CN111156919A - Metal material micro-deformation measuring method - Google Patents
Metal material micro-deformation measuring method Download PDFInfo
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- CN111156919A CN111156919A CN202010163139.3A CN202010163139A CN111156919A CN 111156919 A CN111156919 A CN 111156919A CN 202010163139 A CN202010163139 A CN 202010163139A CN 111156919 A CN111156919 A CN 111156919A
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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Abstract
The invention provides a metal material micro-deformation measuring method, which comprises the following steps: s1, displaying the microstructure of the workpiece measuring part; s2, acquiring the original microstructure image of the workpiece measuring part displayed in the step s1, generating the deformation of the workpiece measuring part and acquiring the microstructure image again; s3, measuring the deformation of the workpiece measuring part. The measuring method is used for directly measuring and analyzing the micro deformation of the measured part of the workpiece, has high measuring accuracy, and can directly measure the micro deformation among the randomly selected specific microstructure characteristics of the measured part of the workpiece in any direction. The measurement can be automatically measured and calculated by using special equipment, such as image recognition software and equipment, or manually measured and calculated by using conventional equipment for metallographic examination, and the application range is wide.
Description
Technical Field
The invention belongs to the technical field of material detection, and particularly relates to a metal material micro-deformation measuring method.
Background
During the manufacturing and use of metal materials and components, it is often necessary to measure and control microscopic deformations, strains of the metal materials and components and to calculate stresses from the strains. The abnormal deformation, strain, working stress and residual stress of the metal material and the member may cause abnormal and lost functions, even failure accidents.
The existing metal material micro deformation measuring method mainly comprises strain gauge measurement and optical measurement, wherein the optical measurement comprises measurement by adopting a laser holographic interference method, a laser speckle shearing interference method, a laser reflection holographic interference method, a digital speckle method and the like.
The strain gauge measuring method is characterized in that the strain gauge is adhered to the surface of a workpiece, the working principle of the strain gauge is based on the strain effect of a conductor or a semiconductor material, and when a sensitive grid made of the material is mechanically deformed under the action of external force, the electrical performance parameters of the sensitive grid are correspondingly changed, so that strain calculation is carried out according to the relation between the change of the electrical performance parameters and strain.
In addition, optical methods such as a laser holographic interference method, a laser speckle shearing interference method, a laser reflection holographic interference method and the like replace a strain gauge method to measure residual stress, so that the trouble of attaching a strain gauge is overcome, but the measuring light path is complex, the fringe processing is troublesome, and the measuring precision is limited.
The existing microscopic deformation measuring method is not a direct method based on the microscopic structural deformation of the essential characteristics of the metal material, and belongs to an indirect measuring mode, and the measuring precision and accuracy cannot be directly evaluated. And the existing measuring mode uses complicated measuring equipment, has higher requirements on measuring environment and has larger limitation in actual measurement of an engineering site.
In summary, a direct and widely applicable measuring method for measuring the micro-deformation of the metal material is still lacked so far, and a better micro-deformation measuring method is expected to be obtained.
Disclosure of Invention
Based on the method, the invention provides the method for measuring the microscopic deformation of the metal material, the method is used for directly measuring and analyzing the microscopic deformation of the measured part of the workpiece, the measurement accuracy is high, meanwhile, the microscopic deformation between the randomly selected specific microstructure characteristics of the measured part of the workpiece in any direction can be directly measured, and the application range is wide.
The specific technical scheme is as follows:
a method for measuring microscopic deformation of a metal material comprises the following steps:
s1, displaying the microstructure of the workpiece measuring part;
s2, acquiring the original microstructure image of the workpiece measuring part displayed in the step s1, generating the deformation of the workpiece measuring part and acquiring the microstructure image again;
s3, measuring the deformation of the workpiece measuring part.
In some of these embodiments, the step s1 includes:
1) grinding a measuring part of the workpiece;
2) and polishing the ground workpiece surface.
