CN111146120A - Wafer cleaning and fixing device and method - Google Patents
Wafer cleaning and fixing device and method Download PDFInfo
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- CN111146120A CN111146120A CN201911347774.0A CN201911347774A CN111146120A CN 111146120 A CN111146120 A CN 111146120A CN 201911347774 A CN201911347774 A CN 201911347774A CN 111146120 A CN111146120 A CN 111146120A
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- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer cleaning and fixing device which comprises a bearing table, a fixing pin, a driving unit and an auxiliary unit, wherein the fixing pin is positioned on the surface of the bearing table, and the driving unit is connected with the fixing pin and used for pushing the fixing pin to fix or loosen a wafer; the auxiliary unit comprises a pressure sensor, a control center and a motor, the pressure sensor is located on the back face of the fixing pin and connected with the control center, the pressure sensor is used for measuring the pressure of the wafer on the fixing pin and transmitting a measuring result to the control center for analysis, and the control center controls the motor to drive the fixing pin to move according to the analysis result so as to ensure that the wafer is not in contact with the bearing table. According to the wafer cleaning and fixing device and method provided by the invention, the pressure of the wafer on the fixing pin can be monitored in real time in the rotation process of the wafer and the fixing pin, so that the position of the fixing pin is adjusted in real time, and the wafer is prevented from contacting with the bearing table.
Description
Technical Field
The invention relates to the field of wafer cleaning, in particular to a wafer cleaning and fixing device and method.
Background
In an integrated circuit fabrication process, multiple wet processing steps of a wafer are included. Generally, the cleaning method is divided into a front cleaning method and a back cleaning method. The front cleaning is to use chemicals to carry out wet processing on the front of the wafer tape chip structure, so as to achieve the purpose of removing particles or wet etching. As shown in FIG. 1, the typical structure of the susceptor for front cleaning is a stepped fixing pin structure 4, so as to generate a supporting force to the wafer 3 to ensure that the wafer is kept at a constant height during high-speed rotation.
The backside cleaning process is also one of the commonly used wet processes. The back cleaning process is to clean the back of the wafer with liquid chemicals to clean the particles on the back of the wafer. The back side cleaning is generally performed by a single wafer cleaning method. Unlike the front side cleaning, when the wafer back side cleaning process is performed, the wafer back side is placed upward, and the front side faces downward toward the susceptor. It is generally desirable that only the back side of the wafer be exposed to the chemical cleaning solution, while the front side of the chip structure should not be exposed to any chemical solution, nor is it desirable that the front side of the wafer be exposed to any hard surface. Unlike the stepped pin for front cleaning, which may cause a contact surface on the front surface of the wafer to be unable to meet the requirement of back cleaning, the stepped pin for back cleaning generally employs a cylindrical pin 1, as shown in fig. 2. The fixing pin 1 is normally driven by a cylinder 5. Such fixing pins 1 are usually several, most often six, evenly distributed around the carrier table 2, as shown in fig. 3. The bearing table 2 utilizes nitrogen to generate Bernoulli effect to form an isolation buffer layer 6, so that the effect of 'suspension' of the wafer 3 is generated, and the front surface of the wafer is prevented from contacting with the bearing table in the process. As shown in fig. 4, the single wafer backside cleaning process is typically performed at high rotational speeds, which can reach thousands of revolutions per minute. The general process for cleaning the back single sheet is as follows: after a wafer is placed on a bearing table, the bearing table drives the wafer to rotate at a high speed, a spray head above the wafer sprays chemical to the surface of the wafer, the chemical is rapidly diffused to the whole wafer by centrifugal force, the chemical is sprayed to the wafer by deionized water after reacting on the surface of the wafer for a period of time, the wafer is washed to remove chemical residues, finally, the nitrogen spray head is used for blowing, and liquid on the surface of the wafer is thrown out by the centrifugal force, so that the purpose of drying the wafer is achieved.
