CN111146359A - Flexible display panel, manufacturing method thereof and display device - Google Patents
Flexible display panel, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN111146359A CN111146359A CN201911371186.0A CN201911371186A CN111146359A CN 111146359 A CN111146359 A CN 111146359A CN 201911371186 A CN201911371186 A CN 201911371186A CN 111146359 A CN111146359 A CN 111146359A
- Authority
- CN
- China
- Prior art keywords
- substrate
- display panel
- area
- flexible
- flexible display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 230000004888 barrier function Effects 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229920006280 packaging film Polymers 0.000 claims description 4
- 239000012785 packaging film Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 230000035515 penetration Effects 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000006870 function Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004590 computer program Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a flexible display panel, a manufacturing method thereof and a display device. Wherein the flexible display panel includes: the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged, wherein the first substrate is provided with a through hole area; the organic light-emitting functional film layer is positioned on one side, away from the first substrate, of the second substrate and is provided with an under-screen camera shooting display area corresponding to the through hole area; and an encapsulation film covering the organic light emitting functional film layer. Through increasing the sacrificial layer in the flexible substrate, get rid of the substrate that corresponds the display area of making a video recording under the screen in the first substrate simultaneously to increase the regional light penetration rate of camera under the screen in the display panel, thereby when realizing the clear formation of image of the display area of making a video recording under the screen, the flexible display panel that corresponds the region also can normally show.
Description
Technical Field
The application relates to the technical field of display, in particular to a flexible display panel, a manufacturing method thereof and a display device.
Background
With the development of display technology, the comprehensive screen has a larger screen occupation ratio and an ultra-narrow frame, and compared with a common display screen, the comprehensive screen can greatly improve the visual effect of a viewer, thereby receiving wide attention. At present, in a display device such as a mobile phone using a full-screen, in order to realize functions of self-photographing and video call, a front camera and the like are generally provided in a display area.
At present, in order to meet the flexibility of the flexible display screen, an organic light emitting display panel is generally adopted to manufacture the flexible display screen. In order to realize a full-screen display on the flexible display screen, a through hole or a blind hole is required to be arranged in a display area of the flexible display screen, so that a camera under the screen is placed in a corresponding area of the through hole or the blind hole. The through hole is a through hole penetrating through the thickness direction of the flexible display screen, and the position of the opening has no display function; the blind hole is designed by making special pixel and circuit in the light-emitting effective area to increase the light penetration rate of the panel, and the position of the open hole has display function. Therefore, the through hole is designed at the position of the opening without a display function, the integral screen occupation ratio is poor, and the display screen effect is influenced; the panel penetration rate of blind hole design can't reach the same level with the through-hole again, influences the camera shooting effect under the screen.
Therefore, how to increase the light penetration rate of the area of the under-screen camera in the display screen is a technical problem which needs to be solved urgently in the field.
Disclosure of Invention
The application aims to provide a flexible display panel, a manufacturing method of the flexible display panel and a display device.
A first aspect of the present application provides a flexible display panel, comprising:
the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged, wherein the first substrate is provided with a through hole area;
the organic light-emitting functional film layer is positioned on one side, away from the first substrate, of the second substrate and is provided with an under-screen camera shooting display area corresponding to the through hole area; and the number of the first and second groups,
and the packaging film covers the organic light-emitting functional film layer.
In one possible implementation, the sacrificial layer is made of amorphous silicon or silicon nitride.
In one possible implementation, the thickness of the sacrificial layer is 50 to 5000 nanometers.
In one possible implementation, the first substrate is made of polyimide.
In one possible implementation, the via area is circular or square.
A second aspect of the present application provides a display device comprising:
a flexible display panel as described in the first aspect; and the number of the first and second groups,
and the camera structure is arranged at the through hole area.
In a possible implementation manner, the light entering region of the camera structure corresponds to the through hole region, and the area of the through hole region is larger than that of the light entering region of the camera structure.