In some of these embodiments, the step s1 further includes: 3) and (3) adopting an erosion method or an interference layer method to display the microstructure of the polished workpiece surface.
If the surface of the workpiece can directly display the microstructure without being processed after grinding and polishing, the subsequent microscopic deformation measurement can be directly carried out; if the surface of the workpiece can not directly display the microstructure without treatment after grinding and polishing, the microstructure of the surface to be detected can be displayed by adopting a physical method or a chemical method and the like, so that the microstructure of the surface of the workpiece presents good contrast and the microstructure can be clearly displayed.
In some embodiments, the grinding in step 1) is performed by using sand paper or grinding disc with a grain size from large to small in sequence until no visible scratches are formed on the measured part of the workpiece.
In some embodiments, the polishing in step 2) is to remove grinding marks on the surface of the workpiece due to grinding by using a polishing method, so that the surface of the workpiece is mirror-finished and has no grinding defects.
In some embodiments, the polishing method in step 2) comprises mechanical polishing, electropolishing, vibratory polishing, micro-polishing, and micro-grinding.
In some embodiments, the etching method in step 3) comprises chemical etching, electrolytic etching, constant potential etching, ion etching and thermal etching; the interference layer method comprises a chemical etching film forming method, an anode film covering method, a constant potential anodizing and anode precipitation method, a vacuum evaporation coating method, a sputtering coating method and a thermal dyeing method.
In some of these embodiments, the step s2 includes:
1) acquiring an original microstructure image of a workpiece measurement part: acquiring a microstructure image of a workpiece measuring part by adopting image measuring and analyzing equipment and software;
2) deformation of the workpiece measurement site:
(a) when the micro deformation and the strain and stress of the workpiece are calculated under the actual working condition, a working load is applied to the workpiece, so that the workpiece is deformed under the action of the working load;
(b) applying a test force to the workpiece when the workpiece is subjected to microscopic deformation and strain and stress calculation under the test load, so that the workpiece is deformed under the action of the test force;
(c) when the microscopic deformation of the workpiece under the action of the residual stress is measured and the residual stress is calculated, drilling or cutting is carried out on the workpiece, so that the workpiece is deformed after stress release;
3) and (3) acquiring the microstructure image of the workpiece measurement part: and acquiring the microstructure image of the workpiece after the deformation of the measuring part by adopting image measuring and analyzing equipment and software.
In some of these embodiments, the step s3 of measuring the deformation of the workpiece at the measuring position includes: and analyzing the microstructure images before and after the workpiece is deformed by adopting image measuring and analyzing equipment and software, selecting specific microstructure characteristics for measurement through manual work or analysis software, and measuring the change of the distance between the relative positions of the specific microstructure characteristics before and after the workpiece is deformed in different directions to obtain the deformation amount between the specific microstructures of the measurement part.
In some of these embodiments, the image measuring and analyzing apparatus comprises a calibrated metallographic microscope, a scanning electron microscope.
Compared with the prior art, the invention has the following beneficial effects:
1. the method of the invention displays the microstructure of the part to be detected of the metal material workpiece to enable the surface of the workpiece to present the microscopic characteristics with extremely small size of the microstructure, and directly measures the deformation of the microscopic characteristics of the microscopic structures with extremely small size, thereby greatly improving the accuracy and precision of the microscopic deformation detection.
2. The method realizes the direct measurement and analysis of the microscopic deformation of the measured part of the workpiece by analyzing the essential characteristics of the microscopic structure of the metal material and measuring the deformation, has high measurement accuracy and precision, and the measurement accuracy and the precision performance are directly measured by the magnification of the microscopic structure and the precision and the accuracy of the measurement equipment.
3. The method can directly measure the micro deformation of the workpiece measuring part in any direction and between randomly selected specific microstructure characteristics.
4. The method can use special equipment, such as high-precision image acquisition equipment and image recognition and analysis and calculation software to carry out automatic measurement and calculation, can also adopt a metallographic microscope, an electron microscope and the like to carry out manual measurement and calculation, and has wide application range.
