CN111176405A - Server cooling system and heating system - Google Patents
Server cooling system and heating system Download PDFInfo
- Publication number
- CN111176405A CN111176405A CN201911362239.2A CN201911362239A CN111176405A CN 111176405 A CN111176405 A CN 111176405A CN 201911362239 A CN201911362239 A CN 201911362239A CN 111176405 A CN111176405 A CN 111176405A
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- heat dissipation
- water
- pipeline
- water outlet
- water inlet
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D15/00—Other domestic- or space-heating systems
Abstract
The invention discloses a server cooling system and a heating system, wherein the cooling system comprises: the heat dissipation device comprises a water inlet pipe, a water distributor pipeline, a water collector pipeline, a water outlet pipe and one or more board card module heat dissipation units; wherein, integrated circuit board module radiating element includes: the heat dissipation plates are arranged between every two adjacent board cards and are respectively attached to two surfaces of each heat dissipation plate; the heat dissipation plate is provided with a water inlet and a water outlet; the water inlet pipe is connected with a water distributor pipeline, and the water distributor pipeline is connected with the water inlets of the heat dissipation plates; the water outlet of each heat dissipation plate is connected with a water collector pipeline, and the water collector pipeline is connected with the water outlet. The heat dissipation system can effectively take away heat generated by the operation of the high-computing-capacity server and convert the heat into heat required by heating.
Description
Technical Field
The invention belongs to the technical field of energy recycling and particularly relates to a server heat dissipation system and a heating system.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
Conventional heating equipment usually uses energy sources such as electricity, coal, gas and the like, converts the energy sources into heat energy, uses water as a heat carrier, transfers the heat generated by a heating body to heating terminal equipment, uses the water as the heat carrier, and has low cost, safety and reliability.
At present, a large number of applications of a CPU \ GPU chip, an ASIC chip, a board card industry, a large-calculation server, a 5G data exchange device, a 4G radio frequency terminal device, a 5G radio frequency terminal device and a virtual currency service device are adopted, a large number of chips and board cards work in a centralized mode, the working time of the used high-speed chip can generate a large amount of heat, and in order to guarantee the normal work of the chip, the chip must be cooled.
To the knowledge of the inventor, the existing heat dissipation methods usually use air cooling or water cooling. The air cooling is to use a high-air-volume cooling fan to accelerate the flow of air and further take away heat, and the fan consumes more electric energy in the working process and generates high-decibel noise to cause the rise of the ambient temperature of a room in which the fan is arranged; the water cooling usually adopts a small-hole water cooling plate, the water cooling plate comprises a water inlet, a water outlet and an internal snake-shaped pipeline, water enters the pipeline through the water inlet and reaches the water outlet repeatedly, the water flow resistance is large, the heat dissipation efficiency is low, in addition, heat is directly released to the environment where the equipment is located, the waste of heat is caused, and the temperature of the environment of the room where the equipment is located is also increased. In order to reduce the ambient temperature as a whole, a large-sized air conditioner compressor and other equipment are reused to perform cooling for 2 times, so that the operation cost is increased and the energy consumption is increased.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a server heat dissipation system and a heating system. The heat dissipation system can effectively take away heat generated by the operation of the high-computing-capacity server and convert the heat into heat required by heating.
In order to achieve the above object, one or more embodiments of the present invention provide the following technical solutions:
a server heat dissipation system, comprising: the heat dissipation device comprises a water inlet pipe, a water distributor pipeline, a water collector pipeline, a water outlet pipe and one or more board card module heat dissipation units; wherein, integrated circuit board module radiating element includes: the heat dissipation plates are arranged between every two adjacent board cards and are respectively attached to two surfaces of each heat dissipation plate; the heat dissipation plate is provided with a water inlet and a water outlet; the water inlet pipe is connected with a water distributor pipeline, and the water distributor pipeline is connected with the water inlets of the heat dissipation plates; the water outlet of each heat dissipation plate is connected with a water collector pipeline, and the water collector pipeline is connected with the water outlet.
Furthermore, the heat dissipation system further comprises a layered cabinet body, and each layer of the cabinet body is used for distributing a plurality of board card module heat dissipation units.
