CN111185846A - Multi-size compatible wafer grinding equipment - Google Patents
Multi-size compatible wafer grinding equipment Download PDFInfo
- Publication number
- CN111185846A CN111185846A CN202010023562.3A CN202010023562A CN111185846A CN 111185846 A CN111185846 A CN 111185846A CN 202010023562 A CN202010023562 A CN 202010023562A CN 111185846 A CN111185846 A CN 111185846A
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- China
- Prior art keywords
- grinding
- cover body
- objective table
- sliding cover
- push
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a multi-size compatible wafer grinding device, which structurally comprises a grinding processing cavity, a supporting platform and a control cabinet, wherein a lifting rod, a grinding disc and an alignment table are arranged in the grinding processing cavity, the lifting rod and the grinding disc are mechanically connected, the grinding disc is arranged at the upper end of the alignment table, two grinding discs are arranged, a signal end of the grinding processing cavity is electrically connected with a signal output end of the control cabinet, the supporting platform is horizontally fixed between the grinding processing cavity and the control cabinet, a push-out shaft, meshing lines, a sliding cover body, an object stage and a cover body sideslip mechanism are arranged in the alignment table, the invention is provided with the sliding cover body on the object stage, a cover surface on the sliding cover body completely covers and is tightly attached to one surface of the object stage for bearing a wafer, one surface of the object stage is completely isolated from the outside, the object stage has a protective effect, and moist air can be placed in the tight attachment of the two parts, ensuring that it is sufficiently dry.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a multi-size compatible wafer grinding device.
Background
The wafer is a raw material for manufacturing LED chips, and the wafer needs to be ground and polished during the manufacturing process to improve the flatness of the surface, and the wafer grinding machine is a processing machine specially used for grinding the surface of the wafer, and generally, a lifting base capable of lifting linearly and a carrying platform capable of moving horizontally are installed on a machine table, the lifting base is equipped with a rotatable grinding wheel, the wafer is placed on the carrying platform, and the grinding wheel can be pressed against the surface of the wafer and the processing of grinding can be performed through the lifting of the lifting base and the horizontal movement of the carrying platform.
The wafer grinds and takes out it from the storage box and shifts to the counterpoint bench through the conveyer, then begin grinding work through grinding tool again, in southern area, the environment is too moist, especially in the time of returning south, because of putting the grinding chamber of consequently wafer in the getting of storage box and not absolute seal, this makes moist air enter into the grinding intracavity very easily, when internal environment wet, counterpoint bench surface can form the thin moisture layer of one deck, at this moment when the moisture layer of counterpoint bench directly carries out grinding work, the wafer back is moistened, be unfavorable for the post processing use, and the inside of grinding chamber is arranged in to the counterpoint bench, moisture layer list is difficult to discover, it is also loaded down with trivial details hard to handle the moisture layer.
Disclosure of Invention
In view of the above problems, the present invention provides a multi-size compatible wafer polishing apparatus.
In order to achieve the purpose, the invention is realized by the following technical scheme: a multi-size compatible wafer grinding device comprises a grinding processing cavity, a supporting platform and a control cabinet, the grinding processing cavity is internally provided with a lifting rod, a grinding disc and an alignment table, the lifting rod and the grinding disc are mechanically connected, the grinding discs are arranged at the upper end of the aligning table, two grinding discs are arranged, the signal end of the grinding processing cavity is electrically connected with the signal output end of the control cabinet, the supporting platform is horizontally fixed between the grinding processing cavity and the control cabinet, a push-out shaft, meshing grains, a sliding cover body, an objective table and a cover body sideslip mechanism are arranged in the aligning table, the objective table is provided with the meshing grains towards one end of the push-out shaft, and the sliding cover body is covered on the upper surface of the objective table in a manner of horizontal movable fit through the cover body side sliding mechanisms arranged on two sides.
As a further improvement of the invention, a convex structure is arranged between the push-out shaft and the objective table, and sliding cover bodies are matched with two sides of the convex part of the push-out shaft.
As a further improvement of the invention, the diameter of the objective table is smaller than that of the sliding cover body, and a hollow groove matched with the sliding cover body is arranged on the outer side of the objective table.
As a further improvement of the invention, the objective table, the pushing shaft and the sliding cover body are concentric, and the objective table and the sliding cover body have the same structure.
As a further improvement of the invention, the cover body side-sliding mechanism comprises a limiting body, a pull rope, a telescopic cylinder and a mounting seat, wherein the limiting body is of a T-shaped structure, the pull rope penetrates through the position of the vertical hollow end of the limiting body, so that the pull rope cannot swing and shift during traction, one end of the pull rope is fixed on the sliding cover body, the other end of the pull rope is connected with the telescopic cylinder, and the telescopic cylinder is fixed by the mounting seat.
