CN111132451A - Reinforcement plate, flexible printed circuit board and dispensing method - Google Patents
Reinforcement plate, flexible printed circuit board and dispensing method Download PDFInfo
- Publication number
- CN111132451A CN111132451A CN202010024201.0A CN202010024201A CN111132451A CN 111132451 A CN111132451 A CN 111132451A CN 202010024201 A CN202010024201 A CN 202010024201A CN 111132451 A CN111132451 A CN 111132451A
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- reinforcing
- plate
- substrate
- gap
- strippable
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a reinforcing plate, a flexible printed circuit board and a dispensing method. The reinforcing plate comprises a reinforcing substrate, at least one gap penetrating through the thickness direction of the reinforcing substrate is etched on the reinforcing substrate, the reinforcing plate further comprises a strippable coating, the strippable coating in the strippable coating is filled in the at least one gap on the lower surface of the reinforcing substrate, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate. Like this, when the device to on the upper surface of stiffening plate is glued, because the gap on the stiffening plate has been filled by strippable coating, liquid glue can not flow to the gap, directly flows to between device and the stiffening plate, and after liquid glue solidification, strippable coating on the stiffening plate can directly peel off, can ensure to have the gap that reduces internal stress on the stiffening plate, and these gaps can not influence the point of gluing between device and the stiffening plate again, ensure good some glue effects when improving the roughness.
Description
Technical Field
The invention relates to the technical field of flexible printed circuit boards, in particular to a reinforcing plate, a flexible printed circuit board and a dispensing method.
Background
A Flexible Printed Circuit (FPC), which is also called a Flexible Printed Circuit (FPC), is a Printed Circuit having high reliability and excellent flexibility, which is manufactured by etching a Circuit on a copper foil using a polyester film or polyimide as a base material. The flexible printed circuit board has the advantages of small volume, light weight, high flexibility, excellent electrical property and the like, and meets the requirements of high density, miniaturization, light weight, thinness and high reliability in the development direction.
Because the flexible printed circuit board has certain flexibility, when the flexible printed circuit board is used for manufacturing related electrical devices, the strength of the flexible printed circuit board needs to be increased by using the reinforcing plate, and the flexible printed circuit board can be attached to the surface of the reinforcing plate through the conductive adhesive so as to obtain certain mechanical stability. In the case where many devices need to be reinforced, a larger area of reinforcing plate is required. The larger the area of the reinforcing plate is, the worse the surface flatness of the reinforcing plate can be caused by the stress generated in the material when the material is subjected to external force. In order to solve the problem of stiffening plate roughness, divide into the polylith with the stiffening plate usually and close the pressure, have the gap between two adjacent to reduce the inside stress of stiffening plate, nevertheless because there is the gap on the stiffening plate, when gluing stiffening plate and device point, glue and flow into these gaps easily, the glue that flows into between stiffening plate and device reduces, is difficult to the adhesion between stiffening plate and device, and the point is glued the effect and is poor.
Disclosure of Invention
The embodiment of the invention provides a reinforcing plate, a flexible printed circuit board and a dispensing method, which are used for solving the technical problem of poor dispensing effect between the reinforcing plate and a device.
In a first aspect, the present invention provides a stiffener for a flexible printed circuit board, including:
the reinforcing substrate is etched with at least one gap penetrating through the thickness direction of the reinforcing substrate;
the strippable coating is coated on the lower surface of the reinforcing substrate, the strippable coating in the strippable coating is filled in the at least one gap, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate.
Optionally, the reinforcing substrate is any one of a steel plate, a polyimide plate, a glass fiber cloth plate, and an aluminum foil plate.
Optionally, the peelable coating in the peelable coating is a peelable glue or a peelable resin.
Optionally, four corners of the reinforcing substrate are provided with round chamfers.
Optionally, the reinforcing substrate is a rectangular plate-shaped structure with a length of 36mm, a width of 26mm, and a thickness of 0.15 mm.
Optionally, the reinforcing substrate is divided into M regions by the at least one slit on the reinforcing substrate, where M is the number of devices to be bonded.
