CN111208475A - X-waveband digital subarray three-dimensional stacking implementation method - Google Patents
X-waveband digital subarray three-dimensional stacking implementation method Download PDFInfo
- Publication number
- CN111208475A CN111208475A CN202010018361.4A CN202010018361A CN111208475A CN 111208475 A CN111208475 A CN 111208475A CN 202010018361 A CN202010018361 A CN 202010018361A CN 111208475 A CN111208475 A CN 111208475A
- Authority
- CN
- China
- Prior art keywords
- digital
- assemblies
- channel
- subarray
- waveband
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims abstract description 19
- 238000007781 pre-processing Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000000712 assembly Effects 0.000 claims abstract description 11
- 238000000429 assembly Methods 0.000 claims abstract description 11
- 239000011449 brick Substances 0.000 abstract description 4
- 238000003491 array Methods 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000010622 cold drawing Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
- G01S7/032—Constructional details for solid-state radar subsystems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S2013/0236—Special technical features
- G01S2013/0245—Radar with phased array antenna
- G01S2013/0254—Active array antenna
Abstract
The invention discloses a method for realizing three-dimensional lamination of an X-waveband digital subarray, and belongs to the technical field of active digital phased arrays. The invention adopts eight front-end brick type eight-channel TR assemblies, every two assemblies are arranged on two sides of a cold plate, four cold plates are fixed together through a water diversion frame, and a tile type eight-channel frequency conversion module, a power supply control board and a digital signal preprocessing board are sequentially arranged at corresponding positions of the frame in a three-dimensional stacking and vertical interconnection mode; radio frequency and power supply control signals among the assemblies, the modules and the boards are vertically interconnected through SMP-KK and floating micro rectangular connectors in a step-by-step blind plugging mode. The digital subarray designed based on the three-dimensional stacking mode greatly reduces the size of each module unit in the X-waveband digital subarray in the signal transmission direction, and reduces the volume and the weight of the whole X-waveband digital subarray.
Description
Technical Field
The invention belongs to the technical field of active digital phased arrays.
Background
The phased array radar has the advantages of controllable wave beams, flexible wave beam scanning and high gain, and plays an important role in the existing radar technology. The phased array front end is an important component of the whole radar, and along with the fact that a phased array radar system faces the field of unmanned platform radar detection and reconnaissance in a large number, the unmanned platform has strict limitation on the weight and the size of equipment, so that the digital sub-array serving as the minimum replaceable unit of the active area array of the phased array radar is required to have the characteristics of small size, modularization and splicing, and therefore the digital sub-array unit is small in size, light in weight and high in internal integration design and accordingly can be produced.
In a multi-channel digital TR component (CN207283544U) and a novel transceiving component (CN107015203A), the layout of modules, printed boards and the like in the TR component of the traditional phased array active surface is flat, the middle layer of a shell is a cold plate, a microwave module, a power supply board and a digital board are laid flat, and a radio frequency signal and a control signal are connected through a cable. The brick type layout mode has good testability and maintainability, but has low integration level, incompact, large volume and heavy weight, thereby limiting the application of the phased array system in an unmanned platform.
Disclosure of Invention
The invention aims to provide a novel X-waveband digital sub-array for an active phased array radar, and mainly solves the problems that in the prior art, a front end TR component, a rear end frequency conversion module, a power panel and a digital signal preprocessing panel are connected in a blade type mode, a connector is large in size, and the whole radar is large in size and heavy in weight due to the fact that all component modules and the digital power panel are packaged again by a metal shielding box.
The invention designs an X-waveband digital subarray, which adopts eight-channel TR assemblies with eight brick blocks at the front end, every two assemblies are arranged on two sides of a cold plate, four cold plates are fixed together through a water diversion frame, and a tile-type eight-channel frequency conversion module, a power supply control board and a digital signal preprocessing board are sequentially arranged at corresponding positions of the frame in a three-dimensional stacking and vertical interconnection mode; radio frequency and power supply control signals among the assemblies, the modules and the boards are vertically interconnected through SMP-KK and floating micro rectangular connectors in a step-by-step blind plugging mode.
