CN111209994A - Electronic label with pattern and manufacturing method thereof - Google Patents
Electronic label with pattern and manufacturing method thereof Download PDFInfo
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- CN111209994A CN111209994A CN201911409335.8A CN201911409335A CN111209994A CN 111209994 A CN111209994 A CN 111209994A CN 201911409335 A CN201911409335 A CN 201911409335A CN 111209994 A CN111209994 A CN 111209994A
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- Prior art keywords
- pattern
- hot melt
- release agent
- label
- printing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
Abstract
The invention discloses an electronic label with a pattern, which comprises a pattern label and an electronic label, wherein the pattern label comprises a pattern layer, a first base material and a first release agent, the first release agent is printed on the first base material, and the pattern layer is printed on the first release agent; the electronic tag comprises a circuit layer, an antenna and a first hot melt body, wherein the first hot melt body is arranged on the circuit layer and the antenna, and the circuit layer is arranged above the pattern layer.
Description
Technical Field
The invention belongs to the field of electronic tags, and particularly relates to an electronic tag with a pattern and a manufacturing method thereof.
Background
Radio Frequency identification (rfid) technology, also called electronic tag or rfid, is a communication technology that can identify a specific target and read and write related data through radio signals. Currently, electronic tags are generally classified into low frequency electronic tags, high frequency electronic tags, and ultra high frequency electronic (UHF RFID) tags. The ultrahigh frequency electronic tag is a frequency band in which a radio frequency signal works in an ultrahigh frequency band (UHF), and certainly, the UHF frequency bands defined by countries are different, for example: the frequency band of 860MHz to 960MHz specified in the international standard of ISO/IEC18000-6 covers the ultrahigh frequency band used in the main market in the world, wherein the frequency band of 840MHz to 845MHz or 920MHz to 925MHz in China, 865MHz to 868MHz in Europe, 902MHz to 928MHz in America. The ultrahigh frequency electronic tag is more suitable for single-grade product information management due to the advantages of high working frequency, long read-write distance and the like, and becomes an important direction for radio frequency identification research and application.
At present, the uhf electronic tag mainly includes an inlay (inlay) and a substrate, wherein the inlay is printed on the substrate, and the inlay is formed by bonding parts such as an antenna layer and an uhf chip. In order to combine a woven label (i.e., a woven trademark label, also commonly called a woven label, which is an identification label widely used in the fields of clothing, apparel, shoes, hats, home textiles, artware, and the like) with an ultrahigh frequency electronic label, the manufacturing method of the ultrahigh frequency woven label electronic label in the prior art is generally to print an inlay on a substrate of a colorless transparent film such as PET (polyethylene terephthalate), PVC (polyvinyl chloride), PP (polypropylene), ABS (acrylonitrile-butadiene-styrene copolymer), and form an ultrahigh frequency electronic label, and then wrap (e.g., sew) the ultrahigh frequency electronic label in the woven label.
The application number is 2013100580182 Chinese patent discloses a method for manufacturing an ultrahigh frequency woven label electronic tag, which comprises the steps of silk-screen release agent, silk-screen first transparent oil layer, silk-screen printing ink, silk-screen antenna, packaging ultrahigh frequency chip, silk-screen second transparent oil layer, silk-screen adhesive, slitting, hot stamping, tearing away a printing carrying sheet and the like, and the ultrahigh frequency woven label electronic tag is manufactured and disclosed according to the method, wherein the method for manufacturing the ultrahigh frequency woven label electronic tag takes a woven label as a base material, and directly hot-prints a single inlay on the woven label without additional processes such as wrapping and the like compared with the existing method for manufacturing the ultrahigh frequency woven label electronic tag, so that the manufacturing process is simplified; in addition, the ultrahigh frequency woven label electronic tag takes the woven label as a base material, the woven label is strong in tensile resistance and not easy to break, so that the tensile resistance of the whole electronic tag can be enhanced, and the electronic tag is not easy to break.