Optionally, the device to be bonded includes a 4-in-1 fingerprint identification chip, the 4-in-1 fingerprint identification chip includes 4 fingerprint identification sub-chips, 3 slits are provided on the reinforcing substrate, the reinforcing substrate is divided into 4 regions corresponding to the 4 fingerprint identification sub-chips one to one, and each region is used for adhering a corresponding fingerprint identification sub-chip in the 4-in-1 fingerprint identification chip.
In a second aspect, the present invention provides a flexible printed circuit board, which includes a flexible substrate and the stiffener described in the first aspect, wherein a hollow area corresponding to the stiffener is disposed on the flexible substrate, an area of the hollow area is larger than an area of a device to be bonded, the at least one gap is located in the hollow area, and the flexible substrate and the upper surface of the stiffener are bonded together by a conductive adhesive.
In a third aspect, the present invention provides a dispensing method applied to the flexible printed circuit board of the second aspect, including:
placing a device to be bonded on the reinforcing plate of the hollowed-out area, wherein the device to be bonded is placed in a corresponding area divided by the at least one gap;
filling liquid glue in the gap closest to the edge of the chip to be bonded, and enabling the liquid glue to flow between the device to be bonded and the reinforcing plate;
and after the liquid glue is solidified, peeling the peelable coating on the lower surface of the reinforcing plate.
In a fourth aspect, the present invention provides a method for manufacturing a reinforcing plate, including:
etching at least one gap on a reinforcing substrate, wherein each gap in the at least one gap penetrates through the thickness direction of the reinforcing substrate;
and coating strippable paint on the lower surface of the reinforcing substrate to form a strippable coating, wherein the strippable paint filled in the at least one gap is flush with the upper surface of the reinforcing substrate.
One or more technical solutions in the embodiments of the present application have at least one or more of the following technical effects:
in the technical scheme of the embodiment of the invention, the reinforcing plate comprises a reinforcing substrate, at least one gap penetrating through the thickness direction of the reinforcing substrate is etched on the reinforcing substrate, the reinforcing plate further comprises a strippable coating, the strippable coating in the strippable coating is filled in the at least one gap on the lower surface of the reinforcing substrate, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate. Thus, through the reinforcing plate in the embodiment of the invention, when the device on the upper surface of the reinforcing plate is subjected to dispensing, as the gap on the reinforcing plate is filled with the strippable coating, the liquid glue can not flow to the gap and directly flow between the device and the reinforcing plate, and after the liquid glue is cured, the strippable coating on the reinforcing plate can be directly stripped, so that the gap for reducing internal stress on the reinforcing plate can be ensured, the gaps can not influence the dispensing between the device and the reinforcing plate, and the good dispensing effect is ensured while the flatness is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a reinforcing plate according to a first embodiment of the present invention;
FIG. 2 is a schematic top view of a reinforcing plate according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a hollow area of a flexible substrate in a flexible printed circuit board according to a second embodiment of the present invention;
FIG. 4 is a schematic view of a third embodiment of the present invention with a chip mounted on a stiffener;
fig. 5 is a schematic diagram of a flexible printed circuit board according to a fourth embodiment of the present invention after a strippable coating is peeled off from a reinforcing plate.
Detailed Description
The embodiment of the invention provides a reinforcing plate, a flexible printed circuit board and a dispensing method, which are used for providing a TOF reinforcing plate capable of automatically zooming and realizing clear images in a range of variable depth of field.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
in the technical solution of the embodiment of the present invention, there is provided a stiffening plate applied to a flexible printed circuit board, including: the reinforcing substrate is etched with at least one gap penetrating through the thickness direction of the reinforcing substrate; the strippable coating is coated on the lower surface of the reinforcing substrate, the strippable coating in the strippable coating is filled in the at least one gap, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate. When the device to on the upper surface of stiffening plate is glued, because the gap on the stiffening plate has been filled by strippable coating, liquid glue can not flow to the gap, directly flows to between device and the stiffening plate, and after liquid glue solidification, strippable coating on the stiffening plate can directly peel off, like this, can ensure to have the gap that reduces internal stress on the stiffening plate, and these gaps can not influence the point of gluing between device and the stiffening plate again, ensure good some glue effects when improving the roughness.