Furthermore, the directions of the water inlets and the water outlets of the heat dissipation plates are consistent; every two layers of the cabinet body are respectively provided with a water distributor pipeline and a water collector pipeline which are used for radiating heat by the upper and lower layers of heat radiating plates.
Furthermore, a plurality of adjacent heat dissipation plates are used as a group, the water inlet of one heat dissipation plate is connected with the water distribution pipeline, the water outlet of the other heat dissipation plate is connected with the water inlet of the adjacent heat dissipation plate in the group, and the water outlet of the last heat dissipation plate is connected with the water collection pipeline.
Furthermore, one end of the heat dissipation plate is blocked, and the other end of the heat dissipation plate is provided with a water inlet and a water outlet; the pipeline in the heating panel includes: the water inlet pipeline comprises a plurality of branch water inlet pipelines, a plurality of branch water outlet pipelines and a plurality of connecting pipelines, wherein one end of each branch water inlet pipeline is communicated with the water inlet, and one end of each branch water outlet pipeline is communicated with the water outlet; wherein, the branch water inlet pipelines and the branch water outlet pipelines are parallel to each other, and the distances among the pipelines are equal.
Furthermore, the aperture sizes of the branch water inlet pipelines and the branch water outlet pipelines are the same.
Further, the size of the pipeline aperture is the maximum size which ensures the strength of the pipeline wall.
One or more embodiments provide a heating system coupled to the server cooling system.
Further, the heat dissipation power of the server heat dissipation system is determined according to the power of heating equipment required by a site.
Furthermore, the heating system also comprises a control terminal which is connected with a chip in the server heat dissipation system.
The above one or more technical solutions have the following beneficial effects:
in the server heat dissipation system provided by the invention, the heat dissipation plate is attached to each chip, so that heat generated in the operation process can be effectively taken away.
The heat dissipation system takes the heat dissipation module consisting of the plurality of board cards and the heat dissipation plates as the heat dissipation unit, adopts the cabinet body as the main frame, and arranges the heat dissipation unit on the cabinet body, so that the heat dissipation system has small overall volume and strong mobility, and is convenient for replacing places.
According to the invention, a plurality of adjacent heat dissipation plates are taken as a group, only one water inlet in the heat dissipation plates is connected with the water distribution pipeline, and only one water outlet in the heat dissipation plates is connected with the water collection pipeline, so that the complexity of pipeline connection between the heat dissipation plates and the water distribution and collection pipelines is reduced, workers can connect a group of heat dissipation plates first and then connect the heat dissipation plates to the water distribution and collection pipelines, and the working efficiency is improved.
The heat dissipation plate is internally provided with the plurality of parallel branch water inlet pipelines and the plurality of branch water outlet pipelines which are uniformly distributed in the heat dissipation plate, so that the flow of water flow from the water flow inlet to the water flow outlet is short, the water flow can be quickly distributed in the whole heat dissipation plate, the heat dissipation efficiency is high, the whole heat dissipation effect is better, the traditional fan can be replaced, the noise is reduced, and the energy consumption is reduced.
And the branch water inlet pipeline and the branch water outlet pipelines have the largest pore diameter and the largest number, namely the pipelines with the large pore diameter and the dense distribution are adopted, so that the water flow resistance in the heat dissipation plate is small, the heat dissipation is fast, the material is saved, and the manufacturing cost is reduced. And because the resistance of rivers is little, can use the mobility to be poor antifreeze liquid also can realize fine radiating effect, can adapt to northern ultralow temperature outdoor environment better.
The heating system provided by the invention is suitable for heating demands of various sites, pollution-free and emission-free sites, low-noise heating sites, electric coal-replacing heating sites, and sites needing heating such as individuals, families, schools, hospitals, swimming pools, Chinese herbal medicines, food factories, office buildings, residential buildings, stations, airports and the like.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic structural diagram of a server cooling system according to an embodiment of the present invention.
