CN111162445B - Welding method and welding apparatus - Google Patents
Welding method and welding apparatus Download PDFInfo
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- CN111162445B CN111162445B CN201911421363.1A CN201911421363A CN111162445B CN 111162445 B CN111162445 B CN 111162445B CN 201911421363 A CN201911421363 A CN 201911421363A CN 111162445 B CN111162445 B CN 111162445B
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- chip
- suction nozzle
- tube seat
- heat sink
- manipulator
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/10—CBE
Abstract
The invention provides a welding method and a welding device, wherein the method comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from the tube seat tray and places the first tube seat on a first welding table; a heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and a chip suction nozzle of the second manipulator picks up a first chip from the chip tray; the second manipulator places the first heat sink on a first tube seat on the first welding table for heating and welding, and places the first chip on the chip rotating table for positioning; the second mechanical arm places the first chip on the first heat sink for heating and welding; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table. The welding method provided by the invention solves the problems that the welding method in the prior art is low in efficiency, high in packaging cost and incapable of meeting the requirements of packaging technology.
Description
Technical Field
The application relates to the technical field of laser packaging, in particular to a welding method and welding equipment.
Background
The packaging technology is a technology for packaging an integrated circuit by using insulating plastic or other materials, and because a chip must be isolated from the outside, on one hand, the chip is prevented from being degraded in electrical performance due to corrosion of impurities in air to a chip circuit, and on the other hand, the packaged chip is more convenient to mount and transport, the packaging technology is necessary and important for the chip, and the performance of the chip and the design and manufacture of a circuit board connected with the chip are directly influenced by the quality of the packaging technology.
The encapsulation of laser instrument chip is through with the chip, heat sink and tube socket weld the laminating back, the encapsulation is accomplished on the tube socket to the tube cap welding that will have the lens again, prior art adopts semi-automatic mode with the tube socket of laser instrument and heat sink welding back at present, rethread equipment or manual work transfer accomplish the welding of chip and heat sink on another equipment, need accomplish the chip through two welding equipment like this, the laminating of heat sink and tube socket, make the encapsulation inefficiency, the encapsulation is with high costs, and the loss of maloperation increase material in the transportation still can appear, can not satisfy packaging technology's demand.
Therefore, the welding equipment and the welding method in the prior art have low efficiency, high packaging cost and increased material loss, and can not meet the requirements of packaging technology.
Disclosure of Invention
In order to solve the technical problems, the application provides a welding method and welding equipment, and solves the problems that the welding equipment and the welding method in the prior art are low in efficiency, high in packaging cost, increased in material loss and incapable of meeting the requirements of packaging technology.
In a first aspect, the present invention provides a method of welding, the method comprising: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray; the first heat sink is placed on the first tube seat on the first welding table by the heat sink suction nozzle of the second manipulator for heating and welding, and the first chip is placed on the chip rotating table for positioning by the chip suction nozzle of the second manipulator; a chip suction nozzle of the second manipulator picks up a positioned first chip from the chip rotating table, and the first chip is placed on a first heat sink on the first welding table for heating and welding; a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table.
Optionally, after the first header suction nozzle of the first robot picks up a first header from the header tray and places the first header on the first bonding stage, before the first header suction nozzle of the first robot places the second header on the first bonding stage, the method further comprises: and the first tube seat suction nozzle of the first manipulator picks up a third tube seat from the tube seat tray and places the third tube seat on the second welding table.
Optionally, after the chip suction nozzle of the second robot places the first chip on the first heat sink on the first bonding stage for heating and bonding, and after the first header suction nozzle of the first robot picks up a third header from the header tray and places the third header on the second bonding stage, the method further comprises: the heat sink suction nozzle of the second manipulator picks up a second heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a second chip from the chip tray; the heat sink suction nozzle of the second manipulator places the second heat sink on a second tube seat on the second welding table for heating and welding, and the heat sink suction nozzle of the second manipulator places the second chip on the chip rotating table for positioning; a chip suction nozzle of the second manipulator picks up a positioned second chip from the chip rotating table, and the second chip is placed on a second heat sink on the second welding table for heating and welding; and after the second tube seat suction nozzle of the first manipulator picks up a welded second tube seat from the second welding table, the first tube seat suction nozzle of the first manipulator places the picked fourth tube seat on the second welding table.
