CN111198591B - Method for controlling current output of SDH8 circuit - Google Patents
Method for controlling current output of SDH8 circuit Download PDFInfo
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- CN111198591B CN111198591B CN201811364118.7A CN201811364118A CN111198591B CN 111198591 B CN111198591 B CN 111198591B CN 201811364118 A CN201811364118 A CN 201811364118A CN 111198591 B CN111198591 B CN 111198591B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
- G05F1/56—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices
- G05F1/565—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor
- G05F1/567—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor for temperature compensation
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Abstract
The invention discloses a method for controlling current output of an SDH8 circuit, which comprises a test process and an application process, wherein in the application process: measuring the current working temperature of a PCB (printed circuit board) provided with an SDH (synchronous digital hierarchy) 8 circuitDegree T; judging whether the current working temperature T of the PCB is lower than a preset value or not; and determining a command transmission value for controlling the SDH8 circuit output target current based on the following formula: SPI _ T ═ z (T) (I _ T)2+ y (T) × I _ T + x (T), where I _ T is the target current desired to be output by SDH8 circuit at operating temperature T, and x (T), y (T), z (T) are functions of operating temperature T, respectively, where the equations of the functions x (T), y (T), z (T) are different depending on whether the current operating temperature T of the PCB board is lower than a predetermined value.
Description
Technical Field
The present invention relates to the field of current control, and more particularly to a method for controlling the current output of an SDH8 circuit.
Background
For SDH8 (high-side solenoid valve driver chip) application-specific integrated circuits, variations in operating temperature can have a large influence on the accuracy of current output control. The calibration process in the final test of the production line can eliminate at least most of the initial error and, if done at different temperatures, many temperature drifts.
The most stringent standard in the current project is to limit the accuracy error to within +/-10mA over a current range of 200mA to 900 mA. Based on this criterion, a linear two-temperature two-point trimming curve (2T2P algorithm) has been selected to improve current measurement accuracy, but this trimming algorithm can only be effective when the ambient temperature T of the terminal controller TCU is >25 ℃, and cannot effectively improve current measurement accuracy for the case of temperature T <25 ℃.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a method for improving the current output precision of an SDH8 circuit, which can improve the current measurement precision under the condition that a circuit board is at a high temperature (T is more than or equal to 25 ℃) and also can improve the precision under the condition that the circuit board is at a low temperature (T is less than 25 ℃). For example, for low temperature conditions, the current measurement accuracy can be improved by + -% 1 over a current range of 200mA to 1500 mA.
The invention provides a method for controlling current output in an SDH8 circuit, which comprises a test process and an application process, wherein in the application process:
measuring the current working temperature T of the PCB arranged with the SDH8 circuit;
judging whether the current working temperature T of the PCB is lower than a preset value or not; and
the command transmission value for controlling the SDH8 circuit output target current is determined based on the following formula:
SPI_T＝z(T)*(I_T)2+y(T)*I_T+x(T)，
wherein I _ T is a target current expected to be output by the SDH8 circuit at an operating temperature T, and x (T), y (T), z (T) are functions of the operating temperature T, respectively, wherein the equations of the functions x (T), y (T), z (T) are different depending on whether the current operating temperature T of the PCB board is lower than the predetermined value.
Wherein x (T), y (T), z (T) are linear functions of the working temperature T, respectively, that is:
x(T)＝A1*T+B1
y(T)＝A2*T+B2，
z(T)＝A3*T+B3
wherein, a1, a2, A3, B1, B2 and B3 are respectively trimming constants determined by a test process, and values of the trimming constants are different in a case where the operating temperature T of the PCB is lower than the predetermined value from values of the trimming constants in a case where the temperature T is higher than or equal to the predetermined value.
