CN111132453A - Jig and method for embedding heat dissipation copper block - Google Patents
Jig and method for embedding heat dissipation copper block Download PDFInfo
- Publication number
- CN111132453A CN111132453A CN202010050354.2A CN202010050354A CN111132453A CN 111132453 A CN111132453 A CN 111132453A CN 202010050354 A CN202010050354 A CN 202010050354A CN 111132453 A CN111132453 A CN 111132453A
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- CN
- China
- Prior art keywords
- heat dissipation
- copper block
- plate
- positioning plate
- embedding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a jig and a method for embedding a heat dissipation copper block, wherein the jig comprises a positioning plate and a support plate, the positioning plate is provided with a through hole and a counterpoint hole, and the through hole is used for placing the heat dissipation copper block; the support plate is arranged at the bottom of the positioning plate in a separable mode, and can cover the through holes and avoid the alignment holes. Before the circuit board is embedded into the copper block, the heat dissipation copper block is placed into the through hole of the positioning plate, the support plate bears the heat dissipation copper block, when the copper block needs to be embedded into the circuit board, the positioning plate with the heat dissipation copper block and the support plate are stacked on the circuit board, the support plate is pulled out to enable the heat dissipation copper block to fall into the circuit board, the copper block can be rapidly embedded, the time of a plate stacking process is shortened, and the work efficiency is improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a jig and a method for embedding a heat dissipation copper block.
Background
With the development of circuit boards toward high-level, high-density, and thin-core boards, copper blocks need to be embedded in the circuit boards in order to improve the heat dissipation efficiency of the circuit boards. The existing process generally includes the step of manually embedding copper blocks in a plate stacking procedure, but because the copper blocks are smaller and denser, hundreds of or even thousands of copper blocks need to be embedded in some circuit boards, a large amount of time is needed for manually embedding the copper blocks to stack the plates, and due to the limitation of working positions, a plurality of people cannot be arranged to simultaneously stack the plates and embed the copper blocks. The automatic copper block embedding mode is introduced, so that alignment difficulty exists in the mode of the split nail pressing plate, wherein the split nail pressing plate is a pressing plate mode that circuit boards need to be aligned through split nails when the circuit boards are stacked.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a jig for embedding a heat dissipation copper block, which can improve the efficiency of embedding the copper block.
The invention also provides a method for embedding the heat dissipation copper block.
The jig for embedding the heat dissipation copper block comprises a positioning plate and a carrier plate, wherein the positioning plate is provided with a through hole and a counterpoint hole, and the through hole is used for placing the heat dissipation copper block; the support plate is arranged at the bottom of the positioning plate in a separable mode, and can cover the through holes and avoid the alignment holes.
The jig for embedding the heat dissipation copper block provided by the embodiment of the invention at least has the following beneficial effects:
before the circuit board is embedded into the copper block, the heat dissipation copper block is placed into the through hole of the positioning plate, the support plate bears the heat dissipation copper block, when the copper block needs to be embedded into the circuit board, the positioning plate with the heat dissipation copper block and the support plate are stacked on the circuit board, the support plate is pulled out to enable the heat dissipation copper block to fall into the circuit board, the copper block can be rapidly embedded, the time of a plate stacking process is shortened, and the work efficiency is improved.
According to some embodiments of the invention, the through hole is a square hole, and the side length of the through hole is larger than that of the heat dissipation copper block.
According to some embodiments of the invention, the side length of the through hole is 150 ± 2 microns wider than the side length of the heat dissipating copper block.
According to some embodiments of the invention, the alignment holes are disposed on edges of two adjacent sides of the alignment plate.
According to some embodiments of the invention, the positioning plate is chamfered at its corners.
According to some embodiments of the present invention, the positioning plate and the carrier plate are respectively provided with magnetic attraction pieces matching with each other.
According to some embodiments of the invention, the carrier plate is a stainless steel plate.
According to some embodiments of the invention, the number of the positioning plates is at least one.
