1, wherein: the shapes of the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad comprise circles, regular squares or other irregular polygons.

3. The easy-to-assemble filter of claim 1, wherein: the shapes of the first coupling ring, the second coupling ring, the third coupling ring and the second coupling ring comprise circles, regular squares or other irregular polygons.

4. The easy-to-assemble filter of claim 3, wherein: and the substrate is provided with a plurality of metalized shielding through holes which respectively surround the third coupling ring and the fourth coupling.

5. The easy-to-assemble filter of claim 4, wherein: the cross-sectional shape of the metalized shielded via includes circular, oval, square and polygonal.

6. The easy-to-assemble filter of claim 4, wherein: the side walls of the metalized shielding via hole, the first metalized via hole and the second metalized via hole are all provided with metal layers.

7. The easy-to-assemble filter of claim 1, wherein: and the first coupling hole and the third coupling ring, and the first coupling hole and the third coupling ring are welded through SMT (surface mount technology) solder paste.

8. The easy-to-assemble filter of claim 1, wherein: the shapes of the green oil solder resist patterns arranged on the metalized top layer and the metalized bottom layer of the bearing PCB board comprise a circle, a regular square or an irregular polygon.

9. The easy-to-assemble filter of claim 1, wherein: the materials of the substrate include Rogers series materials and FR4 materials.

10. The easy-to-assemble filter of claim 2, wherein: the cross-sectional shapes of the first and second metalized vias include circular, oval, square, and polygonal.