Wherein, the test process comprises the following steps:
a) setting three different target current points I1、I2And I3And calculating command sending values SPI corresponding to the three target current points by using the following functions1、SPI2And SPI3：
SPI＝I*4095/(350mV/170mΩ)；
b) Setting the temperature of the PCB at a first temperature RT at which a command transmission value SPI is transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredR1、IR2And IR3；
c) Setting the temperature of the PCB at a second temperature HT higher than said first temperature RT, at which a command transmission value SPI is to be transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredH1、IH2And IH3；
d) Setting the temperature of the PCB at a third temperature LT lower than said first temperature RT, at which a command transmission value SPI is to be transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredL1、IL2And IL3；
Wherein the trimming constants A1, A2, A3, B1, B2 and B3 take values according to the parameters SPI obtained in the steps a) to d)1、SPI2、SPI3、IR1、IR2、IR3、IH1、IH2、IH3、IL1、IL2And IL3To be determined.
Wherein the testing process further comprises:
e) the parameters x (RT), y (RT), z (RT) at the first temperature RT are calculated using the following formulae:
x(RT)＝SPI1-z(RT)(IRi)2-y(RT)IR1；
f) the parameters x (HT), y (HT), z (HT) at the second temperature HT are calculated using the following equations:
x(HT)＝SPI1-z(HT)(IHi)2-y(HT)IH1；
h) calculating gradients and offsets between the parameters x (RT), y (RT), z (RT) at the first temperature and the parameters x (HT), y (HT), z (HT) at the second temperature:
if the current working temperature of the PCB is higher than or equal to the preset value, values of A1, A2 and A3 are values of the calculated gradient g _ x _ H _ R, g _ y _ H _ R, g _ z _ H _ R respectively, and values of B1, B2 and B3 are values of the calculated offset o _ x _ H _ R, o _ y _ H _ R, o _ z _ H _ R respectively.
Wherein the testing process further comprises:
i) the parameters x (LT), y (LT), z (LT) at the third temperature LT are calculated using the following equations:
x(LT)＝SPI1-z(LT)(ILi)2-y(LT)IL1
j) calculating gradients and offsets between the parameters x (rt), y (rt), z (rt) at the first temperature and the parameters x (lt), y (lt), z (lt) at the third temperature:
if the current working temperature of the PCB is lower than the preset value, the values of A1, A2 and A3 are the values of the calculated gradient g _ x _ R _ L, g _ y _ R _ L, g _ z _ R _ L respectively, and the values of B1, B2 and B3 are the values of the calculated offset o _ x _ R _ L, o _ y _ R _ L, o _ z _ R _ L respectively.
Wherein the predetermined value may be set to 25 ℃.
Wherein the first temperature may be set to RT ═ 25 ℃.
Wherein the second temperature may be set to HT-85 ℃.
Wherein the third temperature may be set to LT ═ 40 ℃.
Wherein the target current point I1、I2And I3Set to 200mA, 700mA and 1100mA, respectively.
Other features and advantages of the methods and systems of the present invention will be apparent from, or are more particularly, described in the accompanying drawings, which are incorporated herein, and the following detailed description of the embodiments, which together serve to explain certain principles of the present invention.
Drawings
Specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It is to be understood that such embodiments are merely illustrative and not restrictive of the spirit and scope of the application. In the drawings:
fig. 1 shows a schematic diagram of an SDH8 application specific integrated circuit according to an exemplary embodiment;
fig. 2 shows a flow chart of a current output control method applied in the SDH8 circuit shown in fig. 1.
Detailed Description
The method for controlling the current output of the SDH8 circuit according to the present invention will be described below by way of example with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention to those skilled in the art. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. Rather, it is contemplated that the invention may be practiced with any combination of the following features and elements, whether or not they relate to different embodiments. Thus, the following aspects, features, embodiments and advantages are merely illustrative and should not be considered elements or limitations of the claims except where explicitly recited in a claim(s).
Fig. 1 shows a circuit diagram of an exemplary SDH8 application specific integrated circuit, which SDH8 circuit comprises, for example, an SDH8 control chip and is connected with an external load and a current meter for detecting the magnitude of the current flowing through the load (i.e., the current output from SDH8 circuit). The control method according to the invention is applied to the SDH8 circuit for calibrating the current output result of an external load. The command sending value obtained by using the control method of the invention is input into an SDH8 control chip through an SPI interface so as to control an SDH8 circuit to accurately output a desired target current, thereby obtaining a current output result with higher precision.
