CN111201606A - Touch integrated display panel and preparation method thereof - Google Patents
Touch integrated display panel and preparation method thereof Download PDFInfo
- Publication number
- CN111201606A CN111201606A CN201780095821.XA CN201780095821A CN111201606A CN 111201606 A CN111201606 A CN 111201606A CN 201780095821 A CN201780095821 A CN 201780095821A CN 111201606 A CN111201606 A CN 111201606A
- Authority
- CN
- China
- Prior art keywords
- touch
- layer
- conductive layer
- opening
- touch conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 80
- 238000007639 printing Methods 0.000 claims abstract description 47
- 239000010409 thin film Substances 0.000 claims abstract description 34
- 238000005538 encapsulation Methods 0.000 claims abstract description 24
- 238000005516 engineering process Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000000059 patterning Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 293
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 54
- 229910052709 silver Inorganic materials 0.000 claims description 31
- 239000004332 silver Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 238000007641 inkjet printing Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 238000000608 laser ablation Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000007644 letterpress printing Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 108010001267 Protein Subunits Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
A method for manufacturing a touch integrated display panel includes providing an Organic Light Emitting Diode (OLED) panel including a light emitting body and a thin film encapsulation layer (S101); forming a first touch conductive layer on the thin film encapsulation layer by a printing technology, and patterning the first touch conductive layer (S102); and forming a first insulating layer (S103) on the first touch conductive layer to obtain a touch integrated display panel. The touch integrated display panel and the preparation method are simple in process and good in yield.
Description
The invention relates to the technical field of display, in particular to a touch integrated display panel and a preparation method thereof.
In various flexible or non-flexible display panels, it is a technological trend to integrate touch functions into a display panel. Taking an Organic Light-Emitting Diode (OLED) panel as an example, touch integration can be realized by integrating an additional conductive film on the package film. In the prior art, the process depends on conventional deposition, photolithography, etching, and the like, which include various plasma processes and wet processes, the process steps are too complicated, which may cause damage to the substrate or the device, that is, when the display panel is completed, the complicated process may cause a significant yield loss.
Disclosure of Invention
The embodiment of the invention discloses a touch integrated display panel with a simpler process and a preparation method thereof.
A preparation method of a touch integrated display panel comprises the following steps: providing an Organic Light Emitting Diode (OLED) panel including a light emitting body and a thin film encapsulation layer; forming a first touch conductive layer on the thin film packaging layer by a printing technology, and patterning the first touch conductive layer; and forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel.
A touch integrated display panel, comprising: an organic light emitting diode panel including a light emitting body and a thin film encapsulation layer; the patterned first touch conductive layer is formed on the thin film packaging layer through a printing technology, and the first touch conductive layer is made of a material containing at least one conductive particle; and a first insulating layer formed on the first touch conductive layer.
According to the touch integrated display panel and the preparation method, the touch conductive layer is formed by adopting a printing technology, the traditional processes such as plasma treatment and etching are not needed, the damage of temperature, pressure and the like to the OLED display panel and internal devices can be avoided to the greatest extent, and the process yield is improved.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a touch integrated display panel including a conductive layer according to an embodiment of the present invention.
Fig. 2 is a schematic flowchart of a method for manufacturing a touch integrated display panel including two conductive layers according to an embodiment of the present invention.
Fig. 3a to 3f are schematic diagrams illustrating a method for manufacturing a touch integrated display panel according to a first embodiment of the invention; FIG. 3a is a schematic top view of an OLED motherboard; FIG. 3b is a schematic cross-sectional view of the OLED motherboard of FIG. 3a along III-III; FIG. 3c is a schematic cross-sectional view illustrating a first touch conductive layer formed on an OLED; FIG. 3d is a schematic cross-sectional view illustrating a first insulating layer formed on the first touch conductive layer; fig. 3e is a schematic cross-sectional view illustrating a conductive silver paste layer formed on the OLED and the first touch conductive layer; fig. 3f is a schematic top view of a plurality of touch integrated display panels.