Fig. 2 is a schematic view illustrating a connection of a heat dissipation plate in a board card module according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a water flow passage in the heat dissipation plate according to the embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a heat dissipating plate according to an embodiment of the present invention;
fig. 5 is a schematic view illustrating a connection between a heat dissipation plate and a board card according to an embodiment of the present invention;
wherein, 1, a water inlet; 2. a water outlet; 3. a branch water inlet pipeline; 4. a branch water outlet pipeline; 5. a communicating pipeline; 6. a board card; 7. and (3) a chip.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
Example one
The embodiment discloses a server heat dissipation system, as shown in fig. 1, the heat dissipation system includes a layered cabinet, a water inlet pipe, a water distributor pipeline, a water collector pipeline, and a water outlet pipe. Each layer of the cabinet body is provided with a plurality of board card module heat dissipation units. The water inlet pipe and the water outlet pipe are positioned at one side of the cabinet body, the water inlet pipe is connected with a water distributor pipeline, and the water distributor pipeline is connected with the water inlets of the heat dissipation plates through hoses; the water outlets of the heat dissipation plates are connected with the water collector pipeline through hoses.
As shown in fig. 2, the heat dissipation unit of the board card module includes: each board card module comprises a plurality of board cards, and each board card is provided with a chip; and a heat dissipation plate is arranged between each two adjacent board cards and is respectively attached to two surfaces of the heat dissipation plate, and the position of the heat dissipation plate corresponds to the position of the chip on the board card.
As shown in fig. 3, one end of the heat dissipation plate is blocked, and the other end is provided with a water inlet and a water outlet; the pipeline in the heating panel includes: the water inlet pipe is communicated with the water inlet pipe, the water outlet pipe is communicated with the water outlet pipe, and the water outlet pipe is communicated with the water outlet pipe; wherein, the plurality of branch water inlet pipelines and the plurality of branch water outlet pipelines are parallel to each other.
The plurality of branch water inlet pipelines and the plurality of branch water outlet pipelines are uniformly distributed in the heat dissipation plate, namely, the distances between the plurality of branch water inlet pipelines and the plurality of branch water outlet pipelines are equal. Fig. 4 is a cross-sectional view of the heat dissipating plate, which is a honeycomb-shaped pipe having a large pore diameter and a dense distribution of pores.
And the pipeline aperture size of a plurality of branch inlet pipes and a plurality of branch outlet pipes is the same, and the distance between each pipeline is equal, uses the size of the heat radiation plate and the pipeline wall strength as constraint conditions, and has the aperture as large as possible and the number as large as possible.
The flowing heat carrier enters through the water inlet, flows into the heat dissipation plate through the plurality of branch water inlet pipelines, converges to the communication pipeline, and flows out from the water outlet through the plurality of branch water outlet pipelines, so that the purpose of heat dissipation is achieved, compared with the snake-shaped pipeline, the flow of water flow from the water flow inlet to the water flow outlet is short, the flowing heat carrier can be rapidly distributed in the whole heat dissipation plate, the heat dissipation efficiency is high, and the whole heat dissipation effect is better.
In this embodiment, the water inlet pipeline, the water outlet pipeline, the plurality of branch water inlet pipelines and the plurality of branch water outlet pipelines are all parallel to the long side of the heat dissipation plate, and the communication pipeline is parallel to the short side of the heat dissipation plate. The apertures of the branch water inlet pipelines and the branch water outlet pipelines are as large as possible, the intervals are as small as possible, as shown in figure 3, the cross section of the heat dissipation plate shows that the branch water inlet pipelines and the branch water outlet pipelines which are parallel are uniformly distributed in the heat dissipation plate, and the water flow resistance in the heat dissipation plate is small by adopting the large-aperture porous dense distribution, so that the heat dissipation is fast, the material is saved, and the manufacturing cost is reduced.
The heat dissipation plate is formed by processing a heat conductor made of copper or aluminum, so that the heat conduction effect and the heat dissipation effect can be greatly improved, and the reliability of overall heat dissipation can be improved.
The flowing heat carrier is water, antifreeze, phase-change material, etc.
The heat dissipation plate is directly formed by adopting a die stretching process, and two ends of the heat dissipation plate are sealed by welding. The production efficiency can be effectively improved, and the cost is reduced; the grinding tool can ensure the surface precision of the product, is formed in one step, and reduces the processing cost.
