CN111128797A

CN111128797A - Die conveying system

Info

Publication number: CN111128797A
Application number: CN201911047907.2A
Authority: CN
Inventors: 郭宗圣; 黄志宏; 徐伊芃; 王中仁; 李瑄; 白峻荣
Original assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
Current assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date: 2018-10-30
Filing date: 2019-10-30
Publication date: 2020-05-08

Abstract

Some embodiments of the present disclosure provide a die transport system including a source lane, an inspection sensor, a conforming target lane, a non-conforming target lane, and a conveyor. The source channel is configured to move the first die container between the load port and the source channel buffer. The inspection sensor is configured to generate a sensor result based on the die on the first die container. The conforming target channel is configured to move the second die container between the conforming target channel output port and the conforming target channel buffer. The non-conforming target channel is configured to move the third die container between the non-conforming target channel output port and the non-conforming target channel buffer. The conveyor is configured to move dies from a first die container in the source lane buffer to a second die container in the conforming target lane buffer or a third die container in the non-conforming target lane buffer based on the sensor results.

Description

Die conveying system

Technical Field

The disclosed embodiments relate to a grain conveying system.

Background

Modern manufacturing processes are highly automated to manipulate materials and devices and produce finished products. However, quality control, packaging, and maintenance processes often rely on the skill, knowledge, and expertise of human personnel to handle and inspect manufactured products during manufacturing and finishing.

Disclosure of Invention

Some embodiments of the present disclosure provide a die transport system including a source lane, an inspection sensor, a conforming target lane, a non-conforming target lane, and a conveyor. The source channel is configured to move the first die container between the load port and the source channel buffer. The inspection sensor is configured to generate a sensor result based on the die on the first die container. The conforming target channel is configured to move the second die container between the conforming target channel output port and the conforming target channel scratch pad. The non-conforming target channel is configured to move the third die container between the non-conforming target channel output port and the non-conforming target channel buffer. The conveyor is configured to move dies from a first die container in the source lane buffer to a second die container in the conforming target lane buffer or a third die container in the non-conforming target lane buffer based on the sensor results.

Some embodiments of the present disclosure provide a pellet transport system that includes a source lane, a conforming destination lane, a non-conforming destination lane, and a conveyor. The source channel is configured to move the first die container between the load port and the source channel buffer. The conforming target channel is configured to move the second die container between the conforming target channel output port and the conforming target channel buffer. The non-conforming target channel is configured to move the third die container between the non-conforming target channel output port and the non-conforming target channel buffer. The conveyor is configured to move dies from a first die container in the source lane buffer to a second die container in the conforming target lane buffer or a third die container in the non-conforming target lane buffer.

Some embodiments of the present disclosure provide a method of transporting a die, comprising: moving the first die container from the load port to a buffer through the source channel; generating a sensor result based on the die on the first die container; and moving a die from a first die container on the source lane to a second die container on the conforming target lane or a third die container on the non-conforming target lane based on the sensor results.

Drawings

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not shown to scale and are merely illustrative. In fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the present disclosure.

Fig. 1A is a schematic diagram of a die transport platform having one source channel and three target channels according to some embodiments.

FIG. 1B is a schematic diagram of a die transfer platform with inspection sensors separate from the conveyor, according to some embodiments.

Fig. 1C is a schematic diagram of a die transfer platform with multiple source lanes and multiple conveyors, according to some embodiments.

Fig. 2 is a schematic diagram of components of a die transport platform according to some embodiments.

Fig. 3 is a schematic diagram of a die container according to some embodiments.

Fig. 4 is a block diagram of various functional modules of a die delivery platform functional module according to some embodiments.

Fig. 5 is a flow chart of a die transport process according to some embodiments.

Fig. 6 is a flow diagram of die transport process details according to some embodiments.

