CN111182769A - Temperature compensation heat dissipation device for electronic instrument - Google Patents
Temperature compensation heat dissipation device for electronic instrument Download PDFInfo
- Publication number
- CN111182769A CN111182769A CN202010042924.3A CN202010042924A CN111182769A CN 111182769 A CN111182769 A CN 111182769A CN 202010042924 A CN202010042924 A CN 202010042924A CN 111182769 A CN111182769 A CN 111182769A
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- China
- Prior art keywords
- heat
- heat dissipation
- flow guide
- temperature
- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the technical field of temperature compensation, and particularly relates to a temperature compensation heat dissipation device for an electronic instrument, which comprises a heat absorption plate, an adhesive layer and heat dissipation fin strips, wherein the adhesive layer is arranged on the left side wall of the heat absorption plate, the heat dissipation fin strips are uniformly distributed on the right side wall of the heat absorption plate, flow guide pipes are inserted into the heat dissipation fin strips, the flow guide pipes in the heat dissipation fin strips are mutually connected in series to form flow guide heat collection pipes, the heat absorption plate is adhered to the electronic instrument needing temperature compensation through the adhesive layer, heat is strongly adsorbed and transmitted to the heat absorption plate, and heat can be rapidly absorbed by water in a water cooling mode; the heat of the radiating fin strips and the water in the radiating and collecting chamber is taken away in an air cooling radiating mode through the radiating fan, so that the effect of quick radiation can be achieved; through the arrangement of the buffer guide plate, the wind can be guided, and the wind is concentrated to the position of the heat dissipation and collecting chamber, so that the heat on the heat dissipation and collecting chamber is dissipated quickly.
Description
Technical Field
The invention relates to the technical field of temperature compensation, in particular to a temperature compensation heat dissipation device for an electronic instrument.
Background
Electronic components generally have a certain temperature coefficient, and output signals of the electronic components drift along with temperature changes, which is called "temperature drift", and in order to reduce the temperature drift, some compensation measures are adopted to offset or reduce the temperature drift of the output of the electronic components to a certain extent, which is called temperature compensation.
The sensor (english name: transducer/sensor) is a detection device, which can sense the measured information and convert the sensed information into electric signals or other information in required form according to a certain rule to output, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.
In actual work, because the working environment temperature of the sensor changes greatly, and because the heat output caused by the temperature change is large, a large measurement error can be caused; at the same time, the temperature change also affects the magnitude of the zero point and the sensitivity value, which in turn affects the static characteristics of the sensor, so measures must be taken to reduce or eliminate the effect of the temperature change, i.e. temperature compensation must be performed.
The temperature compensation is usually carried out by cooling the electronic instrument, the existing cooling mode is not thorough enough for the electronic instrument, the temperature loss is slow, and the effect of the temperature compensation is not obvious.
Disclosure of Invention
The invention aims to provide a temperature compensation heat dissipation device for an electronic instrument, which aims to solve the problems that the conventional cooling mode is not thorough enough for the electronic instrument, the temperature loss is slow and the temperature compensation effect is not obvious in the background technology in which the temperature compensation is usually carried out by cooling the electronic instrument.
In order to achieve the purpose, the invention provides the following technical scheme: a temperature compensation heat dissipation device for an electronic instrument comprises a heat absorption plate, an adhesive layer and heat dissipation fin strips, wherein the adhesive layer is arranged on the left side wall of the heat absorption plate, the heat dissipation fin strips are uniformly distributed on the right side wall of the heat absorption plate, a flow guide pipe is inserted in the heat dissipation fin strips, the flow guide pipes in the heat dissipation fin strips are connected in series with each other to form a flow guide heat collection pipe, a heat dissipation flow collection chamber is arranged on the right side of the flow guide heat collection pipe and comprises an outer frame, a dispersion chamber is arranged in the outer frame, a liquid inlet interface and a liquid outlet interface are respectively arranged at the upper end and the lower end of the outer frame, the liquid inlet interface and the liquid outlet interface are communicated with the inner cavity of the dispersion chamber, the liquid inlet interface and the liquid outlet interface are both connected to the pipeline of the flow guide heat collection pipe, a suction pump is, the mounting bracket is provided with a heat radiation fan, the air outlet position of the heat radiation fan faces the heat radiation fin strip, and the upper side and the lower side of the flow guide heat collection pipe are both provided with buffer guide plates.
