CN111208413A - Double-buffering PCBA test fixture pressing plate device - Google Patents
Double-buffering PCBA test fixture pressing plate device Download PDFInfo
- Publication number
- CN111208413A CN111208413A CN202010174494.0A CN202010174494A CN111208413A CN 111208413 A CN111208413 A CN 111208413A CN 202010174494 A CN202010174494 A CN 202010174494A CN 111208413 A CN111208413 A CN 111208413A
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- Prior art keywords
- buffer
- buffer spring
- test fixture
- pcba
- double
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The application discloses two buffering PCBA test fixture presser device includes: the pressing plate device body, the pressing plate device body includes the gland, the retaining member, the one-level bolster, one-level buffer spring, second grade bolster and second grade buffer spring, the mounting groove has been seted up to the upper cover plate bottom, the retaining member is fixed in the mounting groove, and the retaining member center has seted up first slide, the one-level bolster is through first slide and retaining member sliding connection, the second slide has been seted up at one-level bolster center, the second grade bolster passes through second slide and one-level bolster sliding connection, upward be provided with one-level buffer spring between gland and the one-level bolster, upward be provided with second grade buffer spring between gland and the. The double-buffering device is added, so that the buffering effect is greatly improved, overlarge mechanical impact on the PCBA is avoided, the problem that the PCBA is bounced and dislocated or bounced out of the jig is solved, the product quality can be effectively improved, and the production benefit is improved.
Description
Technical Field
The application relates to PCBA test equipment technical field especially relates to a two buffering PCBA test fixture clamp plate device.
Background
The PCBA pressing plate device is a module of a PCBA test fixture, the PCBA test fixture, an instrument and an upper machine form a test device for testing the PCBA performance, the PCBA performance can be tested and judged to be qualified or unqualified, and various defects and faults generated in the SMT assembly process or part incoming material defects can be effectively detected.
At present, the conventional PCBA press plate device has no buffer device or only one-stage buffer device, and has poor buffer effect, so that the invention provides a double-buffer PCBA test fixture press plate device.
Disclosure of Invention
The embodiment of the application provides a two buffering PCBA test fixture clamp plate device for improved buffering effect greatly, thereby avoided causing too big mechanical shock to PCBA, reduced PCBA simultaneously and bounce the dislocation or pop out the outer problem of tool.
In view of this, the present application provides a double buffering PCBA test fixture clamp plate device, includes: a platen device body;
the pressure plate device body comprises an upper gland, a locking piece, a primary buffer spring, a secondary buffer piece and a secondary buffer spring;
the bottom of the upper cover plate is provided with a mounting groove;
the locking piece is fixed in the mounting groove, and a first slide way is formed in the center of the locking piece;
the primary buffer piece is connected with the locking piece in a sliding mode through the first slide way;
a second slideway is formed in the center of the primary buffer piece;
the secondary buffer part is connected with the primary buffer part in a sliding manner through the second slide way;
the primary buffer spring is arranged between the upper gland and the primary buffer part;
and the second-stage buffer spring is arranged between the upper gland and the second-stage buffer part.
Optionally, one end of the primary buffer spring is fixedly connected with the bottom of the mounting groove, and the other end of the primary buffer spring is fixedly connected with the primary buffer piece;
one end of the secondary buffer spring is fixedly connected with the bottom of the mounting groove, and the other end of the secondary buffer spring is fixedly connected with the secondary buffer piece.
Optionally, a positioning groove for fixing the primary buffer spring and the secondary buffer spring is arranged at the bottom of the mounting groove.
Optionally, the diameter of the first-stage buffer spring is larger than that of the second-stage buffer spring, and the first-stage buffer spring and the second-stage buffer spring are concentrically arranged.
Optionally, the method further comprises: testing the jig;
the test fixture consists of a needle bed and a probe;
the test fixture is arranged right below the pressing plate device body.
Optionally, the elastic force of the primary buffer spring is 2-4 times of the total elastic force of the probe.
Optionally, the elastic force of the secondary buffer spring is half of the total elastic force of the probe.
Optionally, the primary buffer has a stroke 2-3 times the stroke of the probe.
Optionally, the secondary buffer has a stroke 4-6 times the stroke of the probe.
Optionally, a PCBA to be tested is provided on the needle bed.
According to the technical scheme, the embodiment of the application has the following advantages: through setting up one-level bolster, one-level buffer spring, second grade bolster and second grade buffer spring, adopt two buffer structure, the buffering effect has been improved greatly, thereby reduce the mechanical impact who causes PCBA when the clamp plate, prevent that PCBA from damaging because of receiving too big mechanical impact, and simultaneously, two buffer structure can effectively absorb the bounce of probe when loosening the clamp plate, avoid the probe bounce to bounce PCBA dislocation or pop out the tool outside, reduce down time, improve efficiency of software testing.
