CN111210230A - Solder paste tracking verification method and system - Google Patents
Solder paste tracking verification method and system Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 94
- 238000012795 verification Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 48
- 238000003860 storage Methods 0.000 claims abstract description 47
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000006071 cream Substances 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims abstract description 5
- 230000006870 function Effects 0.000 claims description 29
- 238000012545 processing Methods 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 20
- 239000000284 extract Substances 0.000 claims description 7
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000015654 memory Effects 0.000 description 14
- 238000005476 soldering Methods 0.000 description 7
- 238000004590 computer program Methods 0.000 description 4
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- 239000000654 additive Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
The present disclosure provides a solder paste tracking verification method and related products, the method comprising the steps of: the two-dimensional code that electronic equipment scanned the tin cream packing obtains the first sign of this tin cream, draws the storage information that this first sign corresponds, and this storage information includes: the storage time of the solder paste and a first formula of the solder paste; the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier; and when the electronic equipment determines that the solder paste is not overdue according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification. The application provides a technical scheme has the advantage that improves production efficiency.
Description
Technical Field
The invention relates to the technical field of information, in particular to a solder paste tracking verification method and a solder paste tracking verification system.
Background
Solder paste, also called solder paste, gray or grey white paste, with a specific gravity of 7.2-8.5, is a novel soldering material. Compared with the traditional soldering paste, the soldering paste has more metal components. The paste is stored at a low temperature of zero to ten degrees (the best temperature is five to seven degrees), and the solder paste is also stored at a normal temperature in the market at present.
The existing solder paste cannot be verified during production, so that the solder paste is possibly not suitable for production equipment, and the production efficiency is influenced.
Disclosure of Invention
The embodiment of the invention provides a solder paste tracking verification method and a related product, which can verify solder paste and have the advantage of improving the production efficiency.
In a first aspect, an embodiment of the present invention provides a solder paste tracking verification method, where the method includes the following steps:
the two-dimensional code that electronic equipment scanned the tin cream packing obtains the first sign of this tin cream, draws the storage information that this first sign corresponds, and this storage information includes: the storage time of the solder paste and a first formula of the solder paste;
the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier;
and when the electronic equipment determines that the solder paste is not overdue according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
In a second aspect, an electronic device is provided, the electronic device comprising:
the scanning unit is used for scanning the two-dimensional code of the solder paste package to obtain a first identifier of the solder paste;
the processing unit is used for extracting storage information corresponding to the first identifier, and the storage information comprises: the storage time of the solder paste and a first formula of the solder paste;
the scanning unit is also used for acquiring a second identifier of the production equipment;
the processing unit is also used for determining the production process corresponding to the second identifier; and when the solder paste is determined to be unexpired according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
In a third aspect, a computer-readable storage medium is provided, which stores a program for electronic data exchange, wherein the program causes a server to execute the method provided in the first aspect.
The embodiment of the invention has the following beneficial effects:
it can be seen that the technical scheme that this application provided scans the two-dimensional code of solder paste packing and obtains the first sign of this solder paste, draws the storage information that this first sign corresponds, and this storage information includes: the storage time of the solder paste and a first formula of the solder paste; the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier; and when the electronic equipment determines that the solder paste is not overdue according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification. Therefore, whether the solder paste conforms to the production equipment can be verified directly by scanning, and therefore, the method has the advantage of improving the production efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device.
FIG. 2 is a flow chart of a solder paste trace verification method.
Fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," and "fourth," etc. in the description and claims of the invention and in the accompanying drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, result, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The electronic device related to the embodiments of the present application may include various handheld devices, vehicle-mounted devices, wearable devices (smart watches, smart bracelets, wireless headsets, augmented reality/virtual reality devices, smart glasses), computing devices or other processing devices connected to wireless modems, and various forms of User Equipment (UE), Mobile Stations (MS), server devices (terminal device), and the like, which have wireless communication functions. For convenience of description, the above-mentioned devices are collectively referred to as electronic devices.
The following describes embodiments of the present application in detail.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application, where the electronic device 100 includes a storage and processing circuit 110, and a sensor 170 connected to the storage and processing circuit 110, where:
the electronic device 100 may include control circuitry, which may include storage and processing circuitry 110. The storage and processing circuitry 110 may be a memory, such as a hard drive memory, a non-volatile memory (e.g., flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., static or dynamic random access memory, etc.), etc., and the embodiments of the present application are not limited thereto. Processing circuitry in storage and processing circuitry 110 may be used to control the operation of electronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.
