CN111198795A - Method and device for acquiring memory temperature by substrate controller - Google Patents
Method and device for acquiring memory temperature by substrate controller Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000006870 function Effects 0.000 claims description 14
- 230000008569 process Effects 0.000 description 4
- 108010028984 3-isopropylmalate dehydratase Proteins 0.000 description 2
- 101150039033 Eci2 gene Proteins 0.000 description 2
- 102100021823 Enoyl-CoA delta isomerase 2 Human genes 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
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- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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Abstract
The invention discloses a method and a device for acquiring memory temperature by a substrate controller, wherein the method comprises the following steps: the CPU is communicated with the plurality of memories and reads SPD information of the plurality of memories by controlling the selector switch to be in a first state, wherein the SPD information is information which is stored in the memories and is associated with the memories; the CPU controls the switch to be in a second state, so that the substrate controller is communicated with the plurality of memories, and a state signal of the switch in the second state is sent to the substrate controller; and after receiving the state signal, the substrate controller reads the SPD information of the plurality of memories to acquire the temperatures of the plurality of memories through the SPD information. According to the technical scheme, the cost of acquiring the memory temperature sensor by the non-Intel platform can be reduced through a simple circuit, and in addition, compared with the existing method of placing the temperature sensor near the memory, the temperature reading is more accurate.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a method and a device for acquiring memory temperature by a substrate controller.
Background
The memory temperature is one of important parameters of an operating server monitored by a BMC (baseboard controller), and the BMC needs to perform corresponding heat dissipation processing through the change of the memory temperature to ensure that the normal operation of the server is not affected. Currently, there are several ways for BMC to obtain the memory temperature by each platform server, and the Intel platform may obtain the memory temperature from NM through an IPMI command or directly from the CPU through a PECI interface. For other platforms (AMD, etc.) that do not have a direct access to memory temperature interface, temperature sensors may be placed around the memory for temperature reading. The method adopts a mode that BMC is connected with the memory SPD through an I2C interface to read the memory temperature, can be used as a candidate for reading the memory temperature of an Intel platform or replace the current reading scheme of the Intel, and can be used as a preferred scheme for obtaining the memory temperature by platforms such as AMD and the like.
However, the conventional memory temperature reading method has the following problems:
1, the non-Intel platform machine acquires the memory temperature by adopting a mode of placing a temperature sensor around the memory, which cannot accurately reflect the temperature of each memory and can increase the cost of the temperature sensor which is used for multiple times.
2, the Intel platform can be obtained from the Node Manager through an IPMI command or from the CPU through a PECI command, and the temperature source is also memory SPD information, which belongs to indirect obtaining. It is not fast to get directly from the SPD.
3, because the BIOS also needs to acquire the information of the memory SPD during the post process, for example, the information of the SPD that is not scanned into the memory during the startup process will affect the normal operation of the entire system. Namely, the problem of switching the access rights of the BMC and the BIOS to the memory SPD is involved.
Disclosure of Invention
In view of the foregoing problems in the related art, the present invention provides a method and an apparatus for acquiring a memory temperature by a substrate controller.
The technical scheme of the invention is realized as follows:
according to an aspect of the present invention, there is provided a method for acquiring a memory temperature by a substrate controller, including:
the CPU is communicated with the plurality of memories and reads SPD information of the plurality of memories by controlling the selector switch to be in a first state, wherein the SPD information is information which is stored in the memories and is associated with the memories;
the CPU controls the switch to be in a second state, so that the substrate controller is communicated with the plurality of memories, and a state signal of the switch in the second state is sent to the substrate controller;
and after receiving the state signal, the substrate controller reads the SPD information of the plurality of memories to acquire the temperatures of the plurality of memories through the SPD information.
According to the embodiment of the present invention, after controlling the switch to be in the first state, the method further includes: the CPU sends a state signal that the switch is in the first state to the substrate controller.
According to an embodiment of the present invention, the reading the plurality of memory temperatures by the substrate controller includes: the temperature of each of the plurality of memories connected to the plurality of channels respectively is acquired by switching the plurality of channels of the I2C extended chip connected between the plurality of memories and the substrate controller.
According to an embodiment of the present invention, the reading the plurality of memory temperatures by the substrate controller includes: the substrate controller enables the memory temperature reading function after receiving the state signal, and reads the plurality of memory temperatures through the memory temperature reading function.
According to another aspect of the present invention, there is provided an apparatus for acquiring a memory temperature by a substrate controller, including:
the selector switch is respectively connected with the CPU, the substrate controller and the plurality of memories;
when the change-over switch is in a first state, the CPU is communicated with the plurality of memories and reads SPD information of the plurality of memories;
when the switch is in the second state, the substrate controller is communicated with the plurality of memories and sends a state signal of the switch in the second state to the substrate controller;
and after receiving the state signal, the substrate controller reads the SPD information of the plurality of memories to acquire the temperatures of the plurality of memories through the SPD information.
