CN111152557A - High-speed dual-process ink-jet printing equipment and ink-jet printing method - Google Patents

High-speed dual-process ink-jet printing equipment and ink-jet printing method Download PDF

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Publication number
CN111152557A
CN111152557A CN202010147858.6A CN202010147858A CN111152557A CN 111152557 A CN111152557 A CN 111152557A CN 202010147858 A CN202010147858 A CN 202010147858A CN 111152557 A CN111152557 A CN 111152557A
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CN
China
Prior art keywords
printing
workbench
circuit board
ink
jet printing
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Granted
Application number
CN202010147858.6A
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Chinese (zh)
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CN111152557B (en
Inventor
徐进
丁延贵
饶志旺
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Shenzhen Jinxin Technology Co ltd
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Shenzhen Jinxin Technology Co ltd
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Priority to CN202010147858.6A priority Critical patent/CN111152557B/en
Publication of CN111152557A publication Critical patent/CN111152557A/en
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Publication of CN111152557B publication Critical patent/CN111152557B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00Actions or mechanisms not otherwise provided for
    • B41J25/02Key actions for specified purposes
    • B41J25/08Case shift
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0081After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams

Abstract

The invention discloses a high-speed dual-process ink-jet printing device and an ink-jet printing method, wherein the device comprises: the device comprises a machine table assembly, a printing workbench assembly arranged in the machine table assembly in a nested manner, a CCD (charge coupled device) alignment system arranged at the front end above the machine table assembly, an ink-jet printing system arranged above the printing workbench assembly and a control system, wherein a circuit board is arranged on the printing workbench assembly; the ink-jet printing system comprises two sets of ink-jet printing devices, and the two sets of ink-jet printing devices can be alternately moved to the position right above the circuit board and print on the circuit board. The two sets of ink-jet printing devices using different printing inks can realize the two manufacturing processes of solder mask and characters of the circuit board at high speed on the same equipment, and meanwhile, the two printing workbenches continuously and circularly print, and the whole working process is finished at one go without interference; the automatic online production requirement is well met, the single-machine double-manufacturing process saves the production field, reduces the production cost and greatly improves the production efficiency.

Description

High-speed dual-process ink-jet printing equipment and ink-jet printing method
Technical Field
The invention relates to the technical field of printed circuit board production equipment, in particular to high-speed double-process ink-jet printing equipment and an ink-jet printing method.
Background
With the improvement and breakthrough of the printing head for jetting and the special ink technology, some manufacturing processes of the circuit board tend to adopt the ink-jet printing technology more and more, and the circuit board ink-jet printing equipment in the industry at present belongs to single ink-jet printing equipment; in the process of manufacturing the circuit board, the solder mask and the characters are two technological processes of starting and stopping, the two manufacturing processes need to be executed independently and belong to different manufacturing workshops, and related equipment, operators and production processes are long, the requirement on a production field is large, and the production cost is high.
Therefore, the prior art is not sufficient and needs to be improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides high-speed dual-process ink-jet printing equipment and an ink-jet printing method.
The technical scheme of the invention is as follows: there is provided a high speed dual process inkjet printing apparatus comprising: board assembly, nested formula are located print table assembly in the board assembly, locate the CCD counterpoint system of board assembly top front end, locate print the inkjet printing system and the control system of board assembly top, control system with print table assembly, CCD counterpoint system, inkjet printing system connect, and the circuit board sets up print table assembly is last.
The ink-jet printing system comprises two sets of ink-jet printing devices, and the two ink-jet printing devices can be alternately moved right above the circuit board and print on the circuit board.
Further, the printing workbench assembly comprises an A printing workbench and a B printing workbench, the circuit boards are respectively arranged on the A printing workbench and the B printing workbench, the A printing workbench and the B printing workbench can independently move in the Z direction and the Y direction, and the two printing workbenches can be interactively overlapped up and down in the Z direction of the equipment, so that the position exchange of the two printing workbenches and the ink-jet printing of the circuit boards are completed.
Further, the machine assembly comprises: the base, two parallels and locate relatively two Y on the base are to the base station, transversely locate two Y is to the frame crossbeam of base station top.
