CN111129338B - Display device, display panel and preparation method thereof - Google Patents

Display device, display panel and preparation method thereof Download PDF

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Publication number
CN111129338B
CN111129338B CN201911164206.7A CN201911164206A CN111129338B CN 111129338 B CN111129338 B CN 111129338B CN 201911164206 A CN201911164206 A CN 201911164206A CN 111129338 B CN111129338 B CN 111129338B
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layer
display
area
organic
packaging
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CN111129338A (en
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罗程远
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

Abstract

The disclosure provides a display device, a display panel and a preparation method of the display panel. The preparation method of the display panel can comprise the following steps: forming a display substrate; forming a first inorganic encapsulation layer on one side of the display substrate; forming an organic encapsulation layer on a surface of the first inorganic encapsulation layer facing away from the display substrate, the organic encapsulation layer including a diluent; and forming a second inorganic packaging layer on one side of the organic packaging layer far away from the first inorganic packaging layer. The packaging method and the packaging device can improve the flatness of the packaging layer, and further improve the production yield.

Description

Display device, display panel and preparation method thereof
Technical Field
The disclosure relates to the technical field of display, and in particular to a display device, a display panel and a preparation method of the display panel.
Background
With the rapid development of display technology, organic electroluminescent (OLED) display panels have attracted more and more attention.
The organic electroluminescent display panel mainly realizes light emission by a light emitting unit provided on a display substrate. The light emitting unit generally includes an anode and a cathode disposed opposite to each other, and a light emitting layer disposed between the anode and the cathode. When the display panel works, the luminous layer is easy to be corroded by water and oxygen to lose efficacy, so that an encapsulation layer is generally manufactured on the luminous unit, and the luminous unit is isolated from the outside water and oxygen through the encapsulation layer, so that the service life of the display panel is ensured. However, in the related art, the manufactured encapsulation layer generally has poor flatness, thereby reducing the production yield of the display panel.
It is noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure and therefore may include information that does not constitute prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The purpose of the present disclosure is to provide a display device, a display panel and a method for manufacturing the display panel, which can improve the flatness of the encapsulation layer, and further improve the production yield.
According to an aspect of the present disclosure, there is provided a method of manufacturing a display panel, including:
forming a display substrate;
forming a first inorganic encapsulation layer on one side of the display substrate;
forming an organic encapsulation layer on a surface of the first inorganic encapsulation layer facing away from the display substrate, the organic encapsulation layer including a diluent;
and forming a second inorganic packaging layer on one side of the organic packaging layer far away from the first inorganic packaging layer.
In an exemplary embodiment of the present disclosure, the display substrate includes a display region, an auxiliary region surrounding the display region, and a peripheral region surrounding the auxiliary region, the organic encapsulation layer includes a first encapsulation portion corresponding to the display region, and the thinner is located at the first encapsulation portion.
In an exemplary embodiment of the present disclosure, the organic encapsulation layer includes a second encapsulation part corresponding to the auxiliary region, the second encapsulation part including a thickener.
In an exemplary embodiment of the present disclosure, the first and second packing portions are spaced apart.
In an exemplary embodiment of the present disclosure, forming a display substrate includes:
forming a driving back plate;
forming a plurality of first electrodes on the driving back plate, wherein the plurality of first electrodes are distributed in the display area and the auxiliary area;
forming a pixel defining layer covering a plurality of the first electrodes and the driving backplane;
forming a plurality of openings on the pixel defining layer, wherein the first electrodes are exposed through the openings in a one-to-one correspondence manner;
forming a light emitting layer covering at least a region of each of the first electrodes exposed to each of the openings;
forming a second electrode on the surface of the light-emitting layer, which is back to the driving backboard, wherein the area of the second electrode, which corresponds to each opening, is provided with a concave part;
the first inorganic packaging layer covers the surface, opposite to the driving back plate, of the second electrode, recessed areas are formed in the first inorganic packaging layer corresponding to the recessed areas, the first packaging portion is located in the recessed areas corresponding to the display area, and the second packaging portion is located in the recessed areas corresponding to the auxiliary area.
In an exemplary embodiment of the present disclosure, the diluent includes a functional acrylate.
