CN111190036A - Shunt lead structure, electric power meter with shunt lead structure and manufacturing method of shunt lead structure - Google Patents
Shunt lead structure, electric power meter with shunt lead structure and manufacturing method of shunt lead structure Download PDFInfo
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- CN111190036A CN111190036A CN202010127006.0A CN202010127006A CN111190036A CN 111190036 A CN111190036 A CN 111190036A CN 202010127006 A CN202010127006 A CN 202010127006A CN 111190036 A CN111190036 A CN 111190036A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000005070 sampling Methods 0.000 claims abstract description 155
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000017105 transposition Effects 0.000 claims description 4
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical group [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 2
- 230000004907 flux Effects 0.000 description 11
- 229910000896 Manganin Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000011173 large scale experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/146—Measuring arrangements for current not covered by other subgroups of G01R15/14, e.g. using current dividers, shunts, or measuring a voltage drop
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R11/00—Electromechanical arrangements for measuring time integral of electric power or current, e.g. of consumption
- G01R11/02—Constructional details
- G01R11/04—Housings; Supporting racks; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R22/00—Arrangements for measuring time integral of electric power or current, e.g. electricity meters
- G01R22/06—Arrangements for measuring time integral of electric power or current, e.g. electricity meters by electronic methods
- G01R22/061—Details of electronic electricity meters
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Abstract
The invention relates to a shunt lead structure, a power meter thereof and a manufacturing method of the shunt lead structure, wherein the shunt lead structure comprises a shunt and a PCB lead plate, and the shunt is sequentially provided with a voltage end, a first sampling end and a second sampling end along the current direction around a resistor body; the PCB lead plate is at least a double-sided metal perforated or multi-layer metal perforated PCB plate, and a voltage connecting end, a first sampling connecting end and a second sampling connecting end which correspond to the shunt are arranged on the PCB lead plate; the circuit of the first sampling connecting end on the PCB lead plate extends to the position of the second sampling connecting end along the resistor body of the shunt in parallel, and extends to the other end of the PCB lead plate with the second sampling connecting end circuit through the perforated stranded state of the cross section of the PCB lead plate to form a first sampling circuit Iin + and a second sampling circuit Iin-for sampling the shunt. By the arrangement, the interference of an external magnetic field is reduced to generate induced current, and the detection accuracy is improved.
Description
Technical Field
The invention relates to a shunt lead structure used in an electric power instrument, an electric power instrument thereof and a shunt lead structure manufacturing method, in particular to a shunt lead structure suitable for the electric energy transmission field, an electric power instrument thereof and a shunt lead structure manufacturing method.
Background
The current diverter has the advantages of high metering accuracy, small temperature influence and low cost, and is widely applied to single-phase intelligent electric energy meters, in particular to manganin diverters; due to the characteristics of the installation position of the shunt and the connection of the sampling lead, the manganin shunt can generate induced current when being interfered by a power frequency magnetic field, and the accuracy of current metering can be seriously influenced.
The traditional manganin shunt carries out current sampling through a piece of manganin alloy, and the wiring is more dispersed, and the twisted pair of novel shunt needs to carry out point gluing fixed position or to make it difficult loose with the fixed shape of pyrocondensation pipe, and this is not only consuming time and power, still is unfavorable for automated production. In 2013, the enterprise standard of the electric energy meter is revised by national grid company, and in the influence quantity test of Q/GDW1364-2013 technical Specification of Single-phase Intelligent electric energy meter, the method is characterized in that 'the voltage circuit of the electric energy meter is 115% Un, no current exists in a current circuit, a 0.5mT power frequency magnetic field is applied to the most sensitive part of the electric energy meter affected by the magnetic field, and the electric energy meter cannot generate more than 1 pulse output within 20 times of theoretical starting time'. The proposal of the standard prompts the electric energy meter industry to actively seek a scheme for improving the anti-electromagnetic interference capability of the electric energy meter.
Therefore, there is a need for improved diverter lead structure and power meter thereof to improve the ability of diverter to resist power frequency magnetic field interference.
