CN111200053A - Method for manufacturing superfine wire type LED transparent display screen and display screen - Google Patents
Method for manufacturing superfine wire type LED transparent display screen and display screen Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 29
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- 239000004568 cement Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010329 laser etching Methods 0.000 abstract description 9
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
A method for manufacturing an ultra-fine wire type LED transparent display screen comprises the following steps: coating transparent pressure-sensitive adhesive on a transparent substrate; printing a driving line and a power line on the transparent pressure-sensitive adhesive using a micro-wire; printing a pad connected with the driving line and the power line by using an ultra-fine wire; connecting the other end of the driving wire and the other end of the power line with the flexible circuit board; fixing the LED device on the bonding pad; the transparent substrate is bonded to the transparent front protective plate using a transparent non-conductive adhesive. The invention adopts the mode of printing the driving wire and the power wire by the superfine wire to replace the traditional laser etching mode, and the cost is reduced by about 20 percent. And the adoption of the superfine wire effectively reduces the impedance and improves the luminous efficiency which can reach more than 80 percent. In addition, through the mode that superfine wire printed, interval between can effectual reduction LED device can also effectual breakthrough size restriction, and the help is made bigger transparent display screen.
Description
Technical Field
The invention belongs to the field of transparent display screens, and particularly relates to a method for manufacturing an ultrafine wire type LED transparent display screen and the display screen.
Background
In recent years, the LED display application industry has been steadily developed, and the overall scale has been promoted year by year, and has become an important component in the LED industry chain, and LED display application products represented by LED display screens have been widely used in various fields of society and economy. With the driving of application markets, the LED transparent display screen becomes a hot spot of current research, can enrich visual contents without blocking a sight, and is widely applied to places such as subways, airports, glass trestles, advertising media, chain stores, superstores, enterprise exhibition halls, museums, science and technology museums.
The current manufacturing mode of the LED transparent display screen is as follows: the method comprises the steps of firstly coating a transparent conductive layer on a transparent substrate and etching a driving wire, then fixing an LED device at one end of an electrode on the transparent substrate by conductive adhesive, then pressing an external driving circuit to the other end of the driving wire by ACF, and finally bonding a front panel and the substrate by a transparent non-conductive material. However, the transparent display screen manufactured by adopting the mode is high in cost, the resistance of the formed driving electrode is large, the LED device is easy to emit light unevenly, the power consumed on the electrode is far greater than the light emitting power, the integral light emitting efficiency is less than 50%, the density of the LED device is small, the distance between the LED devices is difficult to achieve 30mm, and the width of a single LED transparent display screen is less than 1.2 m.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a method for manufacturing an ultrafine wire type LED transparent display screen, which has a simple process and solves the problems of high production cost and low luminous efficiency. The invention also provides an LED transparent display screen.
According to the method for manufacturing the ultra-fine lead type LED transparent display screen, the method comprises the following steps: coating transparent pressure-sensitive adhesive on a transparent substrate; printing driving lines and power lines on the transparent pressure-sensitive adhesive using ultra-fine conductive lines; printing pads connected with the driving lines and the power lines by using superfine wires; connecting the other end of the driving wire and the other end of the power line with a flexible circuit board; fixing an LED device on the bonding pad; the transparent substrate is bonded to the transparent front protective plate using a transparent non-conductive adhesive.
The method for manufacturing the superfine wire type LED transparent display screen according to the embodiment of the invention at least has the following technical effects: the method for printing the driving line and the power line on the transparent pressure-sensitive adhesive by adopting the superfine wires replaces the traditional laser etching method, and the cost is reduced by about 20 percent. And the adoption of the superfine wire as the material of the driving wire and the power wire effectively reduces the impedance and improves the luminous efficiency which can reach more than 80 percent. In addition, the distance between the LED devices can be effectively reduced by adopting a superfine wire printing mode, and the distance can be reduced to about 15 mm. The superfine wire printing is used for replacing a traditional laser etching structure, the size limitation can be effectively broken through, the size width can reach 1.8 meters when a single-side wire outgoing mode is used, and the size width can reach 3.6 meters when a double-side wire outgoing mode is used.