Fig. 4a to 4h are schematic diagrams illustrating a method for manufacturing a touch integrated display panel according to a second embodiment of the invention; FIG. 4a is a schematic top view of an OLED motherboard; FIG. 4b is a schematic cross-sectional view of the OLED motherboard of FIG. 4a taken along IV-IV; FIG. 4c is a schematic cross-sectional view illustrating a first touch conductive layer formed on an OLED; FIG. 4d is a schematic cross-sectional view illustrating a first insulating layer formed on the first touch conductive layer; fig. 4e is a schematic cross-sectional view illustrating a second touch conductive layer formed on the first insulating layer; fig. 4f is a schematic cross-sectional view illustrating a second insulating layer formed on the second touch conductive layer; fig. 4g is a schematic cross-sectional view illustrating a conductive silver paste layer formed on the OLED and the first touch conductive layer; fig. 4h is a schematic top view of a plurality of touch integrated display panels.
Fig. 5a-5b are schematic cross-sectional and top views of a touch integrated display panel according to another embodiment of the invention.
Fig. 6 is a schematic top view of a touch integrated display panel according to another embodiment of the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the technical solutions of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic view illustrating a method for manufacturing a touch integrated display panel according to the present invention.
A method 100 for manufacturing a touch integrated display panel includes:
s101, an Organic Light Emitting Diode (OLED) panel is provided, wherein the OLED panel includes a light emitting body and a Thin Film Encapsulation (TFE).
S102, forming a first touch conductive layer on the thin film packaging layer through a printing technology, and patterning the first touch conductive layer.
S103, forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel.
The light emitting body may include a substrate, a plurality of thin film transistors formed on the substrate, and a plurality of organic light emitting diode light emitting elements electrically connected to the plurality of thin film transistors.
The Printing technology may be Ink-Jet Printing (IJP), letterpress Printing, or the like, and preferably, the first touch conductive layer is formed by the Ink-Jet Printing technology.
An integrated touch conductive layer can be formed through a printing technology, and then the touch conductive layer is patterned through laser ablation and the like, so that a patterned first touch conductive layer is obtained; the patterned first touch conductive layer can also be formed directly by a printing technique.
The material of the first touch conductive layer may be a material containing conductive particles, and preferably, may be a material containing conductive particles such as nano conductive particles, metal silver/copper nanowires, and graphene.
The first insulating layer may be formed by a conventional manner, or may be formed by a printing technique, that is, by an inkjet printing technique or a relief printing technique, or the like. The first insulating layer may be made of a resin material. A first opening may be further formed on the first insulating layer to expose a portion of the first touch conductive layer. The first opening may be formed directly at the time of forming the first insulating layer, that is, the first insulating layer having the first opening may be formed directly by a printing technique or the like, or the first opening may be formed by a technique such as laser ablation after forming the integrated first insulating layer. The first touch conductive layer exposed from the first opening is used for electrically connecting other devices. The OLED panel can be divided into a display area and a non-display area located at the edge of the display area, and the first opening is located in the non-display area.
After the first insulating layer is formed, the method may further include:
and S104, forming a conductive silver glue layer.
The conductive silver adhesive layer is formed on the surface of the thin film packaging layer.
The conductive silver adhesive layer is located in the non-display area and connected with the first touch conductive layer exposed from the first opening so as to be electrically connected. The conductive silver glue layer is used for bonding and electrically connecting the touch integrated display panel with other devices, such as a flexible circuit board.
The conductive silver paste layer may also be formed using a printing technique such as IJP technique, relief printing technique, screen printing technique, and the like.