Drawings
FIG. 1 is a schematic structural diagram illustrating a pressing state of a pressing plate device of a double-buffer PCBA test fixture in an embodiment of the present application;
FIG. 2 is a schematic structural diagram illustrating a released state of a pressing plate device of a double-buffer PCBA test fixture in the embodiment of the present application;
wherein the reference numerals are:
1-upper gland, 2-locking piece, 3-primary buffer spring, 4-secondary buffer spring, 5-primary buffer piece, 6-secondary buffer piece, 7-needle bed, 8-probe and 9-PCBA.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The inventor finds that: traditional PCBA test fixture clamp plate device has following defect owing to do not have the buffering or only have the one-level buffering at the clamp plate in-process: 1. the PCBA is easily damaged due to excessive mechanical impact on the PCBA; 2. when the pressing plate is loosened, the PCBA is often bounced and dislocated or bounced out of the jig due to the rebound force of the probe, so that the machine is stopped, and the testing efficiency is seriously influenced.
The present application provides one embodiment of a double-buffer PCBA test fixture platen apparatus, please refer to fig. 1 and 2 in detail.
Double buffering PCBA test fixture clamp plate device in this embodiment includes: the plate pressing device body, the plate pressing device body includes gland 1, retaining member 2, one-level bolster 5, one-level buffer spring 3, second grade bolster 6 and second grade buffer spring 4, the mounting groove has been seted up to the upper cover plate bottom, retaining member 2 is fixed in the mounting groove, and retaining member 2 center has seted up first slide, one-level bolster 5 is through first slide and retaining member 2 sliding connection, the second slide has been seted up at one-level bolster 5 center, second grade bolster 6 is through second slide and 5 sliding connection of one-level bolster, upward be provided with one-level buffer spring 3 between gland 1 and the one-level bolster 5, upward be provided with second grade buffer spring 4 between gland 1 and the second grade bolster 6.
It should be noted that: through setting up one-level bolster 5, one-level buffer spring 3, second grade bolster 6 and second grade buffer spring 4, adopt two buffer structure, the buffering effect has been improved greatly, thereby reduce the mechanical impact who causes PCBA when the clamp plate, prevent that PCBA from damaging because of receiving too big mechanical impact, and simultaneously, two buffer structure can effectively absorb the bounce of probe when unclamping the clamp plate, avoid the probe bounce to bounce the dislocation or pop out the tool with PCBA outside, reduce down time, improve efficiency of software testing.
The above is a first embodiment of a double-buffer PCBA test fixture platen device provided in the embodiments of the present application, and the following is a second embodiment of a double-buffer PCBA test fixture platen device provided in the embodiments of the present application, and refer to fig. 1 and fig. 2 specifically.
Double buffering PCBA test fixture clamp plate device in this embodiment includes: the plate pressing device body, the plate pressing device body includes gland 1, retaining member 2, one-level bolster 5, one-level buffer spring 3, second grade bolster 6 and second grade buffer spring 4, the mounting groove has been seted up to the upper cover plate bottom, retaining member 2 is fixed in the mounting groove, and retaining member 2 center has seted up first slide, one-level bolster 5 is through first slide and retaining member 2 sliding connection, the second slide has been seted up at one-level bolster 5 center, second grade bolster 6 is through second slide and 5 sliding connection of one-level bolster, upward be provided with one-level buffer spring 3 between gland 1 and the one-level bolster 5, upward be provided with second grade buffer spring 4 between gland 1 and the second grade bolster 6.
Specifically, one end of the primary buffer spring 3 is fixedly connected with the bottom of the mounting groove, and the other end of the primary buffer spring is fixedly connected with the primary buffer piece 5; one end of the secondary buffer spring 4 is fixedly connected with the bottom of the mounting groove, and the other end of the secondary buffer spring is fixedly connected with the secondary buffer part 6.
The tank bottom of mounting groove is provided with the constant head tank that is used for fixed one-level buffer spring 3 and second grade buffer spring 4.
The diameter of one-level buffer spring 3 is greater than the diameter of second grade buffer spring 4, and one-level buffer spring 3 sets up with second grade buffer spring 4 is concentric, and second grade buffer spring 4 is located one-level buffer spring 3 inboardly.
Further comprising: the testing jig is composed of a needle bed 7 and a probe 8 and is arranged right below the pressing plate device body; the needle bed 7 is provided with a PCBA9 to be tested.
It should be noted that: according to PCBA test requirements, a proper first-level buffer spring 3 and a proper second-level buffer spring 4 are selected, the relationship between the elasticity and the displacement of the device is determined through measurement, the PCBA9 is prevented from being excessively impacted in the pressing-down process, and good contact between the PCBA9 and the probe 8 is guaranteed during pressing.