Since the back side cleaning uses the cylindrical fixing pin, the fixing pin is in point contact with the wafer, and only provides a transverse fixing force without an upward lifting force. The fixing pins are generally driven by a cylinder, the driving force is fixed and limited, and the general fixing pins are made of acid-base-resistant plastic materials such as PTFE, PFA and the like, and have smooth surfaces, so that the supporting force for the wafer is far inferior to that of a stepped fixing pin, in the process, the wafer rotating at a high speed is subjected to centrifugal force and pressure of downward injection of upper chemical liquid, and the problem of wafer sliding down may be caused, and in severe cases, the wafer 3 may contact the surface of the susceptor 2 in the process, which may cause damage to the surface of the wafer, increase particles and the like, as shown in fig. 5. The existing fixing pin structure only carries out switching operation at the beginning and the end of the process, and does not monitor and adjust the actual fixing state of the wafer in the process. In fact, the wafer is subjected to the fixing force of the fixing pin, and the wafer is subjected to fluctuation of various factors such as the rotating speed of the bearing table, the compressed air volume of the air cylinder, the liquid flow, the air volume of the cavity and the like in an actual process, so that the state of the wafer is dynamically controlled.
Disclosure of Invention
The invention aims to provide a wafer cleaning and fixing device and a wafer cleaning and fixing method, which can monitor the pressure of a wafer on a fixing pin in real time in the rotation process of the wafer and the fixing pin, thereby adjusting the position of the fixing pin in real time and ensuring that the wafer cannot be contacted with a bearing table.
In order to achieve the purpose, the invention adopts the following technical scheme: a wafer cleaning and fixing device comprises a bearing table, a fixing pin, a driving unit and an auxiliary unit, wherein the fixing pin is positioned on the surface of the bearing table, and the driving unit is connected with the fixing pin and used for pushing the fixing pin to fix or loosen a wafer; the auxiliary unit comprises a pressure sensor, a control center and a motor, the pressure sensor is located on the back face of the fixing pin and connected with the control center, the pressure sensor is used for measuring the pressure of the wafer on the fixing pin and transmitting a measuring result to the control center for analysis, and the control center controls the motor to drive the fixing pin to move according to the analysis result so as to ensure that the wafer is not in contact with the bearing table.
Further, the auxiliary unit further comprises a screw rod coupling, one end of the screw rod coupling is connected with the motor, and the other end of the screw rod coupling is connected with the fixing pin.
Further, the driving unit and the lead screw coupling are connected to the fixing pin by a driving shaft.
Furthermore, the fixing pin is columnar, and the front surface of the fixing pin is in point contact with the wafer.
Further, the distance between the pressure sensor and the normal working position of the fixing pin is 0-10 mm.
Furthermore, the number of the fixing pins is N, the number of the driving units is N, the number of the auxiliary units is N, and the fixing pins, the driving units and the auxiliary units are in one-to-one correspondence.
A wafer cleaning and fixing method comprises the following steps:
s01: moving the wafer to the upper part of the bearing table, and driving the fixing pin to fix the wafer by the driving unit so that the wafer is not contacted with the bearing table;
s02: the bearing table drives the fixing pin and the wafer to start rotating;
s03: the pressure sensor measures the pressure of the wafer on the fixing pin, and transmits the measurement result to the control center for analysis;
s04: the control center controls the motor to drive the fixing pin to move according to the analysis result, so that the wafer is not contacted with the bearing table;
s05: after the wafer is cleaned, the driving unit controls the fixing pin to return to the initial position, and the wafer is moved away.
Further, in step S03, the pressure sensor measures the pressure of the wafer on the fixing pin, converts the measured pressure into an electrical signal, and transmits the electrical signal to the control center for analysis, and the control center outputs a control signal to the motor after performing operation and amplification on the electrical signal.
Further, the electric signal is a voltage signal or a current signal.
Further, the distance between the pressure sensor and the normal working position of the fixing pin is 0-10 mm; in step S03, when the position of the fixing pin changes during rotation, the pressure sensor measures the pressure of the wafer against the fixing pin.
The invention has the beneficial effects that: according to the wafer cleaning and fixing device provided by the invention, the pressure of the wafer on the fixing pin is monitored in real time through the pressure sensor and is transmitted to the control center, the control center analyzes the pressure, then the input current or voltage of the fixing pin corresponding to the motor is adjusted in real time, the position of the fixing pin is changed in real time under the action of the motor, and the problems of damage or poor fixation and the like to the wafer caused by too large or too small acting force of the fixing pin can be reduced.