Disclosure of Invention
The invention aims to provide a shunt lead structure capable of improving the power frequency magnetic field interference resistance, an electric power instrument thereof and a shunt lead structure manufacturing method.
In order to achieve the technical purpose, the invention adopts the following technical modes: a shunt lead structure comprises a shunt and a PCB lead plate, wherein the shunt is provided with a resistor body, the shunt is provided with at least one voltage end and two sampling ends around the resistor body, and the voltage end, the first sampling end and the second sampling end are sequentially arranged along the current flowing direction; the PCB lead plate is at least a double-sided metal perforated or multilayer metal perforated PCB plate, and a voltage connecting end, a first sampling connecting end and a second sampling connecting end which correspond to the shunt are arranged on the PCB lead plate; the circuit of the first sampling connecting end on the PCB lead plate extends to the position of the second sampling connecting end along the resistor body of the shunt in parallel, and extends to the other end of the PCB lead plate with the second sampling connecting end circuit through the perforated stranded state of the cross section of the PCB lead plate to form a first sampling circuit Iin + and a second sampling circuit Iin-for sampling the shunt.
As a further improvement of the invention, the cross section hole stranding state of the PCB lead plate comprises that an upper connecting sheet body group and a lower connecting sheet body group which are arranged in an upper layer and a lower layer are arranged on the PCB lead plate, the upper connecting sheet body group comprises a plurality of upper connecting sheet bodies which are arranged at intervals in the front-back direction, the lower connecting sheet body group comprises a plurality of lower connecting sheet bodies which are arranged at intervals along the arrangement direction of the upper connecting sheet bodies, the upper connecting sheet bodies and the lower connecting sheet bodies which are corresponding to the upper and lower positions are mutually crossed, connecting ends are arranged on the upper connecting sheet bodies and the lower connecting sheet bodies, electric connecting columns which extend up and down are arranged on the PCB lead plate, and the upper connecting sheet bodies and the lower connecting sheet bodies which are adjacent along the front-back arrangement direction are mutually and electrically connected through the electric connecting columns so as to.
As a further improvement of the invention, the current can be converted into a corresponding voltage signal after passing through the shunt, the sampled voltage signal enters an AD metering chip after passing through a first-order RC filter circuit, and the current is calculated through conversion, so that the metering of the current is realized.
In a further improvement of the present invention, the first sampling terminal and the second sampling terminal are respectively provided on the shunt resistor or on a side of the shunt resistor.
As a further improvement of the invention, the PCB lead plate is tightly attached to the surface parallel to the shunt or the PCB lead plate is tightly attached to the surface perpendicular to the shunt.
As a further improvement of the invention, the length of the circuit extending from the first sampling connecting end to the second sampling connecting end on the PCB lead plate is the same as the length of the resistor body between the first sampling end and the second sampling end on the shunt.
As a further improvement of the invention, the back surface of the first sampling connection terminal extension circuit on the PCB lead plate is closely insulated with the shunt.
As a further development of the invention, the shunt is a manganin shunt.
In order to achieve the technical purpose, the invention can also adopt the following technical modes:
the utility model provides an electric power instrument, includes the electric power instrument shell, be equipped with sampling device in the electric power instrument shell, carry out the metering device that the operation was converted to the signal that sampling device surveyed, with the measurement display device that the measurement result shows to the user, sampling device includes the terminal button box, the terminal button box that connects includes the terminal button box, installs the connection terminal button on the terminal button box, the connection terminal button is used for being connected with external electric power input output line, the connection terminal button is connected with above-mentioned shunt lead structure.