The technical solutions of the present invention are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present invention are described in detail in the technical solutions of the present application, and are not limited to the technical solutions of the present application, and the technical features in the embodiments and examples of the present application may be combined with each other without conflict.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
A first embodiment of the present invention provides a stiffener applied to a flexible printed circuit board, including: the reinforcing substrate is etched with at least one gap penetrating through the thickness direction of the reinforcing substrate; the reinforcing substrate is characterized by further comprising a strippable coating which is coated on the lower surface of the reinforcing substrate, the strippable coating in the strippable coating is filled in the at least one gap, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate. The at least one gap on the reinforcing substrate divides the reinforcing substrate into M areas, wherein M is the number of devices to be bonded.
Specifically, in this embodiment, please refer to fig. 1 and fig. 2, in which fig. 1 is a schematic cross-sectional view of a reinforcing plate in a first embodiment of the present invention, fig. 2 is a top view of the reinforcing plate in the first embodiment of the present invention, and fig. 1 and fig. 2 show that 3 slits are disposed on a reinforcing substrate 10 to divide the reinforcing substrate 10 into 4 regions, and the 4 regions are used for adhering devices to be reinforced. Specifically, the 3 slits may be etched in the reinforcing substrate by chemical etching.
Furthermore, a strippable coating 20 is coated on the lower surface of the reinforcing substrate 10, and 3 gaps on the reinforcing substrate 10 are filled with strippable paint in the strippable coating 20 and are flush with the upper surface of the reinforcing substrate 10.
Like this, the device is placed in above-mentioned 4 corresponding region, when the upper surface at reinforcing base plate 10 carries out the point and glues, the liquid glue of point and flow into between device and reinforcing base plate 10, can be in the same place the firm bonding of device and reinforcing base plate 10 after the solidification, strippable coating on the reinforcing plate can directly be peeled off, like this, can ensure to have the gap that reduces internal stress on the reinforcing plate, and these gaps can not influence the point between device and the reinforcing plate again and glue, ensure good point and glue the effect when improving the roughness.
Further, in this embodiment, the to-be-bonded device shown in fig. 1 and fig. 2 includes a 4-in-1 fingerprint identification chip, the 4-in-1 fingerprint identification chip includes 4 fingerprint identification sub-chips, 3 slits are provided on the reinforcing substrate, the reinforcing substrate is divided into 4 regions corresponding to the 4 fingerprint identification sub-chips one by one, and each region is used for adhering the corresponding fingerprint identification sub-chip in the 4-in-1 fingerprint identification chip. According to the size of the 4-in-1 fingerprint identification chip, the reinforcing substrate 10 has a rectangular plate-shaped structure with a length of 36mm, a width of 26mm and a thickness of 0.15 mm. In this embodiment, the reinforcing substrate 10 with a thickness of 0.15mm is selected to improve the strength of the FPC board. The thickness of the reinforcing substrate 10 has a crucial influence on the use performance of the FPC board, and on one hand, if the thickness of the reinforcing substrate is too small, it is difficult to achieve an ideal reinforcing effect, and on the other hand, if the thickness of the reinforcing substrate is too large, the application of the FPC board in electronic equipment is limited. The reinforcing substrate with the thickness of 0.15mm is selected to ensure a good reinforcing effect, and meanwhile, the size of the FPC board is not greatly influenced, so that the FPC board is beneficial to wide application in electronic equipment.
In this embodiment, the reinforcing substrate is any one of a steel plate, a polyimide plate, a glass fiber cloth plate, and an aluminum foil plate.
In the foregoing embodiment, if the device to be bonded includes a 4-in-1 fingerprint identification chip, the reinforcing substrate 10 may be a stainless steel plate, which is not easy to deform and has high strength, and can perform the functions of conduction and induction. Specifically, steel plates of stainless steel 304 and 301 may be used as the reinforcing substrate 10. Furthermore, a nickel-plated steel sheet can be selected as the reinforcing substrate 10, and the nickel has strong corrosion resistance, so that the steel sheet is protected, the plasticity of the nickel is strong, and the bonding force with a matrix is good, so that the service life of the reinforcing substrate 10 can be effectively prolonged by adopting the nickel-plated steel sheet, and the reliability of the FPC board is improved.
Further, if the heat dissipation capacity of the device to be bonded is large, the reinforcing substrate 10 may be a polyimide plate PI made of a polyimide material, and has high temperature resistance.