Preferably, the adhesive layer is a heat-conducting adhesive layer.
Preferably, the inner wall of the heat dissipation fin strip is uniformly provided with a convex block, and the convex block is supported on the outer wall of the flow guide pipe.
Preferably, the heat absorbing plate and the heat radiating fin strips are integrally cast and formed by aluminum alloy.
Preferably, the dispersing chamber is uniformly provided with ventilating grooves, and the position inside the dispersing chamber and in the ventilating grooves is closed.
Preferably, the dispersion chamber comprises two layers of aluminum alloy side plates, and the edges of the two layers of aluminum alloy side plates and the positions of the ventilation grooves are sealed by welding.
Preferably, the diversion heat collecting pipe is a copper diversion heat collecting pipe.
Preferably, the buffering guide plate comprises a guide plate, one end of the guide plate is connected with the outer wall of the flow guide heat collecting tube through a pin shaft, the other end of the guide plate is connected with the outer wall of the flow guide heat collecting tube through a supporting spring, and the guide plate of the buffering guide plate is arranged on two sides and is close to one end of the heat dissipation and collection chamber.
Compared with the prior art, the invention has the beneficial effects that:
1) the heat absorbing plate is bonded on an electronic instrument needing temperature compensation through the bonding layer, heat is strongly absorbed and transmitted to the heat absorbing plate, and heat can be rapidly absorbed by water in a water cooling mode;
2) the heat of the radiating fin strips and the water in the radiating and collecting chamber is taken away in an air cooling radiating mode through the radiating fan, so that the effect of quick radiation can be achieved;
3) through the arrangement of the buffer guide plate, the wind can be guided, and the wind is concentrated to the position of the heat dissipation and collecting chamber, so that the heat on the heat dissipation and collecting chamber is dissipated quickly.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a right-view structure of the heat absorbing plate of the present invention;
FIG. 3 is a schematic side view of a heat sink manifold according to the present invention;
fig. 4 is a schematic structural view of a baffle according to the present invention.
In the figure: the heat absorption device comprises a heat absorption plate 1, an adhesive layer 2, a heat dissipation fin strip 3, a flow guide pipe 4, a heat dissipation and collection chamber 5, an outer frame 51, a dispersion chamber 52, a ventilation groove 53, a liquid inlet port 54, a liquid outlet port 55, a suction pump 6, a buffer flow guide plate 7, a flow guide plate 71, a support spring 72, an installation support 8 and a heat dissipation fan 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example (b):
referring to fig. 1-4, the present invention provides a technical solution: a temperature compensation heat dissipation device for an electronic instrument comprises a heat absorption plate 1, an adhesive layer 2 and heat dissipation fin strips 3, wherein the adhesive layer 2 is arranged on the left side wall of the heat absorption plate 1, the heat dissipation fin strips 3 are uniformly distributed on the right side wall of the heat absorption plate 1, the heat absorption plate 1 is attached to the position of a heat source of the electronic instrument through the adhesive layer 2, the heat absorption plate 1 is tightly attached to the position of the heat source according to the use requirement, the thickness of the heat absorption plate 1 is set to be 0.1-0.2mm, so that the heat absorption plate 1 is moderate in hardness and not easy to rot, the heat absorption plate can be well attached to the position of the heat source of the electronic instrument, the heat transmission effect is realized, and heat generated by the heat source of the electronic instrument is absorbed onto the heat absorption plate 1;
the guide pipes 4 are inserted into the radiating fin strips 3, the guide pipes 4 in the radiating fin strips 3 are connected in series to form a guide heat collecting pipe, the heat of the heat absorbing plate 1 is transmitted to the radiating fin strips 3, the guide pipes 4 are filled with water in advance, and the flowing water exchanges heat with the radiating fin strips 3, so that the heat on the radiating fin strips 3 is transmitted into the water and is taken away along with the water;