Drawings
FIG. 1 is a drawing of a workpiece made of a metallic material according to example 2.
Fig. 2 is a picture of the original microstructure of a workpiece of a metallic material and the distances between the microstructure features of example 2.
FIG. 3 is a picture of the microstructure and the distance between microstructure features after tensile load was applied to the surface of the workpiece in example 2.
Detailed Description
In order that the invention may be more readily understood, reference will now be made to the following more particular description of the invention, examples of which are set forth below. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete. It is to be understood that the experimental procedures in the following examples, where specific conditions are not noted, are generally in accordance with conventional conditions, or with conditions recommended by the manufacturer. The various reagents used in the examples are commercially available.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example 1
The embodiment provides a method for measuring microscopic deformation of a metal material, which comprises the following steps:
s1, microscopic structure visualization of the workpiece measurement site:
1) grinding a workpiece measurement part: grinding by using grinding equipment, and sequentially grinding by using sand paper or a grinding disc with the granularity from large to small until no obvious visible scratches exist at the measured part of the workpiece;
2) polishing the ground workpiece surface: the polishing method is used for eliminating grinding marks generated by grinding on the surface of the workpiece, so that the surface of the workpiece reaches mirror finish and has no grinding defects;
3) adopting an erosion method or an interference layer method to display the microstructure of the polished surface of the workpiece;
s2, acquiring the original microstructure image of the workpiece measuring part displayed in the step s1, generating the deformation of the workpiece measuring part and acquiring the microstructure image again:
1) acquiring an original microstructure image of a workpiece measurement part: collecting a microstructure image of a workpiece measuring part by using a metallographic microscope;
2) deformation of the workpiece measurement site: applying a working load to the workpiece to enable the workpiece to deform under the action of the working load;
3) and (3) acquiring the microstructure image of the workpiece measurement part: collecting a microstructure image of a workpiece measuring part after deformation by adopting a metallographic microscope;
s3, measurement of the deformation size of the workpiece measurement site: and analyzing the microstructure images of the workpiece before and after deformation by adopting a metallographic microscope, selecting specific microstructure characteristics for measurement by analysis software, and measuring the change of the distance between the relative positions of the specific microstructure characteristics before and after deformation in different directions to obtain the deformation amount between the specific microstructures of the measured part.
Example 2
In this embodiment, the method for measuring the micro-deformation of the metal workpiece according to embodiment 1 includes the following steps:
s1, microscopic structure visualization of the workpiece measurement site:
1) grinding a workpiece measurement part: mechanical grinding is adopted for the metal material workpiece shown in the figure 1;
2) mechanically polishing the ground workpiece surface;
3) etching with 4% nitric acid alcohol after polishing for 10s to show the microstructure;
s2, acquiring the original microstructure image of the workpiece measuring part displayed in the step s1, generating the deformation of the workpiece measuring part and acquiring the microstructure image again:
1) collecting an original microstructure image by adopting a metallographic microscope;
2) deformation of the workpiece measurement site: applying a tensile load to the surface of the workpiece to enable the workpiece to deform under the action of the tensile load;
3) and (3) acquiring the microstructure image of the workpiece measurement part: collecting the microstructure of the loaded workpiece again by adopting a metallographic microscope;
s3, measurement of the deformation size of the workpiece measurement site: collecting original microstructure image with metallographic microscope, and measuring distance between specific microstructure characteristics, wherein the original microstructure image and distance between microstructure characteristics are shown in FIG. 2; the distances between the microstructure pictures and the microstructure features after the tensile load is applied to the surface of the workpiece are shown in fig. 3; the micro-deformation between selected features of the workpiece was 344.5 μm after loading minus 343.7 μm before loading, i.e., the micro-deformation of the workpiece under the loading load was 0.8 μm. The strain of the selected feature under the loading load can be further calculated through the magnitude of the deformation. The strain of the workpiece measuring part under the loading load is 0.8 μm divided by the original distance 343.7 μm, namely the local strain of the measuring part is about 0.00233, and the stress state of the part to be measured can be further analyzed according to the metal material elasticity theory and finite element analysis software.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, the scope of the present description should be considered as being described in the present specification.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for measuring microscopic deformation of a metal material is characterized by comprising the following steps:
s1, displaying the microstructure of the workpiece measuring part;
s2, acquiring the original microstructure image of the workpiece measuring part displayed in the step s1, generating the deformation of the workpiece measuring part and acquiring the microstructure image again;
s3, measuring the deformation of the workpiece measuring part.
