CN111142336A - Flexible photoresist composition - Google Patents
Flexible photoresist composition Download PDFInfo
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- CN111142336A CN111142336A CN202010052780.XA CN202010052780A CN111142336A CN 111142336 A CN111142336 A CN 111142336A CN 202010052780 A CN202010052780 A CN 202010052780A CN 111142336 A CN111142336 A CN 111142336A
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- photoresist composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims abstract description 10
- 238000009736 wetting Methods 0.000 claims abstract description 10
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 9
- 239000000049 pigment Substances 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000003623 enhancer Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 4
- -1 4-methylthiophenyl Chemical group 0.000 claims description 11
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 claims description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims description 4
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 3
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 3
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 3
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- 229940119545 isobornyl methacrylate Drugs 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims description 3
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- RTFWHSONHLXREP-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-yloxyphenyl)ethanone Chemical compound CC(C)OC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 RTFWHSONHLXREP-UHFFFAOYSA-N 0.000 claims description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- 229910000928 Yellow copper Inorganic materials 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 claims description 2
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- 235000019239 indanthrene blue RS Nutrition 0.000 claims description 2
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 claims description 2
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 claims description 2
- 229940011051 isopropyl acetate Drugs 0.000 claims description 2
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 claims description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 claims 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- QBRBKPZFIKWTOQ-UHFFFAOYSA-N CC(=C)C(=O)O[SiH2]O Chemical compound CC(=C)C(=O)O[SiH2]O QBRBKPZFIKWTOQ-UHFFFAOYSA-N 0.000 claims 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims 1
- 239000012744 reinforcing agent Substances 0.000 claims 1
- 150000003505 terpenes Chemical class 0.000 claims 1
- 235000007586 terpenes Nutrition 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- ABFKYPFPQRDCGM-UHFFFAOYSA-N 14832-14-5 Chemical compound [Cu+2].[N-]1C(N=C2C3=C(Cl)C(Cl)=C(Cl)C(Cl)=C3C(N=C3C4=C(Cl)C(Cl)=C(Cl)C(Cl)=C4C(=N4)[N-]3)=N2)=C(C(Cl)=C(Cl)C(Cl)=C2Cl)C2=C1N=C1C2=C(Cl)C(Cl)=C(Cl)C(Cl)=C2C4=N1 ABFKYPFPQRDCGM-UHFFFAOYSA-N 0.000 description 1
- CERINUCHRJFNTJ-UHFFFAOYSA-N 2-(1-ethoxy-1-methoxyethyl)-2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.COC(C(CO)(CO)CO)(C)OCC CERINUCHRJFNTJ-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- RYRDKOIZZRUCMC-UHFFFAOYSA-N 2-hydroxy-4-methyl-1,3,2$l^{5}-dioxaphospholane 2-oxide Chemical class CC1COP(O)(=O)O1 RYRDKOIZZRUCMC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention discloses a flexible photoresist composition which comprises the following raw materials in parts by weight: 30-60 parts of long-chain flexible light-cured resin, 5-10 parts of long-chain active diluent, 2-5 parts of adhesion force enhancer, 2-8 parts of light-cured initiator, 1-5 parts of thixotropic agent, 15-25 parts of inorganic filler, 1-2 parts of defoaming agent, 1-2 parts of flatting agent, 1-2 parts of wetting dispersant, 0.5-2 parts of pigment and 10-20 parts of solvent. After being cured, the coating has good adhesive force and corrosion resistance with a base material, and is suitable for manufacturing flexible PCBs and the like.
Description
Technical Field
The invention relates to a flexible photoresist composition, which belongs to the technical field of electronic materials and is used for manufacturing various flexible printed circuit boards.
Background
The photoresist is one of the key materials for fine processing of integrated circuits, flat panel displays, printed circuit boards and the like in the electronic field, and as electronic products develop towards miniaturization, multifunctionality and convenient and comfortable use, flexible PCB boards are more and more widely applied, and higher requirements are provided for the photoresist. The commonly used photoresist has poor toughness, and when the commonly used photoresist is used for manufacturing a flexible PCB, the defects of photoresist film fracture, even local peeling and the like are often generated.