In order to achieve the technical purpose, the invention can also adopt the following technical modes: a manufacturing method of a lead structure of a shunt comprises a PCB lead plate used for being attached and installed on the shunt, wherein the PCB lead plate is provided with a voltage connecting circuit, a first sampling circuit and a second sampling circuit which correspond to the shunt, the first sampling circuit and the second sampling circuit are used for being electrically connected with two sampling ends of the shunt, and the manufacturing method of the PCB lead plate comprises the following steps:
preparing a PCB bottom plate, wherein the bottom plate is provided with a first layer and a second layer which are electrically isolated from each other from top to bottom;
the first layer is provided with a first upper connecting sheet body and a second upper connecting sheet body which are arranged in a front-back manner, and the second layer is provided with a first lower connecting sheet body and a second lower connecting sheet body which are arranged in a front-back manner;
the bottom plate is provided with a first perforation and a second perforation which penetrate through the first layer and the second layer, and the second perforation is positioned beside the first perforation;
a first electrical connection column is arranged in the first through hole and electrically connected with the first upper connection sheet body and the second lower connection sheet body so as to form the first sampling circuit; a second electrical connection column is arranged in the second through hole and electrically connected with the first lower connection sheet body and the second upper connection sheet body to form a second sampling circuit;
the first upper connecting sheet body and the first lower connecting sheet body are arranged on the bottom plate in a manner of being opposite in upper and lower positions and forming a cross angle in a moving direction, and the second upper connecting sheet body and the second lower connecting sheet body are arranged on the bottom plate in a manner of being opposite in upper and lower positions and forming a cross angle in a moving direction.
Compared with the prior art, the PCB lead plate is at least a double-sided metal perforated or multilayer metal perforated PCB, and the PCB lead plate is provided with a voltage connecting end, a first sampling connecting end and a second sampling connecting end which correspond to the shunt; the circuit of the first sampling connecting end on the PCB lead plate extends to the position of the second sampling connecting end along the resistor body of the shunt in parallel, and extends to the other end of the PCB lead plate with the second sampling connecting end circuit through the perforated stranded state of the cross section of the PCB lead plate to form a first sampling circuit Iin + and a second sampling circuit Iin-for sampling the shunt. So set up, the circuit of porose transposition state can restrain electromagnetic interference effectively like the twisted pair line, this is not only the very little return circuit area that has between two circuits of porose transposition state, and the electric current that inducts on the adjacent two return circuits on the porose transposition circuit has opposite direction, consequently can offset each other, the PCB board has fixed the reclamation area as the connecting wire of shunt, the uncertain factor of reclamation area because the wire is connected, the loose uncertain factor of twisted pair line is solved simultaneously, induced-current that produces by external alternating magnetic field interference has been reduced effectively, the interference killing feature is strong, the reliability is high.
Drawings
FIG. 1 is a schematic diagram of a shunt of a first embodiment of the shunt lead configuration of the present invention;
fig. 2 is a schematic structural view of a first embodiment of a shunt lead structure of the present invention.
Fig. 3 is a schematic structural view of a PCB lead plate of a first embodiment of the shunt lead structure of the present invention.
FIG. 4 is a schematic diagram of a PCB with a lead plate having an insulation layer removed according to a first embodiment of the present invention.
Fig. 5 is a schematic diagram of a second embodiment of a shunt lead configuration shunt of the present invention.
Fig. 6 is a schematic structural view of a shunt lead structure according to a second embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a PCB lead plate of a second embodiment of the shunt lead structure of the present invention.
FIG. 8 is a schematic diagram of a PCB with a lead plate having an insulation layer removed according to a second embodiment of the present invention.
Fig. 9 is a schematic structural view of an environment in which the first embodiment of the shunt lead structure of the present invention is used.
Fig. 10 is a schematic structural view of an environment in which a second embodiment of the shunt lead structure of the present invention is used.
Fig. 11 is a schematic view of the structure at another angle in fig. 10.
Reference numerals:
First sampling end 22, 22 'second sampling end 23, 23'
Iin+
Iin-
Connecting end 3012 first upper connecting piece 3013
Second upper connecting piece 3014 second layer 302
Lower connecting piece 3021 connecting end 3022
First lower connecting piece 3023 and second lower connecting piece 3024
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the field of shunt application, great knowledge is given to the problems in the prior art by the Vida electronics Co., Ltd as a supplier skilled in market demand in the industry, and the research and development team further invests huge investment on the original technology owned by the supplier, performs a long-time and large-scale experiment, scheme screening and a large amount of customer investigation, and finally obtains the technical scheme of the invention.