Compared with the prior art, the invention has the following remarkable advantages:
(1) by the internal layout of vertical opposite insertion, the integral integration level of the subarray is improved, and the volume and the weight of the subarray are reduced;
(2) the plurality of high-power TR components utilize the front and back surfaces of the water cooling plate to dissipate heat, so that the whole volume of the equipment is simplified;
(3) and various connectors of radio frequency, intermediate frequency and power supply control signals among the modules realize vertical interconnection, and various connecting cables are omitted. The connecting distance between each component module is compressed, the assembling steps are simplified, the space utilization rate is improved, and the complexity of the whole structure is simplified.
Drawings
FIG. 1 is a schematic diagram (side view) of the X-band digital subarray of the present invention;
FIG. 2 is a schematic diagram (top view) of the X-band digital subarray according to the present invention;
FIG. 3 is a schematic diagram of an X-band digital sub-array arrangement according to the present invention;
FIG. 4 is a schematic block diagram of an X-band digital sub-array according to the present invention.
Detailed Description
The implementation process of the invention is shown in attached figures 1 and 2.
Eight passageway TR subassemblies of 8 brick formulas in front are divided into four groups, and every group comprises 2 subassemblies and 1 cold plate, and 8 eight passageway TR subassemblies are fixed 4 cold drawing both sides respectively, and 4 cold drawing are fixed together through dividing the water frame again. And then sequentially installing the tile type power supply control board, the eight-channel frequency conversion module and the digital signal preprocessing board to corresponding positions of the frame in a three-dimensional vertical stacking mode. Radio frequency signals between the eight-channel TR component and the eight-channel frequency conversion module penetrate through the power control board and are vertically connected through smp-kk; the power control board supplies power and control signals to the eight-channel TR component and vertically inserts the power and control signals into the eight-channel TR component through a micro-rectangular floating connector plug on the power board and a socket of the eight-channel TR component; the intermediate frequency signals of the eight-channel frequency conversion module for the digital signal preprocessing board are vertically connected through smp-kk1, and the power supply and control signals of the digital signal preprocessing board for the eight-channel frequency conversion module are vertically connected with the socket on the eight-channel frequency conversion module through the micro rectangular connector on the digital signal preprocessing board. By the vertical opposite insertion mode, the size of the signal transmission direction is reduced, and the volume and the weight of the subarray are reduced.
The following illustrates the present invention, specifically describing the following process:
the X-waveband digital sub-array realized by the invention mainly comprises 4 water cooling plates 2, 1 water diversion frame 3, 8 eight- channel TR assemblies 1, 1 power supply control plate 6, 1 eight-channel frequency conversion module 4, 1 digital signal preprocessing plate 5, a plurality of floating micro-rectangular connectors 8 and SMP-KK7 and SMP-KK 19 with different lengths.
The single-channel emission peak power of the X-band digital sub-array realized by the invention is assumed to be 8W, the X-band digital sub-array has 64 receiving and transmitting channels in total, and the power density is higher. In order to guarantee high heat dissipation efficiency, 8 eight-channel TR assemblies 1 are respectively fixed on two sides of 4 cold plates 2, and the 4 cold plates 2 are fixed together through a water distribution frame 3. The power control board 6, the eight-channel frequency conversion module 4 and the digital signal preprocessing board 5 are vertically stacked and sequentially installed on the water diversion frame 3. The eight-channel TR component 1 is connected with the eight-channel frequency conversion module 4, and the radio frequency and intermediate frequency signals between the eight-channel frequency conversion module 4 and the digital signal preprocessing board 5 are oppositely inserted through SMP-KK with different lengths. The vertical interconnection of the power supply and the control signal between the eight-channel TR component 1 and the power supply control board 6, between the power supply control board 6 and the eight-channel frequency conversion module 4, between the power supply control board 6 and the digital signal preprocessing board 5 is realized through a floating micro rectangular connector.