Optionally, for two adjacent heat dissipation plates, the water outlet of one of the heat dissipation plates may be connected to the water inlet of the other heat dissipation plate through a hose, that is, the pipes of the adjacent heat dissipation plates are communicated, so that the plurality of heat dissipation plates may be used as a group, only one water inlet is connected to the water diversion pipe, and only one water outlet is connected to the water collection pipe.
Through adopting heating panel and the inseparable laminating of chip, take away the heat through fluid such as water, guarantee that chip work is not overtemperature to, through the mode that adopts integrated circuit board and the parallelly connected structure installation of heating panel interval, reduced fixed fittings such as screw, effectively save man-hour, and, be favorable to the installation that gathers of water knockout drum pipeline and water collector pipeline.
In this embodiment, the directions of the water inlets and the water outlets of the heat dissipation plates are the same. The water distributor pipeline and the water collector pipeline are arranged on the same side, and each two layers are respectively provided with the water distributor pipeline and the water collector pipeline, and are packaged by the junction station to dissipate heat for the upper and lower layers of heat dissipation plates. Those skilled in the art will appreciate that the number of water distributor pipes and water collector pipes can be adjusted according to the number of board card modules.
Example two
An object of the present embodiment is to provide a heating system.
A heating system releases heat through secondary heat exchange of water flowing out of a server cooling system, can be used for heating other places, and particularly connects a water outlet of the server cooling system to heating equipment.
According to the heating power of heating equipment (such as an electric boiler, a radiator and the like) used on site, the heat dissipation power required to be equipped by the equipment is calculated. In order to ensure that the chip heats on the premise of normal operation, the heat dissipation power is higher than the heating power.
Furthermore, the heating system also comprises a control terminal which is connected with a chip in the server heat dissipation system. And a water outlet of the server heat dissipation system is also provided with a temperature sensor which is connected with the control terminal. The control terminal can monitor the current heating condition in real time according to the temperature measured by the temperature sensor.
One or more of the above embodiments have the following technical effects:
in the server heat dissipation system provided by the invention, the heat dissipation plate is attached to each chip, so that heat generated in the operation process can be effectively taken away.
The heat dissipation system takes the heat dissipation module consisting of the plurality of board cards and the heat dissipation plates as the heat dissipation unit, adopts the cabinet body as the main frame, and arranges the heat dissipation unit on the cabinet body, so that the heat dissipation system has small overall volume and strong mobility, and is convenient for replacing places.
According to the invention, a plurality of adjacent heat dissipation plates are taken as a group, only one water inlet in the heat dissipation plates is connected with the water distribution pipeline, and only one water outlet in the heat dissipation plates is connected with the water collection pipeline, so that the complexity of pipeline connection between the heat dissipation plates and the water distribution and collection pipelines is reduced, workers can connect a group of heat dissipation plates first and then connect the heat dissipation plates to the water distribution and collection pipelines, and the working efficiency is improved.
The heat dissipation plate is internally provided with the plurality of parallel branch water inlet pipelines and the plurality of branch water outlet pipelines which are uniformly distributed in the heat dissipation plate, so that the flow of water flow from the water flow inlet to the water flow outlet is short, the water flow can be quickly distributed in the whole heat dissipation plate, the heat dissipation efficiency is high, the whole heat dissipation effect is better, the traditional fan can be replaced, the noise is reduced, and the energy consumption is reduced.
And the branch water inlet pipeline and the branch water outlet pipelines have the largest pore diameter and the largest number, namely the pipelines with the large pore diameter and the dense distribution are adopted, so that the water flow resistance in the heat dissipation plate is small, the heat dissipation is fast, the material is saved, and the manufacturing cost is reduced.
The heat dissipation plate is applied to heat dissipation of the board card or the chip, and heat generated in the working process of the board card or the chip can be taken away in time by alternately installing the board card and the heat dissipation plate, so that the temperature of the chip is effectively reduced, and the safe working of the chip is ensured.