Fig. 1 to 11 are schematic structural views of a lead structure 1 of a shunt according to the present invention. The shunt lead structure 1 comprises a shunt 2 and a PCB lead plate 3, wherein a resistor body 20 is arranged on the shunt 2, the shunt 2 is at least provided with a voltage end 21 and two sampling ends 22 and 23 around the resistor body 20, and the voltage end 21, the first sampling end 22 and the second sampling end 23 are sequentially arranged on the shunt 2 along the current flowing direction; the PCB lead plate 3 is at least a double-sided metal perforated or multilayer metal perforated PCB, and the PCB lead plate 3 is provided with a voltage connecting end 31, a first sampling connecting end 32 and a second sampling connecting end 33 which respectively correspond to the voltage end 21, the first sampling end 22 and the second sampling end 23 of the shunt 2; the circuit of the first sampling connection end 32 on the PCB lead plate 3 extends to the position of the second sampling connection end 33 along the resistor 20 of the shunt 2 in parallel, and extends to the other end of the PCB lead plate 3 with the circuit of the second sampling connection end 33 through the cross section hole-twisted state of the PCB lead plate 3, so as to form a first sampling circuit Iin +321 and a second sampling circuit Iin-331 for sampling the shunt 2.
In this way, the circuit of the first sampling connection terminal 32 on the PCB lead plate 3 extends to the position of the second sampling connection terminal 33 in parallel along the resistor 20 corresponding to the shunt 2; and the circuit of the second sampling connection terminal 33 extends to the other end of the PCB lead plate 3 through the PCB cross section hole-twisted state, so as to form a first sampling circuit Iin +321 and a second sampling circuit Iin-331 for sampling the current divider 2, thereby further electrically connecting to the main circuit board (not shown). In this way, the circuit of the first sampling connection terminal 32 extends to the second sampling connection terminal 33 by a length substantially equal to the length of the resistor body 20 between the first sampling terminal 22 and the second sampling terminal 23 of the shunt 2. According to faraday's law, when the magnetic flux passing through a non-closed coil changes, the coil has no induced current, but the induced electromotive force still exists. When a section of conductor does uniform cutting magnetic induction line motion in a uniform magnetic field, no matter whether a circuit is closed or not, the size of induced electromotive force E is only in direct proportion to magnetic induction intensity B, conductor length L, cutting speed v and the sine value of an included angle theta between v and B directions, namely E is BLvsin theta (theta is an angle obtained by mutually converting every two of the three, namely B, L and v), and when the external magnetic induction intensity B and the cutting speed v are the same as the sine value of the included angle theta between v and B directions, the conductor length L determines the size of the induced electromotive force; in order to have a current in the closed circuit, a power supply must be present in the circuit, because the current is caused by the electromotive force of the power supply, and in the electromagnetic induction phenomenon, since an induced current is present in the closed circuit, the electromotive force must also be present in the circuit.
The other end of the sampling circuit of the PCB lead plate 3 is electrically connected with the load of the main circuit board to form a whole closed loop; the whole closed loop generates induction current when the external alternating magnetic field interferes; as can be seen, the length of the resistor 20 between the first sampling terminal 22 and the second sampling terminal 23 of the corresponding shunt 2 is substantially the same after the extended circuit of the first sampling terminal 32 on the PCB lead plate 3 reaches the position of the second sampling terminal 33; the second sampling circuit Iin-331 on the PCB lead plate 3 extends to the other end of the PCB lead plate 3 through the perforated stranded state of the cross section of the PCB lead plate 3, and the extended lengths of the stranded states of the two sampling circuits 321 and 331 are also the same; that is, the total length of the first sampling circuit Iin +321 is substantially the same as the total length of the corresponding resistor 20 and the total length of the second sampling circuits Iin-331 added together, and the induced electromotive forces E are substantially the same in the two sampling- end circuits 321 and 331, and cancel each other out in opposite polarities.