According to a second aspect of the invention, the method for embedding the heat dissipation copper block comprises the following steps:
pre-arranging copper blocks, stacking the positioning plate on the carrier plate, and placing the heat dissipation copper blocks into the through holes of the positioning plate;
the circuit boards are stacked, the circuit board to be processed is placed on the chassis provided with the splicing nails, and the circuit board to be processed is aligned through the splicing nails;
the copper block is transferred, the positioning plate and the carrier plate which are pre-arranged by the copper block are stacked on the circuit board to be processed, and alignment is carried out according to the split pins;
and (4) embedding the copper block, and extracting the carrier plate to enable the heat dissipation copper block to fall into the circuit board to be processed.
The method for embedding the heat dissipation copper block in the embodiment of the invention at least has the following beneficial effects:
the radiating copper blocks are pre-arranged in the copper block pre-arranging step, the time for occupying the plate stacking procedure can be reduced, the limitation of working positions can be avoided due to the pre-arrangement of the copper blocks, multiple people can be arranged to operate, the production efficiency can be improved, in the plate stacking procedure, the carrier plate can be pulled out after the copper blocks are transferred, the radiating copper blocks can be embedded into a circuit board to be processed, the operation is simple and convenient, and the work efficiency can be improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic top view of a jig for embedding a heat dissipating copper block according to an embodiment of the invention;
fig. 2 is one of schematic top views illustrating a jig for embedding a heat dissipating copper block according to an embodiment of the present invention;
FIG. 3 is a schematic longitudinal cross-sectional view illustrating a fixture embedded with a heat-dissipating copper block according to an embodiment of the present invention;
fig. 4 is a longitudinal cross-sectional view illustrating a usage status of a jig embedded with a heat dissipation copper block according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 to 3, a first embodiment of the present invention discloses a jig for embedding a heat dissipating copper block, including a positioning plate 100 and a carrier plate 200, wherein the positioning plate 100 is provided with a through hole 110 and an alignment hole 120, and the through hole 110 is used for placing the heat dissipating copper block 300; the carrier plate 200 is detachably disposed at the bottom of the positioning plate 100, the carrier plate 200 can cover the through hole 110 and avoid the alignment hole 120, and the carrier plate 200 is used for carrying the heat dissipation copper block 300. It should be understood that the distribution positions of the through holes 110 on the positioning plate 100 are adapted to the positions of the circuit board 400 to be processed, where the copper blocks need to be embedded. Referring to fig. 1 and fig. 2, in practical applications, the carrier 200 can be stacked on the bottom of the positioning plate 100 by reasonably adjusting the shape and size of the carrier 200 to perform the function of carrying the heat-dissipating copper block 300 and covering the through hole 110 and avoiding the alignment hole 120.
Before the circuit board is embedded into the copper block, the heat dissipation copper block 300 is placed into the through hole 110 of the positioning plate 100, and the heat dissipation copper block 300 is carried by the carrier plate 200, referring to fig. 3, when the copper block needs to be embedded into the circuit board, the positioning plate 100 with the heat dissipation copper block 300 and the carrier plate 200 are stacked on the circuit board, and the heat dissipation copper block 300 is dropped onto the circuit board by pulling out the carrier plate 200.
Referring to fig. 1 and 4, in some embodiments, the through hole 110 is a square hole, the shape of the through hole 110 is adapted to the shape of the heat dissipation copper block 300, and the side length of the through hole 110 is greater than the side length of the heat dissipation copper block 300, so that a gap is left between the heat dissipation copper block 300 and the side wall of the through hole 110, thereby avoiding the problem that the through hole 110 is too small in size to increase the difficulty of being placed in the heat dissipation copper block, reducing the difficulty of the heat dissipation copper block 300 being separated from the through hole 110, and facilitating the heat dissipation copper block 300 to fall into the circuit board 400 to be processed quickly in the.
In order to avoid the situation that the size of the through hole 110 is too large and the heat dissipation copper block 300 is freely turned in the through hole 110 to cause dislocation between the heat dissipation copper block 300 and the position of the circuit board where the copper block needs to be embedded, the size of the through hole 110 is 75 +/-1 microns wider than the single side of the heat dissipation copper block 300, namely, the side length of the through hole 110 is 150 +/-2 microns wider than the side length of the heat dissipation copper block 300.