A third aspect of the present application provides a method for manufacturing a flexible display panel, for manufacturing the flexible display panel according to the first aspect, including:
forming a flexible substrate, wherein the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged;
removing the pattern of the first substrate at the via region;
forming an organic light-emitting functional film layer on one side of the second substrate, which is far away from the first substrate;
forming an under-screen camera display area corresponding to the through hole area in the organic light-emitting function film layer;
and forming an encapsulation film covering the organic light-emitting functional film layer.
Compared with the prior art, the flexible display panel provided by the application has the advantages that the flexible substrate comprises the first substrate, the sacrificial layer, the blocking layer and the second substrate which are sequentially arranged, the sacrificial layer is additionally arranged in the flexible substrate, the substrate corresponding to the lower-screen camera shooting display area in the first substrate is removed at the same time, the light penetration rate of the lower-screen camera shooting display area in the display panel is increased, the clear imaging of the lower-screen camera shooting display area is realized, and the flexible display panel corresponding to the area can normally display.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 illustrates a schematic structural diagram of a flexible display panel provided in some embodiments of the present application;
fig. 2 illustrates a flow chart of a method of fabricating a flexible display panel according to some embodiments of the present application;
fig. 3 to 7 are schematic structural diagrams illustrating steps of a method for manufacturing a flexible display panel according to some embodiments of the present application after the steps are completed;
fig. 8 is a schematic structural diagram of a display device according to some embodiments of the present disclosure.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.
In addition, the terms "first" and "second", etc. are used to distinguish different objects, rather than to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Flexible display: a flexible display panel belongs to a self-luminous type display device, and generally includes a pixel electrode and a common electrode serving as an anode and a cathode, respectively, and an organic light emitting layer disposed between the pixel electrode and the common electrode, so that light is emitted from the organic light emitting layer when appropriate voltages are applied to the anode and the cathode. The organic luminescent layer comprises a hole injection layer arranged on the anode, a hole transport layer arranged on the hole injection layer, a luminescent layer arranged on the hole transport layer, an electron transport layer arranged on the luminescent layer and an electron injection layer arranged on the electron transport layer.
The embodiments of the present application provide a flexible display panel, a method for manufacturing the flexible display panel, and a display device, which are described below with reference to the accompanying drawings.
Referring to fig. 1, a block diagram of a flexible display panel provided in some embodiments of the present application is shown, where as shown, the flexible display panel includes: a flexible substrate 100, an organic light emitting functional film layer 200, and an encapsulation film 300.
The flexible substrate 100 comprises a first substrate 110, a sacrificial layer 120, a barrier layer 130 and a second substrate 140 which are arranged in sequence, wherein the first substrate 140 is provided with a through hole area A;
the organic light-emitting functional film layer 200 is located on the side, away from the first substrate 110, of the second substrate 140, and the organic light-emitting functional film layer 200 has an under-screen image capture display area B corresponding to the through hole area a; it should be noted that the pixel density of the under-screen image display area B in the organic light emitting functional film layer 200 is less than that of the other area surrounding the area, and the specific pixel arrangement mode may be any mode, which is not limited herein. The organic light emitting functional film 200 includes a pixel electrode and a common electrode serving as an anode and a cathode, respectively, and an organic light emitting layer disposed between the pixel electrode and the common electrode.
The encapsulation film 300 covers the organic light emitting functional film layer 200. Specifically, the encapsulation film may include a plurality of inorganic films and at least one organic film alternately disposed. The encapsulation film is formed by alternately stacking inorganic films and organic films, and is used for protecting the organic light-emitting functional film layer from external moisture, oxygen and the like. Wherein, the inorganic film mainly plays a role in preventing water and oxygen from entering, and the organic film enables the packaging film to have certain flexibility.