According to faraday's law of electromagnetic induction, as long as the magnetic flux through the closed circuit changes, a current is generated in the closed circuit. The generation of the induced current must meet two conditions: (1) closed circuit, (2) magnetic flux change; the magnetic flux equation Φ ═ BS (magnetic flux Φ ═ flux density Bx reclamation area S), when the disturbance flux density is constant and the circuit is closed, then only the size of the reclamation area determines the size of the magnetic flux. That is, the size of the area enclosed between the two sampling circuits 321 and 331 and the resistor 20 determines the magnitude of the magnetic flux; the smaller the area to be reclaimed, the smaller the magnetic flux, and the smaller the induced current generated.
The invention adopts the PCB as the connecting line of the shunt 2 to fix the reclamation area, solves the uncertain factor of the reclamation area due to the connection of the conducting wire, simultaneously solves the uncertain factor of the looseness of the twisted pair, and effectively reduces the induction current generated by the interference of the external alternating magnetic field.
Specifically, the 3 cross-section hole-oriented strand states of PCB lead plate include: be equipped with on PCB lead plate 3 and be last connection lamellar body group 3011 and lower connection lamellar body group 3021 of two-layer setting from top to bottom, go up connection lamellar body group 3011 and include a plurality of front and back interval arrangement's slope form on the connection lamellar body group, lower connection lamellar body group 3021 includes a plurality of lower connection lamellar bodies along last connection lamellar body arrangement direction interval arrangement, and the upper and lower position is corresponding go up the connection lamellar body and be intercrossing form with lower connection lamellar body, it all is equipped with link 3012, 3022 with lower connection lamellar body both ends to go up the connection lamellar body, be equipped with the electric connection post 4 of extending from top to bottom on PCB lead plate 3, thereby it forms respectively through electric connection post 4 electric connection each other with lower connection lamellar body around adjacent last connection lamellar body first sampling circuit +321 and second sampling circuit Iin-Iin 331. The "front and back" may be any arrangement direction of the upper connection sheet body group 3011 and the lower connection sheet body group 3021 on the PCB lead board 3, and the upper connection sheet body group 3011 and the lower connection sheet body group 3021 are arranged in a straight line or a non-straight line within the protection scope of the present invention. With the arrangement, the first sampling circuit Iin +321 and the second sampling circuit Iin-331 can form a relatively stable cross-section hole-twisted state, and the circuit in the hole-twisted state can effectively suppress electromagnetic interference like a twisted pair, so that not only is a very small loop area between two circuits in the hole-twisted state, but also currents induced on two adjacent loops on the hole-twisted circuit have opposite directions, and therefore the currents can be mutually offset, so that the PCB board can be used as a connecting line of the shunt 2 to fix a reclamation area, thereby solving the uncertain factor of loose twisted pair, and having strong anti-interference capability and high reliability. The electrical connection posts 4 may be hollow or solid.
The PCB lead plate 3 is further provided with a voltage connection circuit 55 located beside the first sampling circuit Ii, n +321 and the second sampling circuit Iin-331, wherein the voltage connection circuit 55 is connected to the voltage terminal 21 of the shunt 2. The current can be converted into corresponding voltage signals after passing through the shunt 2, the sampled voltage signals enter an AD metering chip after passing through a first-order RC filter circuit, and the current is calculated through conversion, so that the metering of the current is realized. With such an arrangement, the shunt lead structure 1 can detect the voltage on the shunt 2, so that the current can be calculated through the metering conversion device.
In the different embodiments of the present invention, the first sampling tip 22 and the second sampling tip 23 are respectively provided on the resistor body 20 of the shunt 2 or on the side of the resistor body 20 of the shunt 2. That is, the first sampling terminal 22 may be provided on or beside the resistor body 20 of the shunt 2, and the second sampling terminal 23 may be provided on or beside the resistor body 20 of the shunt 2, so that the voltage on both sides of the resistor body 20 can be sampled.