If the FPC corresponding to the reinforcing plate in this embodiment is applied to a product requiring high-performance electronic insulation, the reinforcing substrate 10 may be a glass fiber cloth board FR-4, which has high mechanical properties and dielectric properties, stable electrical insulation properties, and good heat resistance and moisture resistance.
If the FPC corresponding to the reinforcing plate in this embodiment is applied to an electronic device with a high heat dissipation requirement, the reinforcing substrate 10 may be an aluminum foil reinforcing plate.
In a specific implementation process, the reinforcing substrate 10 may further select a teflon plate, a polycarbonate plate, a polyester reinforcing plate, and the like according to different application scenarios, and a specific type of the reinforcing substrate 10 may be set according to actual needs, which is not limited in this embodiment.
Specifically, in the present embodiment, the peelable coating in the peelable coating layer 20 mainly has functions including a filling function, and fills the gap in the reinforcing substrate 10 and is flush with the upper surface of the reinforcing substrate 10, so that the subsequent dispensing operation between the device to be bonded and the reinforcing substrate 10 is facilitated. In addition, the strippable coating also has a protective function. The film-forming material of the strippable coating is also a polymeric material. The coating film is solidified to form a continuous and compact strippable coating which is attached to the protected object, so that the invasion of external media such as air, water vapor, salt mist, microorganisms and the like is isolated, the chemical corrosion effect is reduced, and the anticorrosion effect is achieved. In addition, the coating has certain thickness and elasticity, can relieve external force collision and artificial scratch, and achieves the protection effect. Furthermore, the strippable coating also has a decontamination function. The strippable coating adsorbs pollutants on the protected surface through the surface adsorption in the film forming process, so that the pollutants are transferred from the surface of the material to the film to form a part of the film, and other residual substances on the surface of the material are adhered by the viscous force due to the fact that the macromolecular film forming substance has certain viscosity. The result of the action of the two forces is that contaminants accumulate on the film and can be removed from the protected material by simply removing the peelable coating.
Further, in the present embodiment, the peelable coating in the peelable coating layer is peelable glue or peelable resin.
Specifically, in this embodiment, the peelable coating is peelable glue or peelable resin, specifically, the peelable glue has strong water resistance, oil resistance, corrosion resistance and insulation property, and after being sprayed on the lower surface of the reinforcing substrate 10, a peelable film is formed, so that the object is effectively isolated by the peelable film, and the new state of preventing dirt, rust, acid and alkali, scratch and tearing is achieved. The strippable resin is a water-based strippable coating, which is a coating prepared by dispersing water-based strippable resin in water, namely the solvent of the coating is water, and the strippable resin has the advantages of environmental protection and safety, uses cheap water instead of expensive and toxic organic solvent, does not pollute the environment, saves the production cost and improves the construction safety. In a specific implementation process, the strippable coating is not limited to the above two, and can be selected according to actual needs, and the embodiment is not limited herein.
Further, in the present embodiment, four corners of the reinforcing substrate 10 are each provided with a rounded chamfer. Specifically, in this embodiment, four corners of the reinforcing substrate 10 are provided with round chamfers, so that the problem that the flexible substrate of the FPC is easily punctured due to the fact that the reinforcing substrate 10 is thin and the four corners are sharp is solved, and the operation safety of an operator can be ensured by effectively preventing the operator from scratching fingers in the installation process of the reinforcing substrate 10.
Based on the same inventive concept as in the previous embodiments, a second embodiment of the present invention provides a flexible printed circuit board including: referring to fig. 3, a hollowed-out region corresponding to the reinforcing plate is disposed on the flexible substrate, an area of the hollowed-out region is larger than an area of a device to be bonded, at least one gap is located in the hollowed-out region, and the flexible substrate and the upper surface of the reinforcing plate are bonded together by a conductive adhesive. Referring to fig. 4, the chip to be bonded includes 4-to-1 fingerprint identification chips, and 4 fingerprint identification sub-chips are respectively disposed in corresponding regions and separated by gaps.