Drawings
FIG. 1 is a schematic diagram of a front wafer cleaning and fixing device in the prior art.
FIG. 2 is a schematic diagram of a backside wafer cleaning fixture of the prior art.
FIG. 3 is a top view of the susceptor during backside wafer cleaning.
FIG. 4 is a schematic view of a prior art backside wafer cleaning fixture.
FIG. 5 is a schematic diagram of a wafer sliding down and front contacting with a susceptor during back wafer cleaning in the prior art.
FIG. 6 is a schematic view of a wafer cleaning and fixing device according to the present invention.
In the figure: the device comprises a fixing pin 1, a bearing table 2, a wafer 3, a wafer 4, a front cleaning fixing pin 5, an air cylinder 6, an isolation buffer layer 6, a control center 7, a pressure sensor 8, a motor 9 and a lead screw shaft coupling 10.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The wafer cleaning and fixing device provided by the invention comprises a bearing table 2, a fixing pin 1, a driving unit and an auxiliary unit, wherein the fixing pin 1 is positioned on the surface of the bearing table 2, and the driving unit is connected with the fixing pin and used for pushing the fixing pin to fix a wafer; the auxiliary unit comprises a pressure sensor 8, a control center 7 and a motor 9, the pressure sensor 8 is located on the back of the fixing pin 1, the pressure sensor 8 is connected with the control center 7, the pressure sensor 8 is used for measuring the pressure of the wafer 3 on the fixing pin 1, and transmitting the measurement result to the control center 7 for analysis, the control center 7 controls the motor 9 to drive the fixing pin 1 to move according to the analysis result, the wafer is fixed, and the wafer 3 is ensured not to be in contact with the bearing table 2.
The position of the fixing pin in the invention is different according to different working states; when the wafer is not fixed on the bearing table, the driving unit drives the fixing pin to be positioned at a position far away from the center of the bearing table. When the wafer and the fixing pin rotate along with the bearing table, the fixing pin is positioned on the edge of the wafer and used for fixing the wafer, at the moment, the bearing table utilizes nitrogen to generate a Bernoulli effect to form an isolation buffer layer 6, so that the effect of wafer suspension is generated, and the front surface of the wafer is prevented from contacting with the bearing table in the process; the fixing pins ensure that the front surface of the wafer is not contacted with the bearing table. The driving unit is operated when the fixing pin starts to work or stops working; when the fixing pin starts to work, the wafer is moved to the upper part of the bearing table by the mechanical arm, and at the moment, the fixing pin is driven by the driving unit to be close to the wafer and fix the wafer; when the wafer is cleaned, the robot arm grabs the wafer, and the driving unit drives the fixing pins to be far away from the wafer, so that the wafer can be removed. The driving unit may be a cylinder or other driving structure. The driving unit is connected with the fixing pin through the driving shaft and drives the driving shaft to move so as to adjust the position of the fixing pin. When the driving unit is an air cylinder, the driving shaft is correspondingly an air cylinder driving shaft, and the air cylinder is connected with the fixing pin through the air cylinder driving shaft.
The drive unit and the auxiliary unit are independent two systems, and the auxiliary unit is used for acting in the rotating process of the fixing pin. The wafer 3 and the fixing pin 1 are driven by the bearing platform 2 to rotate, the wafer 3 rotating at a high speed is subjected to centrifugal force and pressure of downward injection of chemical liquid above the wafer, the problem that the wafer slides down may be caused, when the wafer slides down, reaction force to the fixing pin is inevitably caused, so that transverse position change of the fixing pin is caused, and at the moment, the auxiliary unit starts to function. After the fixing pins start to work, the driving force provided by the driving unit and the motor are in the same direction, so that the fixing pins are close to the wafer.