The OLED panel can be a motherboard, namely, the OLED panel comprises a plurality of OLED subunits, and each OLED subunit can independently complete the display function of an OLED; the plurality of OLED subunits are manufactured on the same mother board, and the touch conductive layer, the insulating layer and the conductive silver adhesive layer are formed on the mother board, so that the process can be saved, and the cost can be reduced; in this case, after the first insulating layer is formed or the conductive silver paste layer is formed, a step of:
s105, the OLED panel is divided into a plurality of sub-panels, and a plurality of touch integrated display panels are obtained, wherein each touch integrated display panel comprises an OLED sub-unit.
In order to realize more touch design, a multi-layer touch conductive layer can be designed on the TFE layer.
Referring to fig. 2, fig. 2 is a schematic diagram illustrating a method for manufacturing a touch integrated display panel having two touch conductive layers according to the present invention.
A method 200 for manufacturing a touch integrated display panel includes:
s201, providing an Organic Light Emitting Diode (OLED) panel, wherein the OLED panel comprises a light emitting body and a thin film packaging layer;
s202, forming a first touch conductive layer on the thin film packaging layer through a printing technology, and patterning the first touch conductive layer;
s203, forming a first insulating layer on the first touch conductive layer;
s204, forming a second touch conductive layer on the first insulating layer by a printing technology, and patterning the second touch conductive layer;
s205, forming a second insulating layer on the second touch conductive layer to obtain a touch integrated display panel.
The printing technology may be an inkjet printing technology, a letterpress printing technology, or the like. Preferably, the first and second touch conductive layers are formed by an inkjet printing technique.
An integrated touch conductive layer can be formed by a printing technology, and then the touch conductive layer is patterned by laser ablation and other modes, so that a patterned touch conductive layer is obtained; the patterned first and second touch conductive layers can also be formed directly by a printing technology.
The first touch conductive layer and the second touch conductive layer may be made of a material containing conductive particles, and preferably, may be made of a material containing conductive particles such as nano conductive particles, metal silver/copper nanowires, and graphene. The first touch conductive layer and the second touch conductive layer can be made of the same or different materials according to design requirements.
The first insulating layer and the second insulating layer may be formed by a conventional method, or may be formed by a printing technique, such as an inkjet printing technique or a relief printing technique. The first and second insulating layers may be made of resin material. The first insulating layer and the second insulating layer may be made of the same material or different materials.
A first opening may be further formed on the first insulating layer to expose a portion of the first touch conductive layer. The first opening may be formed directly at the time of forming the first insulating layer, that is, the first insulating layer having the first opening may be formed directly by a printing technique or the like, or the first opening may be formed by a technique such as laser ablation after forming the integrated first insulating layer. The first touch conductive layer exposed from the first opening is used for electrically connecting other devices.
A second opening may be further formed on the second insulating layer to expose a portion of the second touch conductive layer. The second opening may be formed directly at the time of formation of the second insulating layer, that is, the second insulating layer having the second opening may be formed directly by a printing technique or the like, or the second opening may be formed by a technique such as laser ablation after forming the integrated second insulating layer. The second touch conductive layer exposed from the second opening is used for electrically connecting other devices.
The OLED can be divided into a display area and a non-display area located at the edge of the display area, and the first opening and the second opening can be located in the non-display area.
After the first insulating layer is formed, the method may further include:
s206, forming a conductive silver glue layer.
The conductive silver colloid layer is formed in the non-display area. The conductive silver adhesive layer may be connected to the second touch conductive layer exposed to the second opening so as to be electrically connected thereto, or may be connected to the first touch conductive layer exposed to the first opening so as to be electrically connected thereto, and the conductive silver adhesive layer may be further divided into two parts spaced apart from each other, and the two parts of the conductive silver adhesive layer are electrically connected to the first touch conductive layer exposed to the first opening and the second touch conductive layer exposed to the second opening, respectively.
The conductive silver paste layer may be formed on the surface of the first insulating layer in the non-display region, or may be directly formed on the surface of the thin film encapsulation layer in the non-display region.
The conductive silver paste layer may also be formed using a printing technique, such as an inkjet printing technique, a letterpress printing technique, a screen printing technique, and the like.