Fig. 2 shows a flowchart of a current output control method applied to the SDH8 circuit shown in fig. 1, which includes a test process and an actual application process. Among them, the test procedure is for obtaining a command transmission value (also referred to herein as "SPI value") input to the SDH8 chip to control the SDH8 circuit output target current, which is obtained by the following three-temperature three-point trimming method (3T3P algorithm) according to the present invention:
SPI_T＝z(T)*(I_T)2+y(T)*I_T+x(T)
in the above equation, I _ T is the target current that is expected to be output by SDH8 circuit at operating temperature T, and x (T), y (T), and z (T) are functions of operating temperature T of the PCB board containing SDH8 control chips, respectively, which is integrated in the terminal controller TCU along with other external components. According to a preferred example, x (T), y (T) and z (T) are each linearly related to the temperature T, i.e. the relationship between them can be shown as:
the working temperature of the PCB is divided into a high temperature range (for example, higher than or equal to 25 ℃) and a low temperature range (for example, lower than 25 ℃) based on a preset temperature value (for example, 25 ℃), and the values of the coefficients A1, A2, A3, B1, B2 and B3 in the high temperature range are different from the values in the low temperature range.
The method of determining each coefficient (a1, a2, A3, B1, B2, and B3) under two temperature conditions during the test, and thus obtaining the corresponding SPI value, is described in detail below. It will be appreciated by those skilled in the art that the trimming steps described below are applicable to only one SPI channel, and each channel must be individually calibrated for the application.
< test procedure >
First, a test device (ammeter), a TCU, and an external load are connected in a circuit connection manner as shown in fig. 1. Subsequently, the test process is divided into three sections, i.e., a normal temperature (RT) section, a High Temperature (HT) section, and a Low Temperature (LT) section, according to the ambient temperature of the TCU.
1. Normal temperature (RT) part
1.1) setting the environmental temperature of the TCU at normal temperature, for example 25 ℃, and measuring the actual temperature RT of the PCB containing the SDH8 chip;
1.2) setting three different target Current points IT_RT1、IT_RT2And IT_RT3(e.g., set to 200mA, 700mA, and 1100mA, respectively, for the EASTII platform TCU currently in use);
1.3) calculating the SPI values corresponding to the three target current points by using the following ideal transfer functionT_RT1、SPIT_RT2And SPIT_RT3：
SPI＝I*4095/(350mV/170mΩ)
4095, 350mV and 170m Ω are parameter values related to the configuration of SDH8 circuit, for example 4095 is the maximum identification resolution corresponding to SDH8 chip, 350mV is the detectable maximum voltage value, and 170m Ω is the shunt resistance value;
1.4) will SPIT_RT1、SPIT_RT2And SPIT_RT3Sent to SDH8 chip, and measured current values corresponding to the three SPI values, respectively (i.e., the current value flowing through the external load) using externally connected ammeters, thus obtaining three current measurement values I at the first temperature RTR1、IR2And IR3；
1.5) calculating the x, y, z parameters at room temperature RT using the following formula:
x(RT)＝SPIT_RT1-z(RT)(IR1)2-y(RT)IR1
1.6, storing the obtained parameter values x (RT), y (RT), z (RT) and the temperature RT of the PCB circuit board into a memory of the TCU.
2. High Temperature (HT) moiety
2.1) setting the ambient temperature of the TCU at a high temperature, e.g. 85 ℃ (this temperature can be set according to the maximum operating temperature of the circuit), and measuring the actual temperature HT of the PCB circuit board;
2.2) repeating the above steps 1.2) to 1.4) at ambient temperature to obtain three current measurements I at the second temperature HTH1、IH2、IH3Wherein, three target current points and corresponding three SPI values are set at the high temperatureT_HT1、SPIT_HT2、SPIT_HT3Respectively taking the same value as the corresponding parameters at normal temperature;
2.3) calculating the x, y and z parameters at high temperature HT:
x(HT)＝SPIT_HT1-z(HT)(IH1)2-y(HT)IH1
2.4) calculating the gradient and offset between x, y and z parameters at normal temperature RT and high temperature HT by using the following formulas;
2.5) storing the values of the above respective gradients and offsets in the memory of the TCU, wherein the stored g _ x _ H _ R, g _ y _ H _ R, g _ z _ H _ R are the values of a1, a2, A3, respectively, in equation (1) at an operating temperature higher than or equal to 25 ℃, and o _ x _ H _ R, o _ y _ H _ R, o _ z _ H _ R are the values of B1, B2, B3, respectively, in equation (1) at an operating temperature higher than or equal to 25 ℃.
