CN111185846B

CN111185846B - Multi-size compatible wafer grinding equipment

Info

Publication number: CN111185846B
Application number: CN202010023562.3A
Authority: CN
Inventors: 陈丽娥; 徐绪友
Original assignee: 徐绪友
Current assignee: Guangxi Free Trade Zone Jianju Technology Co.,Ltd.; Guangxi Qinbao Real Estate Co., Ltd
Priority date: 2020-01-09
Filing date: 2020-01-09
Publication date: 2021-06-29
Anticipated expiration: 2040-01-09
Also published as: CN111185846A

Abstract

The invention discloses a multi-size compatible wafer grinding device, which structurally comprises a grinding processing cavity, a supporting platform and a control cabinet, wherein a lifting rod, a grinding disc and an alignment table are arranged in the grinding processing cavity, the lifting rod and the grinding disc are mechanically connected, the grinding disc is arranged at the upper end of the alignment table, two grinding discs are arranged, a signal end of the grinding processing cavity is electrically connected with a signal output end of the control cabinet, the supporting platform is horizontally fixed between the grinding processing cavity and the control cabinet, a push-out shaft, meshing lines, a sliding cover body, an object stage and a cover body sideslip mechanism are arranged in the alignment table, the invention is provided with the sliding cover body on the object stage, a cover surface on the sliding cover body completely covers and is tightly attached to one surface of the object stage for bearing a wafer, one surface of the object stage is completely isolated from the outside, the object stage has a protective effect, and moist air can be placed in the tight attachment of the two parts, ensuring that it is sufficiently dry.

Description

Multi-size compatible wafer grinding equipment

Technical Field

The invention relates to the technical field of wafer processing, in particular to a multi-size compatible wafer grinding device.

Background

The wafer is a raw material for manufacturing LED chips, and the wafer needs to be ground and polished during the manufacturing process to improve the flatness of the surface, and the wafer grinding machine is a processing machine specially used for grinding the surface of the wafer, and generally, a lifting base capable of lifting linearly and a carrying platform capable of moving horizontally are installed on a machine table, the lifting base is equipped with a rotatable grinding wheel, the wafer is placed on the carrying platform, and the grinding wheel can be pressed against the surface of the wafer and the processing of grinding can be performed through the lifting of the lifting base and the horizontal movement of the carrying platform.

The wafer grinds and takes out it from the storage box and shifts to the counterpoint bench through the conveyer, then begin grinding work through the grinding tool again, in south area, the environment is too moist, especially in the time of returning south, because of taking and putting of storage box consequently not absolute sealedly in the grinding process chamber 1 of wafer, this makes moist air enter into grinding process chamber 1 extremely easily, when the internal environment is moist, counterpoint bench surface can form the thin moisture layer of one deck, at this moment when the moisture layer of counterpoint bench directly carries out grinding work, the wafer back is moistened, be unfavorable for the post processing use, and the counterpoint bench is arranged in grinding process chamber 1's inside, moisture layer list is difficult to discover, it is also loaded down with trivial details hard to handle the moisture layer.

Disclosure of Invention

In view of the above problems, the present invention provides a multi-size compatible wafer polishing apparatus.

In order to achieve the purpose, the invention is realized by the following technical scheme: a multi-size compatible wafer grinding device comprises a grinding processing cavity, a supporting platform and a control cabinet, the grinding processing cavity is internally provided with a lifting rod, a grinding disc and an alignment table, the lifting rod and the grinding disc are mechanically connected, the grinding discs are arranged at the upper end of the aligning table, two grinding discs are arranged, the signal end of the grinding processing cavity is electrically connected with the signal output end of the control cabinet, the supporting platform is horizontally fixed between the grinding processing cavity and the control cabinet, a push-out shaft, meshing grains, a sliding cover body, an objective table and a cover body sideslip mechanism are arranged in the aligning table, the objective table is provided with the meshing grains towards one end of the push-out shaft, and the sliding cover body is covered on the upper surface of the objective table in a manner of horizontal movable fit through the cover body side sliding mechanisms arranged on two sides.

