CN111192848A - Low-cost and efficient flexible circuit manufacturing process - Google Patents
Low-cost and efficient flexible circuit manufacturing process Download PDFInfo
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- CN111192848A CN111192848A CN202010105433.9A CN202010105433A CN111192848A CN 111192848 A CN111192848 A CN 111192848A CN 202010105433 A CN202010105433 A CN 202010105433A CN 111192848 A CN111192848 A CN 111192848A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a low-cost and efficient flexible circuit manufacturing process. A low cost and efficient flexible circuit manufacturing process comprising the steps of: s1: adhering a metal conductor layer on the rigid substrate through low-viscosity glue, and then laying a protective layer on the metal conductor layer; s2: cutting the protective layer by using a laser ablation method to leave a required part, removing redundant metal materials by using a corrosion process, and forming a horseshoe-shaped lead structure on the rigid substrate; s3: stripping the horseshoe-shaped lead structure from the rigid substrate after the required line shape is prepared, so as to prepare the horseshoe-shaped lead; s4: the electronic components are placed in the set positions and fixed to the islands by soldering or a conductive adhesive. The low-cost and high-efficiency flexible circuit manufacturing process provided by the invention has the advantages that the innovation is carried out on the basis of the FPC process flow, the time consumption and the preparation difficulty in the preparation process are greatly reduced, and the requirement on equipment is far lower than that of FPC.
Description
Technical Field
The invention relates to the technical field of flexible circuit processing, in particular to a low-cost and high-efficiency flexible circuit manufacturing process.
Background
The flexible circuit is a special circuit formed by mounting electronic components on a flexible substrate, the substrate is usually made of polymer materials such as polyimide plastic, polyetheretherketone or transparent conductive terylene, and the flexible circuit has the characteristics of light weight, thin thickness, flexibility and bending.
The traditional flexible circuit is generally manufactured by adopting an FPC (flexible printed circuit) process, but the traditional flexible circuit has the problems of more complex preparation process, longer time consumption, high requirement on equipment required by the preparation process and the like.
Therefore, it is necessary to provide a low-cost and efficient flexible circuit manufacturing process to solve the above technical problems.
Disclosure of Invention
The invention solves the technical problem of providing a low-cost and high-efficiency flexible circuit manufacturing process which is innovated on the basis of an FPC (flexible printed circuit) process flow, greatly reduces time consumption and preparation difficulty in the preparation process, and has far lower requirements on equipment than an FPC.
In order to solve the above technical problems, the low-cost and high-efficiency flexible circuit manufacturing process provided by the invention comprises the following steps:
s1: adhering a metal conductor layer on the rigid substrate through low-viscosity glue, and then laying a protective layer on the metal conductor layer;
s2: cutting the protective layer by using a laser ablation method to leave a required part, removing redundant metal materials by using a corrosion process, and forming a horseshoe-shaped lead structure on the rigid substrate;
s3: stripping the horseshoe-shaped lead structure from the rigid substrate after the required line shape is prepared, so as to prepare the horseshoe-shaped lead;
s4: the electronic components are placed in the set positions and fixed to the islands by soldering or conductive adhesive to complete the fabrication of the flexible, extensible thin film circuit.
Preferably, in S1, according to the functional design requirement, a thin film dielectric layer is added on the metal conductor layer, and the conductor layer and the dielectric layer are repeatedly laid, or multiple layers of conducting wires are prepared according to the thickness direction, so as to implement vertical interconnection with the island, so as to implement complex circuit functions.
Preferably, for the circuit with packaging requirements, the flexible extensible film circuit prepared in S1-S4 is embedded into the upper and lower layers of packaging materials to obtain a packaged flexible circuit.
Compared with the related art, the low-cost and high-efficiency flexible circuit manufacturing process provided by the invention has the following beneficial effects:
the invention provides a low-cost and high-efficiency flexible circuit manufacturing process, which is simplified on the basis of an FPC (flexible printed circuit) process flow, and achieves the purpose of preparing an LED dot matrix screen and a plurality of flexible electronic products comprising wearable equipment, intelligent architectural decoration, intelligent automobile lamps, creative intelligent furniture and the like by using a set of low-cost equipment. Provides a feasible scheme for the industrialization of the flexible electronic technology.
The circuit design of the invention carries out reasonable lead spacing arrangement and functional element arrangement according to the equipment precision, thereby greatly reducing the difficulty and rejection rate of preparation.
In the test, the extensible flexible thin film circuit can still keep good electrical effect after 5000 times of stretching and bending.
Drawings
FIG. 1 is a diagrammatic, schematic view of a low cost and efficient flexible circuit manufacturing process provided by the present invention;
fig. 2 is a schematic diagram of a 10 x 10 flexible thin film circuit board manufactured by using the low-cost and efficient flexible circuit manufacturing process provided by the present invention.
Reference numbers in the figures: 1. film, 2, LED, 3, horseshoe wire.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic diagram illustrating a low-cost and efficient flexible circuit manufacturing process according to the present invention; fig. 2 is a schematic diagram of a 10 x 10 flexible thin film circuit board manufactured by using the low-cost and efficient flexible circuit manufacturing process provided by the present invention. A low cost and efficient flexible circuit manufacturing process includes the steps of:
s1: adhering a metal conductor layer on a rigid substrate through low-viscosity glue, and then laying a protective layer (playing a role in protection during corrosion) on the metal conductor layer, as shown in fig. 1 (a);
s2: cutting the protective layer by using a laser ablation method to leave a required part, removing redundant metal materials by using a corrosion process, and forming a horseshoe-shaped lead structure on the rigid substrate, as shown in fig. 1(b), the process can directly manufacture the lead with the horseshoe-shaped structure, and compared with the traditional FPC process, the difficulty of stripping the lead is greatly simplified;
s3: after the desired line shape is made, the horseshoe-shaped wire structure is peeled off from the rigid substrate to make a horseshoe-shaped wire, as shown in fig. 1 (c);
s4: the electronic components (indicated by dots in fig. 1) are placed at the set positions and fixed on the islands by soldering or a conductive adhesive, as shown in fig. 1(d), to complete the preparation of a flexible extensible film circuit (a flexible circuit based on a horseshoe-shaped wire island-bridge structure).