Description of reference numerals:

100 crystal grain conveying platform

102. 162 source channel

104. 106, 108 target channels

112 load port

114 temporary storage area

116. 166, 216 conveyor

118. 168, 218 end effector

120A, 120B, 120C, 170A inspection sensors

124. 126, 128, 224, 226, 228 output ports

130. 160, 200 crystal grain conveying platform

172 load port

202 source channel

204. 206, 208 target channel

206A specific location

210. 302 grain container

212 load port

214 temporary storage area

219 mechanical arm

304 receptacle

306 square corner portion

309 crystal grain

402 crystal grain conveying platform functional module

404 processor

406 computer readable storage module

408 network connection module

410 user interface module

412 controller module

500. 600 die transfer process

502. 504, 506, 508, 510, 512, 602A, 602B, 602C, 604A, 604B, 604C, 606, 608A, 608B, 610A, 610B operations

Detailed Description

Various implementations or examples are disclosed below to carry out the various features of the provided subject matter, and embodiments of specific components and arrangements thereof are described below to illustrate the present disclosure. These examples are, of course, intended to be illustrative only and should not be construed as limiting the scope of the disclosure. For example, it will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or one or more intervening elements may also be present.

Moreover, where specific reference numerals or designations are used in the various embodiments, these are merely used to clearly describe the disclosure and are not intended to necessarily indicate a particular relationship between the various embodiments and/or structures discussed.

Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of describing the relationship of element(s) or feature(s) to other element(s) or feature(s) in the drawings and are intended to encompass the orientation depicted in the drawings and the different orientations of the device in use or operation. When the device is turned to a different orientation (rotated 90 degrees or otherwise), the spatially relative adjectives used herein will also be interpreted in terms of the turned orientation.

Systems and methods of various embodiments of the present disclosure relate to a die transport platform that moves dice on one die container to another die container based on inspection results. The die container may contain at least one die (e.g., eight dies in some embodiments) and may be one of a boat (boat), tray (tray), and jig (jigs). The boat may be a die container made of metal. The tray may be a die container made of a polymer, such as plastic. The fixture may be a die container made of metal and include fasteners for securing the die to the fixture. The die container may be brought to the die transport platform by a load port. The source channel may be configured to move a die container from a load port between the load port and a source channel buffer (e.g., a portion of the source channel within the buffer). The inspection sensor may also be positioned along the source channel (e.g., at an inspection area) and configured to inspect the dice on the die containers while the die containers are on the source channel. The inspection sensor may be configured to determine whether the die includes a defect. The inspection sensor may also be configured to detect an identifier marking (e.g., a die identifier) on the die and/or an identifier on the die container (e.g., a die container identifier).

The die transport platform may also include at least one compliant target lane and at least one non-compliant target lane. Each conforming target channel may be configured to move a die container between a respective conforming output port and a conforming target channel buffer (e.g., a region of the conforming target channel within the buffer). Each non-conforming target channel may be configured to move a die container between a respective non-conforming output port and a non-conforming target channel buffer (e.g., an area of the non-conforming target channel within the buffer). A conveyor (conveyor) may be configured to move dies from a first die container in a source lane buffer to a respective die container in at least one conforming target lane buffer or in at least one non-conforming target lane buffer based on inspection results generated by the inspection sensor. The inspection result may be, for example, whether there is a defect on the inspected die, whether the die meets an expected die id, or whether the die container id meets an expected die container id. In some embodiments, the inspection sensor may be located on the conveyor (e.g., on the head or end effector of the conveyor). However, in some embodiments, the inspection sensor may be separate from the conveyor.

In some embodiments, there may be two conforming target pathways and one non-conforming target pathway. In some embodiments, there may be one conforming target pathway and one non-conforming target pathway. In some embodiments, the conveyor may be configured to manipulate individual dies by suction applied by a head or end effector of the conveyor. In some embodiments, the conveyor may be configured to move in a direction orthogonal to the movement of the target corridor and/or the source corridor. In some embodiments, the die transport platform may be configured to store transport data representing the status of whether a die and/or a die container has been inspected by the inspection sensor. In some embodiments, each lane (e.g., source lane, conforming destination lane, and non-conforming destination lane) may include a conveyor belt capable of moving the die container on top of the conveyor by a rotational motion. In addition, the conveyor may move along a track above the tunnel. The conveyor may also have an end effector configured to handle individual dies on the die container.