According to some embodiments of the invention, the number of the pads, the driving lines, and the LED devices is N; the number of the power lines is M; one end of each of the N driving wires is correspondingly connected with the N bonding pads one by one; the other ends of the N driving wires are connected with the flexible circuit board; each bonding pad is fixedly provided with an LED device; the M power lines are used for supplying power to the N LED devices.
According to some embodiments of the invention, the transparent substrate is a flexible substrate.
According to the second aspect of the invention, the LED transparent display screen comprises: a transparent substrate for providing a carrier; the transparent pressure-sensitive adhesive layer is arranged on the upper surface of the transparent substrate; the bonding pad is arranged on the upper surface of the transparent pressure sensitive adhesive layer, and an LED device is fixed on the bonding pad; the driving wire is arranged on the upper surface of the transparent pressure-sensitive adhesive layer, one end of the driving wire is connected with the bonding pad, and the other end of the driving wire is used for connecting the flexible circuit board; the power line is arranged on the upper surface of the transparent pressure-sensitive adhesive layer, one end of the power line is connected with the bonding pad, and the other end of the power line is connected with the flexible circuit board; and the transparent front protective plate is arranged on the LED device and is bonded with the transparent substrate through transparent non-conductive optical cement.
The LED transparent display screen provided by the embodiment of the invention at least has the following technical effects: by adopting the superfine conducting wire to replace the structure of the transparent conducting layer by laser etching, the cost is reduced by about 20 percent. And the adoption of the superfine wire as the material of the driving wire and the power wire effectively reduces the impedance and improves the luminous efficiency which can reach more than 80 percent. In addition, the structure of printing by adopting the superfine wires can be more compact, the space between the LED devices can be effectively reduced, and the distance can be reduced to about 15 mm.
According to some embodiments of the invention, the number of the pads, the driving lines, and the LED devices is N; the number of the power lines is M; one end of each of the N driving wires is correspondingly connected with the N bonding pads one by one; the other ends of the N driving wires are connected with the flexible circuit board; each bonding pad is fixedly provided with one LED device; the M power lines are used for supplying power to the N LED devices.
According to some embodiments of the invention, each of the drive lines has a diameter of 0.01mm to 0.05 mm.
According to some embodiments of the invention, each of the power lines has a diameter of 0.05mm to 0.2 mm; the total cross-sectional area of M power lines is 2/3-1 of the total cross-sectional area of N drive lines.
According to some embodiments of the invention, the flexible circuit board is distributed on two sides of the transparent substrate; the N driving wires and the M power wires are connected with the flexible circuit board closest to the driving wires and the M power wires.
According to some embodiments of the invention, the LED device employs an RGB three-color LED.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural view of an embodiment of a second aspect of the present invention (a LED removing member and a transparent front protective plate);
FIG. 2 is an enlarged schematic view of a portion of FIG. 1;
FIG. 3 is a schematic structural diagram of an embodiment of a second aspect of the present invention;
fig. 4 is an enlarged schematic view of a portion of fig. 3.
Reference numerals:
a transparent substrate 100,
A bonding pad 200,
A driving line 310, a power line 320,
A flexible circuit board 400,
A transparent front protective plate 500,
The LED device 600.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, if there are first, second, third, fourth, etc. described only for the purpose of distinguishing technical features, they are not to be interpreted as indicating or implying relative importance or implying number of indicated technical features or implying precedence of indicated technical features.
In the description of the present invention, unless otherwise explicitly defined, terms such as arrangement, connection and the like should be broadly construed, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the detailed contents of the technical solutions.
The method for manufacturing the ultra-fine wire type LED transparent display screen according to the embodiment of the first aspect of the present invention is described below.
The method for manufacturing the superfine wire type LED transparent display screen comprises the following steps: coating transparent pressure-sensitive adhesive on a transparent substrate; printing a driving line and a power line on the transparent pressure-sensitive adhesive using a micro-wire; printing a pad connected with the driving line and the power line by using an ultra-fine wire; connecting the other end of the driving wire and the other end of the power line with a flexible circuit board circuit; fixing the LED device on the bonding pad; the transparent substrate is bonded to the transparent front protective plate using a transparent non-conductive adhesive.