Optionally, the placing the first heat sink on the first tube seat on the first bonding stage for heating and bonding by the heat sink suction nozzle of the second robot, and the placing the first chip on the chip rotation stage for positioning by the chip suction nozzle of the second robot include: after the first heat sink is positioned by the heat sink suction nozzle of the second manipulator through the first imaging device, the first heat sink is placed on the first tube seat on the first welding table for heating; the chip suction nozzle of the second manipulator places the first chip on the chip rotating table and positions the first chip through a second imaging device; and moving the second manipulator to the position above the first welding table, and pressing the heat sink suction nozzle on the first heat sink to weld the first heat sink and the first tube seat.
Optionally, the chip suction nozzle of the second robot picks up the positioned first chip from the chip rotation table, places the first chip on the first heat sink on the first bonding stage for heating and bonding, and includes: a chip suction nozzle of the second manipulator picks up the positioned first chip from the chip rotating table; after the first chip is positioned by the chip suction nozzle of the second manipulator through the first imaging device, the first chip is placed on the first heat sink on the first welding table for heating; and a chip suction nozzle of the second manipulator presses the first chip to weld the first chip and the first heat sink.
In a second aspect, the present invention provides a welding apparatus comprising: a first manipulator comprising a first tube holder nozzle and a second tube holder nozzle; the second mechanical arm comprises a heat sink suction nozzle and a chip suction nozzle; the first tube seat suction nozzle of the first manipulator is used for picking up a first tube seat from the tube seat tray and placing the first tube seat on the first welding table; the heat sink suction nozzle of the second manipulator is used for picking up a first heat sink from a heat sink tray and placing the first heat sink on a first tube seat on the first welding table for heating and welding; the first welding table is used for heating and welding the first tube seat and the first heat sink; the chip suction nozzle of the second manipulator picks up a first chip from the chip tray and is also used for placing the first chip on the chip rotating table for positioning; the chip rotating platform is used for adjusting the first chip to a preset position; the chip suction nozzle of the second manipulator is also used for picking up a positioned first chip from the chip rotating table, and placing the first chip on a first heat sink on the first welding table for heating and welding; the second tube seat suction nozzle on the first manipulator is used for picking up the welded first tube seat from the first welding table; and when the second tube seat suction nozzle on the first manipulator is used for picking up the welded first tube seat from the first welding table, the second tube seat suction nozzle on the first manipulator is also used for placing the second tube seat on the first welding table.
Optionally, the apparatus further comprises: a second welding stage; after the first tube seat suction nozzle on the first manipulator picks up a first tube seat from the tube seat tray and places the first tube seat on the first welding table, before the first tube seat suction nozzle on the first manipulator places the second tube seat on the first welding table, the first tube seat suction nozzle of the first manipulator is also used for picking up a third tube seat from the tube seat tray and placing the third tube seat on the second welding table.
Optionally, after the second manipulator places the first chip on the first heat sink on the first soldering station for heating and soldering, and the first header suction nozzle on the first manipulator picks up a third header from the header tray and places the third header on the second soldering station, the heat sink suction nozzle of the second manipulator is further used for picking up a second heat sink from the heat sink tray; the chip suction nozzle of the second manipulator is also used for picking up a second chip from the chip tray; the heat sink suction nozzle of the second manipulator is also used for placing the second heat sink on a second tube seat on the second welding table for heating and welding; the chip suction nozzle of the second manipulator is also used for placing the second chip on the chip rotating table for positioning; the chip suction nozzle of the second manipulator is also used for picking up a positioned second chip from the chip rotating table and placing the second chip on a second heat sink on the second welding table for heating and welding; and when the second tube seat suction nozzle on the first manipulator picks up the welded second tube seat from the second welding table, the first tube seat suction nozzle on the first manipulator is also used for placing the picked fourth tube seat on the second welding table.
Optionally, the apparatus further comprises: the first imaging device is used for positioning the first heat sink and the first tube seat on the first welding table; the second imaging device is used for positioning the first chip on the chip rotating platform; the chip suction nozzle of the second manipulator places the first chip on the chip rotating table and positions the first chip through a second imaging device; the heat sink suction nozzle of the second manipulator is also used for pressing the first heat sink to weld the first heat sink and the first pipe seat.