As a further improvement of the invention, the sliding cover body is composed of a magnetic ring, a magnetic disk and a cover surface, the magnetic ring is fixed at the position of one end of the push-out shaft on the cover surface, the magnetic ring and the magnetic disk are different in magnetism and are fixed in an adsorption manner, and the magnetic disk is arranged in the empty slot.
As a further improvement of the invention, four magnetic disks are arranged, and every two magnetic disks are arranged on the same side.
As a further improvement of the invention, the cover surface is of a pleated structure, and the cover surface is positioned at the upper part of the empty groove after being contracted to form a circular plane with the objective table.
As a further improvement of the present invention, a channel penetrating through the pulling rope is horizontally formed inside the sliding cover body, so that the pulling rope is connected to the head end of the sliding cover body, that is, the end closest to the push-out shaft.
As a further improvement of the present invention, the telescopic cylinder is in a multi-stage type, and the variation distance of the height is equal to the distance of the sliding cover body in the opening of the objective table, that is, the objective table can be opened by the sliding cover body well under the driving of the telescopic cylinder.
As a further improvement of the invention, a driving system is arranged in the pushing shaft, the driving system is mainly controlled by a driver to realize lifting, and an electric signal of the driver is electrically connected to the control cabinet by a lead.
Compared with the prior art, the invention has the beneficial effects that:
1. the object stage is provided with the sliding cover body, the cover surface of the sliding cover body completely covers the surface which is tightly attached to the object stage and bears the wafer, the surface of the object stage which bears the wafer is completely isolated from the outside, the protection effect is achieved, and the tight attachment of the two can be used for placing moist air to be mixed in, so that the sufficient drying is ensured.
2. The sliding cover body and the cover body side-slipping mechanism act together, the sliding cover body is effectively opened on the surface of the objective table through the telescopic cylinder, the pull rope and the limiting body arranged on the cover body side-slipping mechanism, the sliding cover body with the movable function meets the effective grinding work of the objective table, the protection is flexible, and manual operation is not needed.
3. According to the invention, when the cover surface is opened on the object carrying surface of the object carrying table, the cover surface is limited at the right upper end of the empty groove by utilizing the magnetic adsorption matching of the magnetic ring and the magnetic disk, the outer edge of the object carrying table is tangent to the inner edge of the cover surface, and the two are positioned on a circular horizontal plane, so that the grinding of wafers with various sizes is satisfied.
Drawings
FIG. 1 is a schematic diagram of a multi-dimension compatible wafer polishing apparatus according to the present invention.
FIG. 2 is a schematic view of a partial structure inside a polishing chamber according to the present invention.
Fig. 3 is a schematic view of the internal plane structure of the alignment stage according to the present invention.
FIG. 4 is an enlarged view of the side-sliding mechanism of the cover according to the present invention.
Fig. 5 is a schematic top sectional view of the sliding cover according to the present invention.
Fig. 6 is a schematic structural view of the second half of the sliding cover of the present invention after being opened.
Fig. 7 is a schematic structural view of the slide cover of the present invention after being completely opened.
In the figure: the grinding and processing device comprises a grinding and processing cavity-1, a supporting platform-2, a control cabinet-3, a lifting rod-4, a grinding disc-5, a contraposition table-6, a push-out shaft-61, meshing lines-62, a sliding cover body-63, an object stage-64, a cover body sideslip mechanism-65, a limiting body-651, a pull rope-652, a telescopic cylinder-653, a mounting seat-654, a magnetic ring-631, a magnetic disc-632 and a cover surface-633.