3. Low Temperature (LT) part
3.1) setting the ambient temperature of the TCU at a low temperature, for example-40 ℃, and measuring the actual temperature LT of the PCB board;
3.2) repeating the above steps 1.2) to 1.4) at ambient temperature to obtain three current measurements I at a third temperature LTL1、IL2、IL3Wherein, three target current points and corresponding three SPI values are set at the low temperatureT_LT1、SPIT_LT2、SPIT_LT3Respectively taking the same value as the corresponding parameters at normal temperature;
3.3) calculating x, y and z parameters at low temperature LT:
x(LT)＝SpIT_LT1-z(LT)(IL1)2-y(LT)IL1
3.4) calculating the gradient and the offset between x, y and z parameters at normal temperature RT and low temperature LT by using the following formulas;
3.5) storing the above values of the respective gradients and offsets in the memory of the TCU, wherein the stored g _ x _ R _ L, g _ y _ R _ L, g _ z _ R _ L are the values of a1, a2, A3 in equation (1) at operating temperatures below 25 ℃ respectively, and o _ x _ R _ L, o _ y _ R _ L, o _ z _ R _ L are the values of B1, B2, B35 3 in equation (1) at operating temperatures below 25 ℃ respectively.
< practical application Process >
After the testing process is completed, in the practical application process, the corresponding gradient and offset values can be extracted from the memory according to the current working temperature of the PCB so as to calculate the SPI value at the temperature.
Specifically, the current working temperature T of the PCB is firstly measured, then whether the temperature is less than a preset value (such as 25 ℃) or not is judged,
if T.gtoreq.25 ℃, then x (T), y (T), z (T) are calculated based on the following equations:
x(T)＝T*g_x_H_R+o_x_H_R
y(T)＝T*g_y_H_R+o_y_H_R
z(T)＝T*g-z_H_R+o_z_H_R
if T <25 ℃, then x (T), y (T), z (T) are calculated based on the following equations:
x(T)＝T*g_x_R_L+o_x_R_L
y(T)＝T*g_y_R_L+o_y_R_L
x(T)＝T*g_x_R_L+o_x_R_L
finally, the calculated values of x (T), y (T), z (T) are respectively substituted into the following formulas to obtain the corresponding SPI values:
SPI_T＝z(T)*(I_T)2+y(T)*I_T+x(T)
the obtained SPI value is the current command transmission value suitable for the current temperature, and then the current command transmission value is transmitted to the SDH8 chip through the SPI interface to obtain a current output result close to the target current I _ T.
By using the improved trimming method, the current output precision of the SDH8 circuit can be improved, and particularly, the current precision at high temperature (T is more than or equal to 25 ℃) and low temperature (T is less than 25 ℃) can be improved, for example, the current precision can be improved by +/-1% in the current range of 200mA to 1500 mA.
Those skilled in the art will appreciate that all or part of the steps for implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks. In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
Although the present invention has been described with reference to the preferred embodiments, it is not to be limited thereto. Various changes and modifications within the spirit and scope of the present invention will become apparent to those skilled in the art from this disclosure, and it is intended that the scope of the present invention be defined by the appended claims.