In one exemplary embodiment of the present disclosure, the forming of the organic encapsulation layer on the surface of the first inorganic encapsulation layer facing away from the display substrate includes:
forming an organic material layer on a surface of the first inorganic encapsulation layer facing away from the display substrate;
adding a diluent to a region of the organic material layer corresponding to the display region to form a first encapsulation portion; adding a thickener to a region of the organic material layer corresponding to the auxiliary region to form a second encapsulation portion.
According to an aspect of the present disclosure, there is provided a display panel including:
a display substrate;
the first inorganic packaging layer is arranged on the display substrate;
the organic packaging layer is arranged on the surface, back to the display substrate, of the first inorganic packaging layer and comprises a diluent;
and the second inorganic packaging layer is arranged on one side of the organic packaging layer, which is far away from the first inorganic packaging layer.
In an exemplary embodiment of the present disclosure, the diluent includes a functional acrylate.
According to an aspect of the present disclosure, there is provided a display device including the display panel of any one of the above.
According to the display device, the display panel and the preparation method of the display panel, the first inorganic packaging layer is formed on the display substrate, the organic packaging layer is formed on the surface of the first inorganic packaging layer, which faces away from the display substrate, and the second inorganic packaging layer is formed on the side, away from the first inorganic packaging layer, of the organic packaging layer. The organic packaging layer comprises the diluent, so that the organic packaging material in the organic packaging layer can be diluted, the organic packaging material is easy to level, the flatness of the second inorganic packaging layer is improved, and the production yield of the display panel is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1 is a flowchart of a method of manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 2 is a flowchart illustrating a step 120 in a method for manufacturing a display panel according to an embodiment of the disclosure;
FIG. 3 is a schematic diagram of a display panel according to an embodiment of the disclosure;
FIG. 4 is a partial schematic view of a display panel according to an embodiment of the present disclosure;
FIG. 5 is an electron microscope image of an organic encapsulation layer formed on a glass substrate according to the related art;
fig. 6 is an electron microscope image of an organic encapsulation layer formed on a pixel defining layer in the related art.
In the figure: 1. a first inorganic encapsulation layer; 2. an organic encapsulation layer; 3. a second inorganic encapsulation layer; 4. driving the back plate; 5. a first electrode; 6. a pixel defining layer; 7. a light emitting layer; 8. a second electrode; 9. a display area; 10. an auxiliary region; 11. a peripheral region; 12. a recessed region; 1201. a first recessed region; 1202. a second recessed region; 13. a glass substrate.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, materials, devices, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. The terms "a" and "the" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
In the related art, as shown in fig. 5 and 6, the organic encapsulation layer 2 formed on the glass substrate 13 has good flatness, and the organic encapsulation layer 2 formed on the pixel defining layer 6 has poor flatness.
In order to solve the above problems, embodiments of the present disclosure provide a method for manufacturing a display panel. As shown in fig. 1, the method for manufacturing a display panel may include steps S100 to S130, wherein:
in step S100, a display substrate is formed.
Step S110 is to form a first inorganic encapsulation layer on one side of the display substrate.
Step S120, forming an organic encapsulation layer on a surface of the first inorganic encapsulation layer facing away from the display substrate, where the organic encapsulation layer includes a diluent.
Step S130, forming a second inorganic encapsulation layer on the side of the organic encapsulation layer away from the first inorganic encapsulation layer.
In the method for manufacturing a display panel according to the embodiment of the present disclosure, a first inorganic encapsulation layer is formed on a display substrate, an organic encapsulation layer is formed on a surface of the first inorganic encapsulation layer facing away from the display substrate, and a second inorganic encapsulation layer is formed on a side of the organic encapsulation layer away from the first inorganic encapsulation layer. The organic packaging layer comprises the diluent, so that the organic packaging material in the organic packaging layer can be diluted, the organic packaging material is easy to level, the flatness of the second inorganic packaging layer is improved, and the production yield of the display panel is improved.
The following is a detailed description of the steps of the method for manufacturing a display panel according to the embodiment of the present disclosure:
in step S100, a display substrate is formed.