When more than two touch conductive layers need to be formed, the steps S203 and S204 are repeated.
Similar to the above, the OLED panel may be a mother board, i.e. including a plurality of OLED sub-units, and further includes, after forming the first insulating layer or after forming the conductive silver paste layer, the steps of:
and S207, dividing the mother board into a plurality of daughter boards to obtain a plurality of touch integrated display panels, wherein each touch integrated display panel comprises an OLED subunit.
The touch integrated display panel and the manufacturing method thereof are described in the following embodiments.
The first embodiment of the present technical solution provides a touch integrated display panel 3 and a manufacturing method thereof.
Referring to fig. 3a-3b, an Organic Light Emitting Diode (OLED) panel 30 is provided, the OLED panel 30 includes a light emitter 31 and a thin film encapsulation layer 32.
The OLED panel 30 is a mother board, and includes a plurality of OLED sub-units 301, and each OLED sub-unit 301 is divided into a display area 302 and a non-display area 303. The non-display area 303 is located at the edge of the display area 302.
Referring to fig. 3c, a patterned first touch conductive layer 33 is formed on the thin film encapsulation layer 32 by a printing technique.
Referring to fig. 3d, a first insulating layer 34 is formed on the first touch conductive layer 33, so as to obtain a touch integrated display panel 3. The first insulating layer 34 covers the first touch conductive layer 33 and fills the pattern gaps of the first touch conductive layer 33, a first opening 341 is formed on the first insulating layer 34, and a portion of the first touch conductive layer 33 is exposed from the first opening 341. The first opening 341 is located in the non-display region 303.
Referring to fig. 3e, a conductive silver paste layer 35 is formed on the thin film encapsulation layer 32. The conductive silver paste layer 35 is connected to the first touch conductive layer 33 exposed from the first opening 341 so as to be electrically connected.
In this embodiment, the conductive silver paste layer is formed in the non-display region 303.
Referring to fig. 3f, the mother board is divided into a plurality of sub-boards along the boundary of the OLED sub-unit 301, so as to obtain a plurality of touch integrated display panels 3.
Referring to fig. 3e, the touch integrated display panel 3 includes a light emitter 31; a thin film encapsulation layer 32 formed on the light emitter 31; a patterned first touch conductive layer 33 formed on the thin film encapsulation layer 32 by a printing technique; a first insulating layer 34 covering the first touch conductive layer 33 and filling the pattern gaps of the first touch conductive layer 33, wherein a first opening 341 is formed on the first insulating layer 34, and a portion of the first touch conductive layer 33 is exposed from the first opening 341; and a conductive silver glue layer 35 formed on the thin film encapsulation layer 32.
The touch integrated display panel 3 is divided into a display area 302 and a non-display area 303 located at the edge of the display area 302, the first opening 341 is located in the non-display area 303, the conductive silver adhesive layer 35 is also formed in the non-display area 303, and the conductive silver adhesive layer 35 is connected with the first touch conductive layer 33 exposed from the first opening 341 so as to be electrically connected.
Preferably, the first insulating layer 34 is made of a resin material.
Preferably, the first touch conductive layer 33, the first insulating layer 34 and the conductive silver paste layer 35 are formed by a printing technique; more preferably, the first touch conductive layer 33, the first insulating layer 34 and the conductive silver paste layer 35 are formed by an inkjet printing technique.
The material of the first touch conductive layer may be a material containing conductive particles, and preferably, may be a material containing conductive particles such as nano conductive particles, metal silver/copper nanowires, and graphene.
The second embodiment of the present technical solution provides a touch integrated display panel 4 and a manufacturing method thereof.
Referring to fig. 4a-4b, an Organic Light Emitting Diode (OLED) panel 40 is provided, wherein the OLED panel 40 includes a light emitting body 41 and a thin film encapsulation layer 42.
