CN111182744A - 10Z copper foil hollow FPC manufacturing method - Google Patents
10Z copper foil hollow FPC manufacturing method Download PDFInfo
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- CN111182744A CN111182744A CN202010026928.2A CN202010026928A CN111182744A CN 111182744 A CN111182744 A CN 111182744A CN 202010026928 A CN202010026928 A CN 202010026928A CN 111182744 A CN111182744 A CN 111182744A
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- copper foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a 10Z copper foil hollow FPC (flexible printed circuit), which belongs to the technical field of flexible circuit boards, and comprises the following steps: taking a copper foil base material, pretreating the copper foil base material, and manufacturing a via hole and a circuit layer; respectively pressing the two insulating glue layers on one surface of the copper foil base material layer to obtain the copper foil base material pressed with the insulating glue layers; and forming a filling hole in the insulating adhesive layer on the copper foil substrate laminated with the insulating adhesive layer, and filling a conductive material. The FPC manufacturing method has the advantages that the process is simple, compared with the manufacturing method in the prior art, the process is simplified, the production efficiency of PFC is effectively improved, the cost is reduced, the filling hole is formed in the insulating adhesive layer, and then the conductive material is filled into the filling hole, so that the electrical connection relation of each copper foil layer of the multilayer flexible circuit board is realized, the electroplating after the hole is formed in the copper foil layer is avoided, and the uniformity of the thickness of the multilayer flexible circuit board is ensured.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a method for manufacturing a 10Z copper foil hollow FPC.
Background
The FPC is a flexible printed circuit board for short, which is a flexible printed circuit board made of polyimide or polyester film as a base material and has high reliability and excellent properties. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. The flexible circuit board is a technology developed in the United states in the last 70 th century for developing the space rocket technology, and is a printed circuit board which is made of polyester film or polyimide as a base material and has high reliability and excellent flexibility. The circuit board can be bent at will, is folded, has light weight, small volume, good heat dissipation and convenient installation, and breaks through the traditional interconnection technology. In the structure of the flexible circuit board, the constituent materials are an insulating film, a conductor, and an adhesive.
The existing manufacturing method of the multilayer flexible circuit board generally comprises the following steps: manufacturing an FCCL inner layer plate, drilling holes on the inner layer plate and manufacturing a circuit layer; then symmetrically pressing insulating glue layers on two sides of the inner layer plate; then pressing a copper foil layer on the insulating adhesive layer; and drilling a hole in the copper foil layer, opening the hole until the insulating glue layer, and finally electroplating the hole to conduct each layer of copper foil layer. The inventor finds the following defects when manufacturing the multilayer flexible circuit board: the plated via hole may be cracked and cracked due to over-thin copper plating or uneven copper thickness of the via hole.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a 10Z copper foil hollowed-out FPC manufacturing method which is simple in process, and compared with the manufacturing method in the prior art, the process is simplified, the production efficiency of PFC is effectively improved, the cost is reduced, the filling hole is formed in the insulating adhesive layer, and then the conductive material is filled into the filling hole, so that the electrical connection relation of each copper foil layer of the multilayer flexible circuit board is realized, electroplating after the hole is formed in the copper foil layer is avoided, and the uniformity of the thickness of the multilayer flexible circuit board is ensured.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A manufacturing method of a 10Z copper foil hollow FPC comprises the following steps:
s1, taking a copper foil base material, pretreating the copper foil base material, and manufacturing a via hole and a circuit layer;
s2, pressing the two insulation glue layers on one surface of the copper foil base material layer respectively to obtain the copper foil base material pressed with the insulation glue layers;
and S3, forming a filling hole in the insulating adhesive layer on the copper foil substrate laminated with the insulating adhesive layer, and filling a conductive material into the filling hole to obtain a semi-finished product A.
S4, pressing copper foil layers on the upper surface and the lower surface of the semi-finished product A respectively to obtain a semi-finished product B;
s5, drilling, copper deposition, board electroplating, circuit manufacturing, pattern electroplating and alkaline etching are carried out on the semi-finished product B to obtain a semi-finished product C;
s6, baking the semi-finished product C, and covering solder resist ink on the baked semi-finished product C to obtain a semi-finished product D;
and S7, sequentially carrying out character, gold immersion, shape cutting and cutting on the semi-finished product D, and finally carrying out functional detection to obtain a finished product after the detection is qualified.
