CN111185681A - Intelligent industrial laser cutting optimization system and intelligent laser cutting optimization method - Google Patents
Intelligent industrial laser cutting optimization system and intelligent laser cutting optimization method Download PDFInfo
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- CN111185681A CN111185681A CN202010146389.6A CN202010146389A CN111185681A CN 111185681 A CN111185681 A CN 111185681A CN 202010146389 A CN202010146389 A CN 202010146389A CN 111185681 A CN111185681 A CN 111185681A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The system comprises a laser cutting head assembly, a reflected light wave detection module, a cutting parameter storage module, a parameter calling module and a control module, can intelligently and optimally control and improve a perforating process by detecting sensing light, comprises an information process related to cutting, and can be used for detecting and optimizing a perforating stage. The intelligent perforation detection optimization system provides feedback for the cutting machine controller, so that breakthrough perforation efficiency is realized, and the stable process of perforation at each time is ensured.
Description
Technical Field
The invention particularly relates to the technical field of laser cutting, and particularly relates to an industrial laser intelligent cutting optimization system and a laser intelligent cutting optimization method.
Background
Industrial laser cutting systems typically use separate operations for perforating and cutting with a fixed combination of parameters at each given material and thickness. Typically, the perforation procedure is usually programmed to a fixed residence time, but this can result in a loss of device efficiency and puncture quality, especially for thick sample wells. The conventional laser cutting process is divided into several different stages. Perforation is the first stage, creating an approximate cut front through the metal sheet, forming the starting point for each cut. Depending on the material and material thickness, complex pulse shapes and power ramps may be a prerequisite to achieve short piercing times and reduced spattering and bulging on the workpiece surface. Also, depending on the temperature, surface roughness and material quality the perforation times may vary greatly for the same perforation procedure. For industrial processes, the mean residence time increases by a certain safety factor (typically up to 3 times), which is obviously not necessary for most perforations, but it is crucial to ensure a stable process for each perforation.
The reflected light of the perforation process is generally considered to be a nuisance, but it contains information about the cutting process and can be used to detect an optimized perforation phase.
Disclosure of Invention
In order to solve the technical defects in the prior art, the invention provides an industrial laser intelligent cutting optimization system and a laser intelligent cutting optimization method.
The technical solution adopted by the invention is as follows: an industrial laser intelligent cutting optimization system comprises a laser cutting head assembly, and is characterized by also comprising a reflected light wave detection module, a cutting parameter storage module, a parameter calling module and a control module,
the reflected light wave detection module: receiving light waves of reflected light in the laser perforation process, converting the light waves into heat signals, and finally converting the heat signals into voltage signals to be fed back to the parameter calling module;
a cutting parameter storage module: storing different parameter data of different materials passing through various process tests in a process program section mode, and correspondingly calling the parameter data according to signals fed back by the reflected light wave detection module in the perforation process;
a parameter calling module: receiving a voltage signal of light wave conversion of reflected light in the laser perforation process transmitted by the reflected light wave detection module, calling a technical program section parameter matched with the cutting parameter storage module, and transmitting the technical program section parameter data to the control module;
a control module: and receiving the technological program segment parameters transmitted by the parameter calling module, and controlling the laser cutting head assembly to perform perforation cutting according to the technological program segment parameters.
The reflected light wave detection module comprises a plurality of groups of photoelectric sensors, and the photoelectric sensors are arranged in the laser cutting head assembly.
Several groups of the photoelectric sensors comprise 1000-1100nm photoelectric sensors and 440-500nm photoelectric sensors.
The 1000-1100nm photoelectric sensor detects the intensity of laser reflected light, and the detected relative intensity is less than 40.
The 440-500nm photoelectric sensor detects the laser-induced plasma light intensity, and the relative detection intensity is less than 30.
The 440-500nm photoelectric sensor detects the intensity of thermal infrared light in the perforated area of the plate, and the relative detection intensity is less than 50.
The parameters of the technical program section in the parameter calling module comprise power, air pressure, frequency, pulse width time, focus and perforation time.
A laser intelligent cutting optimization method comprises the following steps:
(1) different parameter data of different materials during perforation are tested through various processes and are stored in a cutting parameter storage module in the form of a process program segment;
(2) carrying out laser perforation operation on the material, wherein a reflected light wave detection module in a laser cutting head assembly receives light waves of reflected light in the laser perforation process, converts the light waves into heat signals, and finally converts the heat signals into voltage signals to be fed back to a parameter calling module;
(3) the parameter calling module calls the technological process section parameters matched with the cutting parameter storage module according to the feedback voltage signals and transmits the technological process section parameter data to the control module;
(4) and (3) controlling the laser cutting head assembly to perform perforation cutting according to the parameters of the cover process program segment through the control module, and repeating the step (2) and the subsequent operations in sequence.