Optionally, the chip suction nozzle of the second robot is further used for picking up the positioned first chip from the chip rotating table; the chip suction nozzle of the second manipulator is also used for positioning the first chip through the first imaging device and then placing the first chip on a first heat sink on the first welding table for heating; the chip suction nozzle of the second manipulator is also used for pressing the first chip to weld the first chip and the first heat sink.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:
the invention provides a welding method and a welding device, wherein the method comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray; the first heat sink is placed on the first tube seat on the first welding table by the heat sink suction nozzle of the second manipulator for heating and welding, and the first chip is placed on the chip rotating table for positioning by the chip suction nozzle of the second manipulator; a chip suction nozzle of the second manipulator picks up a positioned first chip from the chip rotating table, and the first chip is placed on a first heat sink on the first welding table for heating and welding; a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table. According to the welding method, the tube seat, the heat sink and the chip of the semiconductor laser are welded in the same full-automatic device, and the welding of the tube seat, the heat sink and the chip of the semiconductor laser is realized without two different devices, so that the welding efficiency and the welding cost are improved, material damage and loss caused by a midway material transferring process are avoided, the working efficiency is improved, and the production cost is saved; and the working method of feeding and discharging of the four suction nozzles of the two manipulators further improves the welding efficiency, so that the problems that the welding equipment and the welding method in the prior art are low in efficiency, high in packaging cost, high in material loss and incapable of meeting the requirements of packaging technology are solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a flow chart of a welding method provided by an embodiment of the present invention;
FIG. 2 is a flow chart of a welding method provided by an embodiment of the present invention;
FIG. 3 is a flow chart of a welding method provided by an embodiment of the present invention;
FIG. 4 is a flow chart of a welding method provided by an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a welding apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
FIG. 1 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 1, the flowchart of the welding method in the embodiment of the present invention specifically includes the following steps:
step S101, the first tube seat suction nozzle of the first mechanical arm picks up a first tube seat from the tube seat tray and places the first tube seat on the first welding table.
And S102, picking up a first heat sink from the heat sink tray by the heat sink suction nozzle of the second manipulator, and picking up a first chip from the chip tray by the chip suction nozzle of the second manipulator.
And S103, placing the first heat sink on a first tube seat on the first welding table for heating and welding by a heat sink suction nozzle of the second manipulator, and placing the first chip on a chip rotating table for positioning by a chip suction nozzle of the second manipulator.
And step S104, picking up the positioned first chip from the chip rotating table by a chip suction nozzle of the second mechanical arm, and placing the first chip on a first heat sink on the first welding table for heating and welding.
In step S105, the first header suction nozzle of the first robot picks up a second header from the header tray.
And S106, after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table.
Specifically, the welding method in this embodiment is applied to welding equipment of a semiconductor laser, where the welding equipment includes, but is not limited to, a first manipulator, a second manipulator, a welding table, a chip rotation table, a tube socket feeding device, a heat sink feeding device, and a chip feeding device, where the tube socket feeding device is provided with a tube socket tray containing a plurality of tube sockets, the heat sink feeding device is provided with a heat sink tray containing a plurality of heat sinks, and the chip feeding device is provided with a chip tray containing a plurality of chips.
In practical application, a first tube seat suction nozzle of a first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table, the first welding table rotates the first tube seat from vertical placement to horizontal placement, a welding surface on the first tube seat faces upwards horizontally, and welding with a heat sink is facilitated; the second mechanical arm picks up a first heat sink and a first chip from the heat sink tray and the chip tray respectively, a heat sink suction nozzle of the second mechanical arm places the picked-up first heat sink on a first tube seat on the first welding table for heating and welding, the chip suction nozzle of the second mechanical arm places the first chip on the chip rotating table for positioning, and after the first heat sink and the first tube seat are welded, the chip suction nozzle of the second mechanical arm picks up the positioned first chip from the chip rotating table and places the first chip on the first heat sink for heating and welding; when the first chip and the first heat sink are welded, the first tube seat suction nozzle of the first manipulator picks up another second tube seat from the tube seat tray, when the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table, the second tube seat suction nozzle of the first manipulator places the welded first tube seat in the tube seat tray, the welding process of the tube seat, the heat sink and the chip of a laser on one welding table is completed, and when the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table, the second manipulator picks up the second heat sink and the second chip and welding is carried out by repeating the steps.