During assembly, the eight-channel TR component 1 is firstly fixed on two sides of the water cooling plate 2, and then 4 water cooling plates 2 and the water distribution frame 3 are installed together; installing SMP-KK7 into a radio frequency collection end of the eight-channel TR component 1, then installing a power control board 6, enabling a hole at a corresponding position of the power control board 6 to penetrate through the SMP-KK7, and fastening 8 floating micro-rectangular plugs 8 on the board after being oppositely inserted into positions with 8 sockets of the eight-channel TR component 1; then the eight-channel frequency conversion module 4 is installed, the SMP-KK7 extending out of the eight-channel TR component 1 is inserted into a radio frequency socket of the eight-channel frequency conversion module 4, and meanwhile, a plug of a floating micro rectangular connector 8 on the power control board 4 is inserted into a socket of the eight-channel frequency conversion module 4; SMP-KK 19 is installed in an intermediate frequency SMP socket of the eight-channel frequency conversion module 4, then a digital signal preprocessing board 5 is installed, the digital signal preprocessing board 5 and a power control board 6 are vertically interconnected through a floating micro rectangular connector 8 socket, and the intermediate frequency signal and the eight-channel frequency conversion module 4 complete 8-way opposite insertion.
Claims (1)
1. A three-dimensional stacking realization method of an X-waveband digital subarray is characterized by comprising the following steps: eight brick-type eight-channel TR assemblies at the front end are adopted, every two assemblies are arranged on two sides of a cold plate, four cold plates are fixed together through a water distribution frame, and a tile-type eight-channel frequency conversion module, a power supply control board and a digital signal preprocessing board are sequentially arranged at corresponding positions of the frame in a three-dimensional stacking and vertical interconnection mode; radio frequency and power supply control signals among the assemblies, the modules and the boards are vertically interconnected through SMP-KK and floating micro rectangular connectors in a step-by-step blind plugging mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010018361.4A CN111208475A (en) | 2020-01-08 | 2020-01-08 | X-waveband digital subarray three-dimensional stacking implementation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010018361.4A CN111208475A (en) | 2020-01-08 | 2020-01-08 | X-waveband digital subarray three-dimensional stacking implementation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111208475A true CN111208475A (en) | 2020-05-29 |
Family
ID=70783454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010018361.4A Pending CN111208475A (en) | 2020-01-08 | 2020-01-08 | X-waveband digital subarray three-dimensional stacking implementation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111208475A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112180352A (en) * | 2020-08-24 | 2021-01-05 | 西安空间无线电技术研究所 | High-integration-level comprehensive radio frequency sensing array system |
| CN114389065A (en) * | 2021-12-21 | 2022-04-22 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
| CN117674879A (en) * | 2024-01-31 | 2024-03-08 | 成都华兴大地科技有限公司 | Brick type TR module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001077706A1 (en) * | 2000-04-07 | 2001-10-18 | The Chief Controller, Research And Development | Transmit/receiver module for active phased array antenna |
| US20150367247A1 (en) * | 2014-06-18 | 2015-12-24 | Jennifer Lynn Kosmo | Surfacescape for Multi-Dimensional Play and Display |
| CN105655725A (en) * | 2016-03-14 | 2016-06-08 | 中国电子科技集团公司第三十八研究所 | Two-dimensional expandable chip type active array antenna |
| CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
| CN206400090U (en) * | 2017-01-23 | 2017-08-11 | 荆州南湖机械股份有限公司 | A kind of T/R assembly apparatus with refrigerating function |
