CN111147772B - 基于复合介质栅双晶体管光敏探测器的曝光方法及其电路 - Google Patents
基于复合介质栅双晶体管光敏探测器的曝光方法及其电路 Download PDFInfo
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- CN111147772B CN111147772B CN201911257874.4A CN201911257874A CN111147772B CN 111147772 B CN111147772 B CN 111147772B CN 201911257874 A CN201911257874 A CN 201911257874A CN 111147772 B CN111147772 B CN 111147772B
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- composite dielectric
- photosensitive detector
- dielectric gate
- exposure
- transistor photosensitive
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- 239000002131 composite material Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 abstract description 7
- 230000003068 static effect Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000004576 sand Substances 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
- H04N25/531—Control of the integration time by controlling rolling shutters in CMOS SSIS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
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CN201911257874.4A CN111147772B (zh) | 2019-12-10 | 2019-12-10 | 基于复合介质栅双晶体管光敏探测器的曝光方法及其电路 |
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CN201911257874.4A CN111147772B (zh) | 2019-12-10 | 2019-12-10 | 基于复合介质栅双晶体管光敏探测器的曝光方法及其电路 |
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CN111147772A CN111147772A (zh) | 2020-05-12 |
CN111147772B true CN111147772B (zh) | 2022-04-22 |
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CN117319821B (zh) * | 2023-11-30 | 2024-03-15 | 南京大学 | 基于偏置电流源的复合介质栅双晶体管像素读出电路 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102544039A (zh) * | 2012-01-09 | 2012-07-04 | 南京大学 | 基于复合介质栅mosfet光敏探测器源漏浮空编程方法 |
CN102938409A (zh) * | 2012-11-07 | 2013-02-20 | 南京大学 | 基于复合介质栅mosfet的双晶体管光敏探测器及其信号读取办法 |
CN103165628A (zh) * | 2011-12-14 | 2013-06-19 | 南京大学 | 基于复合介质栅mosfet光敏探测器的多功能曝光成像方法 |
CN107180844A (zh) * | 2017-06-26 | 2017-09-19 | 南京大学 | 一种复合介质栅电容耦合变增益光敏探测器及其工作方法 |
CN107658321A (zh) * | 2016-07-25 | 2018-02-02 | 南京大学 | 基于复合介质栅的双器件光敏探测单元、探测器及其方法 |
CN109728006A (zh) * | 2017-10-30 | 2019-05-07 | 南京吉相传感成像技术研究院有限公司 | 基于复合介质栅mosfet的全局曝光光敏探测器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2429864B (en) * | 2005-09-01 | 2008-09-24 | Micron Technology Inc | Method and apparatus providing pixel array having automatic light control pixels and image capture pixels |
JP6263914B2 (ja) * | 2013-09-10 | 2018-01-24 | 株式会社リコー | 撮像装置、撮像装置の駆動方法、および、カメラ |
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- 2019-12-10 CN CN201911257874.4A patent/CN111147772B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165628A (zh) * | 2011-12-14 | 2013-06-19 | 南京大学 | 基于复合介质栅mosfet光敏探测器的多功能曝光成像方法 |
CN102544039A (zh) * | 2012-01-09 | 2012-07-04 | 南京大学 | 基于复合介质栅mosfet光敏探测器源漏浮空编程方法 |
CN102938409A (zh) * | 2012-11-07 | 2013-02-20 | 南京大学 | 基于复合介质栅mosfet的双晶体管光敏探测器及其信号读取办法 |
CN107658321A (zh) * | 2016-07-25 | 2018-02-02 | 南京大学 | 基于复合介质栅的双器件光敏探测单元、探测器及其方法 |
CN107180844A (zh) * | 2017-06-26 | 2017-09-19 | 南京大学 | 一种复合介质栅电容耦合变增益光敏探测器及其工作方法 |
CN109728006A (zh) * | 2017-10-30 | 2019-05-07 | 南京吉相传感成像技术研究院有限公司 | 基于复合介质栅mosfet的全局曝光光敏探测器 |
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Effective date of registration: 20240409 Address after: 210046 Xianlin Avenue 163, Qixia District, Nanjing City, Jiangsu Province Patentee after: NANJING University Country or region after: China Address before: 211135 room 801, building 9, No. 100, Tianjiao Road, Qilin high tech Industrial Development Zone, Jiangning District, Nanjing, Jiangsu Province Patentee before: Nanjing Weipaishi Semiconductor Technology Co.,Ltd. Country or region before: China Patentee before: NANJING University |