The method comprises the steps of firstly coating transparent pressure-sensitive adhesive on a transparent substrate, then printing a driving line and a power line on the transparent pressure-sensitive adhesive by using superfine conducting wires, continuously printing a bonding pad connected with the driving line and the power line by using the superfine conducting wires, and connecting the other ends of the driving line and the power line which are not connected with the bonding pad with a flexible circuit board in a crimping mode. And then fixing the LED device on the bonding pad, and welding the LED device by adopting a laser spot welding mode generally. And finally, bonding the transparent front protective plate and the substrate together to finish the manufacture. When actually printing, can continue a part of coherent printing pad after printing the drive line, can directly print out a part of pad after printing the power cord, print through this kind of mode, can avoid printing the pad one by one, reduced work load. When the power lines are printed, because the parallel connection mode is adopted, generally after the structure of the LED device is considered, the printing of the power lines of a row of pads is finished continuously at one time, and the printing is not performed one by one. When a power line and a driving line are printed, the line outgoing mode can be adjusted according to the size of the required printing size, when the size is smaller, a single-side line outgoing mode is adopted, and when the size is larger, a double-side line outgoing mode is adopted. Superfine wire prints and uses dedicated superfine wire printing apparatus to print, and superfine wire printing apparatus can adopt 3D printing apparatus. The ultra-fine wire is usually ultra-fine copper wire, and when ultra-low impedance wire is needed, ultra-fine silver wire, ultra-fine gold wire or other metal materials can be used.
According to the method for manufacturing the superfine wire type LED transparent display screen, the traditional laser etching mode is replaced by adopting a mode that the superfine wires print the driving wires and the power wires on the transparent pressure sensitive adhesive, and the cost is reduced by about 20%. And the adoption of the superfine wire as the material of the driving wire and the power wire effectively reduces the impedance and improves the luminous efficiency which can reach more than 80 percent. In addition, the distance between the LED devices can be effectively reduced by adopting a superfine wire printing mode, and the distance can be reduced to about 15 mm. In addition, the superfine wire printing is used for replacing a traditional laser etching structure, the size limitation can be effectively broken through, the size width can reach 1.8 meters when a single-side wire outgoing mode is used, and the size width can reach 3.6 meters when a double-side wire outgoing mode is used.
In some embodiments of the present invention, N pads, driving lines, and LED devices are provided; the number of the power lines is M; one end of each of the N driving wires is correspondingly connected with the N bonding pads one by one; the other ends of the N driving wires are connected with the flexible circuit board; each bonding pad is fixedly provided with an LED device; the M power lines are used for supplying power to the N LED devices. The N LED devices can be controlled independently through the N driving wires. In addition, because the LED transparent display screen is adopted, the power line is not too thick, so that when the large-size LED transparent display screen is encountered, the power line needs to be divided into M power lines, the power supply effect is ensured, and the sight line cannot be shielded.
In some embodiments of the present invention, the transparent substrate employs a flexible base material. The flexible base material can effectively improve the toughness, the improvement of the toughness can increase the purposes of the product, and the resistance of the product to external damage can also be improved. The flexible base material can adopt flexible PET or flexible transparent glass, and can also directly adopt common glass in a scene without considering the use of flexible materials.
According to the second aspect of the invention, the LED transparent display screen comprises: the transparent substrate 100, the transparent pressure sensitive adhesive layer, the pads 200, the driving lines 310, the power lines 320, and the transparent front protective plate 500. A transparent substrate 100 for providing a carrier; a transparent pressure sensitive adhesive layer disposed on the upper surface of the transparent substrate 100; the bonding pad 200 is arranged on the upper surface of the transparent pressure sensitive adhesive layer, and the LED device 600 is fixed on the bonding pad 200; the driving wire 310 is arranged on the upper surface of the transparent pressure-sensitive adhesive layer, one end of the driving wire is connected with the bonding pad 200, and the other end of the driving wire is used for connecting the flexible circuit board 400; a power line 320 disposed on the upper surface of the transparent pressure sensitive adhesive layer, one end of which is connected to the pad 200 and the other end of which is connected to the flexible circuit board 400; the transparent front protective plate 500 is disposed on the LED device 600 and bonded to the transparent substrate 100 through a transparent non-conductive adhesive.