With reference to fig. 6, the auxiliary unit includes a pressure sensor 8, a control center 7, a motor 9 and a lead screw shaft 10, the pressure sensor 8 is located on the back of the fixing pin 1, wherein the fixing pin is cylindrical and the fixing pin is in point contact with the wafer. The present invention defines: the end of the fixing pin contacting the wafer is the front of the fixing pin, and the side far away from the contact point is the back of the fixing pin. Specifically, a certain gap is left between the position of the pressure sensor 8 and the position of the fixing pin 1, so that the pressure sensor 8 is not contacted under normal conditions, namely when the position of the fixing pin 1 is not changed, and the auxiliary unit is not triggered, so that the auxiliary force is not applied. Usually, pressure sensor 8's mounted position is located fixed pin 1 the latter half, and when the wafer normally rotated, when not having the downward landing trend, pressure sensor 8 can not hit the fixed pin, and only when the slip took place for the wafer, fixed pin the latter half just can outwards slide until hitting pressure sensor. The gap between the pressure sensor and the fixing pin is set to be between the minimum displacement and the maximum displacement generated from the normal working position of the fixing pin in principle, and specifically, the distance between the pressure sensor and the normal working position of the fixing pin can be set to be 0-10mm, wherein the normal working position of the fixing pin refers to the position where the fixing pin can just fix the wafer in the rotating process, and the wafer is ensured not to slide. When the gap is 0, the device is suitable for a system which is very harsh on the wafer fixing position, and the auxiliary unit applies preventive supporting force. Under such control conditions, the front end of the pressure sensor may be added with a probe or contact head that facilitates better contact for sensing changes in the position of the fixation pin, so as to more sensitively sense changes in the position of the fixation pin. The pressure sensor 8 is connected with the control center 7, one end of the screw rod coupling 10 is connected with the motor 9, and the other end of the screw rod coupling is connected with the fixing pin 1; preferably, one end of the screw shaft coupling in the present invention may be connected to a driving shaft of the fixing pin so as to generate an auxiliary force in the same direction as the driving direction of the cylinder when the position of the fixing pin is changed. The force provided by the auxiliary unit is variable and can be realized by adopting a high-precision motor and a control center. For a pressure sensor, a pressure threshold value should be provided that can be modified to set the conditions for activating the provision of the assistance force.
Specifically, the pressure sensor is connected with the fixing pin and used for sensing the position change of the fixing pin. When the wafer slips down, reaction force to the fixing pin is inevitably caused, and therefore, the transverse position of the fixing pin is changed. The pressure sensor converts the pressure of the fixing pin to the pressure sensor into an electric signal to be transmitted to the control center, the controller outputs control current or control voltage to the motor after operational amplification, the motor generates forward rotation or reverse rotation, the motor drives the lead screw shaft coupling to move, force towards the wafer is added to the fixing pin, and auxiliary fixing force is generated on the wafer. Here, the forward rotation and the reverse rotation of the motor do not necessarily have a relationship with the position movement of the fixing pin; the auxiliary unit control center only needs to control whether the fixing pin needs to move towards the direction close to the wafer according to the pressure of the fixing pin to the pressure sensor. The motor can rotate forwards and reversely, and because the auxiliary unit is a closed-loop system and has the characteristic of a closed-loop control loop, namely the mode of reaching a set value is not a linear process but a process of constantly changing, repeatedly approaching until dynamic balance is achieved, when the motor rotates for a plurality of degrees, the reverse motion of the motor can be generated, and vice versa; in addition, after the whole process is finished, the motor is restored to the initial position, and reverse rotation is also generated. Wherein, each fixed pin all disposes a set of auxiliary unit alone, realizes the independent control of each fixed pin.
Specifically, the number of the fixing pins is N, the number of the driving units is N, the number of the auxiliary units is N, and the fixing pins, the driving units and the auxiliary units are in one-to-one correspondence. The auxiliary units of each fixing pin are independently controlled, have no direct influence on each other, do not need to be started simultaneously, and are separately used according to different states of each fixing pin. Preferably, the number of the fixing pins on one bearing platform can be 6 or 12, and the fixing pins are evenly distributed on the bearing platform. The rotary platen is sized for 8 inch and 12 inch wafer equipment.
The invention is not limited with regard to the number of fixing pins, the type of pressure sensor, the type of motor and control center, the size of platform and the kind of wafer to be applied.
The invention provides a wafer cleaning and fixing method, which comprises the following steps:
s01: the wafer is moved to the upper part of the bearing table through the mechanical arm, and the driving unit drives the fixing pins to gradually approach and fix the wafer so that the wafer is not contacted with the bearing table; the fixing pins and the wafer are kept in an initial static state.