The invention provides a welding method, which comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray; the first heat sink is placed on the first tube seat on the first welding table by the heat sink suction nozzle of the second manipulator for heating and welding, and the first chip is placed on the chip rotating table for positioning by the chip suction nozzle of the second manipulator; a chip suction nozzle of the second manipulator picks up a positioned first chip from the chip rotating table, and the first chip is placed on a first heat sink on the first welding table for heating and welding; a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table. According to the welding method, the tube seat, the heat sink and the chip of the semiconductor laser are welded in the same full-automatic device, and the welding of the tube seat, the heat sink and the chip of the semiconductor laser is realized without two different devices, so that the welding efficiency and the welding cost are improved, material damage and loss caused by a midway material transferring process are avoided, the working efficiency is improved, and the production cost is saved; and the working method of feeding and discharging of the four suction nozzles of the two manipulators further improves the welding efficiency, so that the problems that the welding equipment and the welding method in the prior art are low in efficiency, high in packaging cost, high in material loss and incapable of meeting the requirements of packaging technology are solved.
FIG. 2 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 2, the flowchart of the semiconductor laser welding method in the embodiment of the present invention further includes the following steps:
step S201, the heat sink suction nozzle of the second manipulator positions the first heat sink through the first imaging device.
And S202, placing the first heat sink on the first tube seat on the first welding table for heating.
Step S203, the chip suction nozzle of the second manipulator places the first chip on the chip rotation table and positions the first chip through the second imaging device.
And S204, moving the second manipulator to the position above the first welding table, and pressing the heat sink suction nozzle on the first heat sink to weld the first heat sink and the first tube seat.
Specifically, step S103 in the embodiment of fig. 1: the heat sink suction nozzle of the second manipulator places the first heat sink on the first tube seat on the first welding table for heating and welding, the chip suction nozzle of the second manipulator places the first chip on the chip rotating table for positioning, including: after the first heat sink is positioned by the heat sink suction nozzle of the second manipulator through the CCD imaging device and the first tube seat, the first heat sink is placed on the first tube seat on the first welding table to be heated, then the first chip is placed on the chip rotating table by the chip suction nozzle of the second manipulator, and the chip rotating table rotates the chip to a preset position through the second imaging device; the second manipulator moves above the first welding table again, the heat sink suction nozzle presses the first heat sink to enable the first heat sink to be welded with the first tube seat, and the first heat sink and the first tube seat are welded more quickly and more stably through pressing of the heat sink suction nozzle during welding.
FIG. 3 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 3, the flowchart of the semiconductor laser welding method in the embodiment of the present invention further includes the following steps:
and S301, picking up the positioned first chip from the chip rotating table by the chip suction nozzle of the second mechanical arm.
Step S302, the chip suction nozzle of the second manipulator positions the first chip through the first imaging device.
Step S303, placing the first chip on a first heat sink on the first welding table by a chip suction nozzle of the second manipulator for heating.
Step S304, the chip suction nozzle of the second manipulator presses the first chip to solder the first chip and the first heat sink.
Specifically, in step S104 in the embodiment of fig. 1, the picking up the positioned first chip from the chip rotation table by the chip suction nozzle of the second robot, placing the first chip on the first heat sink on the first bonding stage for heating and bonding includes: when the chip rotating table is right after the first chip is positioned, the first heat sink and the first tube seat are welded, the second mechanical arm moves to the top of the chip rotating table to enable a chip suction nozzle of the second mechanical arm to be located, a first chip which is positioned and completed is picked up on the chip rotating table, the second mechanical arm moves to the top of the first welding table again, the first chip and the first tube seat are positioned through the first imaging device, the first chip is placed on the first heat sink to be heated after the positioning is completed, then the chip suction nozzle presses the first chip to enable the first chip to be welded with the first heat sink, and the first chip and the first heat sink are welded more quickly and more stably through the pressing of the chip suction nozzle during welding.