Further, the print station assembly further comprises: two Y-direction guide rails respectively arranged on the upper surfaces of the two Y-direction base stations, two fixed seats respectively arranged on the two Y-direction guide rails in a sliding manner, two Y-direction driving devices respectively driving the two fixed seats to move back and forth along the Y-direction guide rails, two Z-direction guide rails respectively arranged on opposite side surfaces of the two fixed seats, two workbench fixed frames respectively arranged on the two Z-direction guide rails, and two Z-direction driving devices driving the two workbench fixed frames to lift up and down, wherein the two fixed seats are respectively positioned on the inner sides of the two Y-direction base stations, the fixing base passes through connecting device and slides and locates on the Y is to the guide rail, A print workbench with B print workbench locates two respectively on the workstation mount, A, B print workbench is the same to the X on any position to Y to the coordinate to make A, B print workbench to can realize alternately overlapping from top to bottom in the Z to.
Further, the Y-direction driving device is a linear motor, and the Z-direction driving device is a screw rod motor.
Further, the inkjet printing system still includes inkjet track and two inkjet drive arrangement, the inkjet track is located the board assembly top, two the inkjet printing device all includes: the ink jet printing device comprises an ink jet printing trolley arranged on the ink jet track in a sliding mode, an ink supply device connected with the ink jet printing trolley, and a nozzle cleaning device connected with the ink jet printing trolley and the ink supply device respectively, wherein the two ink jet driving devices can drive the two ink jet printing devices to move along the ink jet track along the X direction independently.
Furthermore, the two ink-jet printing trolleys are respectively a solder mask printing trolley and a character printing trolley.
The ink-jet printing trolley comprises an ink-jet printing device and a curing device.
The two spray head cleaning devices are respectively arranged on the outer side walls of the two Y-direction base stations, and the two ink supply devices are respectively arranged at the rear ends of the two Y-direction base stations.
Further, the CCD alignment system includes: the CCD driving device can drive the two CCD devices to move along the X direction and take pictures of different target points on the circuit board.
The printing workbench assembly is sequentially provided with 3 stations from front to back, namely a plate placing/collecting station, an alignment station and a printing station.
The control system is arranged on the outer side of the Y-direction base station and used for controlling the movement and work of the whole machine.
The invention also provides a high-speed dual-process ink-jet printing method, which comprises the following steps:
step S1, initial state: A. b, the printing workbench is vertically and alternately overlapped on a plate placing/collecting station at the forefront of the equipment, and the printing workbench A is positioned at the working height and is positioned right above the printing workbench B;
step S2, A, taking a picture of the circuit board on the printing workbench and adjusting the alignment;
step S3, printing the solder mask layer and the characters of the circuit board on the workbench;
step S4, the point taking photographing and the alignment adjustment of the circuit board on the printing workbench are carried out while the step S3 is carried out;
step S5, returning the printing workbench to a playback/board collection station;
step S6, the solder mask layer printing and the character printing of the circuit board on the workbench are printed while the step S5 is carried out;
and step S7, repeating the step S2 by the printing workbench A loaded with the new circuit board to be printed, returning the printing workbench B to the board placing/receiving station, and continuously circulating the working flow by the A, B printing workbench.
Further, the two layers in step S4 and step S6 are a solder mask layer and a text layer, respectively;
step S2 specifically includes: placing the circuit board on a printing workbench A, and moving the circuit board clamped by the printing workbench A forwards to the front lower part of the frame beam; the CCD device moves to a photographing position and performs point taking photographing on a first target point and a second target point on the circuit board respectively; the printing workbench A continues to move forwards in the Y direction, and the CCD device keeps the position to conduct point taking and photographing on the third target point and the fourth target point of the circuit board on the printing workbench A; the software system compares the shooting target point with the data target point; and the software system and the motion control system simultaneously carry out adjustment and alignment on the circuit board to be subjected to jet printing.
Step S3 specifically includes: the printing workbench A moves to a printing station right below a frame beam in the Y direction, and at the moment, a welding prevention printing trolley which is positioned right above a welding prevention cleaning device on the left side of the equipment in an initial state starts to start and scans and prints UV photosensitive ink to a circuit board of the printing workbench A right below the welding prevention printing trolley back and forth to form a required welding prevention layer; and simultaneously, the UV ultraviolet curing device loaded on the welding-proof printing trolley instantly cures the welding-proof pattern layer printed on the circuit board to complete the printing of the welding-proof pattern layer, and then the welding-proof spray printing trolley moves back to the position right above the welding-proof cleaning device and cleans the spray head as required.