Disclosure of Invention
In view of the state of the art and the shortcomings of the prior art, the present invention provides a flexible photoresist composition, which has good flexibility and adhesion, and can be used for manufacturing flexible PCB without breaking or falling off.
The technical scheme adopted by the invention is as follows: a flexible photoresist composition characterized by: the composite material is prepared from the following raw materials in parts by weight:
30-60 parts of long-chain light-cured resin, 5-10 parts of long-chain active diluent, 2-5 parts of adhesion force enhancer, 2-8 parts of light-cured initiator, 1-5 parts of thixotropic agent, 15-25 parts of inorganic filler, 1-2 parts of defoaming agent, 1-2 parts of flatting agent, 1-2 parts of wetting dispersant, 0.5-2 parts of pigment and 10-20 parts of solvent.
The invention has the beneficial effects that: the flexible photoresist composition provided by the invention has good flexibility and adhesive force, can not generate fracture and falling phenomena when being used for manufacturing flexible PCB boards, has good adhesive force and corrosion resistance with base materials after being cured, and is suitable for manufacturing various flexible printed circuit boards and the like.
Detailed Description
A flexible photoresist composition is composed of the following raw materials in parts by weight:
30-60 parts of long-chain light-cured resin, 5-10 parts of long-chain active diluent, 2-5 parts of adhesion force enhancer, 2-8 parts of light-cured initiator, 1-5 parts of thixotropic agent, 15-25 parts of inorganic filler, 1-2 parts of defoaming agent, 1-2 parts of flatting agent, 1-2 parts of wetting dispersant, 0.5-2 parts of pigment and 10-20 parts of solvent.
The light-curable resin in the composition is long-chain polyurethane acrylate, such as 6363, 6572, 6019 of Corning chemical (Chinese), 612DF-80 of Changxing, Guangzhou, SM6201 of Jiangsu Sanmu, UV-2000, UV-2300 of Zhongshan Qianye synthetic company, etc.; polyester acrylates such as 5429, 5430 from Corning chemical (China), PE56F from Pasteur, 6331-100 from Changxing, N03 from Qian-Hayata, etc.; polyether acrylate, such as 5662F photo-curing resin of Corning chemical (China) company, and epoxy modified acrylate of complexing high-tech (Shanghai) company, and the like, in an amount of 30-60 parts by weight.
The active diluent in the composition is a monofunctional or bifunctional or trifunctional active diluent with a longer molecular chain, and mainly comprises the following components in percentage by weight: isodecyl acrylate, such as 4810 from corning, EM219 from chang; lauryl acrylate, such as 4812 from corning, EM215 from changxing, isobornyl methacrylate, such as EM224, EM226 from chaning; polyethylene glycol diacrylates, such as 4050, 4226 from corning, EM224, EM226 from chang; dipropylene glycol diacrylate such as 4061 from corning, tripropylene glycol diacrylate such as 4006 from corning; ethylene glycol diacrylate such as 4017 from corning; methoxypropoxypentylglycol monoacrylate, such as 812 from corning; the methoxy ethoxy trimethylolpropane diacrylate, such as 8149 of Corning company, and the alkoxylated double A di (methyl) acrylate, such as one or more of EM2260, EM2261, EM2265, EM2268 of Changxing company, are used in a weight part of 5-10.
In order to improve the adhesion of the composition, the adhesion enhancer is added into the flexible photoresist composition, and mainly comprises the following components: silane coupling agents such as gamma-aminopropyltriethoxysilane (KH 550), gamma-aminopropyltrimethoxysilane (KH 551), gamma-glycidoxypropyltrimethylsilane (KH-560), gamma- (methacryloyloxy) propyltrimethylsilane (KH 570), reactive high acid number propylene phosphates such as 4703, 4846, 4173 of Corning corporation, benzotriazole; one or more of maleic anhydride modified rosin glyceride, nano active zinc oxide and the like are used in combination; the weight part is 2-5 parts.