Further, in this embodiment, the flexible substrate material is a polyimide copper clad laminate. The polyimide copper clad laminate is adopted as the material of the flexible substrate, and the rolled copper foil material with high purity and very uniform structure is selected, so that the crystal direction of the rolled copper foil material is parallel to the line trend, and the toughness of the product is improved. And simultaneously, before the circuit is manufactured, the polyimide copper clad laminate is subjected to high-temperature heat treatment, so that the flexural property of the copper foil is enhanced again, and the shrinkage and stress of the polyimide due to moisture absorption are eliminated, thereby effectively improving the flexural capacity of the flexible substrate.
Further, in this embodiment, the area of stiffening plate is greater than the area of flexible base plate, the flexible base plate with the upper surface of stiffening plate passes through conductive adhesive and pastes together, has improved the bonding stress between stiffening plate and the flexible base plate, greatly reduced the risk that the stiffening plate drops from the flexible base plate in the operation process. The specific structure of the reinforcing plate has been described in detail in the foregoing first embodiment, please refer to the contents of the first embodiment, and the description of this embodiment is omitted here.
The flexible printed circuit board in the embodiment ensures the flatness of the reinforcing plane through the reinforcing plate arranged, and does not influence the glue dispensing between the follow-up reinforcing plate and the device to be bonded, thereby ensuring good glue dispensing effect.
Based on the same inventive concept as in the previous embodiments, a third embodiment of the present invention provides a method of manufacturing a reinforcing plate, including:
etching at least one gap on a reinforcing substrate, wherein each gap in the at least one gap penetrates through the thickness direction of the reinforcing substrate;
and coating strippable paint on the lower surface of the reinforcing substrate to form a strippable coating, wherein the strippable paint filled in the at least one gap is flush with the upper surface of the reinforcing substrate.
Specifically, in this embodiment, a chemical etching method is used to etch a predetermined number of slits, such as 3 slits in the foregoing embodiment, in the reinforcing substrate. The 3 slits divide the reinforcing substrate into 4 areas, and the 4 areas are used for pasting the devices to be reinforced. The gap can be in a rectangular strip structure or in other shapes. In the specific implementation process, the position, shape and number of the slits etched on the reinforcing substrate can be set according to actual needs, and the embodiment is not limited herein.
Further, a strippable coating is coated on the lower surface of the reinforcing substrate, and the strippable coating in the strippable coating 20 fills the gaps on the reinforcing substrate and is flush with the upper surface of the reinforcing substrate. In the specific implementation process, the strippable coating used has been described in detail in the foregoing first embodiment, and thus, the description of this embodiment is omitted.
Like this, the device is placed in the upper surface of reinforcement base plate and is corresponded the region, when the upper surface at the reinforcement base plate carries out some glue, the liquid glue of some glue flows into between device and the reinforcement base plate, can be in the same place the firm bonding of device and reinforcement base plate after the solidification, strippable coating on the stiffening plate can directly peel off, like this, can ensure to have the gap that reduces internal stress on the stiffening plate, these gaps can not influence some glue between device and the stiffening plate again, ensure good some glue effect when improving the roughness.
Based on the same inventive concept as the foregoing embodiment, a fourth embodiment of the present invention provides a dispensing method applied to the flexible printed circuit board in the foregoing second embodiment, including:
placing a device to be bonded on the reinforcing plate of the hollowed-out area, wherein the device to be bonded is placed in a corresponding area divided by the at least one gap;
filling liquid glue in the gap closest to the edge of the chip to be bonded, and enabling the liquid glue to flow between the device to be bonded and the reinforcing plate;
and after the liquid glue is solidified, peeling the peelable coating on the lower surface of the reinforcing plate.
Specifically, in this embodiment, during dispensing, the device to be bonded is placed on the stiffener in the hollow area of the flexible printed circuit board, please refer to fig. 4, the chip to be bonded includes 4-to-1 fingerprint identification chips, the 4 fingerprint identification sub-chips are respectively placed in the corresponding areas, and the chips are separated by gaps.