Starting a character printing trolley which is positioned right above a character cleaning device on the right side of equipment in an initial state, and scanning and spraying UV photosensitive ink back and forth to form required pictures and texts on a welding-proof layer on a circuit board on a table top right below; simultaneously, the UV ultraviolet light curing device loaded on the character printing trolley instantly cures the pictures and texts on the printed circuit board to complete character printing; the character spray printing trolley moves back to the position right above the character cleaning device and the spray head is cleaned as required.
Step S4 specifically includes: when the step S3 is carried out, when the printing workbench A is positioned at the alignment station, the table top of the printing workbench B positioned at the board placing/collecting station is lifted to the working height, and the other circuit board is placed on the printing workbench B; and after the circuit board is clamped by the B printing workbench, the Y moves forwards to the front lower part of the frame beam, and the step S2 is repeated to take a point and photograph and adjust and align the circuit board on the B printing workbench.
Step S5 specifically includes: a, vertically lowering the table top of a printing workbench to an interaction height, and moving the table top back to a plate placing/collecting station in front of equipment in a Y direction; and the table top of the printing workbench A rises to the working height, the printed circuit board is collected away, and a new circuit board to be printed is placed on the printing workbench A, so that the printing workbench A finishes one working process.
Step S6 specifically includes: and S5, the printing workbench B moves to the printing station right below the frame beam from the alignment station Y direction, and the step S4 is repeated to complete the solder mask layer printing and the character printing of the circuit board on the printing workbench B.
By adopting the scheme, the two sets of ink-jet printing devices using different printing inks can realize the two manufacturing processes of solder mask and characters of the circuit board at high speed on the same equipment, meanwhile, the two printing workbenches continuously and circularly print, and the whole working flow is finished at one go without mutual interference; the automatic online production requirement is well met, the single-machine double-manufacturing process saves the production field, reduces the production cost and greatly improves the production efficiency.
Drawings
FIG. 1 is a schematic perspective view of the front side of an ink jet printing apparatus according to the present invention;
FIG. 2 is a schematic perspective view of the rear side of the ink jet printing apparatus of the present invention;
FIG. 3 is a front view of the ink jet printing apparatus of the present invention;
FIG. 4 is a flow chart of an ink jet printing method of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, the present invention relates to "X direction, i.e., the left-right direction of the apparatus when the apparatus is viewed from the front", "Y direction, i.e., the front-rear direction of the apparatus when the apparatus is viewed from the front", and "Z direction, i.e., the up-down direction of the apparatus when the apparatus is viewed from the front".
Referring to fig. 1 to 3, the present invention provides a high-speed dual-process inkjet printing apparatus, including: board assembly 1, nested formula are located print table assembly 2 in the board assembly 1, locate the CCD counterpoint system 3 of 1 top front end of board assembly, locate the inkjet printing system 4 and the control system 5 of 1 top of print table assembly, control system 5 with print table assembly 2, CCD counterpoint system 3, inkjet printing system 4 connect, and the circuit board sets up print table assembly 2 is last. Specifically, in this embodiment, the inkjet printing system 4 includes two sets of inkjet printing devices, and the two sets of inkjet printing devices can alternately move to the position right above the circuit board and print different contents on the circuit board. Wherein, the printing equipment is equipped with 3 stations, respectively for putting/receiving the board station, counterpoint station, printing station from the front to the back in proper order corresponding to print work platform assembly 2. Two sets of spray printing systems using different printing inks are arranged on one device, so that the welding prevention and character manufacturing processes of the PCB can be completed on the same device at a high speed, and the problems that the welding prevention and character manufacturing processes limited by a single printing ink spray printing technology need to be independently executed, the requirement on a production field is high, and the production cost and the production efficiency cannot be better broken through are solved.
Specifically, in this embodiment, the machine assembly 1 includes: the device comprises a base 11, two parallel and opposite Y-direction base stations 12 arranged on the base 11, and a frame cross beam 13 transversely arranged above the two Y-direction base stations 12. Specifically, in the present embodiment, the control system 5 is disposed outside the Y-direction base 12, and is used for controlling the movement and operation of the whole machine.