Fig. 1A is a schematic diagram of a die transport platform 100 having one source channel 102 and three

target channels

104, 106, 108 according to some embodiments. The source channel 102 may be connected to the load port 112 such that a die container may be placed in the load port 112 to move through the source channel 102 toward the buffer 114. The buffer 114 (shown in phantom) may be an area enclosed by a chamber and may interface with the chamber through a load port 112 or an output port, as will be discussed further below.

Although the conveyor 116 is shown as being located at a particular location within the staging area 114, the conveyor 116 may be located at any location within the staging area 114 as required by different applications. For example, in some embodiments, the conveyor 116 may be located closer to the load port 112, while in other embodiments it may be located further from the load port 112. In some embodiments, the staging area 114 may include multiple conveyors used in the die transport platform 100 (e.g., each conveyor would be located at a different location of the staging area).

Conveyor 116 may be configured to move the die container between lanes, such as source lane 102 or one of

target lanes

104, 106, 108. For example, the conveyor 116 may be configured to move a die container from the source lane 102 to one of the

target lanes

104, 106, 108. In some embodiments, the conveyor 116 may have an end effector 118 for grasping or holding an object (e.g., a die) by the conveyor 116. The end effector 118 may manipulate the object (e.g., die) using any type of holding mechanism. For example, the holding mechanism may be a pressure holder (e.g., by applying pressure to the object by pincer type movement) for holding), an area holder (e.g., by surrounding the object to be manipulated for holding), a vacuum holder (e.g., by suction for holding), and a magnetic holder (e.g., by electromagnetic force for holding). In some embodiments, the end effector 118 may specifically include a vacuum holder. During transport by conveyor 116, the vacuum holder may apply a vacuum force to retrieve and hold the die (e.g., as a pick and place head vacuum holder). The vacuum force may be stopped to release the die from the conveyor 116. The conveyor 116 may be positioned vertically offset from a lane, such as the source lane 102 or one of the

target lanes

104, 106, 108, so that the end effector 118 may be moved between lanes without contacting the lanes. For example, the conveyor 116 may be disposed above the lanes to move the end effector 118 between the lanes. In some embodiments, conveyor 116 and

lanes

102, 104, 106, 108 may be configured to move dies or die containers, respectively, along a single dimension. For example, the

channels

102, 104, 106, 108 may be configured to move the die container and the die therein along the x-axis (as shown in fig. 1). Furthermore, conveyor 116 may be configured to move the dies in the die container along the y-axis, but not the die container (as shown in fig. 1A). For simplicity of illustration, a portion of the die transport platform where a die can be handled by a conveyor (e.g., removed from one die container and moved to another container) is referred to as a conveyor work area (conveyor extent). Thus, a die may be manipulated within a conveyor manipulation range by taking it out of one die container in source lane 102 and placing it into a die container in one of

target lanes

104, 106, 108.

In some embodiments, although the movement of the dies along the conveyor 116 and

lanes

102, 104, 106, 108 is shown as being orthogonal to one another, the movement of the dies along the conveyor 116 and

lanes

102, 104, 106, 108 may have different configurations according to different application requirements. For example, movement of the grains along conveyor 116 and

lanes

102, 104, 106, 108 may be non-orthogonal (e.g., conveyor 116 makes a 45 degree angle with one of

lanes

102, 104, 106, 108 or any other angle) or conveyor 116 may include movement along two axes (movable along the y-axis and the x-axis, e.g., the entire conveyor 116 may be moved along the x-axis while end effector 118 is moved along the y-axis by conveyor 116).

In some embodiments, an inspection sensor 120A may be mounted on the conveyor 116, such as on the end effector 118. The viewing sensor 120A may be, for example, an image sensor having a field of view that includes a region that may be manipulated by the end effector 118. The inspection sensor 120A may be configured to inspect a die or a die container to determine which of the

target passages

104, 106, 108 the inspected die is to be placed in. In other words, inspection sensor 120A may be configured to collect sensor data representative of a die container or a die located on a die container.

