CN111134507A - Intelligent vacuum cup capable of rapidly cooling by utilizing semiconductor refrigeration piece - Google Patents
Intelligent vacuum cup capable of rapidly cooling by utilizing semiconductor refrigeration piece Download PDFInfo
- Publication number
- CN111134507A CN111134507A CN202010059667.4A CN202010059667A CN111134507A CN 111134507 A CN111134507 A CN 111134507A CN 202010059667 A CN202010059667 A CN 202010059667A CN 111134507 A CN111134507 A CN 111134507A
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- CN
- China
- Prior art keywords
- inner cavity
- stainless steel
- steel inner
- vacuum cup
- pressure
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2205—Drinking glasses or vessels
- A47G19/2227—Drinking glasses or vessels with means for amusing or giving information to the user
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2205—Drinking glasses or vessels
- A47G19/2227—Drinking glasses or vessels with means for amusing or giving information to the user
- A47G2019/225—Drinking glasses or vessels with means for amusing or giving information to the user vessels with thermometers
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G2200/00—Details not otherwise provided for in A47G
- A47G2200/16—Temperature
- A47G2200/166—Temperature sensor
Abstract
The invention discloses an intelligent vacuum cup capable of rapidly cooling by utilizing a semiconductor refrigerating sheet, which comprises a stainless steel inner cavity and the semiconductor refrigerating sheet for refrigerating and cooling; a pressure-relieving layer is arranged between the vacuum insulation layer outside the stainless steel inner cavity and the vacuum cup main body, and an inverted circular truncated cone-shaped small hole is formed in the top of the pressure-relieving layer so that high-pressure air in the pressure-relieving layer is discharged into the atmosphere; the upper end of the stainless steel inner cavity is in threaded connection with the threaded cup cover by adopting a threaded port, the bottom end of the stainless steel inner cavity is connected with the semiconductor refrigerating sheet by virtue of silicone grease, and the lower part of the semiconductor refrigerating sheet is provided with a fin and a heat radiating fan; the bottom of the stainless steel inner cavity is provided with a temperature sensing probe which is connected with an integrated circuit control panel through a lead, and the integrated circuit control panel is connected with an OLED temperature display screen and a jack for connecting an external power supply. The invention adopts the semiconductor refrigeration piece to realize the rapid reduction of the water temperature in the thermos cup so as to meet the requirements of users.
Description
Technical Field
The invention relates to the technical field of vacuum cups, in particular to an intelligent vacuum cup capable of quickly cooling by utilizing a semiconductor refrigerating sheet.
Background
Along with the improvement of the living standard of people, more and more heat preservation cups appear in the sight of people and become necessities of life and work of people. However, people spend a lot of energy and time on how to make the heat preservation effect of the vacuum cup better, but neglect an inevitable problem that people need to place the vacuum cup for a long time after receiving hot water, then the hot water in the cup can be naturally cooled to the drinkable temperature, and people can not know the temperature of the hot water in the vacuum cup in real time, and worry about dust or other dirt falling into the cup when the cup cover is opened for natural cooling, and if a drinker needs to drink water urgently, the vacuum cup is particularly inconvenient for users. Therefore, people also invent various vacuum cups capable of quickly cooling, but many of the prior inventions have the problems of inconvenient use, complex operation, incapability of realizing quick cooling, displaying the temperature of hot water in the cup, setting the desired temperature of the hot water and the like.
Disclosure of Invention
The invention aims to overcome the technical defects in the prior art, and provides an intelligent vacuum cup capable of rapidly cooling by using a semiconductor refrigerating sheet, which not only can display the temperature in the cup in real time, but also can be conveniently set to rapidly cool the heat in the cup to reach the required temperature, so that the use requirements of users are met.
The technical scheme adopted for realizing the purpose of the invention is as follows:
an intelligent vacuum cup capable of rapidly cooling by utilizing a semiconductor refrigeration piece comprises a stainless steel inner cavity and the semiconductor refrigeration piece for refrigerating and cooling; a pressure-relieving layer is arranged between the vacuum insulation layer outside the stainless steel inner cavity and the vacuum cup main body, and an inverted circular truncated cone-shaped small hole is formed in the top of the pressure-relieving layer so that high-pressure air in the pressure-relieving layer is discharged into the atmosphere; the upper end of the stainless steel inner cavity is in threaded connection with the threaded cup cover by adopting a threaded port, the bottom end of the stainless steel inner cavity is connected with the semiconductor refrigerating sheet by virtue of silicone grease, and the lower part of the semiconductor refrigerating sheet is provided with a fin and a heat radiating fan; the bottom of the stainless steel inner cavity is provided with a temperature sensing probe which is connected with an integrated circuit control panel through a lead, and the integrated circuit control panel is connected with an OLED temperature display screen and a jack for connecting an external power supply.