In this embodiment, because the pixel density of the under-screen camera display area B is reduced, under the condition that the size of the under-screen camera display area B itself is not changed, the number of opaque sub-pixels in the under-screen camera display area B is reduced, the region capable of transmitting light is increased along with the reduction of the pixel density, thereby enabling the under-screen camera display area B to have sufficient light penetration rate to complete the under-screen camera, meanwhile, the under-screen camera display area B can still realize display, that is, the under-screen camera display is realized while real full screen display is realized. In order to further increase the light transmittance of the display panel, compared to the prior art, in the present embodiment, the sacrificial layer 120 is added in the flexible substrate 100, the sacrificial layer 120 is located between the first substrate 110 and the barrier layer 130, and a through hole region a is formed on the first substrate 110 in a region corresponding to the off-screen image capture and display region B. When the camera structure is arranged in the through hole area A, compared with the prior art, the light inlet quantity of the camera structure can be increased, and meanwhile, the screen display effect can be kept.
Further, the through hole area a on the first substrate 110 may be configured to be circular or square, or any other shape, which is not limited in the present application.
Further, the sacrificial layer 120 may be made of amorphous silicon or silicon nitride, but may also be made of other feasible materials, which is not limited thereto. The first substrate 110 and the first substrate 140 may be made of polyimide or other feasible materials, which is not limited to this. The barrier layer 130 may be made of an existing barrier material.
Further, the thickness of the sacrificial layer may be set to be between 50 and 5000 nanometers, and may be specifically set according to user requirements.
The application provides a flexible display panel, its flexible base plate is including the first substrate that sets gradually, the sacrificial layer, barrier layer and second substrate, this flexible display panel is through increasing the sacrificial layer in flexible base plate, get rid of the substrate that corresponds the display area of making a video recording under the screen in the first substrate simultaneously, with the light penetration rate that increases the display panel under the screen camera region, thereby when realizing the clear formation of image of the display area of making a video recording under the screen, the flexible display panel who corresponds the region also can normally show.
Referring to fig. 2, an embodiment of the present application further provides a manufacturing method of a flexible display panel, for preparing the flexible display panel in the above embodiment, the manufacturing method includes the following steps:
step S101: forming a flexible substrate, wherein the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged; as shown in fig. 3, the flexible substrate 100 includes a first substrate 110, a sacrificial layer 120, a barrier layer 130, and a second substrate 140. The conventional flexible substrate generally has only the first substrate 110, the barrier layer 130 and the second substrate 140, and in this application, the sacrificial layer 120 is added.
Step S102: removing the pattern of the first substrate at the via region; as shown in fig. 4, a is a via region. Specifically, the pattern of the first substrate at the via region may be removed by laser. More specifically, the laser line spot may be used to pre-strip the pattern of the first substrate 110 at the via area a; the pattern of the first substrate 110 at the via area a is then stripped off using a laser spot. That is, the first substrate at the via area a is pre-peeled off using laser (line spot) scanning, and then the first substrate at the via area a is cut using laser (spot) and then removed. The barrier layer 130 is remained, and the display panel packaging failure risk is lower.
Step S103: forming an organic light-emitting functional film layer on one side of the second substrate, which is far away from the first substrate; as shown in fig. 5, an organic light emitting functional film layer 200 is fabricated on a flexible substrate 100.
Step S104: forming an under-screen camera display area corresponding to the through hole area in the organic light-emitting function film layer; as shown in fig. 6, an under-screen image display region B corresponding to the through-hole region a is formed in the organic light-emitting functional film layer 200. It should be noted that the pixel density of the under-screen image display area B in the organic light-emitting functional film layer 200 is less than that of the other areas surrounding the area.
Step S105: and forming an encapsulation film covering the organic light-emitting functional film layer. As shown in fig. 7, an encapsulation film 300 is formed on the organic light emitting functional film layer 200. Specifically, the encapsulation film may include a plurality of inorganic films and at least one organic film alternately disposed. Generally, the inorganic films are located at the innermost layer and the outermost layer of the encapsulation film, that is, when the encapsulation film is manufactured, a layer of inorganic film is manufactured first, and a layer of inorganic film is manufactured last.