The storage and processing circuitry 110 may be used to run software in the electronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) display screens, operations associated with performing wireless communication functionality, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in the electronic device 100, to name a few.
The electronic device 100 may include input-output circuitry 150. The input-output circuit 150 may be used to enable the electronic device 100 to input and output data, i.e., to allow the electronic device 100 to receive data from an external device and also to allow the electronic device 100 to output data from the electronic device 100 to the external device. The input-output circuit 150 may further include a sensor 170. Sensor 170 may include the ultrasonic fingerprint identification module, may also include ambient light sensor, proximity sensor based on light and electric capacity, touch sensor (for example, based on light touch sensor and/or capacitanc touch sensor, wherein, touch sensor may be a part of touch display screen, also can regard as a touch sensor structure independent utility), acceleration sensor, and other sensors etc., the ultrasonic fingerprint identification module can be integrated in the screen below, or, the ultrasonic fingerprint identification module can set up in electronic equipment's side or back, do not do the restriction here, this ultrasonic fingerprint identification module can be used to gather the fingerprint image.
The sensor 170 may include an Infrared (IR) camera or an RGB camera, and when the IR camera takes a picture, the pupil reflects infrared light, so the IR camera takes a pupil image more accurately than the RGB camera; the RGB camera needs to perform more subsequent image processing, the calculation precision and accuracy are higher than those of the IR camera, the universality is better than that of the IR camera, and the calculation amount is large.
Input-output circuit 150 may also include one or more display screens, such as display screen 130. The display 130 may include one or a combination of liquid crystal display, organic light emitting diode display, electronic ink display, plasma display, display using other display technologies. The display screen 130 may include an array of touch sensors (i.e., the display screen 130 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.
The electronic device 100 may also include an audio component 140. The audio component 140 may be used to provide audio input and output functionality for the electronic device 100. The audio components 140 in the electronic device 100 may include a speaker, a microphone, a buzzer, a tone generator, and other components for generating and detecting sound.
The communication circuit 120 may be used to provide the electronic device 100 with the capability to communicate with external devices. The communication circuit 120 may include analog and digital input-output interface circuits, and wireless communication circuits based on radio frequency signals and/or optical signals. The wireless communication circuitry in communication circuitry 120 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless Communication circuitry in Communication circuitry 120 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 120 may include a near field communication antenna and a near field communication transceiver. The communications circuitry 120 may also include a cellular telephone transceiver and antenna, a wireless local area network transceiver circuitry and antenna, and so forth.
The electronic device 100 may further include a battery, power management circuitry, and other input-output units 160. The input-output unit 160 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, and the like.
A user may input commands through input-output circuitry 150 to control the operation of electronic device 100, and may use output data of input-output circuitry 150 to enable receipt of status information and other outputs from electronic device 100.
Solder paste was produced with the application of Surface Mount Technology (SMT) in the 70's of the 20 th century. It is a creamy mixture of solder powder, flux and other additives that, at soldering temperatures, will solder the components to be soldered to the printed circuit pads to form a permanent connection.
The solder paste mainly comprises soldering flux and solder powder.
The soldering flux mainly comprises the following main components.
1. An activator. Can remove the oxide on the surface layer of the PCB pad and the welding part of the part and reduce the surface tension of tin and lead.
2. A thixotropic agent. The viscosity and the printing function of the solder paste are mainly adjusted, and the phenomena of trailing, adhesion and the like in printing can be avoided.
3. And (3) resin. Solder paste adhesion can be increased and the soldered PCB can be protected and prevented from re-oxidation.
The tin paste is a paste-like object with certain viscosity and composed of mixed materials of tin, other metal substances, soldering flux and additives.
The main purpose is to solder the components to the corresponding positions of the PCB.
The solder paste is mainly divided into a lead solder paste and a lead-free solder paste: the lead-tin paste has the unit component of Sn 63% Pb 37%, and has the advantages of low melting point of only 183 ℃, stable welding performance and low poor welding PPM value. The lead-free solder paste comprises SAC305 series Sn96.5%/Ag 3%/Cu0.5%, and has a melting point of 217-218 deg.C.
Weakly activated no-clean lead-free solder paste (M705) SAC305 series of solder pastes. Because it has moderate viscosity and is easy to control.