S02: the bearing table drives the fixing pin and the wafer to start rotating; the bearing table utilizes nitrogen to generate a Bernoulli effect to form an isolation buffer layer to generate a wafer 'suspension' effect, and the upper spray head sprays chemical to the surface of the wafer and quickly diffuses to the whole wafer by centrifugal force.
S03: the wafer generates backward pressure on the fixing pin when the wafer has a tendency of slipping downwards in the rotating process or starts to slip downwards, so that the position of the fixing pin is changed, the pressure sensor measures the pressure of the wafer on the fixing pin, and the measurement result is transmitted to the control center for analysis; the pressure sensor converts the measured pressure into an electric signal and transmits the electric signal to the control center for analysis. The specific electrical signal may be a current signal or a voltage signal. The normal working position distance between the pressure sensor and the fixing pin is 0-10mm, wherein the normal working position of the fixing pin refers to a position where the fixing pin can just fix the wafer in the rotating process so as to ensure that the wafer cannot slide; the pressure sensor measures the pressure of the wafer against the fixing pins only when the positions of the fixing pins change during rotation.
S04: the control center controls the motor to drive the fixing pin to move according to the analysis result, so that the wafer is not contacted with the bearing table. The number of the fixing pins, the number of the auxiliary units and the number of the driving units are equal and are in one-to-one correspondence; each control center only needs to analyze the pressure of the corresponding fixing pin and give the indication of the corresponding motor. The controller outputs control current or control voltage to the motor after carrying out operational amplification on the received electric signal, the motor drives the screw rod coupling to move, positive force is added to the fixing pin, and auxiliary fixing force is generated on the wafer. In the process of cleaning the wafer, the bearing table rotates, the acting force of the wafer on the fixing pins is in dynamic change, and the auxiliary unit can adjust the rotation state of the motor in real time to enable the fixing pins to fix the wafer, so that the wafer is prevented from sliding.
S05: after the wafer is cleaned, the driving unit controls the fixing pin to return to the initial position, and the wafer is moved away by the mechanical arm.
According to the wafer cleaning and fixing device provided by the invention, the pressure of the wafer on the fixing pin is monitored in real time through the pressure sensor and is transmitted to the control center, the control center analyzes the pressure, then the input current or voltage of the fixing pin corresponding to the motor is adjusted in real time, the position of the fixing pin is changed in real time under the action of the motor, and the problems of damage or poor fixation and the like to the wafer caused by too large or too small acting force of the fixing pin can be reduced.
The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the scope of the appended claims.
Claims (10)
1. A wafer cleaning and fixing device is characterized by comprising a bearing table, a fixing pin, a driving unit and an auxiliary unit, wherein the fixing pin is positioned on the surface of the bearing table, and the driving unit is connected with the fixing pin and used for pushing the fixing pin to fix or loosen a wafer; the auxiliary unit comprises a pressure sensor, a control center and a motor, the pressure sensor is located on the back face of the fixing pin and connected with the control center, the pressure sensor is used for measuring the pressure of the wafer on the fixing pin and transmitting a measuring result to the control center for analysis, and the control center controls the motor to drive the fixing pin to move according to the analysis result so as to ensure that the wafer is not in contact with the bearing table.
2. The wafer cleaning and fixing device of claim 1, wherein the auxiliary unit further comprises a lead screw coupling, one end of the lead screw coupling is connected with the motor, and the other end of the lead screw coupling is connected with the fixing pin.
3. The wafer cleaning fixture of claim 2, wherein the drive unit and the lead screw coupling are each connected to a fixed pin by a drive shaft.
4. The wafer cleaning fixture as claimed in claim 1, wherein the pin is cylindrical and the pin front surface makes point contact with the wafer.
5. The wafer cleaning fixture of claim 1, wherein the pressure sensor is spaced from the normal operating position of the fixture pin by a distance of 0-10 mm.
6. The wafer cleaning and fixing device of claim 1, wherein the number of the fixing pins is N, the number of the driving units is N, the number of the auxiliary units is N, and the fixing pins, the driving units and the auxiliary units correspond to one another.