In some embodiments, the inspection sensor 120A may generate sensor data used to determine on which of the

target channels

104, 106, 108 the inspected die should be placed. For example, the sensor data may be analyzed by the processor to determine whether a die inspected on the die container is defective or not, or whether a die inspected on the die container has a specified name (specifieddelabel) indicated on the die container with an indication of the sensor data.

In some embodiments, the sensor data may indicate whether the die is defective. If a defect is present, the results of the analysis of the sensor data may indicate, for example, that a non-uniformity along the surface of the die was inspected and/or that a die of a particular standard size, larger or smaller, was inspected. Other examples of defects may be scratches (scratches), cracks (cracks) or lattice distortions (lattice distortions) on the grains, for example. If the die is not inspected to have a defect (e.g., no defects), the inspected die may be placed by the conveyor 116 into a die container within one of the conforming

target lanes

104, 106. In some embodiments, the inspected dice may be placed alternately in the die containers in a particular conforming

target lane

104, 106. The alternating placement may be described as placing a first defect-free die in a first conforming target via 104, a second defect-free die in a second conforming target via 106, then a third defect-free die in the first conforming target via 104, etc., and the order may be interchanged. In addition, if defects are detected, the detected dies may be placed by the transporter 116 into a die container in the non-conforming target lane 108.

In some embodiments, the sensor data may represent code or instructions for placing individual dies within the die container in one of the

target channels

104, 106, 108. For example, the sensor data may read a code printed on a die and/or on a die container containing the die. The code may indicate which target lane (e.g., in first conforming target lane 104, second conforming target lane 106, or non-conforming target lane 108) the die and/or die within the die container are to be placed in.

In some embodiments, each

target channel

104, 106, 108 may be connected to a

respective output port

124, 126, 128 such that a die container may be placed within the

respective output port

124, 126, 128 for movement through the

respective target channel

104, 106, 108 in the staging area 114. More specifically, the conforming target channel 104 may be connected to the conforming target channel output port 124 and configured to move the die container between the conforming target channel output port 124 and the staging area 114. Similarly, the conforming target channel 106 may be connected to the conforming target channel output port 126 and configured to move the die container between the conforming target channel output port 126 and the staging area 114. Similarly, the conforming target channel 108 may be connected to the conforming target channel output port 128 and configured to move the die container between the conforming target channel output port 128 and the staging area 114.

In operation, each

target lane

104, 106, 108 may include an initial setup in which a wafer container is placed at a

respective output port

124, 126, 128 and then moved by the

respective target lane

104, 106, 108 into the conveyor operating range (e.g., directly below the conveyor). The die container containing the die may then be placed in the load port 112 and moved into the conveyor operating range by the source tunnel 102. The conveyor 116 may then inspect the die containers within the source lane 102 and/or the individual dies on the die containers to determine which of the

target lanes

104, 106, 108 to place the inspected individual dies on the die containers. For example, inspection may be performed based on sensor data generated by a sensor located on the conveyor 116 to determine whether an individual die on the inspected die container includes a defect. The conveyor may then place the inspected individual die into the

appropriate target lane

104, 106, 108 based on the inspection results. For example, when the inspected single die is free of defects, the conveyor may place the inspected single die without defects into one of the conforming

target lanes

104, 106, or may place the inspected single die with defects into the non-conforming target lane 108. Once each inspected individual die is allocated from the die container on the source lane 102 to the die container on the

target lane

104, 106, 108, the

target lane

104, 106, 108 may move its respective die container from the staging area 114 to the

respective output port

124, 126, 128. Details of the operation of die transport platform 100 will be discussed in more detail later.

Fig. 1B is a schematic diagram of a die transport platform 130 having a

viewing inductor

120B or 120C separate from the conveyor 116, according to some embodiments. Various aspects of die paddle 130 having like reference numerals may be the same as die paddle 100 (see fig. 1A), and are not repeated here for the sake of brevity.