As shown in fig. 3 and 4, the display substrate may include a display region 9, an auxiliary region 10, and a peripheral region 11. The auxiliary area 10 surrounds the display area 9. The peripheral region 11 surrounds the auxiliary region 10. The auxiliary area 10 may be a DUMMY area. For example, step S100 may include: forming a driving back plate 4; forming a plurality of first electrodes 5 on the driving back plate 4, wherein the plurality of first electrodes 5 are distributed in the display area 9 and the auxiliary area 10; forming a pixel defining layer 6 covering the plurality of first electrodes 5 and the driving backplane 4; forming a plurality of openings through which the plurality of first electrodes 5 are exposed in a one-to-one correspondence on the pixel defining layer 6; forming a light-emitting layer 7, the light-emitting layer 7 covering at least the region of each first electrode 5 exposed to each opening; a second electrode 8 is formed on the surface of the light-emitting layer 7 facing away from the driving backplane 4. Wherein, the second electrode 8 is provided with a concave part corresponding to the area of each opening. The first electrode 5 may be an anode and the second electrode 8 may be a cathode. The driving backplane 4 may be provided with a plurality of thin film transistors. The source or drain of the thin film transistor may be connected to the first electrode 5. The light-emitting layer 7 may include a hole transport layer, an organic electroluminescent layer, and an electron transport layer. The organic electroluminescent layer may be provided between the first electrode 5 and the second electrode 8. The hole transport layer may be provided between the first electrode 5 and the organic electroluminescent layer. The electron transport layer may be provided between the second electrode 8 and the organic electroluminescent layer.
In step S110, a first inorganic encapsulation layer is formed on one side of the display substrate.
As shown in fig. 3 and 4, the material of the first inorganic encapsulation layer 1 may be a material with good water and oxygen barrier properties, such as SiNx, siO 2 、SiC、Al 2 O 3 ZnS, znO, but the embodiments of the present disclosure are not limited thereto. The first inorganic encapsulation layer 1 may be prepared by chemical vapor deposition, and of course, may also be prepared by atomic layer deposition, but is not limited thereto, and may also be prepared by other methods. The thickness of the first inorganic encapsulation layer 1 may be 0.05 μm to 2.5 μm, e.g., 0.05 μm, 0.5 μm, 1.4 μm, 2 μm, 2.15 μm, 2.5 μm, etc. The first inorganic encapsulation layer 1 may be a transparent film layer. The first inorganic encapsulation layer 1 may cover the surface of the second electrode 8 away from the driving backplane 4. The first inorganic encapsulation layer 1 is provided with a recessed area 12 corresponding to each recessed portion. The plurality of recessed regions 12 includes a plurality of first recessed regions 1201 and a plurality of second recessed regions 1202. The plurality of first recessed areas 1201 are located in an area of the first inorganic encapsulation layer corresponding to the display area 9, and the plurality of second recessed areas 1202 are located in an area of the first inorganic encapsulation layer corresponding to the auxiliary area 10.
In step S120, an organic encapsulation layer is formed on a surface of the first inorganic encapsulation layer facing away from the display substrate, the organic encapsulation layer including a diluent.
As shown in fig. 3, the organic encapsulation layer 2 may include an organic encapsulation material and a diluent. The diluent is used to dilute the organic encapsulation material in the organic encapsulation layer 2. The organic encapsulation material may include ethylene, propylene, etc., but the embodiment of the present disclosure is not particularly limited thereto. The organic encapsulation material may also include a photoinitiator to enable curing of the organic encapsulation material under ultraviolet radiation. The photoinitiator may be 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and of course, may also be 2-methyl-1- [ 4-methylthiophenyl ] -2-morpholinyl-1-propanone, but the disclosed embodiments are not limited thereto. The diluent may include a functional acrylate. The functional acrylate may be beta hydroxyethyl methacrylate (HEMA) or 1,6 hexanediol diacrylate (HDDA), but embodiments of the present disclosure are not so limited. The thickness of the organic encapsulation layer 2 may be 2 μm to 10 μm, for example, 2 μm, 3 μm, 5 μm, 8 μm, 10 μm, etc., but the disclosed embodiments are not limited thereto.