According to the flexible display panel manufactured by the method, the flexible substrate comprises the first substrate, the sacrificial layer, the blocking layer and the second substrate which are sequentially arranged, the sacrificial layer is added in the flexible substrate, and meanwhile the substrate corresponding to the under-screen camera shooting display area in the first substrate is removed, so that the light penetration rate of the under-screen camera shooting display area in the display panel is increased, and the flexible display panel in the corresponding area can normally display while the under-screen camera shooting display area can clearly image.
Referring to fig. 8, an embodiment of the present application further provides a display device, where the display device includes the flexible display panel in the above embodiment; and a camera structure 10 disposed at the through hole area a. The display device can be used for electronic equipment such as a mobile phone, a notebook computer, a tablet computer and the like.
As shown in fig. 1, the flexible display panel includes: a flexible substrate 100, an organic light emitting functional film layer 200, and an encapsulation film 300.
The flexible substrate 100 comprises a first substrate 110, a sacrificial layer 120, a barrier layer 130 and a second substrate 140 which are arranged in sequence, wherein the first substrate 140 is provided with a through hole area A;
the organic light-emitting functional film layer 200 is located on the side, away from the first substrate 110, of the second substrate 140, and the organic light-emitting functional film layer 200 has an under-screen image capture display area B corresponding to the through hole area a; it should be noted that the pixel density of the under-screen image display area B in the organic light emitting functional film layer 200 is less than that of the other area surrounding the area, and the specific pixel arrangement mode may be any mode, which is not limited herein. The organic light emitting functional film 200 includes a pixel electrode and a common electrode serving as an anode and a cathode, respectively, and an organic light emitting layer disposed between the pixel electrode and the common electrode.
The encapsulation film 300 covers the organic light emitting functional film layer 200. Specifically, the encapsulation film may include a plurality of inorganic films and at least one organic film alternately disposed. The encapsulation film is formed by alternately stacking inorganic films and organic films, and is used for protecting the organic light-emitting functional film layer from external moisture, oxygen and the like. Wherein, the inorganic film mainly plays a role in preventing water and oxygen from entering, and the organic film enables the packaging film to have certain flexibility.
In this embodiment, because the pixel density of the under-screen camera display area B is reduced, under the condition that the size of the under-screen camera display area B itself is not changed, the number of opaque sub-pixels in the under-screen camera display area B is reduced, the region capable of transmitting light is increased along with the reduction of the pixel density, thereby enabling the under-screen camera display area B to have sufficient light penetration rate to complete the under-screen camera, meanwhile, the under-screen camera display area B can still realize display, that is, the under-screen camera display is realized while real full screen display is realized. In order to further increase the light transmittance of the display panel, compared to the prior art, in the present embodiment, the sacrificial layer 120 is added in the flexible substrate 100, the sacrificial layer 120 is located between the first substrate 110 and the barrier layer 130, and a through hole region a is formed on the first substrate 110 in a region corresponding to the off-screen image capture and display region B. When setting up camera structure 10 in through hole region A, compare with prior art, can increase camera structure 10's the light inlet quantity, promote the effect of making a video recording under the screen.
Further, the through hole area a on the first substrate 110 may be configured to be circular or square, or any other shape, which is not limited in the present application.
Further, the sacrificial layer 120 may be made of amorphous silicon or silicon nitride, but may also be made of other feasible materials, which is not limited thereto. The first substrate 110 and the first substrate 140 may be made of polyimide, or other feasible materials, which is not limited to this. The barrier layer 130 may be made of an existing barrier material.
Further, the thickness of the sacrificial layer may be set to be between 50 and 5000 nanometers, and may be specifically set according to user requirements.