Although the above patent application discloses a woven label electronic tag, when it is made into a cloth product or clothes, the woven label electronic tag is not beautiful enough when it is outside, and is not comfortable to wear and difficult to remove when it is inside.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the electronic tag which not only has the recognition function, but also is more beautiful and can be hidden in the patterns of the cloth to form a whole.
In order to achieve the purpose, the invention provides the following technical scheme: an electronic label with a pattern comprises a pattern label and an electronic label, wherein the pattern label comprises a pattern layer, a first substrate and a first release agent, the first release agent is printed on the first substrate, and the pattern layer is printed on the first release agent; the electronic tag comprises a circuit layer, an antenna and a first hot melt, wherein the first hot melt is arranged on the circuit layer and the antenna, and the circuit layer is arranged above the pattern layer.
Further the circuit layer is printed over the pattern layer.
The pattern mark further comprises a second hot melt arranged above the pattern layer.
Further, the first hot melt and the second hot melt are hot melt adhesives or hot melt powders.
The pattern layer is further made of silica gel ink.
A method for manufacturing an electronic label with patterns comprises the following steps,
s1, making a pattern mark:
s11: printing a release agent, namely taking a first base material, and printing the first release agent on the first base material through a screen printing process;
s12: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
s13: coating a hot melt body, and coating a hot melt adhesive or hot melt powder on the surface of the silica gel ink;
s2, manufacturing an electronic tag:
s21: printing a release agent, namely taking a second base material, and printing the second release agent on the second base material by a screen printing technology;
s22: printing a circuit diagram on the surface of the second release agent by a screen printing technology;
s23: a bonded antenna, which is bonded to the surface of the circuit diagram;
s24: coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram;
s3, combining the logo and the electronic tag: and tearing off the second base material on the electronic tag, and heating the pattern label to enable the hot melt on the pattern label to be adhered to the circuit diagram of the electronic tag, so that the manufacturing is completed.
In a further step S23, the antenna is attached to the surface of the circuit pattern by an attaching machine at 180 ℃.
A method for manufacturing an electronic label with patterns comprises the following steps,
l1: printing a release agent, namely taking a first base material, and printing the first release agent on the first base material by a screen printing technology;
l2: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
l3: printing a circuit diagram on the surface of the pattern by a screen printing technique;
l4: a bonded antenna, which is bonded to the surface of the circuit diagram;
l5: and coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram to finish the manufacture.
Compared with the prior art, the invention has the beneficial effects that: the electronic tag is additionally arranged in the pattern mark, and when the pattern of the cloth is manufactured, the complete combination body is only needed to be thermally melted and adhered to the surface of the clothes, so that the attractive appearance of the pattern is achieved, and the pattern can be used as the electronic tag for identification.
Drawings
Fig. 1 is a schematic structural diagram of an electronic tag with a pattern according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the electronic tag with a pattern according to the present invention;
fig. 3 is a schematic structural view of a pattern label and an electronic tag according to a second embodiment of the present invention.
Reference numerals: 1. marking a pattern; 11. a first substrate; 12. a pattern layer; 23. a first hot melt; 2. an electronic tag; 21. a second substrate; 22. a circuit layer; 13. a second hot melt.
Detailed Description
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.
The first embodiment is as follows:
as shown in fig. 1, an electronic tag with a pattern comprises a pattern label 1 and an electronic tag 2, wherein the pattern label 1 comprises a pattern layer 12, a first substrate 11 and a first release agent, wherein the pattern layer 12 is made of silica gel ink, the first release agent is printed on the first substrate 11, and the pattern layer 12 is printed on the first release agent; the electronic tag 2 comprises a circuit layer 22, an antenna and a first hot melt 23, wherein the first hot melt 23 is arranged on the circuit layer 22 and the antenna, and the circuit layer 22 is arranged above the pattern layer 12.