Wherein, the thermos cup body adopts the PP shell of environmental protection material.
Wherein, the pressure relieving layer is arranged at the inner side of the shell tightly attached to the vacuum cup body.
The semiconductor refrigeration piece is adopted, so that the water temperature in the thermos cup can be quickly reduced, and the requirements of users are met; the temperature sensing probe and the OLED temperature display screen are used, the temperature of the water in the cup can be transmitted to a user in real time, and the OLED temperature display screen is used for touch display and is convenient to set and adjust the required temperature. The synchronous starting of the cooling fan and the semiconductor refrigerating sheet is realized through the integrated circuit control panel, and the operation is simple and convenient.
The intelligent vacuum cup can effectively solve the problem that hot water in the vacuum cup is still too high in temperature for drinking after being placed for a long time, the touch switch is convenient for setting the temperature required by a user, and the temperature is quickly reduced through the semiconductor refrigerating sheet.
Drawings
FIG. 1 is a schematic view of an intelligent vacuum cup using a semiconductor chilling plate for rapid cooling;
fig. 2 is a schematic view of a threaded cup cover.
In the figure: 1-a vacuum cup body; 2-a slow-pressing layer; 3-vacuum insulation layer; 4-stainless steel inner cavity; 5-temperature sensing probe; 6-semiconductor refrigerating sheet; 7-integrated circuit control board; 8-a jack; 9-touch control switch; 10-OLED temperature display screen; 11-heat (air) dissipation fan; 12-a fin; 13-rounding the truncated cone-shaped small hole; 14-threaded cup mouth; 15-threaded cup cover.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in figure 1, the intelligent vacuum cup utilizing the semiconductor refrigeration piece to rapidly cool comprises a vacuum cup body 1 with a shell made of polypropylene (PP) materials, wherein a jack 8 is arranged at the lower left side of the vacuum cup body 1; the inner side of the PP shell is provided with a slow pressing layer 2, the top of the slow pressing layer is provided with a plurality of inverted circular truncated cone-shaped small holes 13, and the small holes can exhaust air of the slow pressing layer into the atmosphere and prevent external water from entering, so that not only can the danger caused by overhigh temperature in the slow pressing layer and overlarge pressure caused by heat generated by a hot end when a semiconductor refrigerating sheet in a cup is used for refrigerating be prevented, but also the damage caused by the external water entering the slow pressing layer to elements such as an integrated circuit control panel and the like be prevented, and the PP shell has the advantages of safety, heat preservation; the vacuum heat-insulating layer 3 is arranged on the other side of the pressure-relieving layer, the vacuum heat-insulating layer is arranged in a closed circular ring shape, the inner side of the heat-insulating layer is a 304 stainless steel inner cavity 4, and the upper end of the inner cavity is provided with a threaded cup opening 14, so that the sealing effect of the vacuum cup is improved; the bottom of the inner cavity is connected with the semiconductor refrigerating sheet 6 through silicone grease, so that the heat conducting performance and the use stability are improved; the bottom of the inner cavity is connected with a temperature sensing probe 5, the temperature sensing probe 5 is connected with an integrated circuit control panel 7 through a lead, the integrated circuit control panel 7 is connected with an OLED temperature display screen 10 through a lead, the temperature in the thermos cup can be displayed to a user in real time, the temperature desired by the user is set on the display screen through a touch switch 9, and a plurality of groups of fins 12 and heat dissipation fans 11 are arranged below the semiconductor refrigeration piece and used for dissipating heat on one side of the semiconductor refrigeration piece in time when the semiconductor refrigeration piece works; the semiconductor refrigeration piece is connected with the integrated circuit control board 7 through a heat radiation fan lead, so that the required temperature can be conveniently set through the touch switch 9, and the semiconductor refrigeration piece and the heat radiation fan can be conveniently switched on and off; the OLED temperature display screen is connected with an external power supply through the jack 8.
In the invention, the upper end of the stainless steel inner cavity adopts the threaded cup mouth, so that the sealing performance with the threaded cup cover 15 is ensured, and the heat preservation performance is better. The bottom of the inner cavity is connected with the semiconductor refrigerating sheet 6 through silicone grease, so that the heat conducting performance and the use stability can be improved. The heat dissipation fan 11 is used for the heat that refrigerating piece during operation one side produced can be dispelled soon, guarantees the efficiency of refrigerating piece, OLED temperature display screen sets up and shows the temperature after convenient circular telegram, the PP shell has advantages such as environmental protection nontoxic, high temperature resistant the vacuum insulation layer 3 is between stainless steel and inner chamber wall, and two cylindrical wall all adopt the 304 stainless steel that have the advantages such as safe heat preservation, anticorrosive, can carry out seamless joint, form confined vacuum insulation layer, can keep warm to the water in the thermos cup effectively.