In S1, according to the functional design requirement, a thin film dielectric layer is added on the metal conductor layer, and a conductor layer and a dielectric layer are repeatedly laid, or a plurality of layers of wires are prepared according to the thickness direction, so as to realize vertical interconnection with the island, thereby realizing a complex circuit function.
For the circuit with packaging requirements, the flexible extensible film circuit prepared in S1-S4 is embedded into the upper and lower layers of packaging materials to obtain a packaged flexible circuit, as shown in FIG. 1(e) and FIG. 1 (f).
The flexible circuit manufactured by the invention can be used in intelligent transportation, such as central control, instruments, seats, car window skylights and the like of automobiles, and can use a flexible display screen. During driving control, common driving regulation and control such as steering lamps, windscreen wipers and gear shifting can be integrated on the steering wheel, the hands of a driver do not need to leave the steering wheel, and driving safety is improved. Due to the extensible characteristic, the automobile body can be better attached to the width of the automobile body, and the automobile body can be used for displaying personalized automobile lamps.
The flexible circuit manufactured by the invention can be integrated with soft and comfortable fabrics such as clothes, shoes, bags and the like, and the technological sense, the fashion sense and the practicability are improved.
The flexible circuit manufactured by the invention can be used as the media decoration of the outer wall of a large building, and the flexible circuit is light, thin and flexible, so that the flexible circuit can be applied to wall bodies with different shapes. The film sealing layer can also reduce the damage of various external factors
Compared with the related art, the low-cost and high-efficiency flexible circuit manufacturing process provided by the invention has the following beneficial effects:
the invention provides a low-cost and high-efficiency flexible circuit manufacturing process, which is simplified on the basis of an FPC (flexible printed circuit) process flow, and achieves the purpose of preparing an LED dot matrix screen and a plurality of flexible electronic products comprising wearable equipment, intelligent architectural decoration, intelligent automobile lamps, creative intelligent furniture and the like by using a set of low-cost equipment. Provides a feasible scheme for the industrialization of the flexible electronic technology.
The circuit design of the invention carries out reasonable lead spacing arrangement and functional element arrangement according to the equipment precision, thereby greatly reducing the difficulty and rejection rate of preparation.
In the test, the extensible flexible thin film circuit can still keep good electrical effect after 5000 times of stretching and bending.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (3)
1. A low cost and efficient flexible circuit manufacturing process, comprising the steps of:
s1: adhering a metal conductor layer on the rigid substrate through low-viscosity glue, and then laying a protective layer on the metal conductor layer;
s2: cutting the protective layer by using a laser ablation method to leave a required part, removing redundant metal materials by using a corrosion process, and forming a horseshoe-shaped lead structure on the rigid substrate;
s3: stripping the horseshoe-shaped lead structure from the rigid substrate after the required line shape is prepared, so as to prepare the horseshoe-shaped lead;
s4: the electronic components are placed in the set positions and fixed to the islands by soldering or conductive adhesive to complete the fabrication of the flexible, extensible thin film circuit.
2. The low-cost and efficient flexible circuit manufacturing process according to claim 1, wherein in S1, vertical interconnection with islands is realized by adding thin film dielectric layers on metal conductor layers and repeatedly laying conductor layers and dielectric layers or preparing multiple layers of wires according to thickness direction according to functional design requirements, so as to realize complex circuit functions.
3. The low-cost and efficient process of manufacturing flexible circuits according to claim 1, wherein for circuits with packaging requirements, the flexible and stretchable thin-film circuits prepared in S1-S4 are embedded in the upper and lower layers of packaging materials to obtain packaged flexible circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010105433.9A CN111192848A (en) | 2020-02-20 | 2020-02-20 | Low-cost and efficient flexible circuit manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010105433.9A CN111192848A (en) | 2020-02-20 | 2020-02-20 | Low-cost and efficient flexible circuit manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111192848A true CN111192848A (en) | 2020-05-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010105433.9A Pending CN111192848A (en) | 2020-02-20 | 2020-02-20 | Low-cost and efficient flexible circuit manufacturing process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150173202A1 (en) * | 2012-06-07 | 2015-06-18 | Rmt Limited | Method for producing conductive tracks |
| CN104837300A (en) * | 2015-05-19 | 2015-08-12 | 上海安费诺永亿通讯电子有限公司 | Thick metal circuit board in NFC or wireless charging technology and manufacturing method thereof |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
| CN209265885U (en) * | 2018-09-19 | 2019-08-16 | 昆山工研院新型平板显示技术中心有限公司 | Stretch electrode and the electronic device comprising it |
-
2020
- 2020-02-20 CN CN202010105433.9A patent/CN111192848A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150173202A1 (en) * | 2012-06-07 | 2015-06-18 | Rmt Limited | Method for producing conductive tracks |
| CN104837300A (en) * | 2015-05-19 | 2015-08-12 | 上海安费诺永亿通讯电子有限公司 | Thick metal circuit board in NFC or wireless charging technology and manufacturing method thereof |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
| CN209265885U (en) * | 2018-09-19 | 2019-08-16 | 昆山工研院新型平板显示技术中心有限公司 | Stretch electrode and the electronic device comprising it |
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Application publication date: 20200522 |