In different embodiments of the present invention, the PCB lead plate 3 is closely attached to the surface parallel to the shunt 2 or the PCB lead plate 3 is closely attached to the surface perpendicular to the shunt 2. Referring to fig. 1 to 4 and fig. 9, which are a schematic structural diagram of a lead structure 1 of a shunt and a schematic structural diagram of a terminal box 100 according to a first embodiment of the present invention, in the first embodiment, the PCB lead plate 3 is closely attached to a surface parallel to the shunt 2, and in the embodiment shown in fig. 1 to fig. 2, a current flows through the shunt 2 from left to right. Specifically, referring to fig. 5 to 8 and fig. 10 to 11, which are a schematic structural view of a shunt lead structure 1 and a schematic structural view of a terminal box 100 according to a second embodiment of the present invention, in the second embodiment, a PCB lead plate 3 ' is closely attached to and perpendicular to a shunt 2 ', and the second embodiment is different from the first embodiment in that a voltage terminal 21 ', a first sampling terminal 22 ', and a second sampling terminal 23 ' of the shunt 2 ' for being mounted on the terminal box 100 ' are different from a voltage connection terminal 31 ', a first sampling connection terminal 32 ', and a second sampling connection terminal 33 ' of the PCB lead plate 3 ', and the PCB lead plate 3 ' is perpendicular to the resistor 20 '. And in the embodiment shown in fig. 5 to 6, the current flows through the shunt 2 from right to left. Therefore, the reclamation area can be reduced, and the induction current generated by the interference of an external alternating magnetic field is further reduced. The present invention is not limited to the first embodiment and the second embodiment. In various embodiments of the present invention, the current flow direction can be changed in other directions, and the mutual positions of the corresponding voltage terminal, the first sampling terminal and the second sampling terminal can be adjusted, but still fall within the scope of the present invention.
The circuit of the first sampling terminal 32 on the PCB lead plate 3 extends to the second sampling terminal 33 by the same length as the resistor 20 between the first sampling terminal 22 and the second sampling terminal 23 on the shunt 2. The same length means approximately the same length. According to faraday's law, when a part of the conductor of the closed loop moves in a magnetic field to cut magnetic lines of force, the magnetic flux in the closed loop changes, and an induced electromotive force is generated in the closed loop, so that an induced current is generated. It can be seen that the current divider structure in the prior art does not solve the problem of induced electromotive force generated by the resistor 20 between the two sampling ends of the current divider 2 under the external alternating magnetic field interference, and the length of the extension circuit of the first sampling connection end 32 on the PCB lead plate 3 is substantially the same as the length of the resistor 20 between the first sampling end 22 and the second sampling end 23 of the corresponding current divider 2 after reaching the position of the second sampling connection end 33, thereby solving the induced electromotive force generated on the resistor 20.
The back of the first sampling connection end 32 extending circuit on the PCB lead plate 3 is closely insulated with the shunt 2. So, PCB lead plate 3 hug closely on shunt 2, can further reduce the reclamation area, reduce better and produce induced-current by external alternating magnetic field interference, and avoid taking place the short circuit between PCB lead plate 3 and shunt 2.
Preferably, the shunt 2 according to the present invention may be a manganin shunt. By the arrangement, the manganin shunt is combined with the PCB lead plate 3, so that the lead structure 1 of the shunt has the advantages of higher sampling accuracy, less temperature influence and low cost.
The invention can be used for manufacturing an electric power instrument, which comprises an electric power instrument shell, wherein a sampling device, a metering device for converting and calculating signals measured by the sampling device and a metering display device for displaying a metering result to a user are arranged in the electric power instrument shell, the sampling device comprises a terminal button box 100, the terminal button box 100 comprises a terminal button box 101 and a connecting terminal button 102 arranged on the terminal button box 101, the connecting terminal button 102 is used for being connected with an external electric power input and output line, and the connecting terminal button 102 is connected with the shunt lead structure 1. So set up, the accuracy is higher, the temperature influence is less, with low costs when the detection to user power consumption of electric power meter.