FIG. 4 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 4, the flowchart of the semiconductor laser welding method in the embodiment of the present invention further includes the steps of:
in step S411, the first header suction nozzle of the first robot picks up the first header from the header tray and places the first header on the first bonding stage.
In step S412, the heat sink suction nozzle of the second manipulator picks up the first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up the first chip from the chip tray.
Step S413, the heat sink nozzle of the second manipulator places the first heat sink on the first tube seat on the first soldering stage for heating and soldering, and the chip nozzle of the second manipulator places the first chip on the chip rotating stage for positioning.
And step S414, picking up the positioned first chip from the chip rotating table by the chip suction nozzle of the second mechanical arm, and placing the first chip on the first heat sink on the first welding table for heating and welding.
In step S415, the first header suction nozzle of the first robot picks up the second header from the header tray.
In step S416, after the second socket nozzle of the first manipulator picks up the welded first socket from the first welding stage, the first socket nozzle of the first manipulator places the second socket on the first welding stage.
In step S421, the first header suction nozzle of the first robot picks up a third header from the header tray and places the third header on the second bonding stage.
Step S422, the heat sink suction nozzle of the second manipulator picks up the second heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up the second chip from the chip tray.
And step S423, the heat sink suction nozzle of the second manipulator places a second heat sink on a second tube seat on the second welding table for heating and welding, and the heat sink suction nozzle of the second manipulator places a second chip on the chip rotating table for positioning.
Step S424, the chip suction nozzle of the second manipulator picks up the positioned second chip from the chip rotation table, and places the second chip on the second heat sink on the second bonding stage for heating and bonding.
In step S425, the first header suction nozzle of the first robot picks up a fourth header from the header tray.
In step S426, after the second socket nozzle of the first manipulator picks up the welded second socket from the second welding stage, the first socket nozzle of the first manipulator places the picked-up fourth socket on the second welding stage.
In the embodiment of the present invention, two soldering stages are provided for soldering the chip, the heat sink and the socket, steps S411 to S416 in fig. 4 are a work flow on the first soldering stage, steps S421 to S426 are a work flow on the second soldering stage, and solid arrows indicate the sequence of steps on the same soldering stage, that is, the first soldering stage is performed in sequence according to steps S411 to S416, and the second soldering stage is performed in sequence according to steps S421 to S426; the dashed arrows indicate the sequence of steps of the same manipulator, i.e. the first manipulator performs the sequence of steps: step S411, step S421, step S415, step S416, step S425, and step S426, the second manipulator executes the following steps: step S412, step S413, step S414, step S422, step S423, and step S424, where step S412 and step S421 have no chronological relationship, and step S415 and step S422 also have no chronological relationship.
Specifically, after a first tube seat suction nozzle of a first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table, a second manipulator is started to place a heat sink and a chip on the first welding table in sequence for welding, meanwhile, the first tube seat suction nozzle of the first manipulator continues to pick up a third tube seat from the tube seat tray and places the third tube seat on a second welding table, and after welding work on the first welding table is completed, the second manipulator can place the heat sink and the chip on the second welding table in sequence for welding; after the first tube seat suction nozzle of the first manipulator places a third tube seat on the second welding table and welding work on the first welding table is finished, the first manipulator picks up the second tube seat from the tube seat tray again, and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table again; therefore, in the embodiment, the second welding table is prepared when the first welding table works, and the first welding table is prepared when the second welding table works, so that the two welding tables are matched with the first mechanical arm and the second mechanical arm in a time sequence, the welding efficiency is higher, and the waiting time is reduced.
FIG. 5 is a schematic structural diagram of a welding apparatus according to an embodiment of the present invention; as shown in fig. 5, the semiconductor laser welding apparatus in the embodiment of the present invention specifically includes:
a first feeding area 300 for feeding the laser tube holder; a second loading area 100 for loading the laser heat sink and the laser chip; and the welding working area 200 is used for welding the laser tube seat, the heat sink and the chip.
The first loading zone 300 comprises a first robot 310, said first robot 310 comprising a first header suction nozzle 311 and a second header suction nozzle 312; the first loading area 300 further comprises a stem tray 320 for holding laser stems; the first and second header suction nozzles 311 and 312 pick and place laser headers right above the header tray 320.