Referring to fig. 1B,

inspection sensors

120B or 120C may be located along and/or adjacent to source lane 102 to collect sensor data for each die container and/or individual die transported by source lane 102. For example, the inspection sensor 120B may be vertically aligned with the source channel 102 (e.g., above the source channel 102). In addition, the viewing sensor 120C may be vertically offset from the source channel 102 (e.g., not above the source channel 102). Each of the

inspection sensors

120B and 120C may comprise, for example, an image sensor that may acquire sensor data representative of dies and/or die containers transported (e.g., moved) along the source lane 102.

In some embodiments, any combination of

viewing sensors

120A, 120B, and/or 120C may be utilized to acquire sensor data. For example, only one of the

inspection sensors

120A, 120B, or 120C may be used in the die transport platform 130 to acquire sensor data. However, in some embodiments, a combination of two inspection sensors (e.g.,

inspection sensors

120A and 120B, or

inspection sensors

120B and 120C, or

inspection sensors

120C and 120A) may be used in die transport platform 130 to acquire sensor data. However, in other embodiments, die transport platform 130 may utilize all three

inspection sensors

120A, 120B, and 120C to acquire sensor data. In some embodiments, different types of defects or dies may be inspected using

different inspection sensors

120A, 120B, 120C. For example, different inspection sensors may be configured to inspect different wavelengths of light, or the image data may be processed differently, such that each different inspection sensor may be configured to inspect a different type of defect or die. In some embodiments,

different inspection sensors

120A, 120B, 120C may be used to cross-verify the inspection results of

other inspection sensors

120A, 120B, 120C during inspection of defects or dies. For example, one inspection sensor (e.g., inspection sensor 120B) may be configured to inspect defects or dies, while the other inspection sensors (e.g.,

inspection sensors

120A, 120C) may be configured to verify the inspection results of defects or dies of one of the

inspection sensors

120A, 120B, 120C.

Fig. 1C is a schematic diagram of a die transport platform 160 having

multiple source lanes

102, 162 and

multiple conveyors

116, 166, according to some embodiments. Each

source channel

102, 162 may be connected to a

respective load port

112, 172 such that a die container may be placed within the

respective load port

112, 172 for movement within the buffer 114 by the

respective source channel

102, 162. For example, the source channel 102 may be connected to a load port 112. Likewise, the source channel 162 may be connected to the load port 172. It may be desirable to have

multiple source lanes

102, 162 and

multiple conveyors

116, 166 to expedite the processing of die containers at die transport platform 160 (e.g., the same number of die containers may be processed in a shorter time than a die transport platform without too

many source lanes

102, 162 and/or conveyors 116, 166).

In some embodiments, each

source tunnel

102, 162 may be configured to interface with a

respective conveyor

116, 166. For example, the source tunnel 102 may be configured to interface with the conveyor 116. Further, the source channel 162 may be configured to interface with a conveyor 166. Each

conveyor

116, 166 may be configured to move dies between lanes. For example, the conveyor 116 may be configured to move the grains from the source lane 102 to one of the

target lanes

104, 106, 108. Similarly, conveyor 166 may be configured to move a die from source channel 162 to one of

target channels

104, 106, 108.

In some embodiments, each

conveyor

116, 166 may be configured to move a die from a

particular source lane

102, 162 to a particular conforming

target lane

104, 106. For example, the conveyor 116 may be configured to move dies from the source channel 102 to the conforming target channel 104. In addition, conveyor 166 may be configured to move dies from source lane 162 to the conforming target lane 106.

In some embodiments, each

end effector

118, 168 may specifically include a vacuum holder that selectively applies vacuum force to retrieve, hold, and release the dice to be transported by the respective conveyor 116, 166 (e.g., as a pick-and-place vacuum holder). The

respective conveyor

116, 166 may be positioned vertically offset from a lane, such as one of the

source lanes

102, 162 or the

destination lanes

104, 106, 108, so that the

end effector

118, 168 may be moved between lanes without contacting the lanes. For example, the

respective conveyors

116, 166 may be disposed above the lanes such that the

end effectors

118, 168 move between the lanes.