a heat dissipation and collecting chamber 5 is arranged on the right side of the flow-guiding heat collecting tube, the heat dissipation and collecting chamber 5 comprises an outer frame 51, a dispersion chamber 52 is arranged inside the outer frame 51, a liquid inlet port 54 and a liquid outlet port 55 are respectively arranged at the upper end and the lower end of the outer frame 51, the liquid inlet port 54 and the liquid outlet port 55 are both communicated with the inner cavity of the dispersion chamber 52, the liquid inlet port 54 and the liquid outlet port 55 are both connected to the pipeline of the flow-guiding heat collecting tube, and a suction pump 6 is arranged on the;
the dispersing chamber 52 is flat, after water enters the dispersing chamber 52, the water can be uniformly distributed, so that the contact area between the water and the outside is increased, the heat dissipation can be better realized, and the water can conveniently enter and exit through the arrangement of the liquid inlet interface 54 and the liquid outlet interface 55;
the installation support 8 is connected to the flow guide heat collecting pipe, the heat radiating fan 9 is arranged on the installation support 8, the air outlet position of the heat radiating fan 9 faces the heat radiating fin strip 3, the buffer guide plates 7 are arranged on the upper side and the lower side of the flow guide heat collecting pipe, air flow is driven by the heat radiating fan 9 to blow towards the heat radiating fin strip 3 and the surface of the heat absorbing plate 1, the air cooling effect is achieved, the air impacting on the surfaces of the heat radiating fin strip 3 and the heat absorbing plate 1 reversely flows, and the air flows towards the direction of the heat radiating and collecting chamber 5 under the flow guide effect of the buffer guide plates 7, so that the air cooling effect on the heat radiating and.
Further, the adhesive layer 2 is a heat-conducting adhesive layer, so that heat can be better transmitted.
Further, the inner wall of heat dissipation fin strip 3 evenly is provided with the lug, and the lug supports on the outer wall of honeycomb duct 4, through the setting of lug for the lug hugs closely on the outer wall of honeycomb duct 4, thereby can improve the area of contact between honeycomb duct 4 and heat dissipation fin strip 3, thereby heat exchange effect that can be better.
Further, adopt the integrative casting of aluminum alloy to form between absorber plate 1 and the heat dissipation fin strip 3, adopt the integrative casting of aluminum alloy to form, aluminum alloy heat conduction effect is better, and integrated into one piece between absorber plate 1 and the heat dissipation fin strip 3 to the wholeness is better.
Furthermore, the dispersing chamber 52 is uniformly provided with ventilation grooves 53, and the position inside the dispersing chamber 52 and in the ventilation grooves 53 is closed, so that water is prevented from flowing out, and a welding mode is adopted.
Further, the dispersion chamber 52 includes two layers of aluminum alloy side plates, the edges of the two layers of aluminum alloy side plates and the positions of the ventilation grooves 53 are sealed by welding, the surfaces of the welded parts are polished smoothly, and the detection is searched, so that water leakage is avoided.
Furthermore, the diversion heat collection tube is made of copper, and the heat conduction performance of the copper diversion heat collection tube is better.
Further, buffering guide plate 7 includes guide plate 71, the one end of guide plate 71 is through the outer wall connection of round pin axle with water conservancy diversion thermal-collecting tube, the other end of guide plate 71 passes through supporting spring 72 and water conservancy diversion thermal-collecting tube's outer wall connection, the guide plate 71 of the buffering guide plate 7 of both sides is towards the one end of heat dissipation collecting chamber 5 and draws close the form, guide plate 71 is the slope form, have the position guide effect of gathering together and collecting chamber 5 to the heat dissipation to the air current, and, through supporting spring 72's setting, the effect that has the buffering, when making the air current strike guide plate 71's surface, can cushion guide plate 71, thereby reset fast.