The invention is applied to energy conservation, mute heat dissipation and heat recovery of various chips and board cards, and the recovered heat can be applied to heating, drying, heat preservation, chemical preheating and other industries needing heat supply.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (10)
1. A server heat dissipation system, comprising: the heat dissipation device comprises a water inlet pipe, a water distributor pipeline, a water collector pipeline, a water outlet pipe and one or more board card module heat dissipation units; wherein, integrated circuit board module radiating element includes: the heat dissipation plates are arranged between every two adjacent board cards and are respectively attached to two surfaces of each heat dissipation plate; the heat dissipation plate is provided with a water inlet and a water outlet; the water inlet pipe is connected with a water distributor pipeline, and the water distributor pipeline is connected with the water inlets of the heat dissipation plates; the water outlet of each heat dissipation plate is connected with a water collector pipeline, and the water collector pipeline is connected with the water outlet.
2. The server heat dissipation system of claim 1, further comprising a tiered cabinet, each tier of the cabinet configured to house a plurality of board module heat dissipation units.
3. The server cooling system according to claim 2, wherein the water inlet and the water outlet of each cooling plate are in the same direction; every two layers of the cabinet body are respectively provided with a water distributor pipeline and a water collector pipeline which are used for radiating heat by the upper and lower layers of heat radiating plates.
4. The server cooling system according to claim 1, wherein the plurality of adjacent cooling plates are grouped, a water inlet of one cooling plate is connected to the water distribution pipe, a water outlet of the other cooling plate is connected to a water inlet of the adjacent cooling plate in the group, and a water outlet of the last cooling plate is connected to the water collection pipe.
5. The server cooling system according to claim 1, wherein the cooling plate has one end closed and the other end provided with a water inlet and a water outlet; the pipeline in the heating panel includes: the water inlet pipeline comprises a plurality of branch water inlet pipelines, a plurality of branch water outlet pipelines and a plurality of connecting pipelines, wherein one end of each branch water inlet pipeline is communicated with the water inlet, and one end of each branch water outlet pipeline is communicated with the water outlet; wherein, the branch water inlet pipelines and the branch water outlet pipelines are parallel to each other, and the distances among the pipelines are equal.
6. The heat dissipating system of claim 5, wherein the plurality of branch inlet pipes and the plurality of branch outlet pipes have the same pipe aperture size.
7. The heat dissipating plate for dissipating heat from a chip as claimed in claim 6, wherein the diameter of the pipe hole is set to a maximum size for securing the strength of the pipe wall.
8. A heating system connected to the server heat dissipation system of claim 6.
9. The heating system of claim 8, wherein the heat removal capacity of the server heat removal system is determined based on the site specific heating power demand.
10. The heating system of claim 8, further comprising a control terminal coupled to the chip in the server heat dissipation system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911362239.2A CN111176405B (en) | 2019-12-26 | 2019-12-26 | Server cooling system and heating system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911362239.2A CN111176405B (en) | 2019-12-26 | 2019-12-26 | Server cooling system and heating system |
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| CN111176405A true CN111176405A (en) | 2020-05-19 |
| CN111176405B CN111176405B (en) | 2021-06-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566475A (en) * | 2020-12-25 | 2021-03-26 | 北京涌现数字科技有限公司 | Cooling system |
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| CN109521860A (en) * | 2018-11-06 | 2019-03-26 | 郑州云海信息技术有限公司 | A kind of water-cooling system detected for GPU server with leakage |
| CN110278690A (en) * | 2019-06-24 | 2019-09-24 | 苏州浪潮智能科技有限公司 | A kind of liquid-cooling type single cabinet formula data center |
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2019
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200979248Y (en) * | 2006-12-06 | 2007-11-21 | 李新宇 | Multi-functional heat radiator |
| CN109521860A (en) * | 2018-11-06 | 2019-03-26 | 郑州云海信息技术有限公司 | A kind of water-cooling system detected for GPU server with leakage |
| CN110278690A (en) * | 2019-06-24 | 2019-09-24 | 苏州浪潮智能科技有限公司 | A kind of liquid-cooling type single cabinet formula data center |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112566475A (en) * | 2020-12-25 | 2021-03-26 | 北京涌现数字科技有限公司 | Cooling system |
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| CN111176405B (en) | 2021-06-29 |
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Effective date of registration: 20210721 Address after: 311199 room 449, block a, building 1, No. 326, Nanyuan street, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou darehan Technology Co.,Ltd. Address before: 100020 15th floor, Yintai Center office building, No.2 Jianguomenwai street, Chaoyang District, Beijing Patentee before: Beijing saire Technology Co.,Ltd. |