2. The method for measuring microscopic deformation of metallic material according to claim 1, wherein said step s1 includes:
1) grinding a measuring part of the workpiece;
2) and polishing the ground workpiece surface.
3. The method for measuring microscopic deformation of metallic material according to claim 2, wherein said step s1 further comprises: 3) and (3) adopting an erosion method or an interference layer method to display the microstructure of the polished workpiece surface.
4. The method for measuring the micro-deformation of the metal material as claimed in claim 2, wherein the grinding in the step 1) is performed by using sand paper or grinding disc with the grain size from large to small in sequence until no visible scratch is formed on the measured part of the workpiece.
5. The method for measuring microscopic deformation of a metal material according to claim 2, wherein the polishing in step 2) is a polishing method for removing grinding marks on the surface of the workpiece caused by grinding, so that the surface of the workpiece has a mirror finish and is free from grinding defects.
6. The method for measuring microscopic deformation of a metallic material according to claim 2 or 5, wherein the polishing method in step 2) comprises mechanical polishing, electrolytic polishing, vibratory polishing, micro-polishing, and micro-grinding.
7. The method for measuring microscopic deformation of a metallic material according to claim 3, wherein the etching method in the step 3) comprises chemical etching, electrolytic etching, potentiostatic etching, ion etching, and thermal etching; the interference layer method comprises a chemical etching film forming method, an anode film covering method, a constant potential anodizing and anode precipitation method, a vacuum evaporation coating method, a sputtering coating method and a thermal dyeing method.
8. The method for measuring microscopic deformation of metallic material according to claim 1, wherein said step s2 includes:
1) acquiring an original microstructure image of a workpiece measurement part: acquiring a microstructure image of a workpiece measuring part by adopting image measuring and analyzing equipment and software;
2) deformation of the workpiece measurement site:
(a) when the micro deformation and the strain and stress of the workpiece are calculated under the actual working condition, a working load is applied to the workpiece, so that the workpiece is deformed under the action of the working load;
(b) applying a test force to the workpiece when the workpiece is subjected to microscopic deformation and strain and stress calculation under the test load, so that the workpiece is deformed under the action of the test force;
(c) when the microscopic deformation of the workpiece under the action of the residual stress is measured and the residual stress is calculated, drilling or cutting is carried out on the workpiece, so that the workpiece is deformed after stress release;
3) and (3) acquiring the microstructure image of the workpiece measurement part: and acquiring the microstructure image of the workpiece after the deformation of the measuring part by adopting image measuring and analyzing equipment and software.
9. The method of claim 1, wherein the step s3 of measuring the deformation of the workpiece at the measurement location comprises: and analyzing the microstructure images before and after the workpiece is deformed by adopting image measuring and analyzing equipment and software, selecting specific microstructure characteristics for measurement through manual work or analysis software, and measuring the change of the distance between the relative positions of the specific microstructure characteristics before and after the workpiece is deformed in different directions to obtain the deformation amount between the specific microstructures of the measurement part.
10. The method of claim 8 or 9, wherein the image measuring and analyzing device comprises a calibrated metallographic microscope and a scanning electron microscope.
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| CN113390358A (en) * | 2021-06-04 | 2021-09-14 | 中国十七冶集团有限公司 | Steel structure deformation monitoring method based on machine vision recognition technology |
| CN117907055A (en) * | 2024-01-17 | 2024-04-19 | 东北大学 | Preparation method of metallographic specimen of rare earth dysprosium |
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Application publication date: 20200515 |