Referring to fig. 1 and 3, the printing table assembly 2 includes: two Y-direction guide rails 21 respectively installed on the upper surface of the two Y-direction base stations 12, two fixing seats 22 respectively slidably installed on the two Y-direction guide rails 21, two Y-direction driving devices 23 respectively driving the two fixing seats 22 to move back and forth along the Y-direction guide rails 21, two Z-direction guide rails 24 respectively installed on opposite side surfaces of the two fixing seats 22, two workbench fixing frames 25 respectively installed on the two Z-direction guide rails 24, an A printing workbench 26 installed on one workbench fixing frame 25, a B printing workbench 27 installed on the other workbench fixing frame 25, and two Z-direction driving devices 28 driving the two workbench fixing frames 25 to ascend and descend vertically. Specifically, in this embodiment, the two fixing bases 22 are respectively located at the inner sides of the two Y-directional bases 12, and the fixing bases 22 are slidably disposed on the Y-directional guide rail 21 through the connecting device 29. The circuit board sets up respectively on A print table 26 and B print table 27, A print table with B print table can independently carry out Z to and Y to removing, A print table 26 with B print table 27 is the same to the coordinate in the Y of equipment to the X on any position, and it is exactly that A, B print table is to realizing alternately overlapping from top to bottom in Z to accomplish the position exchange of two print tables and the inkjet of circuit board and print. Specifically, in this embodiment, the Y-direction driving device 23 is a linear motor, and the Z-direction driving device 28 is a screw motor.
Referring to fig. 1, in the present embodiment, the CCD alignment system 3 includes: locate the CCD track 31 of frame crossbeam 13 front side, locate two CCD devices 32 and CCD drive arrangement on the CCD track 31, CCD drive arrangement can drive two CCD device 32 is along X to removing and getting some shootings to the different target spots on the circuit board, carries out the position timing of circuit board through system analysis, guarantees circuit board printing effect.
Referring to fig. 2 and fig. 3, in the present embodiment, the inkjet printing system 4 further includes an inkjet track 41 and two inkjet driving devices, the inkjet track 41 is disposed on the top of the frame beam 13, and both of the two inkjet printing devices include: an ink-jet printing trolley 42 arranged on the ink-jet track 41 in a sliding manner, an ink supply device 43 connected with the ink-jet printing trolley 42, and a nozzle cleaning device 44 respectively connected with the ink-jet printing trolley 42 and the ink supply device 43. The two inkjet printing trolleys 42 are respectively a solder mask printing trolley and a character printing trolley, and the two inkjet printing trolleys 42 respectively comprise an inkjet printing device and a curing device, specifically, in the embodiment, UV photosensitive ink is adopted, and meanwhile, the curing device is a UV ultraviolet curing device. The anti-welding printing trolley and the character printing trolley can transversely run back and forth in the middle of the frame cross beam 13 under the driving of the linear motor, wherein the zero position of the anti-welding printing trolley is arranged at the left end of the frame cross beam 13, the zero position of the character printing trolley is arranged at the right end of the frame cross beam 13, the anti-welding printing trolley and the character printing trolley are respectively provided with a printing head and a UV ultraviolet light curing device, the two printing trolleys alternately scan and print UV photosensitive ink back and forth along the transverse direction of the equipment to a circuit board on a table surface under the printing heads to form required pictures and texts, and simultaneously, the UV ultraviolet light curing devices arranged on the printing trolleys can instantly cure the pictures and texts on the printed circuit board.
Specifically, in this embodiment, the two nozzle cleaning devices 44 are respectively disposed on the outer sidewalls of the two Y-directional bases 12. The spray head cleaning device 44 comprises a welding prevention cleaning device and a character cleaning device, wherein the welding prevention cleaning device is arranged on the outer side surface of the Y-direction base station 12 on the left side and is right below the zero position of the welding prevention ink-jet printing trolley, and the character cleaning device is arranged on the outer side surface of the Y-direction base station 12 on the right side and is right below the zero position of the character ink-jet printing trolley. The anti-welding and character cleaning devices can respectively run along the Y direction of the equipment to clean the spray heads on the anti-welding and character printing trolley, so that the quality and the precision of the printed pictures and texts on the PCB are ensured.