As shown in fig. 3 and 4, the organic encapsulation layer 2 may be formed at an area of the first inorganic encapsulation layer 1 corresponding to the display area 9 and the auxiliary area 10 of the display panel. The area of the first inorganic layer corresponding to the peripheral region 11 is not provided with the organic encapsulation layer 2. Wherein the organic encapsulation layer 2 may include a first encapsulation portion corresponding to the display region 9 and a second encapsulation portion corresponding to the auxiliary region 10. The diluent may be located in the first encapsulation. The second encapsulant portion may include a thickener. The thickener prevents the organic encapsulating material from flowing to the peripheral region 11 of the display substrate. The thickener may include a cellulose derivative, and of course, may also include polyethylene oxide, but the embodiment of the present disclosure is not particularly limited thereto. In addition, the first and second packing parts may be spaced apart. Specifically, the first encapsulation portion is located in the recessed area 12 corresponding to the display area 9, that is, the first encapsulation portion is located in the first recessed area 1201 of the first inorganic encapsulation layer 1, that is, the first encapsulation portion does not overflow the first recessed area 1201. The second encapsulation portion is located in the recessed area 12 corresponding to the auxiliary area 10, i.e. the second encapsulation portion is located in the second recessed area 1202, i.e. the second encapsulation portion does not overflow the second recessed area 1202.
The organic encapsulation layer can be prepared by an ink-jet printing process. For example, as shown in fig. 2, step S120 may include: step S1201, forming an organic material layer on a surface of the first inorganic encapsulation layer facing away from the display substrate; step S1202, adding a diluent to the organic material layer to form an organic encapsulation layer. Wherein, after the diluent is added, ultraviolet light irradiation can be adopted to cure the organic encapsulation layer. Further, step 1202 may include: adding a thinner to a region of the organic material layer corresponding to the display region to form the first encapsulation portion; and adding a thickening agent to the region of the organic material layer corresponding to the auxiliary region to form the second packaging part.
In step S130, a second inorganic encapsulation layer is formed on a side of the organic encapsulation layer away from the first inorganic encapsulation layer.
As shown in fig. 3 and 4, the material of the second inorganic encapsulation layer 3 may be a material with good water and oxygen barrier properties, such as SiNx, siO 2 、SiC、Al 2 O 3 ZnS, znO, but the disclosed embodiments are not so limited. The second inorganic encapsulation layer 3 may be prepared by chemical vapor deposition, and certainly, may also be prepared by atomic layer deposition, but is not limited thereto, and may also be prepared by other manners. The thickness of the second inorganic encapsulation layer 3 may be 0.05 μm to 2.5 μm, for example 0.05 μm, 0.12 μm, 1.4 μm, 2 μm, 2.15 μm, 2.5 μm, etc. In addition, the second inorganic encapsulation layer 3 is a transparent film layer.
The embodiment of the disclosure also provides a display panel prepared by the preparation method of the display panel in any embodiment. As shown in fig. 3, the display panel may include a display substrate, a first inorganic encapsulation layer 1, an organic encapsulation layer 2, and a second inorganic encapsulation layer 3, wherein:
the first inorganic encapsulation layer 1 is disposed on the display substrate. The organic encapsulation layer 2 is disposed on a surface of the first inorganic encapsulation layer 1 facing away from the display substrate. The organic encapsulation layer 2 comprises a diluent. The second inorganic encapsulating layer 3 is disposed on a side of the organic encapsulating layer 2 away from the first inorganic encapsulating layer 1.
The display panel of the present disclosure is prepared by the preparation method of the display panel according to any one of the above embodiments, and therefore, has the same beneficial effects, and is not described herein again.
The following describes each part of the display panel according to the embodiment of the present disclosure in detail:
as shown in fig. 3 and 4, the display substrate may include a display region 9, an auxiliary region 10, and a peripheral region 11. The auxiliary area 10 surrounds the display area 9. The peripheral region 11 surrounds the auxiliary region 10. The display substrate may include a driving backplane 4, a plurality of first electrodes 5, a pixel defining layer 6, a light emitting layer 7, and a second electrode 8. The first electrode 5 may be disposed on the driving backplate 4 and distributed in the display region 9 and the auxiliary region 10. The pixel defining layer 6 may be provided on the same side of the driving backplane 4 as the first electrode 5. The pixel defining layer 6 may be provided with a plurality of openings exposing the plurality of first electrodes 5 in a one-to-one correspondence. The light-emitting layer 7 may be provided in a region where the first electrode 5 is exposed to each opening. The second electrode 8 may be provided on a side of the light-emitting layer 7 remote from the driving backplane 4. The second electrode 8 is provided with a recess in a region corresponding to each opening. The driving backplane 4 may be provided with a plurality of thin film transistors. The source or drain of the thin film transistor may be connected to the first electrode 5. The light-emitting layer 7 may include a hole transport layer, an organic electroluminescent layer, and an electron transport layer. The organic electroluminescent layer may be provided between the first electrode 5 and the second electrode 8. The hole transport layer may be provided between the first electrode 5 and the organic electroluminescent layer. The electron transport layer may be provided between the second electrode 8 and the organic electroluminescent layer.