Detailed Description
In order to make the technical means, the original features, the achieved objects and the effects of the present invention easily understood, fig. 1 to 7 schematically show the structure of a wafer polishing apparatus according to an embodiment of the present invention, and the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-4, the present invention provides a multi-size compatible wafer polishing apparatus, which structurally includes a polishing processing cavity 1, a supporting platform 2, and a control cabinet 3, wherein the polishing processing cavity 1 is provided with a lifting rod 4, a polishing disk 5, and an alignment stage 6, the lifting rod 4 and the polishing disk 5 are mechanically connected, the polishing disk 5 is provided at the upper end of the alignment stage 6, two polishing disks 5 are provided, a signal end of the polishing processing cavity 1 is electrically connected to a signal output end of the control cabinet 3, the supporting platform 2 is horizontally fixed between the polishing processing cavity 1 and the control cabinet 3, the alignment stage 6 is internally provided with a push-out shaft 61, a meshing 62, a sliding cover 63, a stage 64, and a cover sideslip mechanism 65, one end of the stage 64 facing the push-out shaft 61 is provided with a meshing 62, and is matched with the push-out shaft 61 in a vertical sliding manner through the meshing 62, the sliding cover 63 covers the upper surface of the objective table 64 in a horizontally movable fit manner through cover side-sliding mechanisms 65 arranged on two sides, the push-out shaft 61 and the objective table 64 are in a convex structure, the sliding cover 63 is fitted on two sides of the push-out shaft 61, the diameter of the objective table 64 is smaller than that of the sliding cover 63, a hollow groove matched with the sliding cover 63 is arranged on the outer side of the objective table 64, the push-out shaft 61 and the sliding cover 63 are concentric, the objective table 64 and the sliding cover 63 have the same structure, the cover side-sliding mechanisms 65 form a limiting body 651, a pull rope 652, a telescopic cylinder 653 and a mounting seat 654, the limiting body 651 is in a T-shaped structure, a pull rope 652 penetrates through the vertical hollow end of the limiting body, so that the pull rope 652 cannot swing and shift during traction, one end of the pull rope 652 is fixed on the sliding cover 63, and the other end of the pull rope 652 is connected with the telescopic cylinder, telescopic cylinder 653 is fixed with mount pad 654, the passageway that runs through in stay cord 652 is seted up to the inside level of slip lid 63, make stay cord 652 connect in the head end of slip lid 63 (that is closest to in the one end of pushing away the axle), objective table 64 is under the effect of slip lid 63 and lid sideslip mechanism 65, slip lid 63 covers on objective table 64, with objective table 64's bearing surface and external isolated completely, and this slip lid 63's capping 633 is the pleating structure, open the in-process at cooperation lid sideslip mechanism 65, the toper contact jaw that capping 633 formed can further realize the cleaning work to objective table 64 bearing surface, with this, both avoided objective table 64 to wet enough clean in guaranteeing to grind simultaneously, the back has the condition of wearing and tearing to take place in avoiding the wafer grinding.
Example 2
As shown in fig. 5-7, based on the moisture-proof structure of embodiment 1, the sliding cover 63 is composed of a magnetic ring 631, a magnetic disk 632, and a cover 633, the magnetic ring 631 is fixed at the end of the push-out shaft 61, the magnetic ring 631 and the magnetic disk 632 are different in magnetic field, the magnetic disk 632 is disposed inside the empty slot, four magnetic disks 632 are disposed at the same side, the cover 633 is in a pleated structure, the cover 633 is located above the empty slot and forms a circular plane with the stage 64 after shrinking, the telescopic cylinder 653 is in a multi-stage structure, the height variation distance is equal to the distance of the sliding cover 63 opening the stage 64, that is, the sliding cover 63 can be opened the stage 64 by the driving of the telescopic cylinder 653, the push-out shaft 61 is internally provided with a driving system, the driving system is mainly controlled by a driver to achieve the lifting and lowering, the electrical signal of the driver is electrically connected to the control box 3 by a wire, and through the sliding cover 63 composed of the magnetic ring 631, the magnetic disk 632 and the cover surface 633, when the cover surface 633 is opened on the objective table 64, the cover surface 633 is limited at the upper end of the empty slot by the adsorption between the magnetic ring 631 and the magnetic disk 632, at this time, the folded cover surface 633 and the objective table 64 form a circular plane, the diameter of the plane is larger than that of the objective table 64, and the requirement of wafer grinding with various sizes is met.