In some embodiments, the

respective inspection sensors

120A, 170A may be mounted on the

respective conveyors

116, 166, such as the

respective end effectors

118, 168. For example, the inspection sensor 120A may be mounted on the conveyor 116, such as on the end effector 118. In addition, a vision sensor 170A may be mounted on the conveyor 166, such as on the end effector 168. Each

inspection sensor

120A, 170A may be configured to inspect a die or a die container to determine which of the

target channels

104, 106, 108 the die being inspected is to be placed in.

Fig. 2 is a schematic diagram of components of a die transport platform 200, according to some embodiments. Die transport platform 200 may include a source channel 202 and three

target channels

204, 206, 208. The source channel 202 may be connected to a load port 212 such that the die container 210 may be placed within the load port 212 for movement through the channel (e.g., the source channel 202) in the buffer 214. Lanes (e.g., source lane 202, conforming

destination lanes

204, 206, and non-conforming destination lane 208) may interface with conveyor 216.

The conveyor 216 may have an end effector 218 for grasping or holding an object (e.g., a die) by the conveyor 216. The end effector 218 may be mounted on a robot arm 219, and the robot arm 219 has at least one degree of freedom (e.g., two degrees of freedom) coupled to the transporter 216. In some embodiments, the end effector 218 may be vertically offset and/or vertically aligned with the conveyor 216 when in operation. For example, as shown in the plan view of the conveyor 216, the end effector 218 may be configured to operate on one side or the other of the conveyor 216. Further, as shown in the plan view of the conveyor 216, the end effector 218 may be configured to operate below the conveyor 216.

The end effector 218 may manipulate the object (e.g., die) using any type of holding mechanism. By way of example, the end effector may specifically include a vacuum holder that selectively applies vacuum forces to selectively retrieve, hold, and place the die (e.g., as a pick-and-place vacuum holder) during transport of the die by the conveyor 216. The viewing sensor may be, for example, an image sensor having a field of view that includes a region that may be manipulated by the end effector. The inspection sensor may be configured to inspect a die or a die container to determine which

target passage

104, 106, 108 the inspected die is to be placed in.

In various embodiments, each

target channel

204, 206, 208 may be connected to a

respective output port

224, 226, 228 so that a die container may be placed within the

respective output port

224, 226, 228 while the die container is moved within the staging area 214 through the

respective target channel

204, 206, 208. Specifically, the conforming target channel 204 may be connected to the output port 224 and configured to move the die container between the output port 224 and the staging area 214 enclosed by the housing. The scratch pad 214 may contain all of the

target channels

204, 206, 208. Similarly, the conforming target channel 206 may be connected to the output port 226 and configured to move the die container between the output port 226 and the staging area 214. Similarly, non-conforming target channels 208 may be connected to output port 228 and configured to move die containers between output port 228 and staging area 214.

The schematic may show only some, but not all, of the structural features of the die transport platform 200. For example, as described above, the coincident target channel 206 and output port 226 may be continuous when operating. However, the schematic may show how a portion of the conforming target pathway 206 at a particular location 206A may not be continuous with the output port 226 when the conforming target pathway 206 is removed (e.g., when the portion of the target pathway 206 is serviced or repaired).

Fig. 3 is a schematic diagram of a die container 302 according to some embodiments. The die container 302 can include a plurality of receptacles 304 (e.g., cavities) in which the die can be placed (e.g., received) in the receptacles 304. For example, as shown in the embodiment of FIG. 3, there may be eight receptacles 304. Each receptacle 304 may have a substantially rectangular shape with further protrusions along the square corner portions 306 of the respective receptacle 304. The die may be placed in one of the receptacles 304 such that the bottom surface of the die is within the respective receptacle 304 (e.g., within a cavity of the die container 302).