The OLED panel 40 is a mother board, and includes a plurality of OLED sub-units 401, and each OLED sub-unit 401 is divided into a display area 402 and a non-display area 403. The non-display area 403 is located at the edge of the display area 402.
Referring to fig. 4c, a patterned first touch conductive layer 43 is formed on the thin film encapsulation layer 42 by a printing technique.
Referring to fig. 4d, a first insulating layer 44 is formed on the first touch conductive layer 43, and the first insulating layer 44 covers a portion of the first touch conductive layer 43 and fills the pattern gaps of the first touch conductive layer 43.
At least one first opening 441 is further formed on the first insulating layer 44, and a portion of the first touch conductive layer 43 is exposed by the at least one first opening 441. The first opening 441 is located in the non-display area 403.
Referring to fig. 4e, a patterned second touch conductive layer 46 is formed on the first insulating layer 44 by a printing technique;
referring to fig. 4f, a second insulating layer 47 is formed on the second touch conductive layer 46.
At least one second opening 471 is further formed in the second insulating layer 47, and the at least one second opening 471 exposes a portion of the second touch conductive layer 46. The second opening 471 is also located in the non-display area 403 and is different from the first opening 441.
Referring to fig. 4g, a conductive silver paste layer 45 is formed on the thin film encapsulation layer 42. The conductive silver glue layer 45 is located in the non-display area 403, and is connected to the first touch conductive layer 43 exposed in the first opening 441 so as to be electrically connected.
Referring to fig. 4h, the mother board is divided into sub-boards along the boundary of the OLED sub-unit 401, so as to obtain a plurality of touch integrated display panels 4.
The touch integrated display panel 4 comprises a light emitter 41; a thin film encapsulation layer 42 formed on the light emitter 41; a patterned first touch conductive layer 43 formed on the thin film encapsulation layer 42 by a printing technique; a first insulating layer 44 covering the first touch conductive layer 43 and filling the pattern gaps of the first touch conductive layer 43, wherein at least one first opening 441 is formed on the first insulating layer 44, and a portion of the first touch conductive layer 43 is exposed from the first opening 441; a second touch conductive layer 46 formed on the first insulating layer 44 by a printing technique; a second insulating layer 47 formed on the second touch conductive layer 46, wherein at least one second opening 471 is formed in the second insulating layer 47, and a portion of the second touch conductive layer 46 is exposed from the second opening 471; and a conductive silver glue layer 45 formed on the thin film encapsulation layer 42. The touch integrated display panel 4 is divided into a display area 402 and a non-display area 403, the first and second openings 441, 471 are located in the non-display area 403, the conductive silver glue layer 45 is also formed in the non-display area 403, and the conductive silver glue layer 45 is connected to the first touch conductive layer 43 exposed in the first opening 441 so as to be electrically connected.
In this embodiment, the first touch conductive layer 43 is electrically connected to an electronic device (not shown) through the conductive silver layer 45; the second touch conductive layer 46 is electrically connected to another electronic device (not shown) through another conductive medium, such as an anisotropic conductive adhesive, gold wire, or solder paste.
Preferably, the first and second insulating layers 44 and 47 are made of a resin material.
Preferably, the first and second touch conductive layers 43 and 46, the first and second insulating layers 44 and 47, and the conductive silver paste layer 45 are formed by a printing technique; more preferably, the first and second touch conductive layers 43 and 46, the first and second insulating layers 44 and 47, and the conductive silver paste layer 45 are formed by an inkjet printing technique.
The first touch conductive layer 43 and the second touch conductive layer 46 may be made of the same material or different materials, and the first insulating layer 44 and the second insulating layer 47 may be made of the same material or different materials. The first touch conductive layer 43 and the second touch conductive layer 46 may be made of a material containing conductive particles, and preferably, may be made of a material containing conductive particles such as nano conductive particles, metal silver/copper nanowires, and graphene.
In another embodiment, referring to fig. 5a-5b, the conductive silver paste layer 45 may also be connected to the second touch conductive layer 46 exposed in the second opening 471 so as to be electrically connected.