The second feeding area 100 includes a second robot arm 110, the second robot arm 110 includes a heat sink suction nozzle 112 and a chip suction nozzle 111, the second feeding area 100 further includes a heat sink tray 120 for holding heat sinks and a chip tray 130 for holding chips, and the heat sink suction nozzle 112 of the second robot arm 110 is used for picking up a first heat sink from the heat sink tray 120.
The bonding work area 200 includes a first bonding stage 210 and a second bonding stage 220 for bonding, a chip rotation stage 230 for positioning a chip, a rail 240 for movement of the first robot 310 and the second robot 110, and an imaging device for positioning; the imaging device comprises a first imaging device 251, a second imaging device 252 and a third imaging device 253, wherein the first imaging device 251 is used for positioning a tube socket, a heat sink and a chip on the first welding table 210 before welding, the second imaging device 252 is used for positioning the chip on the chip rotating table in the X direction and the Y direction, and the third imaging device 253 is used for positioning the tube socket, the heat sink and the chip on the second welding table 220 before welding.
The specific working process is as follows:
the first socket suction nozzle 311 of the first manipulator 310 is used for picking up a first socket from the socket tray 320 and placing the first socket on the first soldering stage 210, the heat sink suction nozzle 112 of the second manipulator 110 picks up a first heat sink from the heat sink tray 120 and the chip suction nozzle 111 picks up a first chip from the chip tray 130 and moves the first chip to the position right above the first soldering stage 210, after the first heat sink on the heat sink suction nozzle 112 and the first socket on the first soldering stage 210 are positioned by the first imaging device 251, the first heat sink is placed on the first socket by the heat sink suction nozzle 112 for heating, the second manipulator 110 moves to the position right above the chip rotating stage 230, and the chip suction nozzle 111 places the first chip on the chip rotating stage 230, so that the chip rotating stage 230 positions the first chip in the X direction and the Y direction; after the chip suction nozzle 110 places a first chip on the chip rotation stage 230 and after the first heat sink and the first tube seat are heated, the second manipulator 110 moves to a position right above the first welding stage 210, and the heat sink suction nozzle 112 presses the first heat sink to weld the first heat sink and the first tube seat; after the welding is completed, the second manipulator 110 moves to a position right above the chip rotating table 230, so that the chip suction nozzle 111 picks up the positioned first chip, the first chip is positioned by the first imaging device 251 and then placed on the first heat sink on the first welding table 210 for heating and welding, and the chip suction nozzle 111 presses the first chip during the welding, so that the first chip and the first heat sink are welded more stably; after the welding operation is completed, the first robot 300 moves to a position right above the first welding stage 210, so that the second socket suction nozzle 312 picks up the welded first socket from the first welding stage 210, and the first socket suction nozzle 311 places another socket to be welded on the first welding stage to wait for the next welding operation.
The above is the welding process on the first welding stage 210, and at the same time, after the first socket suction nozzle 311 of the first manipulator 310 places the first socket on the first welding stage 210, the first socket suction nozzle 311 of the first manipulator 310 continues to pick up the second socket from the socket tray 320 and place the second socket on the second welding stage 220, and after the welding work on the first welding stage 210 is completed, the second manipulator 110 picks up the second heat sink and places the second chip on the second socket on the second welding stage 220 to perform the welding work; therefore, the welding of the two welding tables enables the welding process to be more compact, reduces the waiting time and improves the welding efficiency.