According to the embodiment of the present invention, after controlling the switch to be in the first state, the method further includes: the CPU sends a state signal that the switch is in the first state to the substrate controller.
According to an embodiment of the present invention, the apparatus for acquiring the memory temperature by the substrate controller further includes: and the I2C expansion chip is connected between the plurality of memories and the selector switch, wherein the temperature of each of the plurality of memories is obtained by switching a plurality of channels of the I2C expansion chip, which are respectively connected with the plurality of channels.
According to the embodiment of the invention, the substrate controller enables the memory temperature reading function after receiving the state signal, and reads the plurality of memory temperatures through the memory temperature reading function.
According to the technical scheme, the BMC can directly read SPD information of the memory to obtain the temperature of the memory by controlling the selector switch, so that the circuit layout is simplified through a simple circuit, the cost of obtaining a memory temperature sensor by a non-Intel platform is reduced, and in addition, compared with the existing method of placing the temperature sensor nearby the memory, the read temperature is more accurate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a method for a substrate controller to obtain a memory temperature according to an embodiment of the invention;
FIG. 2 is a schematic diagram illustrating a substrate controller acquiring a memory temperature according to an embodiment of the invention;
fig. 3 is a flowchart of a method for acquiring a memory temperature by a substrate controller according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
As shown in fig. 1, a method for acquiring a memory temperature by a BMC according to an embodiment of the present invention may include the following steps:
s11, controlling the switch to be in the first state, so that the CPU is connected to the memories and reads SPD information of the memories, where the SPD information is information stored in the memories and associated with the memories, such as chip and module manufacturers, operating frequency, operating voltage, speed, capacity, voltage and row and column address bandwidth of the memories, and other parameters.
And S12, the CPU controls the change-over switch to be in the second state, so that the BMC is communicated with the memories, and the state signal of the switch in the second state is sent to the BMC.
S13, after receiving the status signal, the BMC reads the SPD information of the plurality of memories to obtain the temperatures of the plurality of memories through the SPD information.
The method for acquiring the memory temperature by BMC provided by the invention can be used for reading the memory temperature of an Intel platform and can also be used for acquiring the memory temperature of AMD and other platforms.
According to the technical scheme, the BMC can directly read SPD information of the memory to obtain the temperature of the memory by controlling the selector switch, so that the circuit layout is simplified through a simple circuit, the cost of obtaining a memory temperature sensor by a non-Intel platform is reduced, and in addition, compared with the existing method of placing the temperature sensor nearby the memory, the read temperature is more accurate.
In one embodiment, the BMC may acquire the temperature of each of the plurality of memories 40 respectively connected to the plurality of channels by switching the plurality of channels of the I2C extended chip connected between the plurality of memories 40 (DIMMs) and the BMC. Referring to fig. 2, BMC 10 and server CPU20 may be connected to a switch chip of I2C through an I2C bus, respectively, and a switch 31 (switch) of the switch chip is controlled by a CPU20 terminal, and BMC or CPU20 may be switched to communicate with IC expansion chip 32 by controlling a level state of switch 31. The default state may be that the CPU20 is in communication with the I2C expansion chip 32, which ensures that the BIOS can obtain correct memory SPD information. The I2C expansion chip 32 ensures that the CPU20 or the BMC 10 can acquire the memory SPD information of each channel by switching different channels, which only includes two channels but is not limited to two channels in real application.
In one embodiment, as shown in fig. 2 and 3, the method of the present invention may be performed by:
step S31, system power up or reset.
Step S32, BIOS connects the bus corresponding to I2C expansion chip with CPU end by setting SPD _ SW signal state (first state),
step S33, initializing the memory in the POST process, and reading the SPD information to perform the configuration related to the memory, which is not described herein.
In this embodiment, after controlling the switch to be in the first state, the CPU may send a state signal that the switch is in the first state to the BMC. Specifically, the state of the SPD _ SW signal is also transmitted to the BMC to tell the BMC that the memory SPD is not currently authorized to be accessed, so that the BMC is prevented from performing meaningless reading operation.
And step S34, after the BIOS finishes reading the SPD information and finishes configuring, the BIOS switches the I2C to the BMC so that the BMC is communicated with the I2C extended chip.
And step S35, transmitting the SPD _ SW signal to the BMC, and reading the memory temperature after the BMC receives the signal. In one embodiment, the BMC may enable the memory temperature read function after receiving the status signal and read a plurality of memory temperatures through the memory temperature read function. Specifically, the BMC may enable the memory temperature read function after receiving the signal. Then, the memory read function part operates to obtain the accurate temperature of each memory on each channel by switching the channels of the I2C extended chip.
Through the process shown in fig. 3, the BMC may acquire the accurate temperature of each memory for heat dissipation processing and temperature monitoring.