The invention provides a manufacturing method of a lead structure 1 of a shunt, which comprises a PCB lead plate 3 attached to a shunt 2, wherein the PCB lead plate 3 is provided with a voltage connecting circuit 5 corresponding to the shunt 2, a first sampling circuit Iin +321 and a second sampling circuit Iin-331, the first sampling circuit Iin +321 and the second sampling circuit Iin-331 are used for electrically connecting two sampling ends of the shunt 2, and the manufacturing method of the PCB lead plate 3 comprises the following steps:
preparing a PCB (printed Circuit Board) bottom plate, wherein the bottom plate is provided with a first layer 301 and a second layer 302 which are electrically isolated from each other:
the first layer 301 is provided with a first upper connecting sheet body 3013 and a second upper connecting sheet body 3014 which are arranged in a front-back manner, and the second layer 302 is provided with a first lower connecting sheet body 3023 and a second lower connecting sheet body 3024 which are arranged in a front-back manner;
a first perforation and a second perforation which penetrate through the first layer 301 and the second layer 302 are arranged on the bottom plate, and the second perforation is positioned beside the first perforation;
a first electrical connection post 4 is disposed in the first through hole, and the first electrical connection post 4 is electrically connected to the first upper connection sheet body 3013 and the second lower connection sheet body 3024 to form the first sampling circuit Iin + 321; a second electrical connection post 4 is disposed in the second through hole, and the second electrical connection post 4 is electrically connected to the first lower connection piece 3023 and the second upper connection piece 3014 to form a second sampling circuit Iin-331;
the first upper connecting piece 3013 and the first lower connecting piece 3023 are opposite to each other at the upper and lower positions on the bottom plate and have a crossing angle in the moving direction, and the second upper connecting piece 3014 and the second lower connecting piece 3024 are opposite to each other at the upper and lower positions on the bottom plate and have a crossing angle in the moving direction.
So set up, can effectively make PCB lead plate 3 works as PCB lead plate 3 is installed in corresponding shunt 2, can make the electric power instrument that supplies the user to detect the power consumption, electric power instrument can reduce effectively and disturb and produce induced-current by external alternating magnetic field, and to external environment strong adaptability, the degree of accuracy is higher, and the temperature influence is less, and is with low costs.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A shunt lead structure is characterized in that: comprises a shunt and a PCB lead plate,
the shunt is provided with a resistor body, surrounds the resistor body and is sequentially provided with a voltage end, a first sampling end and a second sampling end along the flowing direction of current;
the PCB lead plate is at least a double-sided metal perforated or multilayer metal perforated PCB plate, and a voltage connecting end, a first sampling connecting end and a second sampling connecting end which correspond to a voltage end of the shunt, the first sampling end and the second sampling end are arranged on the PCB lead plate;
the circuit of the first sampling connecting end on the PCB lead plate extends to the position of the second sampling connecting end along the resistor body of the shunt in parallel, and extends to the other end of the PCB lead plate with the second sampling connecting end circuit through the perforated stranded state of the cross section of the PCB lead plate to form a first sampling circuit Iin + and a second sampling circuit Iin-for sampling the shunt.
2. The splitter lead structure of claim 1, wherein: PCB lead plate cross-section porose transposition state includes, is equipped with on PCB lead plate and is last connection lamellar body group and lower connection lamellar body group of upper and lower two-layer setting, go up connection lamellar body group and include a plurality of front and back interval arrangement's last connection lamellar body, connect lamellar body group down including a plurality of lower connection lamellar bodies along last connection lamellar body arrangement direction interval arrangement, the upper and lower position is corresponding go up connection lamellar body and be intercrossing form with lower connection lamellar body, it is equipped with the link with lower connection lamellar body to go up connection lamellar body, be equipped with the electric connection post that extends from top to bottom on the PCB lead plate, thereby form respectively through electric connection post electric connection each other with lower connection lamellar body on the adjacent last connection lamellar body of arrangement direction around along first sampling circuit Iin + and second sampling circuit Iin-.
3. The splitter lead structure of claim 1, wherein: the current is converted into a corresponding voltage signal after passing through the shunt, the sampled voltage signal enters an AD metering chip after passing through a first-order RC filter circuit, and the current is calculated through conversion, so that the metering of the current is realized.
4. The splitter lead structure of claim 1, wherein: the first sampling end and the second sampling end are respectively arranged on the shunt resistor body or on the side of the shunt resistor body.
5. The splitter lead structure of claim 1, wherein: the PCB lead plate is tightly attached to the surface parallel to the shunt or is tightly attached to the surface perpendicular to the shunt.