Referring to fig. 1 to 4, a transparent pressure sensitive adhesive layer is disposed on the transparent substrate 100 and may be used to fix the ultra-fine conductive lines. The bonding pad 200, the driving line 310 and the power line 320 are all made of ultra-fine wires, one end of the driving line 310 and one end of the power line 320 are respectively connected with the bonding pad 200, and then the driving line 310 and the power line 320 are connected with the external head type circuit board in a pressing mode. The LED device 600 is fixed on the bonding pad 200, and the LED device 600 is finally connected to the flexible circuit board 400 through the bonding pad 200, the driving line 310 and the power line 320, so as to finally realize external control of the LED device 600. A transparent front protection plate 500 is further disposed on the LED, and the transparent front protection plate 500 is bonded to the transparent substrate 100 to realize final protection. In practical use, the resistance value of the laser etching structure is large, so that the laser etching structure is difficult to manufacture in a large size, and the resistance value can be effectively reduced by adopting the superfine wire structure, so that the foundation for building a large-size LED transparent display screen is provided. When printing the ultra-fine conductive lines, one-sided outgoing lines of the driving lines 310 and the power lines 320 can be selected according to actual requirements, and two-sided outgoing lines can also be selected.
According to the LED transparent display screen, the superfine wires are adopted to replace a structure of transparent conducting layer laser etching, and the cost is reduced by about 20%. And the adoption of the superfine wires as the materials of the driving wire 310 and the power wire 320 effectively reduces the impedance and improves the luminous efficiency, and the luminous efficiency can reach more than 80 percent. In addition, the structure of printing through adopting superfine wire can be more compact, can effectual reduction LED device 600 between the interval, can reduce to about 15 mm. In addition, the superfine wire structure is adopted, the size limitation can be effectively broken through, the size width can reach 1.8 meters when a single-side wire outlet mode is used, and the size width can reach 3.6 meters when a double-side wire outlet mode is used.
According to the LED transparent display screen, N bonding pads 200, N driving wires 310 and N LED devices 600 are provided; there are M power lines 320; one end of each of the N driving lines 310 is connected to the N pads 200 in a one-to-one correspondence; the other ends of the N driving wires 310 are connected to the flexible circuit board 400; an LED device 600 is fixed on each pad 200; the M power lines 320 are used to supply power to the N LED devices 600. The N LED devices 600 can be individually controlled by the N driving lines 310. In addition, because the LED transparent display screen is adopted, the power line 320 should not be too thick, and therefore when the large-size LED transparent display screen is encountered, the power line 320 needs to be divided into M, which not only ensures the power supply effect, but also does not obstruct the view.
In some embodiments of the invention, each drive line 310 has a diameter of 0.01mm to 0.05 mm. The light-emitting diode display panel has the advantages that the increase of line resistance and the reduction of light-emitting efficiency caused by over-thinness are avoided, and the display effect is not influenced by over-coarseness.
In some embodiments of the present invention, each power line 320 has a diameter of 0.05mm to 0.2 mm; the total sectional area of the M power lines 320 is 2/3 to 1 of the total sectional area of the N driving lines 310. The power line 320 has a too large diameter, which is likely to affect the visual field, but is not suitable for passing a large current, and therefore, the power line 320 needs to be selected in consideration of both of these points.
In some embodiments of the present invention, the flexible circuit board 400 is plural and distributed on both sides of the transparent substrate 100; the N driving lines 310 and the M power lines 320 are connected to the closest flexible printed circuit board 400. When the size of the transparent LED display screen is large, if a single flexible wiring board 400 is continuously used, the required size of the flexible wiring board 400 may be large. In addition, when the power line 320 and the driving line 310 are led out on two sides, a plurality of circuit boards are directly connected on two sides, so that a large amount of wiring time can be saved, the production efficiency can be improved, and the fault rate can be reduced. Meanwhile, the resistance values of the driving wire and the power wire can be effectively reduced by adopting the double-side outgoing wire, and the luminous efficiency is improved.