Specifically, in the present embodiment, the two ink supply devices 43 are respectively disposed at the rear ends of the two Y-direction bases 12. In this embodiment, the two ink supply devices 43 are an anti-welding ink path system and a character ink path system, respectively, wherein the anti-welding ink path system is disposed at the rear end of the Y-directional base station 12 on the left side, the anti-welding ink path system is next to the anti-welding printing cart and the anti-welding cleaning device, the character ink path system is disposed at the rear end of the Y-directional base station 12 on the right side, and the character ink path system is next to the character printing cart and the character cleaning device. The anti-welding ink path system and the character ink path system respectively comprise a main ink barrel, a secondary ink box, an ink pump, a filter, a negative pressure tank, a vacuum pump, an ink pipe and an air pipe, wherein the main ink barrel, the secondary ink box, the ink pump, the filter, the negative pressure tank, the vacuum pump, the ink pipe and the air pipe are used for being connected with the spray head assemblies of respective spraying systems to provide ink for the spraying systems, and are also connected with the spray head suction nozzles of respective cleaning devices and the ink collecting boxes to.
Referring to fig. 4, the present invention further provides a high-speed dual process inkjet printing method, including the following steps:
step S1, initial state: A. b, the printing workbench is vertically and alternately overlapped on a plate placing/collecting station at the forefront of the equipment, and the printing workbench A is positioned at the working height and is positioned right above the printing workbench B;
step S2, A, taking a picture of the circuit board on the printing workbench and adjusting the alignment;
the specific process is as follows: placing the circuit board on a printing workbench A, and moving the circuit board clamped by the printing workbench A forwards to the front lower part of the frame beam; the CCD device moves to a photographing position and performs point taking photographing on a first target point and a second target point on the circuit board respectively; the printing workbench A continues to move forwards in the Y direction, and the CCD device keeps the position to conduct point taking and photographing on the third target point and the fourth target point of the circuit board on the printing workbench A; the software system compares the shooting target point with the data target point; and the software system and the motion control system simultaneously carry out adjustment and alignment on the circuit board to be subjected to jet printing.
Step S3, sequentially finishing the printing of the two image layers on the circuit board on the printing workbench A;
the specific process is as follows: the printing workbench A moves to a printing station right below a frame beam in the Y direction, and at the moment, a welding prevention printing trolley which is positioned right above a welding prevention cleaning device on the left side of the equipment in an initial state starts to start and scans and prints UV photosensitive ink to a circuit board of the printing workbench A right below the welding prevention printing trolley back and forth to form a required welding prevention layer; and simultaneously, the UV ultraviolet curing device loaded on the welding-proof printing trolley instantly cures the welding-proof pattern layer printed on the circuit board to complete the printing of the welding-proof pattern layer, and then the welding-proof spray printing trolley moves back to the position right above the welding-proof cleaning device and cleans the spray head as required.
Starting a character printing trolley which is positioned right above a character cleaning device on the right side of equipment in an initial state, and scanning and spraying UV photosensitive ink back and forth to form required pictures and texts on a welding-proof layer on a circuit board on a table top right below; simultaneously, the UV ultraviolet light curing device loaded on the character printing trolley instantly cures the pictures and texts on the printed circuit board to complete character printing; the character spray printing trolley moves back to the position right above the character cleaning device and the spray head is cleaned as required.
Step S4, the point taking photographing and the alignment adjustment of the circuit board on the printing workbench are carried out while the step S3 is carried out;
the specific process is as follows: when the printing workbench A is positioned at the alignment station, the table top of the printing workbench B positioned at the plate placing/collecting station is lifted to the working height, and the other circuit board is placed on the printing workbench B; and after the circuit board is clamped by the B printing workbench, the Y moves forwards to the front lower part of the frame beam, and the step S2 is repeated to take a point and photograph and adjust and align the circuit board on the B printing workbench.
Step S5, returning the printing workbench to a playback/board collection station;
the specific process is as follows: a, vertically lowering the table top of a printing workbench to an interaction height, and moving the table top back to a plate placing/collecting station in front of equipment in a Y direction; and the table top of the printing workbench A rises to the working height, the printed circuit board is collected away, and a new circuit board to be printed is placed on the printing workbench A, so that the printing workbench A finishes one working process.