In another embodiment, referring to fig. 6, the conductive silver paste layer 45 may further include a first portion 451 and a second portion 452, wherein the first portion 451 is connected to the first touch conductive layer 43 exposed in the first opening 441 for electrical connection, and the second portion 452 is connected to the second touch conductive layer 46 exposed in the second opening 471 for electrical connection. The first touch conductive layer 43 and the second touch conductive layer 46 can be electrically connected to the same or different electronic devices (not shown).
In other embodiments, the conductive silver layer may not be formed, and the first and second touch conductive layers 43 and 46 are electrically connected to the electronic device through other conductive media, such as anisotropic conductive adhesive, gold wire, or solder paste.
The touch integrated display panel and the preparation method provided by the technical scheme have the following beneficial effects:
1. the touch conductive layer is formed by adopting a printing technology, the traditional processes such as plasma treatment, etching and the like are not needed, the damage of temperature, pressure and the like to the OLED display panel and internal devices can be avoided to the greatest extent, and the process yield is favorably improved.
2. The touch conductive layer is formed by adopting a printing technology, and the patterning of the touch conductive layer can be realized in one step without a yellow light process and an etching process, so that the flow and the cost can be saved.
3. The insulating layer and the conductive silver adhesive layer can be formed in a printing mode, so that the flatness of the formed touch integrated display panel is better, the touch integrated display panel is convenient to assemble with other devices, and the assembly quality is improved.
4. The touch integrated display panel can be manufactured on a mother board and then divided, so that the process and the cost can be saved; moreover, printing can be performed in a fixed area of the motherboard, and printing interference is less.
5. The printing technology can be compatible with various conductive materials, so that the optional range of the manufacturing process is wider, and the proper conductive materials can be selected for printing according to the process and the product requirements.
6. In order to realize more touch designs, a plurality of touch conductive layers can be printed and formed, and the design flexibility is higher; and the conductive layer in the hole for interlayer connection and the touch conductive layer for adding layers can be formed simultaneously, and the manufacturing process is simpler.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (20)
- A preparation method of a touch integrated display panel comprises the following steps:providing an organic light emitting diode panel including a light emitting body and a thin film encapsulation layer;forming a first touch conductive layer on the thin film packaging layer by a printing technology, and patterning the first touch conductive layer; andand forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel.
- The method according to claim 1, wherein the patterned first touch conductive layer is formed directly on the thin film encapsulation layer by a printing technique.
- The method according to claim 1, wherein an integrated touch conductive layer is formed on the thin film encapsulation layer by a printing technique, and then the touch conductive layer is patterned by laser ablation to obtain the patterned first touch conductive layer.
- The method according to claim 1, wherein the first insulating layer is formed by an inkjet printing technique or a letterpress printing technique.
- The method according to claim 4, wherein at least one first opening is formed in the first insulating layer, and a portion of the first touch conductive layer is exposed to the at least one first opening; the organic light emitting diode panel is divided into a display area and a non-display area, and the at least first opening is located in the non-display area.
- The method for manufacturing a touch integrated display panel according to claim 5, further comprising, after forming the first insulating layer, the steps of: and forming a conductive silver adhesive layer on the surface of the film packaging layer of the non-display area, wherein the conductive silver adhesive layer is connected with the first touch conductive layer exposed in the at least one first opening so as to be electrically connected.
- The method according to claim 5, wherein the first insulating layer having the at least one opening is formed on the first touch conductive layer directly by a printing technique.
- The method for manufacturing a touch integrated display panel according to claim 1, wherein after forming a first insulating layer on the first touch conductive layer, the method further comprises:forming a second touch conductive layer on the first insulating layer by a printing technology, and patterning the second touch conductive layer; andand forming a second insulating layer on the second touch conductive layer.
- The method according to claim 8, wherein the patterned second touch conductive layer is formed directly on the thin film encapsulation layer by a printing technique.
