CN111151206B - A plasma device for processing liquids - Google Patents

Abstract

The invention relates to a plasma device for processing liquid, comprising a frame, a high-voltage device, a steering assembly, and a low-voltage device; the high-voltage device, the steering assembly, and the low-voltage device are all arranged on the frame, and the high-voltage device passes through the The steering assembly is communicated with the low pressure device; the high pressure device includes a high pressure tank, a high pressure upper cover, a liquid inlet and an air inlet; the low pressure device includes a low pressure upper cover, a low pressure lower cover, a low pressure glass tube, and an electrode column; The invention solves the defects such as uneven treatment and small treatment amount in the liquid plasma treatment in the prior art. The invention uses a high-pressure environment to melt the gas into the liquid, and then changes to a low-pressure environment, and the gas is in a bubble state from the liquid. Precipitation, and the bubble diameter is very small, to achieve the purpose of full contact between the gas and the liquid, and to achieve plasma discharge, improve the discharge effect and the uniformity of the treatment, so as to improve the treatment effect of the product.

Description

A plasma device for processing liquids

technical field

The invention relates to the technical field of plasma processing equipment, in particular to a plasma device for processing liquid.

Background technique

Plasma is the fourth state of matter different from solids, liquids and gases. Plasma, also known as plasma, is an ionized gas-like substance composed of positive and negative ions generated by atoms deprived of some electrons and atomic groups by ionization.

Plasma is composed of a collection of ions, electrons, and unionized neutral particles, and the whole is a neutral state of matter. Plasma can be divided into two types: high temperature and low temperature plasma. The plasma temperature is represented by the electron temperature and the ion temperature respectively. If the two are equal, they are called high temperature plasma; if they are not equal, they are called low temperature plasma. Low-temperature plasma is a plasma that occurs at room temperature (although the temperature of electrons is very high). Low-temperature plasma can be used for surface treatment such as oxidation, denaturation, or precipitation coating treatment on organic and inorganic substances. Low-temperature plasma is widely used. Used in a variety of production fields.

Plasma treatment technology is one of the most effective treatment processes for cleaning, activating and coating surfaces. It can be used to treat various materials, including plastics, metals or glass, by physicochemical modification of the surface to improve surface adhesion. Wait. Plasma devices for liquid treatment in the prior art mainly include two types, namely water surface treatment and bubbling treatment. Water surface treatment is water surface direct operation treatment. This method has a simple structure and is easy to implement, but the treatment is uneven and the amount of Very tiny, not suitable for large-scale processing. Bubble treatment. Bubble treatment is to generate bubbles in the liquid, and plasma is generated in the bubbles, but the size of the bubbles is large and the discharge distance is small. Although the uniformity of the treatment is greatly improved compared with the first one, the degree of improvement is limited.

Therefore, how to provide a plasma device for processing liquid, so as to realize the microbubble of the gas in the liquid to a degree that is difficult to distinguish with the naked eye, and realize plasma discharge, improve the discharge effect and uniformity, and thus improve the treatment of products The effect is a technical problem to be solved urgently by those skilled in the art at present.

SUMMARY OF THE INVENTION

In view of this, the purpose of the present application is to provide a plasma device for processing liquid, so as to realize the microbubble of gas in the liquid to the extent that it is difficult to distinguish with the naked eye, and realize plasma discharge, improve the discharge effect and the uniformity of treatment so as to improve the treatment effect of the product.

In order to achieve the above purpose, the present application provides the following technical solutions.

A plasma device for processing liquid, comprising a frame, a high-voltage device, a steering assembly, and a low-voltage device;

The high-voltage device, the steering assembly, and the low-voltage device are all arranged on the frame, and the high-voltage device communicates with the low-voltage device through the steering assembly.

Preferably, the rack includes a bottom plate, a top plate, and a column, and the bottom plate and the top plate are fixedly connected by the column;

The high pressure device is arranged above the bottom plate, and the low pressure device is arranged above the top plate.

Preferably, the high-pressure device includes a high-pressure tank, a high-pressure upper cover, a liquid inlet and an air inlet, the high-pressure tank and the high-pressure upper cover are fixedly connected by screws and nuts; the liquid inlet is connected to the The high-pressure upper cover is connected, and the pipeline is provided with a first control valve.