Step S6, the printing of the two image layers is completed on the circuit board on the B printing workbench in sequence;
the specific process is as follows: and S5, the printing workbench B moves to the printing station right below the frame beam from the alignment station Y direction, and the step S4 is repeated to complete the solder mask layer printing and the character printing of the circuit board on the printing workbench B.
And step S7, repeating the step S2 by the printing workbench A loaded with the new circuit board to be printed, returning the printing workbench B to the board placing/receiving station, and continuously circulating the working flow by the A, B printing workbench.
Wherein, the two layers in the steps S4 and S6 are a solder mask layer and a text layer, respectively.
In conclusion, the two sets of ink-jet printing devices using different inks can realize the two manufacturing processes of solder mask and characters of the circuit board at high speed on the same equipment, meanwhile, the two printing workbenches continuously and circularly print, and the whole work flow is finished at one go without interference; the production requirement of an automatic line is well met, the single-machine double-manufacturing process saves the production field, reduces the production cost and greatly improves the production efficiency.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A high-speed dual process inkjet printing apparatus, comprising: the printing device comprises a machine table assembly, a printing workbench assembly arranged in the machine table assembly in a nested manner, a CCD (charge coupled device) alignment system arranged at the front end above the machine table assembly, an ink-jet printing system arranged above the printing workbench assembly and a control system, wherein the control system is connected with the printing workbench assembly, the CCD alignment system and the ink-jet printing system, and a circuit board is arranged on the printing workbench assembly;
the ink-jet printing system comprises two sets of ink-jet printing devices, and the two ink-jet printing devices can be alternately moved right above the circuit board and print on the circuit board.
2. The high-speed dual-process inkjet printing apparatus according to claim 1, wherein the printing table assembly includes an a printing table and a B printing table, the circuit boards are respectively disposed on the a printing table and the B printing table, the a printing table and the B printing table can independently perform Z-direction and Y-direction movement, and the two printing tables can be vertically overlapped in the Z-direction of the apparatus, thereby completing position exchange of the two printing tables and inkjet printing of the circuit boards.
3. The high-speed dual process inkjet printing apparatus of claim 2 wherein said station assembly comprises: the base, two parallels and locate relatively two Y on the base are to the base station, transversely locate two Y is to the frame crossbeam of base station top.
4. The high speed dual process inkjet printing apparatus of claim 3 wherein said print station assembly further comprises: two Y-direction guide rails respectively arranged on the upper surfaces of the two Y-direction base stations, two fixed seats respectively arranged on the two Y-direction guide rails in a sliding manner, two Y-direction driving devices respectively driving the two fixed seats to move back and forth along the Y-direction guide rails, two Z-direction guide rails respectively arranged on opposite side surfaces of the two fixed seats, two workbench fixed frames respectively arranged on the two Z-direction guide rails, and two Z-direction driving devices driving the two workbench fixed frames to lift up and down, wherein the two fixed seats are respectively positioned on the inner sides of the two Y-direction base stations, the fixing base passes through connecting device and slides and locates on the Y is to the guide rail, A print workbench with B print workbench locates two respectively on the workstation mount, A, B print workbench is the same to the X on any position to Y to the coordinate to make A, B print workbench to can realize alternately overlapping from top to bottom in the Z to.
5. The high speed dual process inkjet printing apparatus of claim 4 wherein said Y-direction drive is a linear motor and said Z-direction drive is a lead screw motor.
6. A high speed dual process inkjet printing apparatus according to any one of claims 1 to 5 wherein the inkjet printing system further comprises an inkjet track and two inkjet driving devices, the inkjet track being disposed at the top of the machine assembly, both of the inkjet printing devices comprising: the ink jet printing device comprises an ink jet printing trolley arranged on the ink jet track in a sliding mode, an ink supply device connected with the ink jet printing trolley, and a nozzle cleaning device connected with the ink jet printing trolley and the ink supply device respectively, wherein the two ink jet driving devices can drive the two ink jet printing devices to move along the ink jet track along the X direction independently.
7. The high-speed dual process inkjet printing apparatus according to claim 6 wherein said two inkjet printing carriages are a solder mask printing carriage and a text printing carriage, respectively;
the ink-jet printing trolley comprises an ink-jet printing device and a curing device;
the two spray head cleaning devices are respectively arranged on the outer side walls of the two Y-direction base stations, and the two ink supply devices are respectively arranged at the rear ends of the two Y-direction base stations.