In some embodiments of the present invention, the LED device 600 employs RGB three-color LEDs. Adopt RGB three-colour LED, can effectual improvement user experience. In some occasions where colored light is not needed, the single-color LED can be directly used to reduce the use cost.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited to the embodiments, and those skilled in the art will understand that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A method for manufacturing an ultra-fine conductor type LED transparent display screen is characterized by comprising the following steps:
coating transparent pressure-sensitive adhesive on a transparent substrate;
printing driving lines and power lines on the transparent pressure-sensitive adhesive using ultra-fine conductive lines;
printing pads connected with the driving lines and the power lines by using superfine wires;
connecting the other end of the driving wire and the other end of the power line with a flexible circuit board;
fixing an LED device on the bonding pad;
the transparent substrate is bonded to the transparent front protective plate using a transparent non-conductive adhesive.
2. The method of claim 1, wherein N pads, driving lines, and LED devices are provided; the number of the power lines is M; one end of each of the N driving wires is correspondingly connected with the N bonding pads one by one; the other ends of the N driving wires are connected with the flexible circuit board; each bonding pad is fixedly provided with an LED device; the M power lines are used for supplying power to the N LED devices.
3. The method for manufacturing the ultra-fine wire type LED transparent display screen according to claim 1, wherein the transparent substrate is made of a flexible base material.
4. An LED transparent display screen, comprising:
a transparent substrate (100) for providing a carrier;
the transparent pressure-sensitive adhesive layer is arranged on the upper surface of the transparent substrate (100);
the bonding pad (200) is arranged on the upper surface of the transparent pressure sensitive adhesive layer, and an LED device (600) is fixed on the bonding pad (200);
the driving wire (310) is arranged on the upper surface of the transparent pressure-sensitive adhesive layer, one end of the driving wire is connected with the bonding pad (200), and the other end of the driving wire is used for being connected with a flexible circuit board (400);
the power line (320) is arranged on the upper surface of the transparent pressure-sensitive adhesive layer, one end of the power line is connected with the bonding pad (200), and the other end of the power line is connected with the flexible circuit board (400);
and the transparent front protection plate (500) is arranged on the LED device (600) and is bonded with the transparent substrate (100) through transparent non-conductive optical cement.
5. The LED transparent display screen according to claim 4, wherein the number of the bonding pads (200), the driving lines (310) and the LED devices (600) is N; the number of the power lines (320) is M; one ends of the N driving wires (310) are correspondingly connected with the N bonding pads (200) one by one; the other ends of the N driving wires (310) are connected with the flexible circuit board (400); each bonding pad (200) is fixed with one LED device (600); the M power lines (320) are used for supplying power to the N LED devices (600).
6. The LED transparent display screen of claim 5, wherein the diameter of each of the driving lines (310) is 0.01mm to 0.05 mm.
7. The LED transparent display screen of claim 6, wherein each power line (320) has a diameter of 0.05mm to 0.2 mm; the total cross-sectional area of the M power supply lines (320) is 2/3-1 of the total cross-sectional area of the N drive lines (310).
8. The LED transparent display screen according to claim 7, wherein the flexible circuit board (400) is distributed on two sides of the transparent substrate (100); the N drive lines (310) and the M power lines (320) are connected with the flexible circuit board (400) which is closest to the drive lines.
9. The LED transparent display screen of claim 4, characterized in that the LED device (600) employs RGB tri-color LEDs.
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| CN201911232874.9A CN111200053A (en) | 2019-12-05 | 2019-12-05 | Method for manufacturing superfine wire type LED transparent display screen and display screen |
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| CN201911232874.9A CN111200053A (en) | 2019-12-05 | 2019-12-05 | Method for manufacturing superfine wire type LED transparent display screen and display screen |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653214A (en) * | 2020-07-09 | 2020-09-11 | 蚌埠明微光电玻璃科技有限公司 | LED equivalent resistance luminous glass |
| TWI789756B (en) * | 2021-05-17 | 2023-01-11 | 范文正 | Flexible transparent display and flexible circuit board thereof |
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