The working principle is as follows: water is filled in the guide pipe 4 and the heat dissipation and collection chamber 5 in advance, the suction action of the suction pump 6 drives the water in the guide pipe 4 to flow, the water in the guide pipe 4 is close to the heat dissipation fin strips 3 to realize heat exchange, the heat is taken away by the water, the heat dissipation fan 9 drives the air flow to blow to the heat dissipation fin strips 3 and the outer wall of the heat absorption plate 1, the outer walls of the heat absorbing plate 1 and the radiating fins 3 are cooled by air cooling, so that the surfaces of the heat absorbing plate 1 and the radiating fins 3 are rapidly cooled, the air flow impacting the surfaces of the heat absorbing plate 1 and the radiating fins 3 reversely flows back after being impacted, the air flow blows to the heat dissipation collecting chamber 5 through the guiding function of the buffer flow guide plate 7, flows to the other side of the heat dissipation collecting chamber 5 through the ventilation slot 53, thereby realizing the function of carrying away the heat on the surface of the dispersion chamber 52, so as to lower the temperature of the surface of the dispersion chamber 52, and the temperature difference enables the heat of the water in the dispersion chamber 52 to be radiated to the surface of the dispersion chamber 52.
While there have been shown and described the fundamental principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a temperature compensation heat abstractor for electronic instrument, includes absorber plate (1), adhesive linkage (2) and heat dissipation fin strip (3), adhesive linkage (2) set up the left side wall at absorber plate (1), heat dissipation fin strip (3) evenly distributed is on the right side wall of absorber plate (1), its characterized in that: the heat dissipation device is characterized in that a flow guide pipe (4) is inserted in the heat dissipation fin strip (3), the flow guide pipe (4) in the heat dissipation fin strip (3) are connected in series with each other to form a flow guide heat collection pipe, a heat dissipation collecting chamber (5) is arranged on the right side of the flow guide heat collection pipe, the heat dissipation collecting chamber (5) comprises an outer frame (51), a dispersion chamber (52) is arranged in the outer frame (51), a liquid inlet interface (54) and a liquid outlet interface (55) are respectively arranged at the upper end and the lower end of the outer frame (51), the liquid inlet interface (54) and the liquid outlet interface (55) are both communicated with the inner cavity of the dispersion chamber (52), the liquid inlet interface (54) and the liquid outlet interface (55) are both connected to the pipeline of the flow guide heat collection pipe, a suction pump (6) is arranged on the pipeline of the flow guide heat collection pipe, an installation support, the air outlet position of the heat radiation fan (9) faces the heat radiation fin strip (3), and the upper side and the lower side of the flow guide heat collection pipe are both provided with buffer guide plates (7).
2. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: the bonding layer (2) is a heat-conducting bonding glue layer.
3. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: the inner wall of the heat dissipation fin strip (3) is uniformly provided with convex blocks, and the convex blocks are supported on the outer wall of the flow guide pipe (4).
4. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: the heat absorbing plate (1) and the heat radiating fin strips (3) are integrally cast and formed by aluminum alloy.
5. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: the dispersing chamber (52) is uniformly provided with ventilating grooves (53), and the position inside the dispersing chamber (52) and located in the ventilating grooves (53) is closed.
6. The temperature-compensated heat sink for electronic instruments according to claim 5, wherein: the dispersion chamber (52) comprises two layers of aluminum alloy side plates, and the edges of the two layers of aluminum alloy side plates and the positions of the ventilation grooves (53) are sealed by welding.
7. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: the diversion heat collecting pipe is made of copper.