Referring to fig. 1 and 2, in order to avoid the alignment holes 120 from affecting the distribution positions of the through holes 110 and facilitate quick searching of the alignment holes 120, the alignment holes 120 are disposed on the edges of two adjacent sides of the positioning board 100. It should be noted that the number of the aligning holes 120 may be two, three, or more than four. In the embodiment of the present invention, the number of the aligning holes 120 is four, wherein the aligning holes 120 located at the left side and the upper side of the alignment plate 100 are general holes, and the aligning holes 120 located at the right side and the lower side of the alignment plate 100 are spare holes.
Referring to fig. 2, in some embodiments, the corners of the positioning plate 100 are provided with chamfers 130, wherein the chamfers 130 include fillets and chamfers. Chamfer 130 can reduce the edges and corners of locating plate 100, avoids causing the edges and corners fish tail or stabbing operating personnel of locating plate 100 because of the unexpected condition, is favorable to improving the security of production.
In some embodiments, the production is performed in a flow line manner to improve the production efficiency, that is, a plurality of working positions are arranged on the flow line, and an operator at each working position is responsible for placing the heat dissipation copper block 300 into the through hole 110 of a certain partition of the positioning plate 100, so that the production yield per unit time can be improved in the flow line manner in which a plurality of persons work simultaneously. In order to prevent the positioning plate 100 and the carrier plate 200 from shifting when the positioning plate 100 and the carrier plate 200 are transported through the assembly line, magnetic attraction members (not shown) are disposed on the positioning plate 100 and the carrier plate 200, respectively. The magnetic attraction member can be made of magnet and ferromagnetic material, such as iron and steel. Specifically, the bottom of the positioning plate 100 is provided with a magnetic sheet, the support plate 200 is provided with an iron sheet, or the bottom of the positioning plate 100 is provided with an iron sheet, and the support plate 200 is provided with a magnetic sheet, or the bottom of the positioning plate 100 and the support plate 200 are both provided with magnetic sheets. It should be noted that, since the carrier plate 200 needs to be separated from the positioning plate 100 in the subsequent steps, the magnetic sheet has weaker magnetism, which can not only avoid the deviation between the positioning plate 100 and the carrier plate 200, but also facilitate the separation between the positioning plate 100 and the carrier plate 200.
In some embodiments, the carrier plate 200 is a stainless steel plate. The stainless steel has high strength, is not easy to deform, has good anti-corrosion performance, and is beneficial to prolonging the service life of the carrier plate 200. In practical application, the stainless steel surface may be polished and polished to make the stainless steel surface smoother, thereby facilitating separation between the carrier plate 200 and the positioning plate 100 in subsequent steps.
The thickness of the positioning plate 100 is determined according to the thickness of the heat dissipation copper block 300, and the number of the positioning plates 100 is one, two or more. When the thickness of heat dissipation copper billet 300 is thinner, adopt a locating plate 100 can satisfy the thickness requirement, when the thickness of heat dissipation copper billet 300 is thicker, in order to avoid making locating plate 100 again, stack in order to satisfy the thickness requirement through two or more locating plates 100.
The method for embedding the heat dissipation copper block in the second aspect embodiment of the invention comprises the following steps:
pre-arranging copper blocks: referring to fig. 1 or fig. 2, the positioning plate 100 is stacked on the carrier plate 200, and the heat-dissipating copper block 300 is placed in the through hole 110 of the positioning plate 100;
stacking circuit boards: referring to fig. 3 or fig. 4, a circuit board 400 to be processed is placed on a chassis 500 provided with a splice nail 510, and the circuit board 400 to be processed is aligned by the splice nail 510;
transferring the copper blocks: referring to fig. 3, the positioning plate 100 and the carrier plate 200, which are pre-arranged with copper blocks, are stacked on the circuit board 400 to be processed, and are aligned according to the dowels 510, that is, the positioning plate 100 is sleeved on the dowels 510 through the alignment holes 120;
embedding a copper block: referring to fig. 4, the carrier 200 is pulled out to make the heat-dissipating copper block 300 fall onto the circuit board 400 to be processed.