- The method according to claim 8, wherein an integrated touch conductive layer is formed on the thin film encapsulation layer by a printing technique, and then the touch conductive layer is patterned by laser ablation to obtain the patterned second touch conductive layer.
- The method according to claim 8, wherein at least one first opening is formed in the first insulating layer, and a portion of the first touch conductive layer is exposed to the at least one first opening; at least one second opening is formed in the second insulating layer, and part of the second touch conductive layer is exposed to the at least one second opening; the organic light emitting diode panel is divided into a display area and a non-display area, and the at least one first opening and the at least one second opening are located at different positions of the non-display area.
- The method for manufacturing a touch integrated display panel according to claim 11, further comprising, after forming the second insulating layer, the steps of: and forming a conductive silver adhesive layer in the non-display area, wherein the conductive silver adhesive layer is connected with the first touch conductive layer exposed in the at least one first opening or connected with the second touch conductive layer exposed in the at least one second opening so as to be electrically connected.
- The method for manufacturing a touch integrated display panel according to claim 11, further comprising, after forming the second insulating layer, the steps of: and forming a conductive silver adhesive layer in the non-display area, wherein the conductive silver adhesive layer comprises a first part and a second part which are separated, the first part is connected with the first touch conductive layer exposed in the at least one first opening so as to be electrically connected, and the second part is connected with the second touch conductive layer exposed in the at least one second opening so as to be electrically connected.
- A touch integrated display panel, comprising:an organic light emitting diode panel including a light emitting body and a thin film encapsulation layer;the patterned first touch conductive layer is formed on the thin film packaging layer through a printing technology, and the first touch conductive layer is made of a material containing at least one conductive particle; andthe first insulating layer is formed on the first touch conductive layer.
- The touch integrated display panel according to claim 14, wherein the first insulating layer has at least one first opening formed thereon, a portion of the first touch conductive layer is exposed to the at least one first opening, the touch integrated display panel is divided into a display region and a non-display region, and the at least one first opening is located in the non-display region.
- The touch integrated display panel of claim 15, further comprising a conductive silver paste layer formed on the non-display region, the conductive silver paste layer contacting the first touch conductive layer exposed to the at least one first opening so as to be electrically connected thereto.
- The touch integrated display panel according to claim 14, further comprising a second touch conductive layer formed on the first insulating layer by a printing technique, and a second insulating layer formed on the second touch conductive layer; at least one first opening is formed on the first insulating layer, and part of the first touch conductive layer is exposed to the at least one first opening; at least one second opening is formed in the second insulating layer, and part of the second touch conductive layer is exposed to the at least one second opening; the organic light emitting diode panel is divided into a display area and a non-display area, the at least one first opening and the at least one second opening are located at different positions of the non-display area, and the second touch conductive layer is made of a material containing at least one conductive particle.
- The touch integrated display panel according to claim 17, wherein the first touch conductive layer, the second touch conductive layer and the conductive layer inside the hole are made of a material containing at least one conductive particle selected from nano conductive particles, metal silver/copper nanowires and graphene.
- The touch integrated display panel of claim 17, further comprising a conductive silver paste layer formed in the non-display region, the conductive silver paste layer contacting the first touch conductive layer exposed in the at least one first opening or contacting the second touch conductive layer exposed in the at least one second opening to be electrically connected.