The photo-curing initiator in the composition is mainly one or more of 1, 2-diphenylhydroxyacetone (benzoin), isopropoxybenzoin (benzoin isopropyl ether), diphenylethanedione (benzil), α -dimethoxy- α -phenylacetophenone (651 photoinitiator), 2-hydroxy-2-methyl-1-phenyl-1-acetone (1173 photoinitiator), 1-hydroxycyclohexyl phenyl ketone (184 photoinitiator), 2-methyl-1- (4-methylthiophenyl) -2-morphine-1-acetone (907 photoinitiator), benzophenone, isopropyl thioxanthone (1 TX) and the like, and the used parts by weight are 2-8 parts.
In order to improve the uniformity of the coating, a small amount of thixotropic agent is added, wherein the thixotropic agent is mainly one or more of hydrophilic fumed silica such as M5 of cabot corporation, and hydrophobic fumed silica such as R972 of degussa corporation, hydrogenated castor oil, active nano calcium carbonate and the like, and the weight part of the thixotropic agent is 1-5 parts.
The inorganic filler in the composition can not only reduce the cost, but also reduce the shrinkage rate during curing, and mainly comprises the following components: one or more of talcum powder, glass beads, barium sulfate, calcium carbonate and the like are used in a combined mode, and the used weight portion is 15-25 portions.
The antifoaming agent in the composition is mainly one or more of BYK-020, BYK-067A of Bike company, 5300, 2700 and 3100 of German modest company, 86, 910 and 920 of Di Gao company, and the like, and the used weight part is 1-2 parts.
The leveling agent in the composition is mainly one or more of S71UV and S83UV of Corning company, BYK371, BYK361 and BYK333 of Bike company, and the use weight part is 1-2 parts.
The wetting dispersant in the composition is mainly one or more of P61 of Corning company, BYK-180, BYK-111 of Picker company, and the like, and the used weight part is 1-2 parts.
The pigment in the composition is mainly one or more of phthalocyanine blue (PB 15), indanthrone (PB 60), phthalocyanine green G (PG 7), pigment green edge (PG 8), yellow copper phthalocyanine (PG 36) and the like, and the used weight part is 0.5-2 parts.
The solvent in the composition is mainly one or more of ethylene glycol butyl ether, ethylene glycol phenyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol butyl ether, diacetone alcohol, benzyl alcohol, butanone, methyl isopropyl ketone, methyl isobutyl ketone, butyl acetate, isopropyl acetate, propylene glycol methyl ether acetate, 1-dimethylethane, dimethylformamide and the like, and the using weight portion is 10-30 portions.
Example 1:
48 parts of urethane acrylate (6363), 8 parts of isodecyl acrylate (4810), 2 parts of gamma-aminopropyltriethoxysilane (KH 550), 3 parts of diphenylethanedione, 2 parts of fumed silica (M5), 20 parts of talcum powder, 1 part of defoamer (986), 1 part of flatting agent (S71 UV), 1 part of phthalocyanine blue (PB 15), 2 parts of wetting dispersant (P61) and 12 parts of propylene glycol methyl ether.
Example 2:
42 parts of urethane acrylate (6572), 9 parts of isobornyl methacrylate (EM 224), 2 parts of active high-acid-value acrylic phosphate (4703), 3 parts of α -dimethoxy- α -phenylacetophenone, 2 parts of fumed silica (R972), 24 parts of talcum powder, 1 part of a defoaming agent (BYK-020), 1 part of a flatting agent (BYK-361), 2 parts of a wetting dispersant (P61), 1 part of pigment green (PG 8) and 13 parts of propylene glycol butyl ether.
Example 3:
41 parts of polyester acrylate (5429), 8 parts of tripropylene glycol diacrylate (4006), 2 parts of active high-acid-value acrylic phosphate (4846), 3 parts of 2-hydroxy-2-methyl-1-phenyl-1-acetone, 4 parts of hydrogenated castor oil, 21 parts of barium sulfate, 1 part of defoaming agent (BY-067A), 1 part of flatting agent (BKK-333), 2 parts of wetting dispersant (BYK-11), 1 part of phthalocyanine blue and 16 parts of ethylene glycol phenyl ether.