In some embodiments, the end effector may include a vacuum holder (e.g., as a pick-and-place vacuum holder) that applies a vacuum force to retrieve and hold the die 309 during transport of the die 309 by the conveyor. For example, the end effector positions a vacuum holder in contact with or proximate to the die 309 and then utilizes vacuum force (e.g., suction) to pick up the die. Similarly, the end effector may position a vacuum retainer within the empty receptacle 304 (e.g., when the vacuum retainer holds the die 309 using a vacuum force) to release the die within the receptacle 304 by stopping the application of the vacuum force holding the die.

Fig. 4 is a block diagram of various functional modules of die transport platform functional module 402 according to some embodiments. The die paddle functional module 402 may be part of a die paddle. Die transport platform functional module 402 may include a processor 404. In further embodiments, processor 404 may be implemented as one or more processors.

The processor 404 may be operatively connected to a computer-readable storage module 406 (e.g., memory and/or database), a network connection module 408, a user interface module 410, and a controller module 412. In some embodiments, the computer-readable memory module 406 may include logic (logic) that may configure the processor 404 to perform various processes discussed herein. The computer readable memory may also store data such as sensor data collected by the inspection sensors, image data for identifying defects, identification symbols for dies, identification symbols for die containers, identification symbols for image sensors, and any other parameter or information that may be used to perform the various processes discussed herein.

The network connection module 408 may facilitate network connection of the die delivery platform to various devices and/or components of the die delivery platform that may communicate with the environment inside or outside the die delivery platform. In some embodiments, the network connection module 408 may facilitate a physical connection, such as a line or bus (bus). In some embodiments, the network connection module 408 may facilitate wireless connectivity through the use of transmitters, receivers, and/or transceivers, such as through a Wireless Local Area Network (WLAN). For example, the network connection module 408 may facilitate wireless or wired connections to various portions of the die transport platform.

The die delivery platform function module 402 may also include a user interface module 410. The user interface module 410 may include any type of interface for user input and/or output to the die transport platform including, but not limited to, a display, a laptop, a tablet, or a mobile device.

The die transport platform function module 402 may include a controller module 412. In some embodiments, the controller module 412 may be implemented by the processor 404 (e.g., as part of the processor 404). The controller module 412 may be configured to control various physical devices that control the movement or function of the wafer transport platform, such as conveyors, robots, end effectors, source lanes, and/or target lanes. For example, the controller module 412 may be configured to control the movement or function of at least one conveyor belt, robot arm, etc., on a conveyor, source lane, and/or destination lane. In other examples, the controller module 412 may control a motor of at least one of a movable conveyor belt, a robot arm, and/or an end effector. The controller module 412 may be controlled by the processor 404 and may perform various aspects of the various processes discussed herein.

Fig. 5 is a flow diagram of a die transport process 500 according to some embodiments. The die transfer process 500 may be performed by a die transfer platform (e.g., a die transfer platform having die transfer function module elements). It should be noted that the die transfer process 500 is only an example and is not intended to limit the present disclosure. Thus, it should therefore be understood that additional operations may be provided before, during, and after the die transport process 500 of fig. 5. Certain operations may be omitted, performed concurrently with other operations, and only some operations may be described briefly herein.

In operation 502, die containers may be loaded into individual load ports and output ports of a die transport platform. As described above, a die transport platform may have at least one load port and at least one output port. For example, a die transfer platform may include a load port and two output ports (e.g., one output port for a conforming target channel and another output port for a non-conforming target channel).

At operation 504, the die container may be moved to the staging area through either the source channel or the destination channel. The buffer may be an area within a housing (e.g., a shell) in which the dies may move between a source channel and a destination channel. For example, the buffer may be located within a housing accessible by one or more load ports and/or one or more output ports. In addition, the conveyor may move the die in the buffer from the die container in the source lane to the destination lane.

In some embodiments, the die container may be moved to an area within the working range of the conveyor. As described above, the conveyor operating envelope may be the area where the conveyor can handle the die. For example, the end effector may be moved by a robot and/or conveyor to pick and place the wafers within the conveyor operating envelope. Additionally, in some embodiments, an inspection sensor may be located on the end effector to inspect dies and/or die containers within the conveyor operating envelope.