Further, in S1, the step of pretreating the copper foil base material includes removing oxides, grease and impurities from the metal surface of the copper foil base material.
Further, in S1, the copper foil base material is a double-sided flexible copper foil base material.
Further, in S1, the step of fabricating the via hole includes: the method comprises the steps of forming a through hole in a copper foil base material, attaching a shielding film to the whole outer surface of the copper foil base material, wherein the shielding film is used for preventing the copper foil base material from being electroplated or etched, opening a window of the shielding film corresponding to the through hole to obtain a base material to be electroplated, then immersing the base material to be electroplated into electroplating solution for a preset time, completing electroplating of the through hole in the base material to be electroplated, and obtaining a through hole.
Further, the specific way of forming the via hole is as follows: and forming via holes on the copper foil base material in a laser drilling mode.
Further, in S3, the conductive material is solder paste or copper paste.
Further, in S4, the thickness of the copper foil layer is 1OZ, the copper foil used in the copper foil layer is an electrolytic copper foil produced by adding an additive, and the additive includes solute components: cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the concentration of each component is 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol.
Further, the preparation method of the additive comprises the following steps: taking cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the mass ratio of the cellulose to the titanium sulfate to the sodium tungstate to the polypropylene glycol is (10-20): 2-5: 6-10: 15-20 parts of;
dissolving cellulose, titanium sulfate, sodium tungstate and polypropylene glycol in water at 40-60 ℃ to ensure that the following solutes have the concentration ranges: 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol, and stirring to fully dissolve solutes of the components to obtain the additive.
Further, in the step S6, the temperature is ensured to be 75 ℃ in the baking process, and the baking time is 20 min.
Further, in S7, the cutting process specifically includes an inspection process and a laser cutting process;
wherein the inspection process comprises: performing a predetermined inspection on the cut semi-finished product D, thereby inspecting whether the cut semi-finished product D is a good product without abnormality or a defective product with abnormality;
the outer shape cutting step includes: the connecting portion determined as a good product in the inspection step is cut using a laser, but the connecting portion determined as a defective product in the inspection step is not cut and kept in a connected state.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the FPC manufacturing method has the advantages of simple process, simplified flow compared with the manufacturing method in the prior art, effectively improved PFC production efficiency and reduced cost.
(2) According to the FPC manufacturing method, the filling hole is formed in the insulating adhesive layer, and then the conductive material is filled into the filling hole, so that the electric connection relation of the copper foil layers of the multilayer flexible circuit board is realized, electroplating after the copper foil layers are opened is avoided, and the uniformity of the thickness of the multilayer flexible circuit board is guaranteed.
(3) The copper foil used in the copper foil layer is an electrolytic copper foil produced by adding the additive, wherein the additive can effectively reduce the rough surface roughness of the electrolytic copper foil, increase the crystal density of crystal grains and effectively improve the tensile strength and the peel strength of the copper foil through unique components and proportions.
(4) According to the FPC manufacturing method, the cutting process is added, the cutting process specifically comprises the inspection process and the laser cutting process, the workload of stripping defective products can be reduced, and the defective products can be reliably discarded.
Drawings
FIG. 1 is a flow chart of the FPC manufacturing method of the present invention.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, a method for manufacturing a 10Z copper foil hollow FPC includes the following steps:
s1, taking a copper foil base material, pretreating the copper foil base material, and manufacturing a via hole and a circuit layer;
the copper foil base material is a double-sided flexible copper foil base material, and the step of pretreating the copper foil base material comprises the step of removing oxides, grease and impurities on the metal surface of the copper foil base material.