The application provides a display device, its flexible display panel's flexible substrate is including the first substrate that sets gradually, the sacrificial layer, barrier layer and second substrate, this flexible display panel is through increasing the sacrificial layer in flexible substrate, get rid of the substrate that corresponds the display area of making a video recording under the screen in the first substrate simultaneously, with the light penetration rate that increases the display panel under the screen camera region, thereby when realizing the clear formation of image of the display area of making a video recording under the screen, the flexible display panel who corresponds the region also can normally show.
It should be noted that the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification.
Claims (10)
1. A flexible display panel, comprising:
the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged, wherein the first substrate is provided with a through hole area;
the organic light-emitting functional film layer is positioned on one side, away from the first substrate, of the second substrate and is provided with an under-screen camera shooting display area corresponding to the through hole area; and the number of the first and second groups,
and the packaging film covers the organic light-emitting functional film layer.
2. The flexible display panel of claim 1, wherein the sacrificial layer is made of amorphous silicon or silicon nitride.
3. The flexible display panel of claim 1, wherein the sacrificial layer has a thickness of 50 to 5000 nanometers.
4. The flexible display panel of claim 1, wherein the first substrate is made of polyimide.
5. The flexible display panel of claim 1, wherein the via area is circular or square.
6. A display device, comprising:
the flexible display panel of any one of claims 1 to 5; and the number of the first and second groups,
and the camera structure is arranged at the through hole area.
7. The display device according to claim 6, wherein the light entering region of the camera structure corresponds to the through hole region, and the area of the through hole region is larger than that of the light entering region of the camera structure.
8. A method for manufacturing a flexible display panel, for manufacturing the flexible display panel according to any one of claims 1 to 5, comprising:
forming a flexible substrate, wherein the flexible substrate comprises a first substrate, a sacrificial layer, a barrier layer and a second substrate which are sequentially arranged;
removing the pattern of the first substrate at the via region;
forming an organic light-emitting functional film layer on one side of the second substrate, which is far away from the first substrate;
forming an under-screen camera display area corresponding to the through hole area in the organic light-emitting function film layer;
and forming an encapsulation film covering the organic light-emitting functional film layer.
9. The method of claim 8, wherein the removing the pattern of the first substrate at the via region comprises:
and removing the pattern of the first substrate at the position of the through hole area by adopting a laser mode.
10. The method of claim 9, wherein laser removing the pattern of the first substrate at the via area comprises:
pre-stripping the pattern of the first substrate at the via area with a laser line spot;
the pattern of the first substrate at the via area is stripped off with a laser spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911371186.0A CN111146359A (en) | 2019-12-26 | 2019-12-26 | Flexible display panel, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911371186.0A CN111146359A (en) | 2019-12-26 | 2019-12-26 | Flexible display panel, manufacturing method thereof and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111146359A true CN111146359A (en) | 2020-05-12 |
Family
ID=70520731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911371186.0A Pending CN111146359A (en) | 2019-12-26 | 2019-12-26 | Flexible display panel, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111146359A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725274A (en) * | 2020-06-10 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Array substrate, manufacturing method thereof and display device with under-screen camera |
| CN111755421A (en) * | 2020-06-29 | 2020-10-09 | 上海天马微电子有限公司 | Display panel, preparation method thereof and display device |
| CN112509468A (en) * | 2020-11-27 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | Display module, preparation method thereof and display device |
| CN114425659A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser stripping method and laser processing equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397984A (en) * | 2001-07-16 | 2003-02-19 | 株式会社半导体能源研究所 | Semiconductor device and stripping method and method for mfg. semiconductor device |
