CN111152126B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN111152126B
CN111152126B CN201811474024.5A CN201811474024A CN111152126B CN 111152126 B CN111152126 B CN 111152126B CN 201811474024 A CN201811474024 A CN 201811474024A CN 111152126 B CN111152126 B CN 111152126B
Authority
CN
China
Prior art keywords
adjusting
polishing pad
processing apparatus
substrate processing
adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811474024.5A
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English (en)
Chinese (zh)
Other versions
CN111152126A (zh
Inventor
申盛皓
金泰贤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KCTech Co Ltd
Original Assignee
KCTech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KCTech Co Ltd filed Critical KCTech Co Ltd
Publication of CN111152126A publication Critical patent/CN111152126A/zh
Application granted granted Critical
Publication of CN111152126B publication Critical patent/CN111152126B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201811474024.5A 2018-11-08 2018-12-04 基板处理装置 Active CN111152126B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180136476A KR102629678B1 (ko) 2018-11-08 2018-11-08 기판 처리 장치
KR10-2018-0136476 2018-11-08

Publications (2)

Publication Number Publication Date
CN111152126A CN111152126A (zh) 2020-05-15
CN111152126B true CN111152126B (zh) 2023-06-20

Family

ID=70555601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811474024.5A Active CN111152126B (zh) 2018-11-08 2018-12-04 基板处理装置

Country Status (2)

Country Link
KR (1) KR102629678B1 (ko)
CN (1) CN111152126B (ko)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP4817687B2 (ja) * 2005-03-18 2011-11-16 株式会社荏原製作所 研磨装置
US7163435B2 (en) * 2005-01-31 2007-01-16 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of CMP pad conditioning process
CN100560295C (zh) * 2007-06-29 2009-11-18 上银科技股份有限公司 研磨切削颤振的抑制机构
CN201544116U (zh) * 2009-12-15 2010-08-11 上海华虹Nec电子有限公司 Cmp研磨装置
KR20160051219A (ko) * 2014-11-03 2016-05-11 주식회사 케이씨텍 연마 패드의 높이 편차 측정이 가능한 화학 기계적 연마 장치의 컨디셔너
KR101916211B1 (ko) * 2015-12-07 2018-11-07 주식회사 케이씨텍 화학 기계적 연마 장치 및 그 방법
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
US10930535B2 (en) * 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
KR20180089037A (ko) * 2017-01-31 2018-08-08 주식회사 케이씨텍 기판 처리 장치 및 그 제어방법
KR102629676B1 (ko) * 2017-01-31 2024-01-29 주식회사 케이씨텍 화학 기계적 연마 장치의 컨디셔너
CN207290112U (zh) * 2017-07-03 2018-05-01 株式会社安川电机 机器人研磨系统、机器人系统、研磨装置、吸盘装置、驱动部件及压力产生装置

Also Published As

Publication number Publication date
KR20200053183A (ko) 2020-05-18
KR102629678B1 (ko) 2024-01-29
CN111152126A (zh) 2020-05-15

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