As a further improvement of the invention, a convex structure is arranged between the push-out shaft and the objective table, and sliding cover bodies are matched with two sides of the convex part of the push-out shaft.

As a further improvement of the invention, the diameter of the objective table is smaller than that of the sliding cover body, and a hollow groove matched with the sliding cover body is arranged on the outer side of the objective table.

As a further improvement of the invention, the objective table, the pushing shaft and the sliding cover body are concentric, and the objective table and the sliding cover body have the same structure.

As a further improvement of the invention, the cover body side-sliding mechanism comprises a limiting body, a pull rope, a telescopic cylinder and a mounting seat, wherein the limiting body is of a T-shaped structure, the pull rope penetrates through the position of the vertical hollow end of the limiting body, so that the pull rope cannot swing and shift during traction, one end of the pull rope is fixed on the sliding cover body, the other end of the pull rope is connected with the telescopic cylinder, and the telescopic cylinder is fixed by the mounting seat.

As a further improvement of the invention, the sliding cover body is composed of a magnetic ring, a magnetic disk and a cover surface, the magnetic ring is fixed at the position of one end of the push-out shaft on the cover surface, the magnetic ring and the magnetic disk are different in magnetism and are fixed in an adsorption manner, and the magnetic disk is arranged in the empty slot.

As a further improvement of the invention, four magnetic disks are arranged, and every two magnetic disks are arranged on the same side.

As a further improvement of the invention, the cover surface is of a pleated structure, and the cover surface is positioned at the upper part of the empty groove after being contracted to form a circular plane with the objective table.

As a further improvement of the present invention, a channel penetrating through the pulling rope is horizontally formed inside the sliding cover body, so that the pulling rope is connected to the head end of the sliding cover body, that is, the end closest to the push-out shaft.

As a further improvement of the present invention, the telescopic cylinder is in a multi-stage type, and the variation distance of the height is equal to the distance of the sliding cover body in the opening of the objective table, that is, the objective table can be opened by the sliding cover body well under the driving of the telescopic cylinder.

As a further improvement of the invention, a driving system is arranged in the pushing shaft, the driving system is mainly controlled by a driver to realize lifting, and an electric signal of the driver is electrically connected to the control cabinet by a lead.

Compared with the prior art, the invention has the beneficial effects that:

1. the object stage is provided with the sliding cover body, the cover surface of the sliding cover body completely covers the surface which is tightly attached to the object stage and bears the wafer, the surface of the object stage which bears the wafer is completely isolated from the outside, the protection effect is achieved, and the tight attachment of the two can be used for placing moist air to be mixed in, so that the sufficient drying is ensured.

2. The sliding cover body and the cover body side-slipping mechanism act together, the sliding cover body is effectively opened on the surface of the objective table through the telescopic cylinder, the pull rope and the limiting body arranged on the cover body side-slipping mechanism, the sliding cover body with the movable function meets the effective grinding work of the objective table, the protection is flexible, and manual operation is not needed.

3. According to the invention, when the cover surface is opened on the object carrying surface of the object carrying table, the cover surface is limited at the right upper end of the empty groove by utilizing the magnetic adsorption matching of the magnetic ring and the magnetic disk, the outer edge of the object carrying table is tangent to the inner edge of the cover surface, and the two are positioned on a circular horizontal plane, so that the grinding of wafers with various sizes is satisfied.

Drawings

FIG. 1 is a schematic diagram of a multi-dimension compatible wafer polishing apparatus according to the present invention.

Fig. 2 is a schematic view of a partial structure of the interior of the polishing chamber 1 according to the present invention.

Fig. 3 is a schematic view of the internal plane structure of the alignment stage according to the present invention.

FIG. 4 is an enlarged view of the side-sliding mechanism of the cover according to the present invention.

Fig. 5 is a schematic top sectional view of the sliding cover according to the present invention.