The invention has the beneficial effects that: the invention provides an industrial laser intelligent cutting optimization system and a laser intelligent cutting optimization method, which comprise a laser cutting head assembly, a reflected light wave detection module, a cutting parameter storage module, a parameter calling module and a control module. The intelligent perforation detection optimization system provides feedback for the cutting machine controller, so that breakthrough perforation efficiency is realized, and the stable process of perforation at each time is ensured.
Drawings
FIG. 1 is a schematic diagram of the industrial laser intelligent cutting optimization system.
FIG. 2 is a flowchart of the laser intelligent cutting optimization method of the present invention.
Detailed Description
The invention will be further explained with reference to fig. 1 and 2, and an industrial laser intelligent cutting optimization system comprises a laser cutting head assembly, a reflected light wave detection module, a cutting parameter storage module, a parameter calling module and a control module,
the reflected light wave detection module: receiving light waves of reflected light in the laser perforation process, converting the light waves into heat signals, and finally converting the heat signals into voltage signals to be fed back to the parameter calling module;
a cutting parameter storage module: storing different parameter data of different materials passing through various process tests in a process program section mode, and correspondingly calling the parameter data according to signals fed back by the reflected light wave detection module in the perforation process;
a parameter calling module: receiving a voltage signal of light wave conversion of reflected light in the laser perforation process transmitted by the reflected light wave detection module, calling a technical program section parameter matched with the cutting parameter storage module, and transmitting the technical program section parameter data to the control module;
a control module: and receiving the technological program segment parameters transmitted by the parameter calling module, and controlling the laser cutting head assembly to perform perforation cutting according to the technological program segment parameters.
The reflected light of the perforation process contains information about the cutting process and can be used to detect an optimized perforation stage. The intelligent perforation detection optimization system provides feedback to the cutting machine controller, and achieves breakthrough perforation efficiency. This allows the controller to move to the cutting stage with minimal dwell time necessary. In general, the intelligent optimization system for perforation detection is based on the interior of a cutting head and is controlled by a special optical system.
The perforation of a metal sheet with a fiber laser and a gas-assisted cutting head is similar to the laser drilling process. Initially, the focused beam will be absorbed by the top surface of the sheeting, causing a local temperature increase which can lead to melting and potential evaporation, depending on the beam intensity. The coaxial gas injection pressure and vapor pressure of the vaporized metal create blind holes with molten metal droplets being ejected upward and outward. The drilling process continues as the laser beam passes through the entire thickness of the plate. Although the through-hole is a blind hole (i.e., not yet fully through the thickness of the plate), the laser level increases because all of the beam strikes the metal plate and is reflected upward. This is in contrast to a steady state cut, in which an angled cutting front will cause a large portion of the unused beam to exit the sheet from the back.
The reflected light wave detection module comprises a plurality of groups of photoelectric sensors, and the photoelectric sensors are arranged in the laser cutting head assembly.
Several groups of the photoelectric sensors comprise 1000-1100nm photoelectric sensors and 440-500nm photoelectric sensors.
The 1000-1100nm photoelectric sensor detects the intensity of laser reflected light, and the detected relative intensity is less than 40. (Note: the sensor display range: 0-100)
The 440-500nm photoelectric sensor detects the laser-induced plasma light intensity, and the relative detection intensity is less than 30. (Note: the sensor display range: 0-100)
The 440-500nm photoelectric sensor detects the intensity of thermal infrared light in the perforated area of the plate, and the relative detection intensity is less than 50. (Note: the sensor display range: 0-100)
The parameters of the technical program section in the parameter calling module comprise power, air pressure, frequency, pulse width time, focus and perforation time.
A laser intelligent cutting optimization method comprises the following steps:
(1) different parameter data of different materials during perforation are tested through various processes and are stored in a cutting parameter storage module in the form of a process program segment;
(2) carrying out laser perforation operation on the material, wherein a reflected light wave detection module in a laser cutting head assembly receives light waves of reflected light in the laser perforation process, converts the light waves into heat signals, and finally converts the heat signals into voltage signals to be fed back to a parameter calling module;
(3) the parameter calling module calls the technological process section parameters matched with the cutting parameter storage module according to the feedback voltage signals and transmits the technological process section parameter data to the control module;
(4) and (3) controlling the laser cutting head assembly to perform perforation cutting according to the parameters of the cover process program segment through the control module, and repeating the step (2) and the subsequent operations in sequence.