As shown in fig. 3 and 4, the first inorganic encapsulation layer 1 may be disposed on a side of the second electrode 8 away from the driving backplane 4. The material of the first inorganic encapsulation layer 1 may be a material with good water and oxygen barrier properties, such as SiNx, siO 2 、SiC、Al 2 O 3 ZnS, znO, but the disclosed embodiments are not so limited. The thickness of the first inorganic encapsulation layer 1 may be 0.05 μm to 2.5 μm, e.g., 0.05 μm, 0.12 μm, 1.4 μm, 2 μm, 2.15 μm, 2.5 μm, etc. The first inorganic encapsulation layer 1 may be a transparent film layer. The first inorganic encapsulation layer 1 is provided with a recessed area 12 corresponding to each recessed portion. The plurality of recessed regions 12 includes a plurality of first recessed regions 1201 and a plurality of second recessed regions 1202. The plurality of first recessed areas 1201 are located in a region of the first inorganic encapsulation layer corresponding to the display area 9, and the plurality of second recessed areas 1202 are located in a region of the first inorganic encapsulation layer corresponding to the auxiliary area 10.
As shown in fig. 3, the organic encapsulation layer 2 is disposed on a side of the first inorganic encapsulation layer 1 away from the display substrate. The organic encapsulation layer 2 may include an organic encapsulation material and a diluent. The diluent is used to dilute the organic encapsulation material in the organic encapsulation layer 2. The organic encapsulation material may include ethylene, propylene, etc., but the embodiment of the present disclosure is not particularly limited thereto. The organic encapsulation material may also include a photoinitiator to enable curing of the organic encapsulation material under ultraviolet radiation. The photoinitiator may be 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and of course, may also be 2-methyl-1- [ 4-methylthiophenyl ] -2-morpholinyl-1-propanone, but the disclosed embodiments are not limited thereto. The diluent may include a functional acrylate. The functional acrylate may be beta-hydroxyethyl methacrylate (HEMA) or 1,6-hexanediol diacrylate (HDDA), but the disclosed embodiments are not so limited. The thickness of the organic encapsulation layer 2 may be 2 μm to 10 μm, for example, 2 μm, 3 μm, 5 μm, 8 μm, 10 μm, etc., but the disclosed embodiments are not limited thereto.
As shown in fig. 3 and 4, the organic encapsulation layer 2 may be disposed in an area of the first inorganic encapsulation layer 1 corresponding to the display area 9 and the auxiliary area 10 of the display panel. The area of the first inorganic encapsulation layer corresponding to the peripheral area 11 is not provided with the organic encapsulation layer 2. Wherein the organic encapsulation layer 2 may include a first encapsulation portion corresponding to the display region 9 and a second encapsulation portion corresponding to the auxiliary region 10. The diluent may be located in the first encapsulation. The second encapsulant portion may include a thickener. The thickener can prevent the organic encapsulation material from flowing to the peripheral region 11 of the display substrate. The thickener may include a cellulose derivative, and of course, may also include polyethylene oxide, but the embodiment of the present disclosure is not particularly limited thereto. In addition, the first encapsulating portion and the second encapsulating portion may be disposed at an interval, that is, the first encapsulating portion and the second encapsulating portion do not contact each other, so that the organic encapsulating layer 2 of the display panel can be prevented from being broken during a bending process. Specifically, the first encapsulation portion is located in the first recessed area 1201 of the first inorganic encapsulation layer 1, that is, the first encapsulation portion does not overflow the first recessed area 1201. The second encapsulant is located within the second recessed area 1202, i.e., the second encapsulant does not overflow the second recessed area 1202.
As shown in fig. 3 and 4, the material of the second inorganic encapsulation layer 3 may be a material with good water and oxygen barrier properties, such as SiNx, siO 2 、SiC、Al 2 O 3 ZnS, znO, but the disclosed embodiments are not so limited. The thickness of the second inorganic encapsulation layer 3 may be 0.05 μm to 2.5 μm, e.g., 0.05 μm, 0.12 μm, 1.4 μm, 2 μm, 2.15 μm, 2.5 μm, etc. This is achievedBesides, the second inorganic encapsulation layer 3 is a transparent film layer.