The diameter of the solder powder particles should be selected from 20um to 45um, the selection is carried out according to the density between an IC bonding pad and a bonding pad, and the distance between the IC pin bonding pad and the bonding pad of the I department is 0.4Md, and the diameter of the solder paste should be selected from 20um to 45 um: it must be stored in a refrigerator at 2-10 c in a sealed form. The storage period specifically refers to the specification requirement of the solder paste. The principle of first-in first-out is adhered to. The temperature of the refrigerator is monitored from time to time. The thermometer should be placed in the refrigerator.
The solder paste must be tempered at room temperature before use. The temperature return time was about 5 hours. After the temperature is raised to the end, the solder paste is stirred by a stirrer (about 15 minutes).
The unused solder paste should be returned to the refrigerator in time, and the overdue solder paste or the solder paste adjacent to the overdue solder paste should be returned to the supplier for replacing the new solder paste after confirmation of the relevant technicians.
Referring to fig. 2, fig. 2 provides a solder paste trace verification method, which is shown in fig. 2 and includes the following steps:
step S201, the electronic device scans the two-dimensional code of the solder paste package to obtain a first identifier of the solder paste, and extracts storage information corresponding to the first identifier, wherein the storage information comprises: the storage time of the solder paste and a first formula of the solder paste;
step S202, the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier;
step S203, when the electronic device determines that the solder paste is not expired according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
The application provides a two-dimensional code that technical scheme scanned tin cream packing acquires the first sign of this tin cream, draws the storage information that this first sign corresponds, and this storage information includes: the storage time of the solder paste and a first formula of the solder paste; the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier; and when the electronic equipment determines that the solder paste is not overdue according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification. Therefore, whether the solder paste conforms to the production equipment can be verified directly by scanning, and therefore, the method has the advantage of improving the production efficiency.
Optionally, the method may further include:
and the electronic equipment sends a loading command to the production equipment, and the loading command is used for instructing the production equipment to load the solder paste.
Optionally, the method further includes:
if the comparison result shows that the verification information is inconsistent, sending a verification failing message to the production equipment, wherein the verification failing message comprises: reasons for failure and reminder messages.
Optionally, the comparing the first formula with the formula template to determine whether the first formula and the formula template are consistent specifically includes:
the electronic equipment extracts x components of the formula template, extracts y components of the first formula, compares the x components with the y components to determine whether the x components are completely consistent, if so, determines that the verification is passed, if not, determines whether the x components are similar to the y components, if so, determines that the verification is passed, if not, determines that the verification is not passed.
Optionally, the determining whether the x components and the y components are similar specifically includes:
extracting z components which are completely the same in the x components and the y components, searching a first group of functions of the x-z components, searching a second group of functions of the y-z components, if the first group of functions is the same as the second group of functions, determining that the x components are similar to the y components, and if the first group of functions is different from the second group of functions, determining that the x components are dissimilar.
Referring to fig. 3, fig. 3 provides an electronic device including:
the scanning unit is used for scanning the two-dimensional code of the solder paste package to obtain a first identifier of the solder paste;
the processing unit is used for extracting storage information corresponding to the first identifier, and the storage information comprises: the storage time of the solder paste and a first formula of the solder paste;
the scanning unit is also used for acquiring a second identifier of the production equipment;
the processing unit is also used for determining the production process corresponding to the second identifier; and when the solder paste is determined to be unexpired according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
Optionally, the electronic device further includes:
and the communication unit is used for sending a loading command to the production equipment, and the loading command is used for instructing the production equipment to load the solder paste.
Optionally, the electronic device further includes:
a communication unit, configured to send a verification failure message to the production device if the comparison determines that the verification failure message is inconsistent, where the verification failure message includes: reasons for failure and reminder messages.
Optionally, the processing unit is specifically configured to extract x components of the recipe template, extract y components of the first recipe, compare the x components with the y components to determine whether the x components are completely consistent with each other, if the x components are completely consistent with each other, determine that the verification is passed, if the x components are not completely consistent with each other, determine whether the x components are similar to the y components, if the x components are similar to each other, determine that the verification is passed, if the x components are not similar to each other, and determine that the verification is not passed.
Optionally, the processing unit is specifically configured to extract z components that are completely the same in the x components and the y components, search for a first group function of the x-z components, search for a second group function of the y-z components, determine that the x components are similar to the y components if the first group function is the same as the second group function, and determine that the x components are not similar to the y components if the first group function is different from the second group function.