Fig. 6 is a schematic structural view of the second half of the sliding cover of the present invention after being opened.

Fig. 7 is a schematic structural view of the slide cover of the present invention after being completely opened.

In the figure: the grinding and processing device comprises a grinding and processing cavity-1, a supporting platform-2, a control cabinet-3, a lifting rod-4, a grinding disc-5, a contraposition table-6, a push-out shaft-61, meshing lines-62, a sliding cover body-63, an object stage-64, a cover body sideslip mechanism-65, a limiting body-651, a pull rope-652, a telescopic cylinder-653, a mounting seat-654, a magnetic ring-631, a magnetic disc-632 and a cover surface-633.

Detailed Description

In order to make the technical means, the original features, the achieved objects and the effects of the present invention easily understood, fig. 1 to 7 schematically show the structure of a wafer polishing apparatus according to an embodiment of the present invention, and the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

As shown in fig. 1-4, the present invention provides a multi-size compatible wafer polishing apparatus, which comprises a polishing chamber 1, a supporting platform 2, and a control cabinet 3, wherein a lifting rod 4, a polishing disk 5, and an alignment table 6 are disposed in the polishing chamber 1, the lifting rod 4 and the polishing disk 5 are mechanically connected, the polishing disk 5 is disposed at the upper end of the alignment table 6, two polishing disks 5 are disposed, a signal terminal of the polishing chamber 1 is electrically connected to a signal output terminal of the control cabinet 3, the supporting platform 2 is horizontally fixed between the polishing chamber 1 and the control cabinet 3,

the inside ejecting axle 61, meshing line 62, slip lid 63, objective table 64, lid sideslip mechanism 65 that is provided with of counterpoint platform 6, objective table 64 is equipped with meshing line 62 towards the one end in ejecting axle 61 to through this meshing line 62 with ejecting axle 61 adopt gliding mode cooperation from top to bottom, slip lid 63 covers the upper surface at objective table 64 through the horizontal clearance fit's of lid sideslip mechanism 65 mode that both sides set up, be the dogbone structure between ejecting axle 61 and the objective table 64, be equipped with slip lid 63 in the protruding both sides cooperation of ejecting axle 61, the diameter of objective table 64 is less than slip lid 63, and is equipped with the dead slot of a cooperation slip lid 63 in the outside of objective table 64, objective table 64 and ejecting axle 61, slip lid 63 are the same centre of a circle, and objective table 64 is the same with slip lid 63 structure, limited 651 body 65 constitution of lid mechanism 65, The pull rope 652, the telescopic cylinder 653 and the mounting seat 654 are arranged in a T-shaped structure, the pull rope 652 penetrates through the vertical hollow end of the T-shaped limiting body 651, so that the pull rope 652 is not shaken or deviated during traction, one end of the pull rope 652 is fixed on the sliding cover 63, the other end of the pull rope 652 is connected with the telescopic cylinder 653, the telescopic cylinder 653 is fixed by the mounting seat 654, a channel penetrating through the pull rope 652 is horizontally arranged in the sliding cover 63, so that the pull rope 652 is connected to the head end (i.e. the end closest to the push-out shaft) of the sliding cover 63, the object stage 64 is covered on the object stage 64 by the sliding cover 63 under the action of the sliding cover 63 and the cover sideslip mechanism 65, the bearing surface of the object stage 64 is completely isolated from the outside, the cover surface 633 of the sliding cover 63 is of a pleated structure, and in the opening process of the cover 65, the conical contact end 633 formed by the cover surface can further realize the cleaning of the bearing surface of the object, therefore, the object stage 64 is prevented from being affected with damp, the grinding process is sufficiently clean, and the situation that the back surface of the wafer is abraded in the wafer grinding process is avoided.