Cutting head technical parameters
The laser intelligent cutting optimization method of the invention intelligently optimizes and controls the improved perforation process by detecting the sensing light, contains the information process related to cutting and can be used for detecting and optimizing the perforation stage. The intelligent perforation detection optimization system provides feedback for the cutting machine controller, so that breakthrough perforation efficiency is realized, and the stable process of perforation at each time is ensured.
The skilled person should understand that: although the invention has been described in terms of the above specific embodiments, the inventive concept is not limited thereto and any modification applying the inventive concept is intended to be included within the scope of the patent claims.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. An industrial laser intelligent cutting optimization system comprises a laser cutting head assembly, and is characterized by also comprising a reflected light wave detection module, a cutting parameter storage module, a parameter calling module and a control module,
the reflected light wave detection module: receiving light waves of reflected light in the laser perforation process, converting the light waves into heat signals, and finally converting the heat signals into voltage signals to be fed back to the parameter calling module;
a cutting parameter storage module: storing different parameter data of different materials passing through various process tests in a process program section mode, and correspondingly calling the parameter data according to signals fed back by the reflected light wave detection module in the perforation process;
a parameter calling module: receiving a voltage signal of light wave conversion of reflected light in the laser perforation process transmitted by the reflected light wave detection module, calling a technical program section parameter matched with the cutting parameter storage module, and transmitting the technical program section parameter data to the control module;
a control module: and receiving the technological program segment parameters transmitted by the parameter calling module, and controlling the laser cutting head assembly to perform perforation cutting according to the technological program segment parameters.
2. An industrial laser intelligent cutting optimization system as claimed in claim 1, wherein said reflected light wave detection module includes a plurality of sets of photoelectric sensors, said photoelectric sensors being disposed in the laser cutting head assembly.
3. The system as claimed in claim 2, wherein the plurality of sets of photo sensors include 1000-1100nm photo sensors and 440-500nm photo sensors.
4. The system as claimed in claim 3, wherein the 1000-1100nm photoelectric sensor detects the intensity of the reflected laser light, and the relative intensity of the detected light is less than 40.
5. The system as claimed in claim 3, wherein the 440-500nm photo sensor detects the intensity of laser-induced plasma light, and the detected relative intensity is less than 30.
6. The system as claimed in claim 3, wherein the 440-nm 500nm photoelectric sensor detects the intensity of the thermal infrared light in the perforated area of the plate, and the detected relative intensity is less than 50.
7. The system as claimed in claim 5, wherein the process segment parameters in the parameter calling module include power, air pressure, frequency, pulse width time, focus and perforation time.
8. A laser intelligent cutting optimization method using the industrial laser intelligent cutting optimization system of claim 1, characterized by comprising the following steps:
(1) different parameter data of different materials during perforation are tested through various processes and are stored in a cutting parameter storage module in the form of a process program segment;
(2) carrying out laser perforation operation on the material, wherein a reflected light wave detection module in a laser cutting head assembly receives light waves of reflected light in the laser perforation process, converts the light waves into heat signals, and finally converts the heat signals into voltage signals to be fed back to a parameter calling module;
(3) the parameter calling module calls the technological process section parameters matched with the cutting parameter storage module according to the feedback voltage signals and transmits the technological process section parameter data to the control module;
(4) and (3) controlling the laser cutting head assembly to perform perforation cutting according to the parameters of the cover process program segment through the control module, and repeating the step (2) and the subsequent operations in sequence.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113649702A (en) * | 2021-09-07 | 2021-11-16 | 徐州金琳光电材料产业研究院有限公司 | Device and method for testing action time of laser ablation metal material |
| CN114112311A (en) * | 2021-11-17 | 2022-03-01 | 深圳市大族数控科技股份有限公司 | Debugging method and device of laser processing equipment and storage medium |
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- 2020-03-05 CN CN202010146389.6A patent/CN111185681A/en active Pending
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Cited By (2)
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| CN113649702A (en) * | 2021-09-07 | 2021-11-16 | 徐州金琳光电材料产业研究院有限公司 | Device and method for testing action time of laser ablation metal material |
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