Preferably, the high-pressure device further includes a pressure relief valve and a pressure gauge, the pressure relief valve is fixedly connected to the high-pressure upper cover through a straight-through joint; the pressure gauge is fixed on the high-pressure upper cover.

Preferably, the steering assembly includes a valve seat, a drain pipe, and a manual steering valve; the lower end of the valve seat is fixed above the high-pressure device by screws, and the upper end is fixed on the top plate;

The manual steering valve and the drain pipe are both fixed on the valve seat, and the drain pipe is provided with a second control valve.

Preferably, the low-pressure device includes a low-pressure upper cover, a low-pressure lower cover, a low-pressure glass tube, and an electrode column; the upper and lower ends of the low-pressure glass tube are respectively in contact with the low-pressure upper and lower covers through silica gel pads;

The low-pressure upper cover and the low-pressure lower cover are fixedly connected by tie rod studs.

Preferably, the electrode column is arranged in the low-pressure glass tube, the electrode column includes a positive electrode column and a negative electrode column, and the positive electrode column and the negative electrode column are spaced at a column/row unit interval.

Preferably, one end of the negative electrode column is fixed on the low-voltage lower cover by a first electrode fixing plate, and the other end is fixed by a second electrode fixing plate.

Preferably, the positive electrode column is arranged in a glass rod, the lower end of the glass rod is arranged above the first electrode plate, and the upper end is fixed on the second electrode plate;

The positive electrode column passes through the low-voltage upper cover and is fixed on the shorting board above the low-voltage upper cover.

Preferably, the diameter of the upper end of the positive electrode column is reduced to form a transition table, and a tetrafluoro tube is arranged on the transition table, the tetrafluoro tube passes through the low pressure upper cover, and a tetrafluoroethylene tube is arranged above the low pressure upper cover Tube pressure plate.

Beneficial technical effect obtained by the present invention:

1) The present invention mainly solves the defects such as uneven treatment and small amount of treatment existing in the liquid plasma treatment in the prior art. The present invention can microbubble the gas in the liquid to a degree that is difficult to distinguish with the naked eye, and realizes the plasma Discharge, improve the discharge effect and the uniformity of treatment, so as to improve the treatment effect of the product;

2) In the present invention, the gas is integrated into the liquid by means of a high-pressure environment, and then suddenly changes to a low-pressure environment. The gas is precipitated from the liquid in a bubble state, and the diameter of the bubble is very small, so as to achieve the purpose of full contact between the gas and the liquid, which is conducive to improving the processing efficiency. Efficiency and uniformity;

3) In the present invention, through the high-voltage device, the steering assembly, and the low-voltage device, the liquid is first entered into the high-voltage device from the liquid inlet, and then enters the low-voltage device through the steering assembly under the action of high pressure, and is subjected to the plasma discharge treatment of the positive and negative electrode columns in the low-voltage device. , which is beneficial to improve the uniformity of plasma treatment.

The above description is only an overview of the technical solution of the present application, in order to be able to understand the technical means of the present application more clearly, so that it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand , the preferred embodiments of the present application and the accompanying drawings are described in detail below.

The above and other objects, advantages and features of the present application will be more apparent to those skilled in the art from the following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are For some embodiments of the present application, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. In the drawings, each element or section is not necessarily drawn to actual scale.

FIG. 1 is a schematic structural diagram of a plasma device for processing liquid in an embodiment of the present disclosure;

Fig. 2 is the front view of the plasma apparatus for processing liquid in Fig. 1;

3 is a schematic structural diagram of a high-voltage device and a low-voltage device in an embodiment of the present disclosure;

4 is a schematic diagram 1 of the internal structure of a low-voltage device in an embodiment of the present disclosure;

5 is a second schematic diagram of the internal structure of a low-voltage device in an embodiment of the present disclosure;

6 is a first structural schematic diagram of electrode column distribution in an embodiment of the present disclosure;

FIG. 7 is a second structural schematic diagram of electrode column distribution in an embodiment of the present disclosure.