- The touch integrated display panel of claim 17, further comprising a conductive silver paste layer formed on the non-display region, the conductive silver paste layer comprising a first portion and a second portion separated from each other, the first portion being in contact with and thus electrically connected to the first touch conductive layer exposed in the at least one first opening, and the second portion being in contact with and thus electrically connected to the second touch conductive layer exposed in the at least one second opening.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/111992 WO2019100183A1 (en) | 2017-11-21 | 2017-11-21 | Touch control integrated display panel and preparation method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111201606A true CN111201606A (en) | 2020-05-26 |
Family
ID=66631361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780095821.XA Pending CN111201606A (en) | 2017-11-21 | 2017-11-21 | Touch integrated display panel and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111201606A (en) |
| WO (1) | WO2019100183A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100265206A1 (en) * | 2009-04-21 | 2010-10-21 | Industrial Technology Research Institute | Touch-sensing display apparatus and fabricating method thereof |
| CN106125990A (en) * | 2016-08-03 | 2016-11-16 | 京东方科技集团股份有限公司 | A kind of Organic Light Emitting Diode touch-control display panel and preparation method thereof |
| CN106449707A (en) * | 2016-10-31 | 2017-02-22 | 上海天马微电子有限公司 | Organic light emitting display panel and manufacture method thereof |
| CN107275512A (en) * | 2017-05-25 | 2017-10-20 | 厦门天马微电子有限公司 | A kind of organic EL display panel, its preparation method and display device |
-
2017
- 2017-11-21 WO PCT/CN2017/111992 patent/WO2019100183A1/en active Application Filing
- 2017-11-21 CN CN201780095821.XA patent/CN111201606A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100265206A1 (en) * | 2009-04-21 | 2010-10-21 | Industrial Technology Research Institute | Touch-sensing display apparatus and fabricating method thereof |
| CN106125990A (en) * | 2016-08-03 | 2016-11-16 | 京东方科技集团股份有限公司 | A kind of Organic Light Emitting Diode touch-control display panel and preparation method thereof |
| CN106449707A (en) * | 2016-10-31 | 2017-02-22 | 上海天马微电子有限公司 | Organic light emitting display panel and manufacture method thereof |
| CN107275512A (en) * | 2017-05-25 | 2017-10-20 | 厦门天马微电子有限公司 | A kind of organic EL display panel, its preparation method and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019100183A1 (en) | 2019-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8809694B2 (en) | Circuit module | |
| JP4749795B2 (en) | Semiconductor device | |
| TWI446464B (en) | Package structure and manufacturing method thereof | |
| JP5400094B2 (en) | Semiconductor package and mounting method thereof | |
| CN104051408A (en) | Module and method of manufacturing same | |
| JP2010510665A (en) | Method for packaging a device using a dielectric layer | |
| US20150382459A1 (en) | Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad | |
| JP6508333B2 (en) | Electronic circuit module | |
| US10002825B2 (en) | Method of fabricating package structure with an embedded electronic component | |
| WO2018198856A1 (en) | Circuit module and method for manufacturing same | |
| JP2010010441A (en) | Circuit module and method of manufacturing the same | |
| US20200144179A1 (en) | Chip packaging structure and manufacturing method thereof | |
| US9991222B2 (en) | Package substrate and manufacturing method thereof and package | |
| JP2008258478A (en) | Electronic component device and its manufacturing method | |
| JP2009194079A (en) | Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same | |
| KR100611291B1 (en) | Circuit device, circuit module, and manufacturing method of the circuit device | |
| CN102270619B (en) | Pad configurations for an electronic package assembly | |
| TWI553787B (en) | Ic substrate,semiconductor device with ic substrate and manufucturing method thereof | |
| US20140070395A1 (en) | Electronic device and manufacturing method thereof | |
| US8357861B2 (en) | Circuit board, and chip package structure | |
| CN111201606A (en) | Touch integrated display panel and preparation method thereof | |
| US20040140764A1 (en) | Light emitting diode device and method of fabricating the devices | |
| JP2007287503A (en) | Organic el display | |
| TWI659511B (en) | Substrate for package and manufacturing method thereof and package | |
| CN112825310A (en) | Packaging structure and flexible integrated packaging method of ultrathin chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Ruoyu Technology Co.,Ltd. Address before: Building 43, Dayun software Town, No. 8288 Longgang Avenue, Henggang street, Longgang District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200526 |
|
| RJ01 | Rejection of invention patent application after publication |