Claims (9)
1. A method for controlling the current output of SDH8 circuit, the method comprising a test procedure and an application procedure, wherein in the application procedure:
measuring the current working temperature T of the PCB arranged with the SDH8 circuit;
judging whether the current working temperature T of the PCB is lower than a preset value or not; and
the command transmission value for controlling the SDH8 circuit output target current is determined based on the following formula:
SPI_T＝z(T)*(I_T)2+y(T)*I_T+x(T)，
wherein I _ T is the target current expected to be output by SDH8 circuit at the working temperature T, and x (T), y (T), z (T) are respectively the functions of the working temperature T, wherein the equations of the functions x (T), y (T), z (T) are different depending on whether the current working temperature T of PCB board is lower than the predetermined value,
wherein x (T), y (T), z (T) are linear functions of the working temperature T, respectively, that is:
x(T)＝A1*T+B1
y(T)＝A2*T+B2，
z(T)＝A3*T+B3
wherein, a1, a2, A3, B1, B2 and B3 are respectively trimming constants determined by a test process, and values of the trimming constants are different in a case where the operating temperature T of the PCB is lower than the predetermined value from values of the trimming constants in a case where the temperature T is higher than or equal to the predetermined value.
2. The method of claim 1, wherein the testing process comprises the steps of:
a) setting three different target current points I1、I2And I3And calculating command sending values SPI corresponding to the three target current points by using the following functions1、SPI2And SPI3：
SPI＝I*4095/(350mV/170mΩ)；
b) Setting the temperature of the PCB at a first temperature RT at which a command transmission value SPI is transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredR1、IR2And IR3；
c) Setting the temperature of the PCB at a second temperature HT higher than said first temperature RT, at which a command transmission value SPI is to be transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredH1、IH2And IH3；
d) Setting the temperature of the PCB at a third temperature LT lower than said first temperature RT, at which a command transmission value SPI is to be transmitted1、SPI2And SPI3Respectively sent to the control chips of the SDH8 circuit, and three corresponding current values I respectively output from the SDH8 circuit are measuredL1、IL2And IL3；
Wherein the trimming constants A1, A2, A3, B1, B2 and B3 take values according to the parameters SPI obtained in the steps a) to d)1、SPI2、SPI3、IR1、IR2、IR3、IH1、IH2、IH3、IL1、IL2And IL3To be determined.
3. The method of claim 2, wherein the testing process further comprises:
e) the parameters x (RT), y (RT), z (RT) at the first temperature RT are calculated using the following formulae:
x(RT)＝SPI1-z(RT)(IR1)2-y(RT)IR1；
f) the parameters x (HT), y (HT), z (HT) at the second temperature HT are calculated using the following equations:
x(HT)＝SPI1-z(HT)(IH1)2-y(HT)IH1；
h) calculating gradients and offsets between the parameters x (RT), y (RT), z (RT) at the first temperature and the parameters x (HT), y (HT), z (HT) at the second temperature:
if the current working temperature of the PCB is higher than or equal to the preset value, values of A1, A2 and A3 are values of the calculated gradient g _ x _ H _ R, g _ y _ H _ R, g _ z _ H _ R respectively, and values of B1, B2 and B3 are values of the calculated offset o _ x _ H _ R, o _ y _ H _ R, o _ z _ H _ R respectively.
4. The method of claim 3, wherein the testing process further comprises:
i) the parameters x (LT), y (LT), z (LT) at the third temperature LT are calculated using the following equations:
x(LT)＝SPI1-z(LT)(IL1)2-y(LT)IL1
j) calculating gradients and offsets between the parameters x (rt), y (rt), z (rt) at the first temperature and the parameters x (lt), y (lt), z (lt) at the third temperature:
if the current working temperature of the PCB is lower than the preset value, the values of A1, A2 and A3 are the values of the calculated gradient g _ x _ R _ L, g _ y _ R _ L, g _ z _ R _ L respectively, and the values of B1, B2 and B3 are the values of the calculated offset o _ x _ R _ L, o _ y _ R _ L, o _ z _ R _ L respectively.
5. The method according to any one of claims 1 to 4, wherein the predetermined value is set to 25 ℃.
6. The method according to any one of claims 2 to 4, wherein the first temperature is set at RT-25 ℃.
7. The method according to any one of claims 2 to 4, wherein the second temperature is set to HT-85 ℃.
8. The method according to any one of claims 2 to 4, wherein the third temperature is set to LT ═ -40 ℃.
9. The method of any one of claims 2 to 4, wherein the target current point I1、I2And I3Set to 200mA, 700mA and 1100mA, respectively.
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