The working principle of the wafer polishing apparatus in the above technical solution is explained as follows:
the grinding cavity 1 is opened, after a wafer storage box loaded with small-sized wafers is placed at a designated position in the grinding cavity 1, the grinding cavity 1 is closed, the control cabinet 3 is started, moist air is easy to flow in the grinding cavity 1 during opening and closing, in order to avoid the objective table 64 from being wetted during grinding, a sliding cover 63 is arranged on one surface of the objective table 64, the cover surface 633 of the sliding cover 63 is completely attached to and covered on the objective table, the bearing surface of the objective table 64 is isolated from the outside, the objective table is prevented from being wetted, a horizontally penetrating pull rope 652 is arranged in the cover surface 633, the pull rope 652 can realize traction on the cover surface 633 under the action of a telescopic cylinder 653, namely, the telescopic cylinder 653 drives the pull rope 652 to horizontally slide and fold the cover surface 633 along the surface of the objective table 64, and thus the small-sized wafers are effectively ground;
in the folding process of the cover surface 633, the contact surface of the cover surface is continuously formed into a conical shape, the conical shape is contacted with the object stage 64 to play a role of wiping and cleaning the object carrying surface, the object carrying surface is not required to be cleaned manually during grinding and carrying, the object stage 64 can be ensured to be clean enough, the back surface of the wafer is prevented from being accidentally abraded, then the object stage 64 is exposed, the conveyor prevents the taken-out wafer from the object stage 64, and then the grinding disc 5 is started to grind;
when the object stage 64 is opened during grinding of a large-size wafer, based on the above, the pushing shaft 61 drives the pushing shaft to push out, the cover surface 633 is opened before the object stage 64 ascends, the cover surface 633 is limited to the upper end of the empty slot, namely, the position tangent to the outer edge of the object stage 64 by the mutual adsorption between the magnetic ring 631 and the magnetic disk 632, so that the object stage 64 ascends to form a circular plane with the cover surface 63, and the object stage 64 formed by the circular plane is mainly used for grinding of the large-size wafer.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "length," "width," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "side," and the like, as used herein, are used in an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Claims (8)
1. A multi-size compatible wafer polishing apparatus, comprising: the structure of the grinding machine comprises a grinding processing cavity (1), a supporting platform (2) and a control cabinet (3), wherein a lifting rod (4), a grinding disc (5) and an alignment table (6) are arranged in the grinding processing cavity (1), the lifting rod (4) and the grinding disc (5) are mechanically connected, the grinding disc (5) is arranged at the upper end of the alignment table (6), the number of the grinding disc (5) is two, a signal end of the grinding processing cavity (1) is electrically connected with a signal output end of the control cabinet (3), and the supporting platform (2) is horizontally fixed between the grinding processing cavity (1) and the control cabinet (3);
counterpoint platform (6) inside is provided with and pushes away axle (61), meshing line (62), slip lid (63), objective table (64), lid sideslip mechanism (65), objective table (64) are equipped with meshing line (62) towards the one end in pushing away axle (61) to through this meshing line (62) with push away axle (61) adoption gliding mode cooperation from top to bottom, lid sideslip mechanism (65) horizontal clearance fit's that slip lid (63) set up through both sides mode cover is at the upper surface of objective table (64).
2. The apparatus of claim 1, wherein: the push-out shaft (61) and the objective table (64) are in a convex structure, and sliding cover bodies (63) are matched with the two convex sides of the push-out shaft (61).
3. A multi-size compatible wafer polishing apparatus according to claim 1 or 2, wherein: the diameter of the objective table (64) is smaller than that of the sliding cover body (63), and a hollow groove matched with the sliding cover body (63) is formed in the outer side of the objective table (64).
4. The apparatus of claim 1, wherein: the objective table (64) is concentric with the push-out shaft (61) and the sliding cover body (63), and the objective table (64) and the sliding cover body (63) are identical in structure.
5. The apparatus of claim 1, wherein: the cover body side-sliding mechanism (65) comprises a limiting body (651), a pull rope (652), a telescopic cylinder (653) and a mounting seat (654), wherein the limiting body (651) is of a T-shaped structure, the pull rope (652) penetrates through the position of the vertical hollow end of the limiting body, one end of the pull rope (652) is fixed on the sliding cover body (63), the other end of the pull rope (652) is connected with the telescopic cylinder (653), and the telescopic cylinder (653) is fixed by the mounting seat (654).
6. A multi-size compatible wafer polishing apparatus according to claim 1, 2 or 5, wherein: the sliding cover body (63) is composed of a magnetic ring (631), a magnetic disk (632) and a cover surface (633), the cover surface (633) is located at one end of the push-out shaft (61) and is fixedly provided with the magnetic ring (631), the magnetic ring (631) and the magnetic disk (632) are different in magnetism and are fixedly adsorbed, and the magnetic disk (632) is arranged inside the empty groove.
7. The apparatus of claim 6, wherein: the number of the magnetic disks (632) is four, and every two magnetic disks are arranged on the same side.