Referring to fig. 2, according to another aspect of the present invention, there is provided an apparatus for BMC to obtain a memory temperature, including:
a switch 31 connected to the CPU20, the BMC 10, and the plurality of memories, respectively;
when the switch 31 is in the first state, the CPU20 is connected to the plurality of memories and reads SPD information of the plurality of memories;
when the switch 31 is in the second state, the BMC 10 is connected to the plurality of memories, and transmits a state signal indicating that the switch is in the second state to the BMC;
after receiving the status signal, the BMC reads the SPD information of the memories to obtain the temperatures of the memories through the SPD information.
According to the embodiment of the present invention, after controlling the switch to be in the first state, the method further includes: and the CPU sends the state signal of the switch in the first state to the BMC.
According to the embodiment of the present invention, the apparatus for acquiring the memory temperature by the BMC further includes: and the I2C expansion chip is connected between the plurality of memories and the selector switch, wherein the temperature of each of the plurality of memories is obtained by switching a plurality of channels of the I2C expansion chip, which are respectively connected with the plurality of channels.
According to an embodiment of the invention, the BMC enables the memory temperature read function after receiving the status signal, and reads the plurality of memory temperatures through the memory temperature read function.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A method for acquiring memory temperature by a substrate controller is characterized by comprising the following steps:
the method comprises the steps that a change-over switch is controlled to be in a first state, so that a CPU is communicated with a plurality of memories and reads SPD information of the memories, wherein the SPD information is information which is stored in the memories and is associated with the memories;
the CPU controls the change-over switch to be in a second state, so that the substrate controller is communicated with the plurality of memories, and a state signal of the switch in the second state is sent to the substrate controller;
and after receiving the state signal, the substrate controller reads the SPD information of the memories to acquire the temperatures of the memories through the SPD information.
2. The method of claim 1, wherein after controlling the switch to be in the first state, the method further comprises:
and the CPU sends a state signal that the switch is in the first state to the substrate controller.
3. The method of claim 1, wherein the reading of the plurality of memory temperatures by the substrate controller comprises:
acquiring a temperature of each of a plurality of memories respectively connected to the plurality of channels by switching a plurality of channels of an I2C extended chip connected between the plurality of memories and the substrate controller.
4. The method of claim 1, wherein the reading of the plurality of memory temperatures by the substrate controller comprises:
and enabling a memory temperature reading function by the substrate controller after receiving the state signal, and reading the plurality of memory temperatures through the memory temperature reading function.
5. An apparatus for acquiring a memory temperature by a substrate controller, comprising:
the selector switch is respectively connected with the CPU, the substrate controller and the plurality of memories;
when the change-over switch is in a first state, the CPU is communicated with the memories and reads SPD information of the memories;
when the change-over switch is in a second state, the substrate controller is communicated with the plurality of memories, and a state signal of the switch in the second state is sent to the substrate controller;
and after receiving the state signal, the substrate controller reads the SPD information of the memories to acquire the temperatures of the memories through the SPD information.
6. The apparatus for acquiring the memory temperature by the substrate controller according to claim 5, further comprising, after controlling the switch to be in the first state:
and the CPU sends a state signal that the switch is in the first state to the substrate controller.
7. The apparatus for acquiring the memory temperature by the substrate controller according to claim 5, further comprising:
and an I2C expansion chip connected between the plurality of memories and the switch, wherein the temperature of each of the plurality of memories is obtained by switching a plurality of channels of the I2C expansion chip respectively connected to the plurality of channels.
8. The apparatus for obtaining the memory temperature of a substrate controller according to claim 5,
and enabling a memory temperature reading function by the substrate controller after receiving the state signal, and reading the plurality of memory temperatures through the memory temperature reading function.
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| CN201911333393.7A CN111198795A (en) | 2019-12-23 | 2019-12-23 | Method and device for acquiring memory temperature by substrate controller |
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| CN201911333393.7A CN111198795A (en) | 2019-12-23 | 2019-12-23 | Method and device for acquiring memory temperature by substrate controller |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111949465A (en) * | 2020-09-02 | 2020-11-17 | 苏州浪潮智能科技有限公司 | Memory temperature reading method and system |
| CN112130913A (en) * | 2020-08-28 | 2020-12-25 | 山东云海国创云计算装备产业创新中心有限公司 | Method and system for reading memory temperature and computer readable storage medium |
| CN112506745A (en) * | 2020-12-11 | 2021-03-16 | 浪潮电子信息产业股份有限公司 | Memory temperature reading method and device and computer readable storage medium |
| CN112653516A (en) * | 2020-12-04 | 2021-04-13 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for accessing DIMM in server |
| CN112965930A (en) * | 2021-05-18 | 2021-06-15 | 中科可控信息产业有限公司 | Access controller, access control method, computer device, and readable storage medium |
| CN113608684A (en) * | 2021-06-30 | 2021-11-05 | 苏州浪潮智能科技有限公司 | Memory information acquisition method, device and system, electronic equipment and storage medium |
| CN114924998A (en) * | 2022-06-09 | 2022-08-19 | 北京东土科技股份有限公司 | Memory information reading device and method, computing equipment mainboard, equipment and medium |
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