6. The splitter lead structure of claim 1, wherein: the length of the circuit extending from the first sampling connecting end to the second sampling connecting end on the PCB lead plate is the same as the length of the resistor body between the first sampling end and the second sampling end on the shunt.
7. The splitter lead structure of claim 1, wherein: the back of the first sampling connecting end extension circuit on the PCB lead plate is closely attached to the shunt in an insulating mode.
8. The splitter lead structure of claim 1, wherein: the shunt is a manganese copper shunt.
9. An electric power meter characterized in that: the power meter comprises a power meter shell, wherein a sampling device, a metering device for converting signals measured by the sampling device into operation and a metering display device for displaying a metering result to a user are arranged in the power meter shell, the sampling device comprises a terminal box, the terminal box comprises a terminal box, and a connecting terminal is mounted on the terminal box and used for being connected with an external power input and output line, and the connecting terminal is connected with the shunt lead structure according to any one of claims 1 to 8.
10. A manufacturing method of a shunt lead structure is characterized in that: the PCB lead plate is used for being attached to and installed on a shunt, the PCB lead plate is provided with a voltage connection circuit, a first sampling circuit and a second sampling circuit which correspond to the shunt, the first sampling circuit and the second sampling circuit are used for being electrically connected with two sampling ends of the shunt, and the manufacturing method of the PCB lead plate comprises the following steps:
preparing a PCB bottom plate, wherein the bottom plate is provided with a first layer and a second layer which are electrically isolated from each other from top to bottom;
the first layer is provided with a first upper connecting sheet body and a second upper connecting sheet body which are arranged in a front-back manner, and the second layer is provided with a first lower connecting sheet body and a second lower connecting sheet body which are arranged in a front-back manner;
the bottom plate is provided with a first perforation and a second perforation which penetrate through the first layer and the second layer, and the second perforation is positioned beside the first perforation;
a first electrical connection column is arranged in the first through hole and electrically connected with the first upper connection sheet body and the second lower connection sheet body so as to form the first sampling circuit; a second electrical connection column is arranged in the second through hole and electrically connected with the first lower connection sheet body and the second upper connection sheet body to form a second sampling circuit;
the first upper connecting sheet body and the first lower connecting sheet body are arranged on the bottom plate in a manner of being opposite in upper and lower positions and forming a cross angle in a moving direction, and the second upper connecting sheet body and the second lower connecting sheet body are arranged on the bottom plate in a manner of being opposite in upper and lower positions and forming a cross angle in a moving direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127006.0A CN111190036A (en) | 2020-02-28 | 2020-02-28 | Shunt lead structure, electric power meter with shunt lead structure and manufacturing method of shunt lead structure |
| PCT/CN2020/132749 WO2021169456A1 (en) | 2020-02-28 | 2020-11-30 | Shunt lead structure, electric power instrument and method for manufacturing shunt lead structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127006.0A CN111190036A (en) | 2020-02-28 | 2020-02-28 | Shunt lead structure, electric power meter with shunt lead structure and manufacturing method of shunt lead structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111190036A true CN111190036A (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010127006.0A Pending CN111190036A (en) | 2020-02-28 | 2020-02-28 | Shunt lead structure, electric power meter with shunt lead structure and manufacturing method of shunt lead structure |
Country Status (2)
| Country | Link |
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| CN (1) | CN111190036A (en) |
| WO (1) | WO2021169456A1 (en) |
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| CN112255436A (en) * | 2020-09-30 | 2021-01-22 | 深圳市航天泰瑞捷电子有限公司 | Wiring method of manganese-copper shunt, PCB (printed circuit board), circuit board and electric energy meter |
| WO2021169456A1 (en) * | 2020-02-28 | 2021-09-02 | 浙江永泰隆电子股份有限公司 | Shunt lead structure, electric power instrument and method for manufacturing shunt lead structure |
| WO2023179181A1 (en) * | 2022-03-25 | 2023-09-28 | 桐乡市伟达电子有限公司 | Anti-magnetic field shunt, electric power meter, and manufacturing method for anti-magnetic field shunt |
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