7. A wafer cleaning and fixing method is characterized by comprising the following steps:
s01: moving the wafer to the upper part of the bearing table, and driving the fixing pin to fix the wafer by the driving unit so that the wafer is not contacted with the bearing table;
s02: the bearing table drives the fixing pin and the wafer to start rotating;
s03: the pressure sensor measures the pressure of the wafer on the fixing pin, and transmits the measurement result to the control center for analysis;
s04: the control center controls the motor to drive the fixing pin to move according to the analysis result, so that the wafer is not contacted with the bearing table;
s05: after the wafer is cleaned, the driving unit controls the fixing pin to return to the initial position, and the wafer is moved away.
8. The method as claimed in claim 7, wherein in step S03, the pressure sensor measures the pressure of the wafer on the fixing pins, converts the measured pressure into an electrical signal, and transmits the electrical signal to the control center for analysis, and the control center outputs a control signal to the motor after computing and amplifying the electrical signal.
9. The wafer cleaning and fixing method as recited in claim 8, wherein the electrical signal is a voltage signal or a current signal.
10. The wafer cleaning and fixing method according to claim 8, wherein the distance between the pressure sensor and the normal working position of the fixing pin is 0-10 mm; in step S03, when the position of the fixing pin changes during rotation, the pressure sensor measures the pressure of the wafer against the fixing pin.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220157632A1 (en) * | 2020-11-18 | 2022-05-19 | Changxin Memory Technologies, Inc. | Airlock and wafer machine |
| CN114520176A (en) * | 2020-11-18 | 2022-05-20 | 长鑫存储技术有限公司 | Vacuum chamber and wafer machine |
| CN115458471A (en) * | 2022-08-31 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Chuck device and method for monitoring wafer state |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459382B1 (en) * | 2001-04-26 | 2002-10-01 | Applied Materials, Inc. | Over clamp sensor |
| JP2003053661A (en) * | 2001-08-16 | 2003-02-26 | Applied Materials Inc | Load cup for mechanical and chemical polishing device, mechanical and chemical polishing device, and transfer method for substrate |
| CN102867771A (en) * | 2012-09-18 | 2013-01-09 | 北京七星华创电子股份有限公司 | Clamping device with function of monitoring state of semiconductor chip and method |
| CN103715128A (en) * | 2013-12-30 | 2014-04-09 | 上海集成电路研发中心有限公司 | Adjustable wafer fixing device and method and wafer cleaning platform |
| CN104813460A (en) * | 2012-11-27 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Substrate supporting apparatus |
| CN108461440A (en) * | 2018-03-30 | 2018-08-28 | 上海新创达智能科技有限公司 | A kind of wafer centralising device and method |
-
2019
- 2019-12-24 CN CN201911347774.0A patent/CN111146120B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459382B1 (en) * | 2001-04-26 | 2002-10-01 | Applied Materials, Inc. | Over clamp sensor |
| JP2003053661A (en) * | 2001-08-16 | 2003-02-26 | Applied Materials Inc | Load cup for mechanical and chemical polishing device, mechanical and chemical polishing device, and transfer method for substrate |
| CN102867771A (en) * | 2012-09-18 | 2013-01-09 | 北京七星华创电子股份有限公司 | Clamping device with function of monitoring state of semiconductor chip and method |
| CN104813460A (en) * | 2012-11-27 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Substrate supporting apparatus |
| CN103715128A (en) * | 2013-12-30 | 2014-04-09 | 上海集成电路研发中心有限公司 | Adjustable wafer fixing device and method and wafer cleaning platform |
| CN108461440A (en) * | 2018-03-30 | 2018-08-28 | 上海新创达智能科技有限公司 | A kind of wafer centralising device and method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220157632A1 (en) * | 2020-11-18 | 2022-05-19 | Changxin Memory Technologies, Inc. | Airlock and wafer machine |
| CN114520176A (en) * | 2020-11-18 | 2022-05-20 | 长鑫存储技术有限公司 | Vacuum chamber and wafer machine |
| WO2022105293A1 (en) * | 2020-11-18 | 2022-05-27 | 长鑫存储技术有限公司 | Vacuum chamber and wafer machine table |
| CN114520176B (en) * | 2020-11-18 | 2023-12-26 | 长鑫存储技术有限公司 | Vacuum chamber and wafer machine |
| CN115458471A (en) * | 2022-08-31 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Chuck device and method for monitoring wafer state |
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