Example 4:
42 parts of polyether acrylate (5662F), 7 parts of dipropylene glycol diacrylate (4061), 2 parts of gamma- (methacryloyloxy) trimethoxy silane, 3 parts of diphenyl ethylene dione, 5 parts of active nano calcium carbonate, 20 parts of barium sulfate, 1 part of defoaming agent (BYK-020), 1 part of leveling agent (S83 UV), 2 parts of wetting dispersant (BYK-180), 1 part of phthalocyanine blue (PB 15) and 16 parts of propylene glycol ether.
Claims (10)
1. A flexible photoresist composition characterized by: the composite material is prepared from the following raw materials in parts by weight:
30-60 parts of long-chain light-cured resin,
5-10 parts of long-chain active diluent,
2-5 parts of an adhesion force reinforcing agent,
2-8 parts of a light-curing initiator,
1-5 parts of a thixotropic agent,
15-25 parts of an inorganic filler,
1-2 parts of a defoaming agent,
1-2 parts of a leveling agent,
1-2 parts of a wetting dispersant,
0.5 to 2 parts of pigment,
10-20 parts of a solvent.
2. A flexible photoresist composition according to claim 1 wherein: the long-chain flexible light-cured resin is one or more of polyurethane acrylate, polyester acrylate, polyether acrylate and epoxy acrylate.
3. A flexible photoresist composition according to claim 1 wherein: the long-chain active diluent is one or more of isodecyl acrylate, lauryl acrylate, isobornyl methacrylate, polyethylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate and hexanediol diacrylate.
4. A flexible photoresist composition according to claim 1 wherein: the adhesion force enhancer is one or more of methacryloyloxyl hydroxyl silane, active high acid number acrylic phosphate, benzotriazole, rosin modified terpene resin and active zinc oxide.
5. A flexible photoresist composition according to claim 1, wherein the photo-curing initiator is one or more of 1, 2-diphenylhydroxyacetone, isopropoxybenzoin, diphenylethanedione, α -dimethoxy- α -phenylacetophenone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morphine-1-propanone, benzophenone, and isopropylthioxanthone (1 TX) in combination.
6. A flexible photoresist composition according to claim 1 wherein: the thixotropic agent is one or more of hydrophilic fumed silica, hydrophobic fumed silica, hydrogenated castor oil and active nano calcium carbonate.
7. A flexible photoresist composition according to claim 1 wherein: the inorganic filler is one or more of talcum powder, glass beads, barium sulfate and calcium carbonate.
8. A flexible photoresist composition according to claim 1 wherein: the antifoaming agent is one or more of BYK-020 and BYK-067A of Pico, 5300, 2700 and 3100 of Germany, and 86, 910 and 920 of Digao.
9. A flexible photoresist composition according to claim 1 wherein: the leveling agent is one or more of S71UV and S83UV of Corning company, BYK371, BYK361 and BYK333 of Bike company.
10. A flexible photoresist composition according to claim 1 wherein: the wetting dispersant is one or more of P61 of Corning company, BYK-180 and BYK-111 of Bike company;
the pigment is one or more of phthalocyanine blue PB15, indanthrone PB60, phthalocyanine green GPG7, pigment green PG8 and yellow copper phthalocyanine PG 36;
the solvent is one or more of ethylene glycol butyl ether, ethylene glycol phenyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol butyl ether, diacetone alcohol, benzyl alcohol, butanone, methyl isopropyl ketone, methyl isobutyl ketone, butyl acetate, isopropyl acetate, propylene glycol methyl ether acetate, 1-dimethyl ethane and dimethylformamide.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103209770A (en) * | 2010-07-07 | 2013-07-17 | 新型材料莱布尼兹研究所公益性有限责任公司 | Method for producing finely structured surfaces |
| CN105573057A (en) * | 2016-02-22 | 2016-05-11 | 昆山海斯电子有限公司 | Photoresist and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209770A (en) * | 2010-07-07 | 2013-07-17 | 新型材料莱布尼兹研究所公益性有限责任公司 | Method for producing finely structured surfaces |
| CN105573057A (en) * | 2016-02-22 | 2016-05-11 | 昆山海斯电子有限公司 | Photoresist and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
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| 藏广州, 安徽音像出版社 * |
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Application publication date: 20200512 |