The heat dissipation fan is connected with the integrated circuit control board 7 through a wire, and the heat dissipation fan is started simultaneously when the refrigerating sheet works. One side of the semiconductor refrigerating sheet is connected with the integrated circuit control panel through a wire.
The temperature sensing probe is connected with the integrated circuit control panel through a wire and can transmit a temperature signal to the integrated circuit control panel, the other side of the integrated control panel is connected with the OLED temperature display screen through a wire and can transmit the temperature signal to the temperature display screen in real time, and the temperature sensing probe can be adjusted to set the temperature required by a user through the temperature display screen.
Wherein, OLED temperature display screen establishes on the shell surface of thermos cup main part, can embedded setting to convenient observation and operation use. OLED temperature display screen is connected through the jack of wire and thermos cup left side downside, makes things convenient for external power supply. A safety protection shell can be arranged outside the jack.
The intelligent vacuum cup capable of rapidly cooling by using the semiconductor refrigeration piece realizes that the temperature of the vacuum cup is displayed to a user in real time through the OLED temperature display screen and the touch switch, and the integrated circuit control board is used for intelligently controlling the semiconductor refrigeration piece to rapidly cool water in the vacuum cup to the temperature required by the user.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (3)
1. An intelligent vacuum cup capable of rapidly cooling by utilizing a semiconductor refrigeration piece is characterized by comprising a stainless steel inner cavity and the semiconductor refrigeration piece for refrigerating and cooling; a pressure-relieving layer is arranged between the vacuum insulation layer outside the stainless steel inner cavity and the vacuum cup main body, and an inverted circular truncated cone-shaped small hole is formed in the top of the pressure-relieving layer so that high-pressure air in the pressure-relieving layer is discharged into the atmosphere; the upper end of the stainless steel inner cavity is in threaded connection with the threaded cup cover by adopting a threaded port, the bottom end of the stainless steel inner cavity is connected with the semiconductor refrigerating sheet by virtue of silicone grease, and the lower part of the semiconductor refrigerating sheet is provided with a fin and a heat radiating fan; the bottom of the stainless steel inner cavity is provided with a temperature sensing probe which is connected with an integrated circuit control panel through a lead, and the integrated circuit control panel is connected with an OLED temperature display screen and a jack for connecting an external power supply.
2. An intelligent vacuum cup capable of rapidly cooling by using a semiconductor refrigeration piece as claimed in claim 1, wherein the vacuum cup body is made of a PP shell made of an environment-friendly material.
3. The intelligent vacuum cup capable of rapidly cooling by using the semiconductor refrigeration piece as claimed in claim 1, wherein the slow-pressing layer is arranged inside the shell tightly attached to the vacuum cup body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010059667.4A CN111134507A (en) | 2020-01-19 | 2020-01-19 | Intelligent vacuum cup capable of rapidly cooling by utilizing semiconductor refrigeration piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010059667.4A CN111134507A (en) | 2020-01-19 | 2020-01-19 | Intelligent vacuum cup capable of rapidly cooling by utilizing semiconductor refrigeration piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111134507A true CN111134507A (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010059667.4A Pending CN111134507A (en) | 2020-01-19 | 2020-01-19 | Intelligent vacuum cup capable of rapidly cooling by utilizing semiconductor refrigeration piece |
Country Status (1)
| Country | Link |
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| CN (1) | CN111134507A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112021897A (en) * | 2020-09-10 | 2020-12-04 | 浙江先导热电科技股份有限公司 | High-efficient constant temperature cup device |
| CN115300930A (en) * | 2022-10-09 | 2022-11-08 | 江苏鸣翔化工有限公司 | Acetoacetanilide rapid crystallization equipment and crystallization process |
-
2020
- 2020-01-19 CN CN202010059667.4A patent/CN111134507A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112021897A (en) * | 2020-09-10 | 2020-12-04 | 浙江先导热电科技股份有限公司 | High-efficient constant temperature cup device |
| CN115300930A (en) * | 2022-10-09 | 2022-11-08 | 江苏鸣翔化工有限公司 | Acetoacetanilide rapid crystallization equipment and crystallization process |
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