The elasticity of the first-level buffer spring 3 is 2-4 times of the total elasticity of the probe 8; the elasticity of the secondary buffer spring 4 is half of the total elasticity of the probe 8; the stroke of the primary buffer piece 5 is 2-3 times of that of the probe 8; the stroke of the secondary buffer 6 is 4-6 times of the stroke of the probe 8.
In specific implementation, as shown in fig. 2, when the device is started, the lower end surface of the secondary buffer member 6 contacts the PCBA9 first when the body of the pressure plate device is pressed down, and because the two buffer mechanisms are both in an extended state, the pressure applied to the PCBA9 is minimum; the secondary buffer spring 4 is gradually compressed as the pressing force applied to the PCBA9 is gradually increased, and when the secondary buffer spring is pressed to the position 2/3, the lower end face of the primary buffer member 5 starts to contact the PCBA9, and at this time, the elastic force of the primary buffer spring 3 starts to be applied to the PCBA 9; continuing to depress, the primary buffer spring 3 compresses to about the 1/2 position, depressing into position, and beginning the test. During the entire pressing process of the pressing plate, the pressure applied to the PCBA9 is gradually increased, and excessive mechanical impact on the PCBA9 is avoided.
As shown in fig. 1, when the test is completed, the pressing plate device body in a pressing state gradually rises, the primary buffer member 5 gradually extends out, and the probe 8 rebounds; continuing to ascend, finishing the rebound of the probe 8, finishing the extension of the primary buffer part 5, and starting the gradual extension of the secondary buffer part 6; the press plate is released to the top and the secondary cushion 6 is fully extended. In the whole process of loosening the pressing plate, the pressure applied to the PCBA9 is gradually reduced, and the resilience force of the probe 8 is absorbed, so that the PCBA9 cannot be bounced or bounced out of the jig.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. The utility model provides a two buffering PCBA test fixture presser device which characterized in that includes: a platen device body;
the pressure plate device body comprises an upper gland, a locking piece, a primary buffer spring, a secondary buffer piece and a secondary buffer spring;
the bottom of the upper cover plate is provided with a mounting groove;
the locking piece is fixed in the mounting groove, and a first slide way is formed in the center of the locking piece;
the primary buffer piece is connected with the locking piece in a sliding mode through the first slide way;
a second slideway is formed in the center of the primary buffer piece;
the secondary buffer part is connected with the primary buffer part in a sliding manner through the second slide way;
the primary buffer spring is arranged between the upper gland and the primary buffer part;
and the second-stage buffer spring is arranged between the upper gland and the second-stage buffer part.
2. The double-buffer PCBA test fixture pressing plate device as recited in claim 1, wherein one end of said primary buffer spring is fixedly connected with the bottom of said mounting groove, and the other end is fixedly connected with said primary buffer member;
one end of the secondary buffer spring is fixedly connected with the bottom of the mounting groove, and the other end of the secondary buffer spring is fixedly connected with the secondary buffer piece.
3. The double-buffer PCBA test fixture pressure plate apparatus as in claim 2, wherein a groove bottom of the mounting groove is provided with a positioning groove for fixing the primary buffer spring and the secondary buffer spring.
4. The double-buffer PCBA test fixture platen apparatus of claim 1, wherein the diameter of the primary buffer spring is greater than the diameter of the secondary buffer spring, and the primary buffer spring and the secondary buffer spring are concentrically disposed.
5. The double-buffer PCBA test fixture platen apparatus of claim 1, further comprising: testing the jig;
the test fixture consists of a needle bed and a probe;
the test fixture is arranged right below the pressing plate device body.
6. The double-buffer PCBA test fixture platen apparatus of claim 5, wherein the primary buffer spring has a spring force 2-4 times greater than the total spring force of the probes.
7. The double-buffer PCBA test fixture platen apparatus of claim 5, wherein the secondary buffer spring has a spring force that is half of the total spring force of the probes.
8. The double-buffer PCBA test fixture platen apparatus of claim 5, wherein the primary buffer has a stroke 2-3 times that of the probe.
9. The double-cushioned PCBA test fixture platen apparatus as in claim 5, wherein the secondary cushion has a stroke 4-6 times the stroke of the probe.
10. The double-buffer PCBA test fixture platen apparatus as in claim 5, wherein the needle bed is provided with a PCBA to be tested.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010174494.0A CN111208413A (en) | 2020-03-13 | 2020-03-13 | Double-buffering PCBA test fixture pressing plate device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010174494.0A CN111208413A (en) | 2020-03-13 | 2020-03-13 | Double-buffering PCBA test fixture pressing plate device |
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Publication Number | Publication Date |
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CN111208413A true CN111208413A (en) | 2020-05-29 |
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CN202010174494.0A Pending CN111208413A (en) | 2020-03-13 | 2020-03-13 | Double-buffering PCBA test fixture pressing plate device |
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CN (1) | CN111208413A (en) |
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2020
- 2020-03-13 CN CN202010174494.0A patent/CN111208413A/en active Pending
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