In the above drawings: 1, frame; 101, bottom plate; 102, top plate; 103, pillar; 2, high pressure device; 201, high pressure tank; 202, high pressure upper cover; 203, liquid inlet; 204, pipeline, 205 , the first control valve; 206, the relief valve; 207, the straight joint; 208, the pressure gauge; 209, the screw; 3, the steering assembly; 301, the valve seat; 302, the drain pipe; 303, the second control valve; 304 4, low pressure device; 401, low pressure upper cover; 402, low pressure lower cover; 403, low pressure glass tube; 404, positive electrode column; 405, negative electrode column; 406, tie rod stud; 407, first electrode fixing plate; 408, second electrode fixing plate; 409, glass rod; 410, glass rod sealing plate; 411, shorting plate; 412, tetrafluorotube; 413, tetrafluorotube pressing plate.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. In the following description, specific details such as specific configurations and components are provided merely to assist in a comprehensive understanding of embodiments of the present application. Accordingly, it should be apparent to those skilled in the art that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the embodiments for clarity and conciseness.

It should be understood that reference throughout the specification to "one embodiment" or "the present embodiment" means that a particular feature, structure or characteristic associated with the embodiment is included in at least one embodiment of the present application. Thus, appearances of "one embodiment" or "this embodiment" in various places throughout this specification are not necessarily necessarily referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments.

Furthermore, this application may repeat reference numerals and/or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed.

The term "and/or" in this article is only an association relationship to describe associated objects, indicating that there can be three kinds of relationships, for example, A and/or B, which can mean: A alone exists, B alone exists, and A and B exist simultaneously. There are three cases of B. In this article, the term "/and" is to describe another related object relationship, which means that there can be two relationships, for example, A/ and B, which can mean that A exists alone, and A and B exist alone. , In addition, the character "/" in this text generally indicates that the related objects are an "or" relationship.

The term "at least one" in this paper is only an association relationship to describe the associated objects, which means that there can be three kinds of relationships, for example, at least one of A and B, it can mean that A exists alone, A and B exist at the same time, There are three cases of B alone.

It should also be noted that in this document, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply those entities or operations There is no such actual relationship or order between them. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion.

Example 1

As shown in FIGS. 1 and 2 , a plasma device for processing liquid includes a frame 1 , a high-voltage device 2 , a steering assembly 3 , and a low-voltage device 4 .

The high-voltage device 2 , the steering assembly 3 , and the low-voltage device 4 are all disposed on the frame 1 , and the high-voltage device 2 communicates with the low-voltage device 4 through the steering assembly 3 .

The rack 1 includes a bottom plate 101 , a top plate 102 , and a column 103 , and the bottom plate 101 and the top plate 102 are fixedly connected through the column 103 .

The high pressure device 2 is arranged above the bottom plate 101 , and the low pressure device 4 is arranged above the top plate 102 .

Referring to FIG. 2 , the high-pressure device 2 includes a high-pressure tank 201 , a high-pressure upper cover 202 , a liquid inlet 203 and an air inlet.

The high-pressure tank 201 and the high-pressure upper cover 202 are provided with corresponding threaded holes. The high-pressure tank 201 and the high-pressure upper cover 202 are respectively fixed to both ends of the screw rod 209 and further locked with nuts.

Preferably, an O-ring is provided at the contact between the high-pressure tank 201 and the high-pressure upper cover 202 to improve the tightness of the high-pressure tank 201 and the high-pressure upper cover 202 .

The liquid inlet 203 is communicated with the high-pressure upper cover 202 through a pipeline 204, and a first control valve 205 is provided on the pipeline 204, and the first control valve 205 is used to control the flow of the liquid.

The air inlet is arranged on the high pressure tank 201 and is located at a lower position. The air inlet is connected with a ventilation pipe in the high pressure tank 201. The vent pipe passes through the bread stone.

The high-pressure device 2 further includes a pressure relief valve 206 and a pressure gauge 208 . The pressure relief valve 206 is fixedly connected to the high-pressure upper cover 202 through a straight-through joint 207 , and the pressure gauge 208 is fixed on the high-pressure upper cover 202 . .

As shown in FIG. 3 , the steering assembly 3 includes a valve seat 301 , a drain pipe 302 , and a manual steering valve 304 .