Embodiments of the present invention also provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute part or all of the steps of any one of the solder paste tracking verification methods described in the above method embodiments.
Embodiments of the present invention also provide a computer program product comprising a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any one of the solder paste trace verification methods as recited in the above method embodiments.
It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules illustrated are not necessarily required to practice the invention.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one type of division of logical functions, and there may be other divisions when actually implementing, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit may be implemented in the form of hardware, or may be implemented in the form of a software program module.
The integrated units, if implemented in the form of software program modules and sold or used as stand-alone products, may be stored in a computer readable memory. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a memory and includes several instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned memory comprises: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by associated hardware instructed by a program, which may be stored in a computer-readable memory, which may include: flash Memory disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.
The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A solder paste tracking verification method is characterized by comprising the following steps:
the two-dimensional code that electronic equipment scanned the tin cream packing obtains the first sign of this tin cream, draws the storage information that this first sign corresponds, and this storage information includes: the storage time of the solder paste and a first formula of the solder paste;
the electronic equipment acquires a second identifier of the production equipment and determines a production process corresponding to the second identifier;
and when the electronic equipment determines that the solder paste is not overdue according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
2. The method of claim 1, further comprising:
and the electronic equipment sends a loading command to the production equipment, and the loading command is used for instructing the production equipment to load the solder paste.
3. The method of claim 1, further comprising:
if the comparison result shows that the verification information is inconsistent, sending a verification failing message to the production equipment, wherein the verification failing message comprises: reasons for failure and reminder messages.
4. The method of claim 1, wherein comparing the first recipe to the recipe template to determine if the first recipe is consistent comprises:
the electronic equipment extracts x components of the formula template, extracts y components of the first formula, compares the x components with the y components to determine whether the x components are completely consistent, if so, determines that the verification is passed, if not, determines whether the x components are similar to the y components, if so, determines that the verification is passed, if not, determines that the verification is not passed.
5. The method of claim 4, wherein the determining whether the x components are similar to the y components comprises:
extracting z components which are completely the same in the x components and the y components, searching a first group of functions of the x-z components, searching a second group of functions of the y-z components, if the first group of functions is the same as the second group of functions, determining that the x components are similar to the y components, and if the first group of functions is different from the second group of functions, determining that the x components are dissimilar.
6. An electronic device, characterized in that the electronic device comprises:
the scanning unit is used for scanning the two-dimensional code of the solder paste package to obtain a first identifier of the solder paste;
the processing unit is used for extracting storage information corresponding to the first identifier, and the storage information comprises: the storage time of the solder paste and a first formula of the solder paste;
the scanning unit is also used for acquiring a second identifier of the production equipment;
the processing unit is also used for determining the production process corresponding to the second identifier; and when the solder paste is determined to be unexpired according to the storage time, extracting a formula template corresponding to the production process, comparing the first formula with the formula template to determine whether the first formula is consistent with the formula template, and if so, determining that the solder paste passes verification.
7. The electronic device of claim 6, further comprising:
and the communication unit is used for sending a loading command to the production equipment, and the loading command is used for instructing the production equipment to load the solder paste.
8. The electronic device of claim 6, further comprising:
a communication unit, configured to send a verification failure message to the production device if the comparison determines that the verification failure message is inconsistent, where the verification failure message includes: reasons for failure and reminder messages.
9. The electronic device of claim 6,
the processing unit is specifically configured to extract x components of the formula template, extract y components of the first formula, compare the x components with the y components to determine whether the x components are completely consistent, if the x components are completely consistent, determine that the verification is passed, if the verification is not completely consistent, determine whether the x components are similar to the y components, if the verification is passed, determine that the verification is not passed, if the verification is not similar, and determine that the verification is not passed.
10. The electronic device of claim 9,
the processing unit is specifically configured to extract z components that are completely the same among the x components and the y components, search for a first group function of the x-z components, search for a second group function of the y-z components, determine that the x components are similar to the y components if the first group function is the same as the second group function, and determine that the x components are dissimilar from the y components if the first group function is different from the second group function.
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| CN201911377320.8A CN111210230A (en) | 2019-12-27 | 2019-12-27 | Solder paste tracking verification method and system |
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| CN201911377320.8A CN111210230A (en) | 2019-12-27 | 2019-12-27 | Solder paste tracking verification method and system |
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