Example 2

As shown in fig. 5-7, based on the moisture-proof structure of embodiment 1, the sliding cover 63 is composed of a magnetic ring 631, a magnetic disk 632, and a cover 633, the magnetic ring 631 is fixed at the end of the push-out shaft 61, the magnetic ring 631 and the magnetic disk 632 are different in magnetic field, the magnetic disk 632 is disposed inside the empty slot, four magnetic disks 632 are disposed at the same side, the cover 633 is in a pleated structure, the cover 633 is located above the empty slot and forms a circular plane with the stage 64 after shrinking, the telescopic cylinder 653 is in a multi-stage structure, the height variation distance is equal to the distance of the sliding cover 63 opening the stage 64, that is, the sliding cover 63 can be opened the stage 64 by the driving of the telescopic cylinder 653, the push-out shaft 61 is internally provided with a driving system, the driving system is mainly controlled by a driver to achieve the lifting and lowering, the electrical signal of the driver is electrically connected to the control box 3 by a wire, and through the sliding cover 63 composed of the magnetic ring 631, the magnetic disk 632 and the cover surface 633, when the cover surface 633 is opened on the objective table 64, the cover surface 633 is limited at the upper end of the empty slot by the adsorption between the magnetic ring 631 and the magnetic disk 632, at this time, the folded cover surface 633 and the objective table 64 form a circular plane, the diameter of the plane is larger than that of the objective table 64, and the requirement of wafer grinding with various sizes is met.

The working principle of the wafer polishing apparatus in the above technical solution is explained as follows:

the grinding processing cavity 11 is opened, after a storage box loaded with small-sized wafers is placed at a designated position in the grinding processing cavity 11, the grinding processing cavity 11 is closed, the control cabinet 3 is started, moist air is easy to flow in during the opening and closing of the grinding processing cavity 11, in order to avoid the objective table 64 from being wetted during grinding processing, a sliding cover 63 is arranged on one surface carried on the objective table 64, the cover surface 633 of the sliding cover 63 is completely attached to and covered on the objective surface, the carrying surface of the objective table 64 is isolated from the outside, the objective surface is prevented from being wetted, a horizontally penetrating pull rope 652 is arranged in the cover surface 633, the pull rope 652 can realize the traction on the cover surface 633 under the action of a telescopic cylinder 653, that is, the telescopic cylinder 653 drives the pull rope 652 to horizontally slide and fold the cover surface 633 along the surface of the objective table 64, so as to realize the effective grinding of the small-sized wafers;

in the folding process of the cover surface 633, the contact surface of the cover surface is continuously formed into a conical shape, the conical shape is contacted with the object stage 64 to play a role of wiping and cleaning the object carrying surface, the object carrying surface is not required to be cleaned manually during grinding and carrying, the object stage 64 can be ensured to be clean enough, the back surface of the wafer is prevented from being accidentally abraded, then the object stage 64 is exposed, the conveyor prevents the taken-out wafer from the object stage 64, and then the grinding disc 5 is started to grind;

when the object stage 64 is opened during grinding of a large-size wafer, based on the above, the pushing shaft 61 drives the pushing shaft to push out, the cover surface 633 is opened before the object stage 64 is lifted, the cover surface 633 is limited to the upper end of the empty slot, namely, the position tangent to the outer edge of the object stage 64 by the mutual adsorption between the magnetic ring 631 and the magnetic disk 632, so that the object stage 64 is lifted to form a circular plane with the cover surface 633, and the object stage 64 formed by the circular plane is mainly used for grinding of the large-size wafer, therefore, the object stage 64 has the characteristics of moisture resistance and improvement of the grinding precision of the wafer during grinding of wafers with various sizes.