| CN107561504A (en) * | 2017-07-27 | 2018-01-09 | 中国船舶重工集团公司第七二四研究所 | A kind of multichannel T/R inside modules three-dimensional blindmate structure implementation method |
| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
-
2020
- 2020-01-08 CN CN202010018361.4A patent/CN111208475A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001077706A1 (en) * | 2000-04-07 | 2001-10-18 | The Chief Controller, Research And Development | Transmit/receiver module for active phased array antenna |
| US20150367247A1 (en) * | 2014-06-18 | 2015-12-24 | Jennifer Lynn Kosmo | Surfacescape for Multi-Dimensional Play and Display |
| CN105655725A (en) * | 2016-03-14 | 2016-06-08 | 中国电子科技集团公司第三十八研究所 | Two-dimensional expandable chip type active array antenna |
| CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
| CN206400090U (en) * | 2017-01-23 | 2017-08-11 | 荆州南湖机械股份有限公司 | A kind of T/R assembly apparatus with refrigerating function |
| CN107561504A (en) * | 2017-07-27 | 2018-01-09 | 中国船舶重工集团公司第七二四研究所 | A kind of multichannel T/R inside modules three-dimensional blindmate structure implementation method |
| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
Non-Patent Citations (1)
| Title |
|---|
| 张慧锋等: "小型化Ku波段瓦片式TR组件设计", 《中国西部科技》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112180352A (en) * | 2020-08-24 | 2021-01-05 | 西安空间无线电技术研究所 | High-integration-level comprehensive radio frequency sensing array system |
| CN114389065A (en) * | 2021-12-21 | 2022-04-22 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
| CN114389065B (en) * | 2021-12-21 | 2024-01-02 | 贵州航天计量测试技术研究所 | PXI radio frequency module and radio frequency microwave system |
| CN117674879A (en) * | 2024-01-31 | 2024-03-08 | 成都华兴大地科技有限公司 | Brick type TR module |
| CN117674879B (en) * | 2024-01-31 | 2024-04-02 | 成都华兴大地科技有限公司 | Brick type TR module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111208475A (en) | X-waveband digital subarray three-dimensional stacking implementation method | |
| CN105914476A (en) | Ka-band tilt-structure active phased array antenna | |
| CN110794373A (en) | Integrated millimeter wave tile formula TR subassembly | |
| EP3214700A1 (en) | Intelligent antenna device | |
| CN101984599A (en) | Backplane, communication equipment and communication systems | |
| CN109884594B (en) | High-performance integrated active module | |
| CN204405902U (en) | Optical module | |
| CN109687128B (en) | CTS flat panel array antenna based on SIW technology | |
| CN109860995B (en) | Light-weight phased array antenna correcting device | |
| CN111009736A (en) | Equal phase connecting device | |
| CN205004441U (en) | Waveguide slot antenna and mfg method thereof | |
| CN219498182U (en) | Two-dimensional expandable AOB architecture phased array antenna | |
| CN109888509B (en) | Large-scale array antenna | |
| CN217507633U (en) | Tightly-coupled broadband active phase-controlled antenna array surface | |
| CN212908106U (en) | Large-scale dense array antenna applied to 5G communication | |
| CN113992227A (en) | Radio frequency caliber transformation device and transmission method thereof | |
| CN113161765B (en) | Light-weighted low-profile flat plate array antenna | |
| CN110380200B (en) | Planar pyramid antenna array with hybrid power division feed | |
| CN211905671U (en) | Antenna assembly of microwave radar, microwave radar and movable platform | |
| CN114740430A (en) | Radar and vehicle | |
| CN216055192U (en) | Antenna array and antenna array combination device | |
| CN217882134U (en) | CVM controller cascade device, interface module and CVM controller | |
| CN111740234A (en) | Antenna structure | |
| CN203085758U (en) | High-gain high-efficient flat antenna loaded with medium lens | |
| CN208508052U (en) | A kind of radio frequency interface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant after: 724 Research Institute of China Shipbuilding Corp. Address before: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant before: 724TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200529 |