The invention provides a welding method and a welding device, wherein the method comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray; the first heat sink is placed on the first tube seat on the first welding table by the heat sink suction nozzle of the second manipulator for heating and welding, and the first chip is placed on the chip rotating table for positioning by the chip suction nozzle of the second manipulator; a chip suction nozzle of the second manipulator picks up a positioned first chip from the chip rotating table, and the first chip is placed on a first heat sink on the first welding table for heating and welding; a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table. According to the welding method, the tube seat, the heat sink and the chip of the semiconductor laser are welded in the same full-automatic device, and the welding of the tube seat, the heat sink and the chip of the semiconductor laser is realized without two different devices, so that the welding efficiency and the welding cost are improved, material damage and loss caused by a midway material transferring process are avoided, the working efficiency is improved, and the production cost is saved; and the working method of feeding and discharging of the four suction nozzles of the two manipulators further improves the welding efficiency, so that the problems that the welding equipment and the welding method in the prior art are low in efficiency, high in packaging cost, high in material loss and incapable of meeting the requirements of packaging technology are solved.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A method of welding, the method comprising:
a first tube seat suction nozzle of the first manipulator picks up a first tube seat from the tube seat tray and places the first tube seat on a first welding table;
a heat sink suction nozzle of a second manipulator picks up a first heat sink from a heat sink tray, and a chip suction nozzle of the second manipulator picks up a first chip from a chip tray;
the first heat sink is placed on the first tube seat on the first welding table by the heat sink suction nozzle of the second manipulator for heating and welding, and the first chip is placed on the chip rotating table for positioning by the chip suction nozzle of the second manipulator;
a chip suction nozzle of the second manipulator picks up a positioned first chip from the chip rotating table, and the first chip is placed on a first heat sink on the first welding table for heating and welding;
a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray;
after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table;
wherein after the chip suction nozzle of the second manipulator places the first chip on the first heat sink on the first bonding stage for heating and bonding, and after the first socket suction nozzle of the first manipulator picks up the third socket from the socket tray and places the third socket on the second bonding stage, the method further comprises:
the heat sink suction nozzle of the second manipulator picks up a second heat sink from the heat sink tray, the chip suction nozzle of the second manipulator picks up a second chip from the chip tray,
the heat sink suction nozzle of the second manipulator places the second heat sink on the second tube seat on the second welding table for heating and welding, the heat sink suction nozzle of the second manipulator places the second chip on the chip rotating table for positioning,
the chip suction nozzle of the second manipulator picks up the positioned second chip from the chip rotating table, the second chip is placed on the second heat sink on the second welding table for heating and welding,
and after the second tube seat suction nozzle of the first manipulator picks up a welded second tube seat from the second welding table, the first tube seat suction nozzle of the first manipulator places the picked fourth tube seat on the second welding table.
2. The method of claim 1, wherein after the first header suction nozzle of the first robot picks a first header from a header tray and places the first header on the first bonding station, and before the first header suction nozzle of the first robot places the second header on the first bonding station, the method further comprises:
and the first tube seat suction nozzle of the first manipulator picks up a third tube seat from the tube seat tray and places the third tube seat on the second welding table.
3. The method of claim 1, wherein the placing of the first heat sink onto the first header on the first bonding stage for heating and bonding by the heat sink nozzle of the second robot, and the placing of the first chip onto the chip rotation stage for positioning by the chip nozzle of the second robot, comprises:
after the first heat sink is positioned by the heat sink suction nozzle of the second manipulator through the first imaging device, the first heat sink is placed on the first tube seat on the first welding table for heating;
the chip suction nozzle of the second manipulator places the first chip on the chip rotating table and positions the first chip through a second imaging device;
and moving the second manipulator to the position above the first welding table, and pressing the heat sink suction nozzle on the first heat sink to weld the first heat sink and the first tube seat.
4. The method of claim 1, wherein the chip suction nozzle of the second robot picks up the positioned first chip from the chip rotation table, places the first chip onto a first heat sink on the first bonding stage for heating and bonding, comprising:
a chip suction nozzle of the second manipulator picks up the positioned first chip from the chip rotating table;
after the first chip is positioned by the chip suction nozzle of the second manipulator through the first imaging device, the first chip is placed on the first heat sink on the first welding table for heating;
and a chip suction nozzle of the second manipulator presses the first chip to weld the first chip and the first heat sink.