The specific steps for manufacturing the via hole are as follows: forming a through hole on a copper foil substrate, attaching a shielding film to the whole outer surface of the copper foil substrate, wherein the shielding film is used for preventing the copper foil substrate from being electroplated or etched, windowing the shielding film corresponding to the through hole to obtain a substrate to be electroplated, then immersing the substrate to be electroplated into electroplating solution for a preset time to complete electroplating of the through hole on the substrate to be electroplated, and obtaining a through hole; the specific mode of forming the via hole is as follows: and forming via holes on the copper foil base material in a laser drilling mode.
S2, pressing the two insulation glue layers on one surface of the copper foil base material layer respectively to obtain the copper foil base material pressed with the insulation glue layers;
s3, forming a filling hole in the insulating adhesive layer on the copper foil substrate laminated with the insulating adhesive layer, and filling a conductive material into the filling hole to obtain a semi-finished product A; wherein the conductive material is solder paste or copper paste.
S4, pressing copper foil layers on the upper surface and the lower surface of the semi-finished product A respectively to obtain a semi-finished product B;
the thickness of the copper foil layer is 1OZ, the copper foil used by the copper foil layer is an electrolytic copper foil produced by adding additives, and the additives comprise solute components: cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the concentration of each component is 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol.
The preparation method of the additive comprises the following steps: taking cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the mass ratio of the cellulose to the titanium sulfate to the sodium tungstate to the polypropylene glycol is (10-20): 2-5: 6-10: 15-20 parts of;
dissolving cellulose, titanium sulfate, sodium tungstate and polypropylene glycol in water at 40-60 ℃ to ensure that the following solutes have the concentration ranges: 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol, and stirring to fully dissolve solutes of the components to obtain the additive.
S5, drilling, copper deposition, board electroplating, circuit manufacturing, pattern electroplating and alkaline etching are carried out on the semi-finished product B to obtain a semi-finished product C;
s6, baking the semi-finished product C, and covering solder resist ink on the baked semi-finished product C to obtain a semi-finished product D; wherein the temperature is kept at 75 ℃ in the baking process, and the baking time is 20 min.
S7, sequentially carrying out character, gold immersion, shape cutting and finally functional detection on the semi-finished product D, and obtaining a finished product after the detection is qualified; the cutting process specifically comprises an inspection process and a laser cutting process;
wherein the inspection process comprises: performing a predetermined inspection on the cut semi-finished product D, thereby inspecting whether the cut semi-finished product D is a good product without abnormality or a defective product with abnormality;
the outer shape cutting step includes: the connecting portion determined as a good product in the inspection step is cut using a laser, but the connecting portion determined as a defective product in the inspection step is not cut and kept in a connected state.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (10)
1. A manufacturing method of a 10Z copper foil hollow FPC is characterized by comprising the following steps: the method comprises the following steps:
s1, taking a copper foil base material, pretreating the copper foil base material, and manufacturing a via hole and a circuit layer;
s2, pressing the two insulation glue layers on one surface of the copper foil base material layer respectively to obtain the copper foil base material pressed with the insulation glue layers;
and S3, forming a filling hole in the insulating adhesive layer on the copper foil substrate laminated with the insulating adhesive layer, and filling a conductive material into the filling hole to obtain a semi-finished product A.
S4, pressing copper foil layers on the upper surface and the lower surface of the semi-finished product A respectively to obtain a semi-finished product B;
s5, drilling, copper deposition, board electroplating, circuit manufacturing, pattern electroplating and alkaline etching are carried out on the semi-finished product B to obtain a semi-finished product C;
s6, baking the semi-finished product C, and covering solder resist ink on the baked semi-finished product C to obtain a semi-finished product D;
and S7, sequentially carrying out character, gold immersion, shape cutting and cutting on the semi-finished product D, and finally carrying out functional detection to obtain a finished product after the detection is qualified.
2. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in S1, the step of pretreating the copper foil base material includes removing oxides, grease, and impurities from the metal surface of the copper foil base material.
3. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in S1, the copper foil substrate is a double-sided flexible copper foil substrate.
4. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in S1, the specific steps of making the via hole include: the method comprises the steps of forming a through hole in a copper foil base material, attaching a shielding film to the whole outer surface of the copper foil base material, wherein the shielding film is used for preventing the copper foil base material from being electroplated or etched, opening a window of the shielding film corresponding to the through hole to obtain a base material to be electroplated, then immersing the base material to be electroplated into electroplating solution for a preset time, completing electroplating of the through hole in the base material to be electroplated, and obtaining a through hole.
5. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 4, wherein the manufacturing method comprises the following steps: the specific mode of forming the via hole is as follows: and forming via holes on the copper foil base material in a laser drilling mode.
6. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in S3, the conductive material is solder paste or copper paste.
7. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in the step S4, the thickness of the copper foil layer is 1OZ, the copper foil used by the copper foil layer is an electrolytic copper foil produced by adding additives, and the additives comprise solute components: cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the concentration of each component is 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol.
8. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 7, wherein the manufacturing method comprises the following steps: the preparation method of the additive comprises the following steps: taking cellulose, titanium sulfate, sodium tungstate and polypropylene glycol, wherein the mass ratio of the cellulose to the titanium sulfate to the sodium tungstate to the polypropylene glycol is (10-20): 2-5: 6-10: 15-20 parts of;
dissolving cellulose, titanium sulfate, sodium tungstate and polypropylene glycol in water at 40-60 ℃ to ensure that the following solutes have the concentration ranges: 15-20mg/L of cellulose, 2-5mg/L of titanium sulfate, 6-10mg/L of sodium tungstate and 15-20mg/L of polypropylene glycol, and stirring to fully dissolve solutes of the components to obtain the additive.
9. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in the step S6, the temperature is ensured to be 75 ℃ in the baking process, and the baking time is 20 min.
10. The manufacturing method of the 10Z copper foil hollowed-out FPC as claimed in claim 1, wherein the manufacturing method comprises the following steps: in S7, the cutting process specifically includes an inspection step and a laser cutting step;
wherein the inspection process comprises: performing a predetermined inspection on the cut semi-finished product D, thereby inspecting whether the cut semi-finished product D is a good product without abnormality or a defective product with abnormality;
the outer shape cutting step includes: the connecting portion determined as a good product in the inspection step is cut using a laser, but the connecting portion determined as a defective product in the inspection step is not cut and kept in a connected state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010026928.2A CN111182744A (en) | 2020-01-10 | 2020-01-10 | 10Z copper foil hollow FPC manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010026928.2A CN111182744A (en) | 2020-01-10 | 2020-01-10 | 10Z copper foil hollow FPC manufacturing method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070025091A1 (en) * | 2005-07-29 | 2007-02-01 | Victor Company Of Japan, Ltd. A Corporation Of Japan | Printed wiring board and production method therefor |
| CN103866354A (en) * | 2014-03-07 | 2014-06-18 | 东莞华威铜箔科技有限公司 | Electrolytic copper foil additive for flexible printed circuit board as well as preparation method and application thereof |
| CN105792544A (en) * | 2015-12-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Manufacturing method of multi-layer flexible circuit board, multi-layer flexible circuit board and mobile terminal |
| CN108738378A (en) * | 2017-02-15 | 2018-11-02 | 日本梅克特隆株式会社 | The manufacturing method of flexible printed circuit board and the manufacture system of flexible printed circuit board |
-
2020
- 2020-01-10 CN CN202010026928.2A patent/CN111182744A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070025091A1 (en) * | 2005-07-29 | 2007-02-01 | Victor Company Of Japan, Ltd. A Corporation Of Japan | Printed wiring board and production method therefor |
| CN103866354A (en) * | 2014-03-07 | 2014-06-18 | 东莞华威铜箔科技有限公司 | Electrolytic copper foil additive for flexible printed circuit board as well as preparation method and application thereof |
| CN105792544A (en) * | 2015-12-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Manufacturing method of multi-layer flexible circuit board, multi-layer flexible circuit board and mobile terminal |
| CN108738378A (en) * | 2017-02-15 | 2018-11-02 | 日本梅克特隆株式会社 | The manufacturing method of flexible printed circuit board and the manufacture system of flexible printed circuit board |
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Application publication date: 20200519 |
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