Furthermore, a strippable coating is coated on the lower surface of the reinforcing substrate, and gaps on the reinforcing substrate are filled with the strippable coating in the strippable coating and are flush with the upper surface of the reinforcing substrate. Therefore, the device is placed in the corresponding area of the upper surface of the reinforcing substrate, when the glue is dispensed on the upper surface of the reinforcing substrate, the liquid glue dispensed flows between the device and the reinforcing substrate, the device and the reinforcing substrate can be firmly bonded together after curing, and the strippable coating on the reinforcing plate can be directly stripped. Referring to fig. 5, a schematic diagram of the stripped coating is shown, so that gaps for reducing internal stress can be ensured on the reinforcing plate, and the gaps do not affect the dispensing between the device and the reinforcing plate, thereby improving the flatness and ensuring good dispensing effect.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A stiffening plate applied to a flexible printed circuit board, comprising:
the reinforcing substrate is etched with at least one gap penetrating through the thickness direction of the reinforcing substrate;
the strippable coating is coated on the lower surface of the reinforcing substrate, the strippable coating in the strippable coating is filled in the at least one gap, and the strippable coating filled in the at least one gap is flush with the upper surface of the reinforcing substrate.
2. The reinforcing plate of claim 1, wherein the reinforcing substrate is any one of a steel plate, a polyimide plate, a glass fiber cloth plate, and an aluminum foil plate.
3. The reinforcing panel of claim 1, wherein the strippable coating in the strippable coating is a strippable glue or a strippable resin.
4. The reinforcing plate of claim 1, wherein each of four corners of the reinforcing base plate is provided with a rounded chamfer.
5. The reinforcing plate of claim 1, wherein the reinforcing base plate has a rectangular plate-like structure having a length of 36mm, a width of 26mm, and a thickness of 0.15 mm.
6. The stiffening plate of claim 5, wherein the at least one slit in the stiffening substrate divides the stiffening substrate into M zones, where M is the number of devices to be bonded.
7. The reinforcing plate of claim 6, wherein the device to be bonded comprises a 4-in-1 fingerprint identification chip, the 4-in-1 fingerprint identification chip comprises 4 fingerprint identification sub-chips, 3 slits are arranged on the reinforcing substrate, the reinforcing substrate is divided into 4 areas corresponding to the 4 fingerprint identification sub-chips one by one, and each area is used for adhering the corresponding fingerprint identification sub-chip in the 4-in-1 fingerprint identification chip.
8. A flexible printed circuit board, comprising a flexible substrate and the reinforcing plate of any one of claims 1 to 7, wherein the flexible substrate is provided with a hollowed-out region corresponding to the reinforcing plate, the area of the hollowed-out region is larger than that of a device to be bonded, the at least one slit is located in the hollowed-out region, and the flexible substrate and the upper surface of the reinforcing plate are bonded together through a conductive adhesive.
9. A dispensing method applied to the flexible printed circuit board of claim 8, comprising:
placing a device to be bonded on the reinforcing plate of the hollowed-out area, wherein the device to be bonded is placed in a corresponding area divided by the at least one gap;
filling liquid glue in the gap closest to the edge of the chip to be bonded, and enabling the liquid glue to flow between the device to be bonded and the reinforcing plate;
and after the liquid glue is solidified, peeling the peelable coating on the lower surface of the reinforcing plate.
10. A method of manufacturing a stiffener, comprising:
etching at least one gap on a reinforcing substrate, wherein each gap in the at least one gap penetrates through the thickness direction of the reinforcing substrate;
and coating strippable paint on the lower surface of the reinforcing substrate to form a strippable coating, wherein the strippable paint filled in the at least one gap is flush with the upper surface of the reinforcing substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010024201.0A CN111132451A (en) | 2020-01-09 | 2020-01-09 | Reinforcement plate, flexible printed circuit board and dispensing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010024201.0A CN111132451A (en) | 2020-01-09 | 2020-01-09 | Reinforcement plate, flexible printed circuit board and dispensing method |
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| CN111132451A true CN111132451A (en) | 2020-05-08 |
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| CN202010024201.0A Pending CN111132451A (en) | 2020-01-09 | 2020-01-09 | Reinforcement plate, flexible printed circuit board and dispensing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712062A (en) * | 2020-06-30 | 2020-09-25 | 生益电子股份有限公司 | Chip and PCB welding method |
-
2020
- 2020-01-09 CN CN202010024201.0A patent/CN111132451A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712062A (en) * | 2020-06-30 | 2020-09-25 | 生益电子股份有限公司 | Chip and PCB welding method |
| CN111712062B (en) * | 2020-06-30 | 2021-09-28 | 生益电子股份有限公司 | Chip and PCB welding method |
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