The lower end of the valve seat 301 is fixed on the high pressure upper cover 202 by screws, and the upper end is fixed on the top plate 102 by screws. The valve seat 301 is connected with the high pressure device 2 and the low pressure device 4 respectively.

The manual steering valve 304 and the drain pipe 302 are both fixed on the valve seat 301 , and the drain pipe 302 is provided with a second control valve 303 for controlling the flow of the liquid.

Referring to FIG. 3 , the low-pressure device 4 includes a low-pressure upper cover 401 , a low-pressure lower cover 402 , a low-pressure glass tube 403 , and an electrode column.

The upper and lower ends of the low-pressure glass tube 403 are respectively contacted with the low-pressure upper cover 401 and the low-pressure lower cover 402 through silicone pads (not shown in the drawings), so as to improve the tightness of the contact.

A tie rod stud 406 is provided between the low pressure upper cover 401 and the low pressure lower cover 402 , the low pressure upper cover 401 , the low pressure lower cover 402 , and the top plate 102 are all provided with threads, and the tie rod stud 406 is connected with all the threaded rods. One end of the tie rod stud 406 is fixedly connected to the low pressure upper cover 401 through a nut, and the other end is fixedly connected to the low pressure lower cover 402 and the top plate 102 .

As shown in FIG. 4 , the electrode column is arranged in the low pressure glass tube 403 , the electrode column includes a positive electrode column 404 and a negative electrode column 405 , the positive electrode column 404 and the negative electrode column 405 are separated by The columns/rows are distributed at unit intervals, and a plasma discharge treatment area is formed between the positive electrode column 404 and the negative electrode column 405 .

One end of the negative electrode column 405 is fixed on the low-voltage lower cover 402 through the first electrode fixing plate 407, and the low-voltage lower cover 402 is provided with a column hole corresponding to the negative electrode column 405, so that the negative electrode The electrode column 405 is fixed stably, and the other end is fixed by the second electrode fixing plate 408 .

Preferably, a column hole corresponding to the negative electrode column 405 is provided on the low pressure lower cover 402 , so that the negative electrode column 405 extends into the low pressure lower cover 402 .

As shown in FIG. 5 , the positive electrode column 404 is arranged in a glass rod 409 , the lower end of the glass rod 409 is arranged above the first electrode plate, and the upper end is fixed on the second electrode plate.

The glass rod 409 passes through the second electrode plate, a glass rod sealing plate 410 is disposed above the second electrode plate, the glass rod 409 passes through the glass rod sealing plate 410, and the glass rod 409 is connected to the glass rod sealing plate 410. O-rings are provided at the contact points between the second electrode plate and the glass rod sealing plate 410 .

As shown in FIG. 6 , the diameter of the upper end of the positive electrode column 404 is reduced at the position below the second electrode plate, and a transition table is formed. The transition table is provided with a PTFE tube 412 . 412 passes through the low pressure upper cover 401 , and a tetrafluoro tube pressing plate 413 is arranged above the low pressure upper cover 401 .

As shown in FIG. 7 , the positive electrode column 404 passes through the low-voltage upper cover 401 and is fixed on the shorting plate 411 above the low-voltage upper cover 401 to realize the connection between the positive electrode column 404 and the power supply. connect.

The above-mentioned plasma device for processing liquid passes through the high-pressure device 2, the steering assembly 3, and the low-pressure device 4. First, the liquid enters the high-pressure device 2 from the liquid inlet 203, and the gas is injected into the high-pressure device 2 from the air inlet. The assembly 3 enters the low-pressure glass tube 403 in the low-pressure device 4, and is subjected to plasma discharge treatment of the positive and negative electrode columns in the low-pressure device 4. After the treatment is completed, it is discharged through the drain pipe 302 in the steering assembly 3; this is conducive to improving the plasma The uniformity of the body treatment; with the help of the high-pressure environment, the gas is melted into the liquid, and then suddenly changed to a low-pressure environment, the gas is precipitated from the liquid in the state of bubbles, and the diameter of the bubbles is very small, so as to achieve the purpose of full contact between the gas and the liquid, which is beneficial to Improve process efficiency and uniformity.

The above-mentioned plasma device for processing liquid mainly solves the defects of uneven processing and small processing amount in the liquid plasma processing in the prior art. Realize plasma discharge, improve the discharge effect and the uniformity of treatment, so as to improve the treatment effect of the product.