8. The temperature-compensated heat sink for electronic instruments according to claim 1, wherein: buffer guide plate (7) include guide plate (71), the one end of guide plate (71) is through the outer wall connection of round pin axle with water conservancy diversion thermal-collecting tube, the other end of guide plate (71) passes through supporting spring (72) and the outer wall connection of water conservancy diversion thermal-collecting tube, both sides guide plate (71) of buffer guide plate (7) are towards the one end of heat dissipation collecting chamber (5) and draw close the form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010042924.3A CN111182769A (en) | 2020-01-15 | 2020-01-15 | Temperature compensation heat dissipation device for electronic instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010042924.3A CN111182769A (en) | 2020-01-15 | 2020-01-15 | Temperature compensation heat dissipation device for electronic instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111182769A true CN111182769A (en) | 2020-05-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010042924.3A Pending CN111182769A (en) | 2020-01-15 | 2020-01-15 | Temperature compensation heat dissipation device for electronic instrument |
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| CN (1) | CN111182769A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110665A (en) * | 2009-12-25 | 2011-06-29 | 富士电机控股株式会社 | Fluid cooling type radiator |
| CN204741406U (en) * | 2015-06-11 | 2015-11-04 | 马菲菲 | Converter heat abstractor of dustproof function in area |
| CN206671989U (en) * | 2017-04-18 | 2017-11-24 | 重庆医药高等专科学校 | A kind of high radiating computer housing |
| CN207706627U (en) * | 2018-01-26 | 2018-08-07 | 湖南汽车工程职业学院 | A kind of radiator of Automobile networked devices |
| CN108398993A (en) * | 2018-04-28 | 2018-08-14 | 北京中科寒武纪科技有限公司 | Radiator |
| CN108712850A (en) * | 2018-06-27 | 2018-10-26 | 安徽慕凡电子科技有限公司 | A kind of radiator for instrument and meter |
| US20190053403A1 (en) * | 2016-01-19 | 2019-02-14 | Cooler Master Co., Ltd. | Liquid cooling heat sink device |
| CN208722133U (en) * | 2018-09-27 | 2019-04-09 | 深圳市科焱实业有限公司 | A kind of dust-proof water cooling cooling type computer case |
| US20190215986A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
| CN209376111U (en) * | 2018-09-27 | 2019-09-10 | 邹昊雄 | Radiator and electronic product with the radiator |
| CN209462850U (en) * | 2018-11-02 | 2019-10-01 | 杭州唯在信息科技有限公司 | A kind of internet of things data acquisition storage platform cooling device |
| CN110318867A (en) * | 2019-07-05 | 2019-10-11 | 广州威能机电有限公司 | A kind of generating set |
-
2020
- 2020-01-15 CN CN202010042924.3A patent/CN111182769A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110665A (en) * | 2009-12-25 | 2011-06-29 | 富士电机控股株式会社 | Fluid cooling type radiator |
| CN204741406U (en) * | 2015-06-11 | 2015-11-04 | 马菲菲 | Converter heat abstractor of dustproof function in area |
| US20190053403A1 (en) * | 2016-01-19 | 2019-02-14 | Cooler Master Co., Ltd. | Liquid cooling heat sink device |
| CN206671989U (en) * | 2017-04-18 | 2017-11-24 | 重庆医药高等专科学校 | A kind of high radiating computer housing |
| US20190215986A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
| CN207706627U (en) * | 2018-01-26 | 2018-08-07 | 湖南汽车工程职业学院 | A kind of radiator of Automobile networked devices |
| CN108398993A (en) * | 2018-04-28 | 2018-08-14 | 北京中科寒武纪科技有限公司 | Radiator |
| CN108712850A (en) * | 2018-06-27 | 2018-10-26 | 安徽慕凡电子科技有限公司 | A kind of radiator for instrument and meter |
| CN208722133U (en) * | 2018-09-27 | 2019-04-09 | 深圳市科焱实业有限公司 | A kind of dust-proof water cooling cooling type computer case |
| CN209376111U (en) * | 2018-09-27 | 2019-09-10 | 邹昊雄 | Radiator and electronic product with the radiator |
| CN209462850U (en) * | 2018-11-02 | 2019-10-01 | 杭州唯在信息科技有限公司 | A kind of internet of things data acquisition storage platform cooling device |
| CN110318867A (en) * | 2019-07-05 | 2019-10-11 | 广州威能机电有限公司 | A kind of generating set |
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Application publication date: 20200519 |
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| RJ01 | Rejection of invention patent application after publication |