In the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims

1. A multi-size compatible wafer polishing apparatus, comprising: the structure of the grinding machine comprises a grinding processing cavity (1), a supporting platform (2) and a control cabinet (3), wherein a lifting rod (4), a grinding disc (5) and an alignment table (6) are arranged in the grinding processing cavity (1), the lifting rod (4) and the grinding disc (5) are mechanically connected, the grinding disc (5) is arranged at the upper end of the alignment table (6), the grinding disc (5) is provided with two grinding discs, the signal end of the grinding processing cavity (1) is electrically connected with the signal output end of the control cabinet (3), the supporting platform (2) is horizontally fixed between the grinding processing cavity (1) and the control cabinet (3), a push-out shaft (61), meshing grains (62), a sliding cover body (63), an object stage (64) and a cover body side-sliding mechanism (65) are arranged inside the alignment table (6), and the object stage (64) is provided with meshing grains (62) towards one end of the push-out shaft (61), the sliding cover body (63) covers the upper surface of an objective table (64) in a manner of horizontal movable fit through cover body side-sliding mechanisms (65) arranged on two sides, a convex structure is arranged between the sliding cover body (61) and the objective table (64), the sliding cover body (63) is matched on two convex sides of the pushing shaft (61), the diameter of the objective table (64) is smaller than that of the sliding cover body (63), a hollow groove matched with the sliding cover body (63) is arranged on the outer side of the objective table (64), the objective table (64) is concentric with the pushing shaft (61) and the sliding cover body (63), the objective table (64) is identical with the sliding cover body (63), and the side-sliding mechanisms (65) form a limit body (651), a pull rope (652), a telescopic cylinder (653) and a mounting seat (654), spacing body (651) are T font structure, and it has stay cord (652) to run through in the position of its vertical cavity end, the one end of stay cord (652) is fixed on slip lid (63), and the other end is connected with telescopic cylinder (653), telescopic cylinder (653) are fixed with mount pad (654), slip lid (63) comprise magnetic ring (631), disc (632), capping (633) are located the rigidity that pushes out axle (61) one end has magnetic ring (631), magnetic ring (631) and disc (632) each other are different magnetism, and both adsorb fixedly, inside the dead slot was located in disc (632), disc (632) were equipped with four, per two homonymy settings, capping (633) are hectare formula structure, and capping (633) shrink back is located dead slot upper portion and objective table (64) and forms a circular plane.

2. The apparatus of claim 1, wherein: firstly, after a grinding processing cavity (1) is opened, a storage box loaded with small-sized wafers is placed at a designated position in the grinding processing cavity (1), the grinding processing cavity (1) is closed, a control cabinet (3) is started, moist air is easy to flow in during the opening and closing of the grinding processing cavity (1), in order to prevent a carrier table (64) from being affected with damp during grinding processing, a sliding cover body (63) is arranged on one surface of the carrier table (64), a cover surface (633) of the sliding cover body (63) is completely attached and covered on the carrier surface, the bearing surface of the carrier table (64) is isolated from the outside, the carrier surface is prevented from being affected with damp, a horizontally penetrating pull rope (652) is arranged in the cover surface (633), the pull rope (652) can realize the traction of the cover surface (633) under the action of a telescopic cylinder (653), namely, the telescopic cylinder (653) drives the pull rope (652) to horizontally slide and fold the cover surface (633) along the surface of the carrier table (64), thereby realizing the effective grinding of the small-size wafer; secondly, in the folding process of the cover surface (633), the contact surface of the cover surface (633) continuously forms a conical shape, the conical shape is contacted with the objective table (64) to play a role of wiping and cleaning the objective surface, the objective table (64) can be ensured to be clean enough without manual cleaning during grinding the objective, the back surface of the wafer is prevented from being accidentally worn, then the objective table (64) is exposed outside, the conveyor prevents the taken-out wafer on the objective table (64), then the grinding disc (5) is started for grinding, and when the large-size wafer is ground, based on the above, when the objective table (64) is opened, the push-out shaft (61) drives the push-out shaft to push out, before the objective table (64) rises, the cover surface (633) is opened, and the cover surface (633) is limited at the upper end of the empty groove, namely at the position tangent to the outer edge of the objective table (64), the object stage (64) is lifted to form a circular plane with the cover surface (633), and the object stage (64) formed by the plane is mainly used for grinding large-size wafers, so that the moisture-proof and wafer grinding precision improving device has the characteristics of moisture resistance and improvement on the wafer grinding precision during grinding of wafers with various sizes.