It should be understood that after the heat dissipating copper block 300 is dropped onto the circuit board 400 to be processed, the method further comprises the steps of removing the positioning plate 100 and stacking the circuit boards according to the stacking requirement of the circuit boards.
The radiating copper blocks 300 are pre-arranged in the copper block pre-arranging step, so that the time for occupying a plate stacking procedure can be reduced, the limitation of working positions can be avoided due to the pre-arrangement of the copper blocks, multiple people can be arranged to operate, the production efficiency can be improved, in the plate stacking procedure, the radiating copper blocks 300 can be embedded into the circuit board 400 to be processed by drawing out the support plate 200 after the copper blocks are transferred, the operation is simple and convenient, and the work efficiency can be improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. The utility model provides a tool of embedding heat dissipation copper billet which characterized in that includes:
the positioning plate (100) is provided with a through hole (110) and a positioning hole (120), and the through hole (110) is used for placing a heat dissipation copper block (300);
the support plate (200) is arranged at the bottom of the positioning plate (100) in a separable mode, and the support plate (200) can cover the through hole (110) and avoid the alignment hole (120).
2. The jig for embedding heat dissipating copper blocks as claimed in claim 1, wherein the through holes (110) are square holes, and the side length of the through holes (110) is greater than the side length of the heat dissipating copper blocks (300).
3. The jig for embedding heat dissipating copper blocks as claimed in claim 2, wherein the side length of the through holes (110) is wider than the side length of the heat dissipating copper blocks (300) by 150 ± 2 μm.
4. The jig for embedding heat dissipating copper blocks as claimed in claim 1, wherein the alignment holes (120) are disposed on the edges of two adjacent sides of the positioning plate (100).
5. The jig for embedding heat dissipation copper blocks as claimed in claim 1, wherein the positioning plate (100) is provided with chamfers (130) at its corners.
6. The jig for embedding heat dissipation copper blocks as claimed in claim 1, wherein the positioning plate (100) and the carrier plate (200) are respectively provided with magnetic attraction members matching with each other.
7. The jig for embedding heat dissipating copper blocks as claimed in any one of claims 1 to 6, wherein the carrier plate (200) is made of stainless steel.
8. The jig for embedding heat dissipation copper blocks as claimed in any one of claims 1 to 6, wherein the number of the positioning plates (100) is at least one.
9. A method for embedding a heat dissipation copper block is characterized by comprising the following steps:
pre-arranging copper blocks, namely stacking the positioning plate (100) on the carrier plate (200), and placing the heat-dissipation copper blocks (300) into the through holes (110) of the positioning plate (100);
stacking the circuit boards, placing the circuit board (400) to be processed on a chassis (500) provided with split nails (510), and aligning the circuit board (400) to be processed through the split nails (510);
the copper block is transferred, the positioning plate (100) and the carrier plate (200) which are pre-arranged by the copper block are stacked on the circuit board (400) to be processed, and alignment is carried out according to the split pins (510);
and (3) embedding the copper block, and extracting the carrier plate (200) to enable the heat dissipation copper block (300) to fall onto the circuit board (400) to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010050354.2A CN111132453A (en) | 2020-01-17 | 2020-01-17 | Jig and method for embedding heat dissipation copper block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010050354.2A CN111132453A (en) | 2020-01-17 | 2020-01-17 | Jig and method for embedding heat dissipation copper block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111132453A true CN111132453A (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010050354.2A Pending CN111132453A (en) | 2020-01-17 | 2020-01-17 | Jig and method for embedding heat dissipation copper block |
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| CN (1) | CN111132453A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111491461A (en) * | 2020-05-28 | 2020-08-04 | 苏州欣汇电智能装备技术有限公司 | Automatic embedding device for metal base |
| CN113194600A (en) * | 2021-04-27 | 2021-07-30 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
-
2020
- 2020-01-17 CN CN202010050354.2A patent/CN111132453A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111491461A (en) * | 2020-05-28 | 2020-08-04 | 苏州欣汇电智能装备技术有限公司 | Automatic embedding device for metal base |
| CN113194600A (en) * | 2021-04-27 | 2021-07-30 | 四川普瑞森电子有限公司 | Copper block embedding tool and method for circuit board |
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