8. A high speed dual process inkjet printing apparatus according to any one of claims 1 to 5 wherein said CCD registration system comprises: the CCD driving device can drive the two CCD devices to move along the X direction and take photos of different target points on the circuit board;
the printing workbench assembly is sequentially provided with 3 stations from front to back, namely a plate placing/collecting station, an alignment station and a printing station;
the control system is arranged on the outer side of the Y-direction base station and used for controlling the movement and work of the whole machine.
9. A high-speed dual-process ink-jet printing method is characterized by comprising the following steps:
step S1, initial state: A. b, the printing workbench is vertically and alternately overlapped on a plate placing/collecting station at the forefront of the equipment, and the printing workbench A is positioned at the working height and is positioned right above the printing workbench B;
step S2, A, taking a picture of the circuit board on the printing workbench and adjusting the alignment;
step S3, printing the solder mask layer and the characters of the circuit board on the workbench;
step S4, the point taking photographing and the alignment adjustment of the circuit board on the printing workbench are carried out while the step S3 is carried out;
step S5, returning the printing workbench to a playback/board collection station;
step S6, the solder mask layer printing and the character printing of the circuit board on the workbench are printed while the step S5 is carried out;
and step S7, repeating the step S2 by the printing workbench A loaded with the new circuit board to be printed, returning the printing workbench B to the board placing/receiving station, and continuously circulating the working flow by the A, B printing workbench.
10. A high speed dual process inkjet printing method according to claim 9,
step S2 specifically includes: placing the circuit board on a printing workbench A, and moving the circuit board clamped by the printing workbench A forwards to the front lower part of the frame beam; the CCD device moves to a photographing position and performs point taking photographing on a first target point and a second target point on the circuit board respectively; the printing workbench A continues to move forwards in the Y direction, and the CCD device keeps the position to conduct point taking and photographing on the third target point and the fourth target point of the circuit board on the printing workbench A; the software system compares the shooting target point with the data target point; the software system and the motion control system simultaneously carry out adjustment and alignment on the circuit board to be subjected to jet printing;
step S3 specifically includes: the printing workbench A moves to a printing station right below a frame beam in the Y direction, and at the moment, a welding prevention printing trolley which is positioned right above a welding prevention cleaning device on the left side of the equipment in an initial state starts to start and scans and prints UV photosensitive ink to a circuit board of the printing workbench A right below the welding prevention printing trolley back and forth to form a required welding prevention layer; simultaneously, a UV ultraviolet curing device loaded on the anti-welding printing trolley instantly cures the anti-welding layer printed on the circuit board to complete the printing of the anti-welding layer, then the anti-welding spray printing trolley moves back to the position right above the anti-welding cleaning device, and the sprayer is cleaned according to the requirement;
starting a character printing trolley which is positioned right above a character cleaning device on the right side of equipment in an initial state, and scanning and spraying UV photosensitive ink back and forth to form required pictures and texts on a welding-proof layer on a circuit board on a table top right below; simultaneously, the UV ultraviolet light curing device loaded on the character printing trolley instantly cures the pictures and texts on the printed circuit board to complete character printing; the character spray printing trolley moves back to the position right above the character cleaning device and the spray head is cleaned as required;
step S4 specifically includes: step S3, when the printing workbench A is positioned at the alignment station, the table top of the printing workbench B positioned at the board placing/collecting station is raised to the working height, and the other circuit board is placed on the printing workbench B; after the circuit board is clamped by the B printing workbench, the Y moves forwards to the front lower part of the frame beam, and the step S2 is repeated to take a point and photograph and adjust and align the circuit board on the B printing workbench;
step S5 specifically includes: a, vertically lowering the table top of a printing workbench to an interaction height, and moving the table top back to a plate placing/collecting station in front of equipment in a Y direction; lifting the table top of the printing workbench A to the working height, collecting the printed circuit board, and then placing a new circuit board to be printed on the printing workbench A, so that the printing workbench A finishes a working process;
step S6 specifically includes: and S5, the printing workbench B moves to the printing station right below the frame beam from the alignment station Y direction, and the step S4 is repeated to complete the solder mask layer printing and the character printing of the circuit board on the printing workbench B.
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