The circuit layer 22 is printed over the pattern layer 12 in this embodiment.
In this embodiment, the first hot melt 23 is preferably a hot melt adhesive or a hot melt powder.
The specific manufacturing method of the first embodiment is as follows:
a method for manufacturing an electronic label with patterns comprises the following steps,
l1: printing a release agent, namely taking the first base material 11, and printing the first release agent on the first base material 11 by a screen printing technology;
l2: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
l3: printing a circuit diagram on the surface of the pattern by a screen printing technique;
l4: a bonded antenna, which is bonded to the surface of the circuit diagram;
l5: and coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram to finish the manufacture.
In this embodiment, the electronic label 2 is directly printed after the pattern label 1 is printed, that is, the whole electronic label 2 with the pattern is printed at one time, when the electronic label is used, the whole electronic label 2 is heated, so that the hot melt is melted and stands on the clothes, the first base material 11 is torn off, and the silica gel ink is used as a protective layer of the whole label while being beautiful.
In the preferred embodiment, the antenna is bonded to the surface of the circuit pattern by a bonding machine at 180 ℃.
Example two:
as shown in fig. 2, an electronic label with a pattern comprises a pattern label 1 and an electronic label 2, wherein the pattern label 1 comprises a pattern layer 12, a first substrate 11 and a first release agent, the first release agent is printed on the first substrate 11, and the pattern layer 12 is printed on the first release agent; the electronic tag 2 comprises a circuit layer 22, an antenna and a first hot melt 23, the first hot melt 23 is arranged on the circuit layer 22 and the antenna, the circuit layer 22 is arranged above the pattern layer 12, and in this embodiment, the pattern tag 1 further comprises a second hot melt 13 arranged above the pattern layer 12.
When the design label 1 and the electronic tag 2 are initially in a separated state, they are bonded together by the second hot melt 13.
In this embodiment, the first hot melt 23 and the second hot melt 13 are preferably hot melt adhesives or hot melt powders.
As shown in fig. 3, the specific manufacturing method is as follows: a method for manufacturing an electronic label with patterns comprises the following steps,
s1, making a pattern label 1:
s11: printing a release agent, namely taking the first base material 11, and printing the first release agent on the first base material 11 through a screen printing process;
s12: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
s13: coating a hot melt body, and coating a hot melt adhesive or hot melt powder on the surface of the silica gel ink;
s2, manufacturing electronic tag 2:
s21: printing a release agent, namely taking the second base material 21, and printing the second release agent on the second base material 21 by a screen printing technology;
s22: printing a circuit diagram on the surface of the second release agent by a screen printing technology;
s23: a bonded antenna, which is bonded to the surface of the circuit diagram;
s24: coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram;
s3, combining the logo 1 and the electronic tag 2: and (3) tearing off the second base material 21 on the electronic tag 2, and heating the pattern label 1 to enable the hot melt on the pattern label 1 to be adhered to the circuit diagram of the electronic tag 2, thereby completing the manufacture.
In the first and second embodiments of the present invention, the preferable material of the circuit layer 22 is conductive nano silver; the first substrate 11 and the second substrate 21 may be PET or paper or other materials, and the first substrate 11 and the second substrate 21 may be made of different materials.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. An electronic label with patterns is characterized in that: the pattern label comprises a pattern label and an electronic label, wherein the pattern label comprises a pattern layer, a first substrate and a first release agent, the first release agent is printed on the first substrate, and the pattern layer is printed on the first release agent; the electronic tag comprises a circuit layer, an antenna and a first hot melt, wherein the first hot melt is arranged on the circuit layer and the antenna, and the circuit layer is arranged above the pattern layer.
2. The electronic label with pattern as claimed in claim 1, characterized in that: the circuit layer is printed over the pattern layer.
3. The electronic label with pattern as claimed in claim 1, characterized in that: the pattern mark further comprises a second hot melt arranged above the pattern layer.