8. The apparatus of claim 6, wherein: the cover surface (633) is of a pleated structure, and the cover surface (633) is positioned on the upper part of the empty groove after being contracted to form a circular plane with the object stage (64).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010023562.3A CN111185846B (en) | 2020-01-09 | 2020-01-09 | Multi-size compatible wafer grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010023562.3A CN111185846B (en) | 2020-01-09 | 2020-01-09 | Multi-size compatible wafer grinding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111185846A true CN111185846A (en) | 2020-05-22 |
| CN111185846B CN111185846B (en) | 2021-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010023562.3A Active CN111185846B (en) | 2020-01-09 | 2020-01-09 | Multi-size compatible wafer grinding equipment |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199049A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Bernoulli wafer bearing table capable of containing wafers with different sizes in compatible mode |
| CN203077070U (en) * | 2012-12-27 | 2013-07-24 | 浙江水晶光电科技股份有限公司 | Wafer grinding miller |
| CN203266384U (en) * | 2013-05-31 | 2013-11-06 | 鉅仑科技股份有限公司 | Wafer grinding machine |
| CN205568230U (en) * | 2016-03-16 | 2016-09-14 | 苏州市绿中缘纺织科技有限公司 | Adjustable mesa size workstation |
| CN206732787U (en) * | 2017-05-05 | 2017-12-12 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
| CN207071860U (en) * | 2017-06-13 | 2018-03-06 | 浙江非攻机械有限公司 | A kind of dust guard of Mold polishing machine |
| CN108857862A (en) * | 2018-06-12 | 2018-11-23 | 合肥沃智信息科技有限公司 | A kind of semiconductor silicon wafer milled processed system |
| CN109848826A (en) * | 2019-03-04 | 2019-06-07 | 天通日进精密技术有限公司 | Wafer multistation edge polishing equipment |
| CN209000866U (en) * | 2018-09-12 | 2019-06-18 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN110201754A (en) * | 2019-07-09 | 2019-09-06 | 安吉县宇宏粘土化工有限公司 | A kind of grinder |
| DE102019204555A1 (en) * | 2018-04-05 | 2019-10-10 | Disco Corporation | Method for polishing a SiC substrate |
| JP2019202398A (en) * | 2018-05-24 | 2019-11-28 | 株式会社東京精密 | Cmp device |
| CN110625519A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江润美机械科技有限公司 | High-precision wafer grinding machine |
-
2020
- 2020-01-09 CN CN202010023562.3A patent/CN111185846B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199049A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Bernoulli wafer bearing table capable of containing wafers with different sizes in compatible mode |
| CN203077070U (en) * | 2012-12-27 | 2013-07-24 | 浙江水晶光电科技股份有限公司 | Wafer grinding miller |
| CN203266384U (en) * | 2013-05-31 | 2013-11-06 | 鉅仑科技股份有限公司 | Wafer grinding machine |
| CN205568230U (en) * | 2016-03-16 | 2016-09-14 | 苏州市绿中缘纺织科技有限公司 | Adjustable mesa size workstation |
| CN206732787U (en) * | 2017-05-05 | 2017-12-12 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
| CN207071860U (en) * | 2017-06-13 | 2018-03-06 | 浙江非攻机械有限公司 | A kind of dust guard of Mold polishing machine |
| DE102019204555A1 (en) * | 2018-04-05 | 2019-10-10 | Disco Corporation | Method for polishing a SiC substrate |
| JP2019202398A (en) * | 2018-05-24 | 2019-11-28 | 株式会社東京精密 | Cmp device |
| CN108857862A (en) * | 2018-06-12 | 2018-11-23 | 合肥沃智信息科技有限公司 | A kind of semiconductor silicon wafer milled processed system |
| CN209000866U (en) * | 2018-09-12 | 2019-06-18 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN109848826A (en) * | 2019-03-04 | 2019-06-07 | 天通日进精密技术有限公司 | Wafer multistation edge polishing equipment |
| CN110201754A (en) * | 2019-07-09 | 2019-09-06 | 安吉县宇宏粘土化工有限公司 | A kind of grinder |
| CN110625519A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江润美机械科技有限公司 | High-precision wafer grinding machine |
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|---|---|
| CN111185846B (en) | 2021-06-29 |
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Address after: 510405 1901, No.9 Huihai street, Baiyun District, Guangzhou City, Guangdong Province Applicant after: Xu Xuyou Address before: 201807 600 Huiwang Road, Jiading District, Shanghai Applicant before: Xu Xuyou |
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Inventor after: Chen Lie Inventor after: Xu Xuyou Inventor before: Xu Xuyou |
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Effective date of registration: 20211222 Address after: 535008 room A107, public service center, No. 1, Zhongma street, Zhongma Qinzhou Industrial Park, Qinzhou port area, China (Guangxi) pilot Free Trade Zone, Qinzhou City, Guangxi Zhuang Autonomous Region Patentee after: Guangxi Free Trade Zone Jianju Technology Co.,Ltd. Patentee after: Guangxi Qinbao Real Estate Co., Ltd Address before: 510405 1901, No.9 Huihai street, Baiyun District, Guangzhou City, Guangdong Province Patentee before: Xu Xuyou |
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