| CN108983487A (en) * | 2018-08-31 | 2018-12-11 | 厦门天马微电子有限公司 | A kind of liquid crystal display panel and display device |
| CN110071160A (en) * | 2019-04-30 | 2019-07-30 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN110350104A (en) * | 2019-07-04 | 2019-10-18 | 武汉华星光电半导体显示技术有限公司 | Organic LED display panel and electronic equipment |
| CN110377177A (en) * | 2018-04-13 | 2019-10-25 | 三星电子株式会社 | Display and electronic device with the display |
| CN110391254A (en) * | 2019-07-16 | 2019-10-29 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110520919A (en) * | 2019-06-28 | 2019-11-29 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
| CN110600516A (en) * | 2019-09-10 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Display panel, display module and display device |
-
2019
- 2019-12-26 CN CN201911371186.0A patent/CN111146359A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397984A (en) * | 2001-07-16 | 2003-02-19 | 株式会社半导体能源研究所 | Semiconductor device and stripping method and method for mfg. semiconductor device |
| CN110377177A (en) * | 2018-04-13 | 2019-10-25 | 三星电子株式会社 | Display and electronic device with the display |
| CN108983487A (en) * | 2018-08-31 | 2018-12-11 | 厦门天马微电子有限公司 | A kind of liquid crystal display panel and display device |
| CN110071160A (en) * | 2019-04-30 | 2019-07-30 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN110520919A (en) * | 2019-06-28 | 2019-11-29 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
| CN110350104A (en) * | 2019-07-04 | 2019-10-18 | 武汉华星光电半导体显示技术有限公司 | Organic LED display panel and electronic equipment |
| CN110391254A (en) * | 2019-07-16 | 2019-10-29 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110600516A (en) * | 2019-09-10 | 2019-12-20 | 武汉华星光电半导体显示技术有限公司 | Display panel, display module and display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725274A (en) * | 2020-06-10 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Array substrate, manufacturing method thereof and display device with under-screen camera |
| CN111725274B (en) * | 2020-06-10 | 2022-07-29 | 武汉华星光电半导体显示技术有限公司 | Array substrate, manufacturing method thereof and display device with under-screen camera |
| CN111755421A (en) * | 2020-06-29 | 2020-10-09 | 上海天马微电子有限公司 | Display panel, preparation method thereof and display device |
| CN114425659A (en) * | 2020-10-29 | 2022-05-03 | 大族激光科技产业集团股份有限公司 | Laser stripping method and laser processing equipment |
| CN112509468A (en) * | 2020-11-27 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | Display module, preparation method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111146359A (en) | Flexible display panel, manufacturing method thereof and display device | |
| CN107731888B (en) | Flexible display panel, manufacturing method thereof and display device | |
| CN108321176B (en) | Flexible display panel, manufacturing method thereof and display device | |
| CN111128066B (en) | Terminal screen, screen structure, control method and device thereof and terminal | |
| EP3951882A1 (en) | Display panel and display apparatus | |
| CN109828418B (en) | Display panel and display device | |
| CN111402743A (en) | Display panel and display device | |
| JP7048637B2 (en) | Terminal screen display control methods, devices, programs and recording media | |
| TWI704671B (en) | Display device and driving method thereof | |
| CN111223908A (en) | Under-screen camera display module and electroluminescent display screen | |
| RU2736269C1 (en) | Terminal screen, terminal screen control method and terminal | |
| CN111430436A (en) | Display panel and display device | |
| CN112864217B (en) | Display panel and electronic device | |
| JP7329688B2 (en) | Display devices and electronic devices | |
| CN111885230A (en) | Electronic equipment, display screen and display method thereof | |
| US20170140197A1 (en) | Oled panel, terminal and method for controlling identification | |
| CN110176474B (en) | Display panel, manufacturing method thereof and display device | |
| CN110767706A (en) | Display substrate, display optimization method thereof, display panel and display device | |
| US11514710B2 (en) | Display panel and terminal device | |
| US11678554B2 (en) | Under-display camera assembly and corresponding terminal device | |
| EP3629321B1 (en) | Display structure, display panel and display device | |
| CN110728921B (en) | Display device and electronic apparatus | |
| CN109148365B (en) | Display panel manufacturing method, display panel and display device | |
| CN111725276A (en) | Light emitting device, display device and manufacturing method of light emitting device | |
| CN111833811A (en) | Display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200512 |