4. The electronic label with pattern as claimed in claim 3, characterized in that: the first hot melt body and the second hot melt body are hot melt adhesives or hot melt powder.
5. The electronic label with pattern as claimed in claim 1, characterized in that: the pattern layer is made of silica gel ink.
6. A method for manufacturing an electronic label with patterns is characterized by comprising the following steps,
s1, making a pattern mark:
s11: printing a release agent, namely taking a first base material, and printing the first release agent on the first base material through a screen printing process;
s12: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
s13: coating a hot melt body, and coating a hot melt adhesive or hot melt powder on the surface of the silica gel ink;
s2, manufacturing an electronic tag:
s21: printing a release agent, namely taking a second base material, and printing the second release agent on the second base material by a screen printing technology;
s22: printing a circuit diagram on the surface of the second release agent by a screen printing technology;
s23: a bonded antenna, which is bonded to the surface of the circuit diagram;
s24: coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram;
s3, combining the logo and the electronic tag: and tearing off the second base material on the electronic tag, and heating the pattern label to enable the hot melt on the pattern label to be adhered to the circuit diagram of the electronic tag, so that the manufacturing is completed.
7. The method for manufacturing an electronic tag with a pattern according to claim 6, wherein: in step S23, the antenna is attached to the surface of the circuit pattern by an attaching machine at 180 ℃.
8. A method for manufacturing an electronic label with patterns is characterized by comprising the following steps,
l1: printing a release agent, namely taking a first base material, and printing the first release agent on the first base material by a screen printing technology;
l2: printing patterns, namely printing silica gel ink on the surface of the first release agent by a screen printing technology according to the pattern style to be printed;
l3: printing a circuit diagram on the surface of the pattern by a screen printing technique;
l4: a bonded antenna, which is bonded to the surface of the circuit diagram;
l5: and coating hot melt, and coating hot melt adhesive or hot melt powder on the surface of the antenna and the circuit diagram to finish the manufacture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911409335.8A CN111209994A (en) | 2019-12-31 | 2019-12-31 | Electronic label with pattern and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911409335.8A CN111209994A (en) | 2019-12-31 | 2019-12-31 | Electronic label with pattern and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN111209994A true CN111209994A (en) | 2020-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911409335.8A Pending CN111209994A (en) | 2019-12-31 | 2019-12-31 | Electronic label with pattern and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093268A (en) * | 2013-02-25 | 2013-05-08 | 东莞植富商标印制有限公司 | Ultrahigh frequency woven label electronic label manufacturing method and ultrahigh frequency woven label electronic label |
| CN105243417A (en) * | 2015-11-19 | 2016-01-13 | 山东泰宝防伪技术产品有限公司 | RFID printed antenna hot stamped electronic tag and manufacturing method thereof |
| CN105279549A (en) * | 2015-11-19 | 2016-01-27 | 山东泰宝防伪技术产品有限公司 | Gold-stamped RFID tag and preparation method thereof |
| CN107247987A (en) * | 2017-05-26 | 2017-10-13 | 孙涵 | Make the production method of thermoprint RFID |
-
2019
- 2019-12-31 CN CN201911409335.8A patent/CN111209994A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103093268A (en) * | 2013-02-25 | 2013-05-08 | 东莞植富商标印制有限公司 | Ultrahigh frequency woven label electronic label manufacturing method and ultrahigh frequency woven label electronic label |
| CN105243417A (en) * | 2015-11-19 | 2016-01-13 | 山东泰宝防伪技术产品有限公司 | RFID printed antenna hot stamped electronic tag and manufacturing method thereof |
| CN105279549A (en) * | 2015-11-19 | 2016-01-27 | 山东泰宝防伪技术产品有限公司 | Gold-stamped RFID tag and preparation method thereof |
| CN107247987A (en) * | 2017-05-26 | 2017-10-13 | 孙涵 | Make the production method of thermoprint RFID |
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