5. A welding apparatus, characterized in that the apparatus comprises:
a first manipulator comprising a first tube holder nozzle and a second tube holder nozzle;
the second mechanical arm comprises a heat sink suction nozzle and a chip suction nozzle;
the first tube seat suction nozzle of the first manipulator is used for picking up a first tube seat from the tube seat tray and placing the first tube seat on the first welding table;
the heat sink suction nozzle of the second manipulator is used for picking up a first heat sink from a heat sink tray and placing the first heat sink on a first tube seat on the first welding table for heating and welding;
the first welding table is used for heating and welding the first tube seat and the first heat sink;
the chip suction nozzle of the second manipulator is used for picking up a first chip from the chip tray and placing the first chip on the chip rotating table for positioning;
the chip rotating platform is used for adjusting the first chip to a preset position;
the chip suction nozzle of the second manipulator is also used for picking up a positioned first chip from the chip rotating table, and placing the first chip on a first heat sink on the first welding table for heating and welding;
the second tube seat suction nozzle on the first manipulator is used for picking up the welded first tube seat from the first welding table;
the first tube seat suction nozzle on the first manipulator is also used for picking up a second tube seat from the tube seat tray, and when the second tube seat suction nozzle on the first manipulator is used for picking up a welded first tube seat from the first welding table, the second tube seat is also used for placing the second tube seat on the first welding table;
wherein after the second manipulator places the first chip on the first heat sink on the first soldering station for heating and soldering, and after the first socket suction nozzle on the first manipulator picks up a third socket from the socket tray and places the third socket on the second soldering station, the heat sink suction nozzle of the second manipulator is also used for picking up a second heat sink from the heat sink tray,
the chip suction nozzle of the second robot is also used for picking up a second chip from the chip tray,
the heat sink suction nozzle of the second manipulator is also used for placing the second heat sink on a second tube seat on the second welding table for heating and welding,
the chip suction nozzle of the second manipulator is also used for placing the second chip on the chip rotating platform for positioning,
the chip suction nozzle of the second manipulator is also used for picking up a positioned second chip from the chip rotating table and placing the second chip on a second heat sink on the second welding table for heating and welding,
and when the second tube seat suction nozzle on the first manipulator picks up the welded second tube seat from the second welding table, the first tube seat suction nozzle on the first manipulator is also used for placing the picked fourth tube seat on the second welding table.
6. The apparatus of claim 5, further comprising:
a second welding stage;
after the first tube seat suction nozzle on the first manipulator picks up a first tube seat from the tube seat tray and places the first tube seat on the first welding table, before the first tube seat suction nozzle on the first manipulator places the second tube seat on the first welding table, the first tube seat suction nozzle of the first manipulator is also used for picking up a third tube seat from the tube seat tray and placing the third tube seat on the second welding table.
7. The apparatus of claim 5, further comprising:
the first imaging device is used for positioning the first heat sink and the first tube seat on the first welding table;
the second imaging device is used for positioning the first chip on the chip rotating platform;
the chip suction nozzle of the second manipulator places the first chip on the chip rotating table and positions the first chip through a second imaging device;
the heat sink suction nozzle of the second manipulator is also used for pressing the first heat sink to weld the first heat sink and the first pipe seat.
8. The apparatus of claim 5,
the chip suction nozzle of the second manipulator is also used for picking up the positioned first chip from the chip rotating table;
the chip suction nozzle of the second manipulator is also used for positioning the first chip through the first imaging device and then placing the first chip on the first heat sink on the first welding table for heating;
the chip suction nozzle of the second manipulator is also used for pressing the first chip to weld the first chip and the first heat sink.
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| CN201911421363.1A CN111162445B (en) | 2019-12-31 | 2019-12-31 | Welding method and welding apparatus |
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| JP2008187056A (en) * | 2007-01-30 | 2008-08-14 | Shinka Jitsugyo Kk | Soldering method and device |
| JP2011151179A (en) * | 2010-01-21 | 2011-08-04 | Shibuya Kogyo Co Ltd | Bonding apparatus |
| CN202934266U (en) * | 2012-11-14 | 2013-05-15 | 徐州重型机械有限公司 | Welding device and welding equipment with same |
| AT514318B1 (en) * | 2013-09-12 | 2014-12-15 | Fronius Int Gmbh | Method for carrying out a welding process, welding apparatus and wire roller for such a welding apparatus |
| KR101664610B1 (en) * | 2014-12-05 | 2016-10-10 | 현대자동차주식회사 | Welding device and welding system of automobile parts |
| CN105935836B (en) * | 2016-05-05 | 2018-10-26 | 温州职业技术学院 | Rotary disc type laser welding automatic complete equipment |
| CN108098231B (en) * | 2018-01-26 | 2024-03-29 | 无锡奥特维科技股份有限公司 | Welding equipment and welding method |
| CN108772646A (en) * | 2018-08-29 | 2018-11-09 | 无锡先导智能装备股份有限公司 | Welding equipment and welding method |
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