The embodiment of the disclosure also provides a display device. The display device may include the display panel described in any of the above embodiments. The display device may be a mobile phone, or a tablet computer, but is not limited thereto, and may also be other devices. The display panel included in the display device of the embodiment of the present disclosure is the same as the display panel in the embodiment of the display panel, and therefore, the display device has the same beneficial effects, and is not repeated herein.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims (7)

1. A method for manufacturing a display panel, comprising:
forming a display substrate, including forming a plurality of openings on a pixel defining layer, and forming a recessed region in the openings of the pixel defining layer;
forming a first inorganic encapsulation layer on one side of the display substrate;
forming an organic encapsulation layer on a surface of the first inorganic encapsulation layer facing away from the display substrate, the organic encapsulation layer including a diluent;
forming a second inorganic packaging layer on one side of the organic packaging layer far away from the first inorganic packaging layer;
the display substrate includes a display region, an auxiliary region surrounding the display region, and a peripheral region surrounding the auxiliary region, the organic encapsulation layer includes a first encapsulation portion corresponding to the display region, and the thinner is located at the first encapsulation portion;
the organic encapsulation layer includes a second encapsulation part corresponding to the auxiliary region, the second encapsulation part including a thickener; the first packaging part and the second packaging part are arranged at intervals, the first packaging part is positioned in the recessed area corresponding to the display area, and the second packaging part is positioned in the recessed area corresponding to the auxiliary area.
2. The method of claim 1, wherein forming a display substrate further comprises:
forming a driving back plate;
forming a plurality of first electrodes on the driving back plate, wherein the plurality of first electrodes are distributed in the display area and the auxiliary area;
forming a pixel defining layer covering a plurality of the first electrodes and the driving backplane;
a plurality of the first electrodes are exposed through a plurality of the openings on the pixel defining layer in a one-to-one correspondence;
forming a light emitting layer covering at least a region where each of the first electrodes is exposed to each of the openings;
forming a second electrode on the surface of the light-emitting layer, which faces away from the driving backboard, wherein a concave part is arranged in the area of the second electrode corresponding to each opening;
the first inorganic packaging layer covers the surface of the second electrode, which faces away from the driving back plate, and the area of the first inorganic packaging layer, which corresponds to each concave part, is provided with the concave area.
3. The method for manufacturing a display panel according to claim 1, wherein the diluent comprises a functional acrylate.
4. The method for manufacturing a display panel according to claim 1, wherein the forming of the organic encapsulation layer on the surface of the first inorganic encapsulation layer facing away from the display substrate comprises:
forming an organic material layer on a surface of the first inorganic encapsulation layer facing away from the display substrate;
adding a thinner to a region of the organic material layer corresponding to the display region to form a first encapsulation portion; adding a thickener to a region of the organic material layer corresponding to the auxiliary region to form a second encapsulation portion.
5. A display panel, comprising:
the display substrate comprises a pixel defining layer, wherein a plurality of openings are arranged on the pixel defining layer, and a concave area is formed in each opening of the pixel defining layer;
the first inorganic packaging layer is arranged on the display substrate;
the organic packaging layer is arranged on the surface, back to the display substrate, of the first inorganic packaging layer and comprises a diluent;
the second inorganic packaging layer is arranged on one side, far away from the first inorganic packaging layer, of the organic packaging layer;
the display substrate comprises a display area, an auxiliary area and a peripheral area, wherein the auxiliary area surrounds the display area, the peripheral area surrounds the auxiliary area, the organic packaging layer comprises a first packaging part corresponding to the display area, and the diluent is arranged in the first packaging part;
the organic encapsulation layer includes a second encapsulation part corresponding to the auxiliary region, the second encapsulation part including a thickener; the first packaging part and the second packaging part are arranged at intervals, the first packaging part is positioned in the depressed area corresponding to the display area, and the second packaging part is positioned in the depressed area corresponding to the auxiliary area.
6. The display panel of claim 5, wherein the diluent comprises a functional acrylate.
7. A display device characterized by comprising the display panel according to any one of claims 5 to 6.
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