The above descriptions are only preferred embodiments of the present invention, which are not intended to limit the protection scope of the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any changes, modifications, substitutions, integrations and parameter changes to these embodiments without departing from the principles and spirit of the present invention, through conventional substitutions or capable of achieving the same function within the spirit and principles of the present invention, all fall within the scope of the present invention. into the protection scope of the present invention.

Claims (8)

1. A plasma device for processing liquid is characterized by comprising a frame (1), a high-pressure device (2), a steering assembly (3) and a low-pressure device (4);

the high-pressure device (2), the steering assembly (3) and the low-pressure device (4) are all arranged on the rack (1), and the high-pressure device (2) is communicated with the low-pressure device (4) through the steering assembly (3);

the rack (1) comprises a bottom plate (101), a top plate (102) and a strut (103), wherein the bottom plate (101) is fixedly connected with the top plate (102) through the strut (103);

the high-pressure device (2) is arranged above the bottom plate (101), and the low-pressure device (4) is arranged above the top plate (102);

the high-pressure device (2) comprises a high-pressure tank (201), a high-pressure upper cover (202), a liquid inlet (203) and a gas inlet, wherein the high-pressure tank (201) is fixedly connected with the high-pressure upper cover (202) through a screw (209) and a nut; the liquid inlet (203) is communicated with the high-pressure upper cover (202) through a pipeline (204), and a first control valve (205) is arranged on the pipeline (204);

the air inlet sets up on high-pressure tank (201), and be located the position of descenting, the air inlet is in high-pressure tank (201) in-connection has the breather pipe.

2. A liquid processing plasma device according to claim 1, wherein said high pressure device (2) further comprises a pressure relief valve (206), a pressure gauge (208), said pressure relief valve (206) being fixedly connected to said high pressure upper cover (202) by a through connection (207); the pressure gauge (208) is fixed on the high-pressure upper cover (202).

3. A liquid processing plasma device according to claim 1, characterized in that said diverting assembly (3) comprises a valve seat (301), a drain (302), a manual diverting valve (304); the lower end of the valve seat (301) is fixed above the high-pressure device (2) through a screw, and the upper end of the valve seat is fixed on the top plate (102);

the manual steering valve (304) and the liquid discharge pipe (302) are fixed on the valve seat (301), and a second control valve (303) is arranged on the liquid discharge pipe (302).

4. A liquid processing plasma device according to claim 1, characterized in that the low pressure means (4) comprises a low pressure upper cover (401), a low pressure lower cover (402), a low pressure glass tube (403), an electrode column; the upper end and the lower end of the low-pressure glass tube (403) are respectively contacted with the low-pressure upper cover (401) and the low-pressure lower cover (402) through silica gel pads;

the low-pressure upper cover (401) is fixedly connected with the low-pressure lower cover (402) through a pull rod stud (406).

5. A liquid processing plasma device according to claim 4, characterized in that the electrode columns are arranged inside the low pressure glass tube (403), the electrode columns comprise a positive electrode column (404) and a negative electrode column (405), and the positive electrode column (404) and the negative electrode column (405) are spaced in units of columns/rows.

6. A liquid processing plasma device according to claim 5, characterized in that the negative electrode column (405) is fixed at one end to the low pressure lower cover (402) by a first electrode fixing plate (407) and at the other end by a second electrode fixing plate (408).

7. A liquid processing plasma device according to claim 6, characterized in that the positive electrode column (404) is arranged inside a glass rod (409), the lower end of the glass rod (409) is arranged above the first electrode fixing plate, and the upper end is fixed on the second electrode fixing plate;

the positive electrode column (404) penetrates through the low-voltage upper cover (401) and is fixed on a short-circuit board (411) above the low-voltage upper cover (401).

8. A liquid processing plasma device according to claim 7, wherein the diameter of the upper end of the positive electrode column (404) is reduced to form a transition table, a tetrafluoride pipe (412) is arranged on the transition table, the tetrafluoride pipe (412) passes through the low pressure upper cover (401), and a tetrafluoride pipe pressing plate (413) is arranged above the low pressure upper cover (401).

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