At operation 506, it may be determined whether to move the die delivered from the source channel to the buffer to the conforming target channel. For dies to be delivered to the conforming target channel, the die delivery process 500 may move to operation 508. For dies that are not moved to the conforming target channel, the die transfer process 500 may move to operation 510.

In some embodiments, a die may be moved to a conforming target channel based on whether the die contains a defect. As described above, the conveyor may include at least one inspection sensor configured to generate sensor data that may be representative of dies conveyed by the die container within the source lane. The sensor data may be analyzed to determine whether the die includes defects, such as undesired non-uniformities or undesired artifacts (artifacts) and/or a lack of desired artifacts. Thus, for dies that are eligible for inspection absent a detected defect, the die transfer process 500 may move to operation 508. In addition, for dies that are inspected for defects and not eligible for inspection, the die transfer process 500 may move to operation 510.

In some embodiments, a die may be moved to a conforming target lane based on whether the die itself and/or a die container holding the die includes an indication that the die is to be moved to the particular target lane. As described above, the conveyor may include at least one inspection sensor configured to generate sensor data that may be representative of dies conveyed by the die container within the source lane. This sensor data may include, for example, a reading of an indicator (e.g., a code or other type of indication) that may indicate to which target lane or to which target lane (e.g., a conforming target lane or a non-conforming target lane) the conveyor is to move the die. For example, the indicator may be an index value that a die transport platform (e.g., a processor of the die transport platform) may cross-reference (e.g., using a look-up table) to determine which target channel (e.g., a conforming target channel or a non-conforming target channel) to place one and/or each die that is to be viewed on a particular die container within the source channel.

At operation 508, the die may be moved by a conveyor to a conforming target lane. The conforming target path may include an open (open) die container within the conveyor operating envelope and the die may be placed on the die container by the conveyor. For ease of illustration, such a die container capable of holding dies (e.g., because the receptacle on the current die container does not have a die) can be referred to as an open die container.

At operation 510, the die may be moved by a conveyor to a non-conforming target lane. The non-conforming target path may contain an open die container within the conveyor operating envelope and may have dies placed thereon by the conveyor.

At operation 512, loaded die containers within the target lanes (e.g., conforming target lanes and non-conforming target lanes) may be moved to their respective output ports. For ease of illustration, the die container that has completed receiving a die (e.g., because all receptacles on the die container have a respective die) may be referred to as a loaded die container. As described above, these output ports may be the interfaces with the die transfer platform, and more specifically, the buffers. The dice (e.g., on each die pad) may then be moved away from their respective output ports from the die transport pad.

Fig. 6 is a flow diagram of a detailed die transport routine 600 according to some embodiments. The detailed die delivery process 600 may be performed by a die delivery platform (e.g., a die delivery platform having components with die delivery functionality). It should be noted that the die transfer process 600 is only an example and is not intended to limit the present disclosure. Thus, it should be understood that additional operations may be provided before, during, and after the die transport routine 600 of fig. 6. Certain operations may be omitted, performed concurrently with other operations, and only some operations may be described briefly herein.

In operation 602A, a die container may be loaded into a load port of a die transport platform. As described above, one die transport platform may have at least one load port. The load port may be a port through which a die container may be placed to handle dies on the die container.

In operation 602B, the die container may be loaded into a conforming output port (pass output) of the die transport platform. As described above, a die transport platform may have at least one output port, such as a compliant output port. The conforming output port may be a port through which a die container may be placed to receive a die (e.g., in some embodiments, a defective die that is not detected by the inspection sensor).

In operation 602C, a die container may be loaded into a non-conforming output port (failout port) of a die transport platform. As described above, a die transport platform may have at least one output port, such as a non-compliant output port. The non-conforming output port may be a port through which a die container may be placed to receive a die (e.g., in some embodiments, a defective die is detected by a detection sensor).

At operation 604A, the die container in the loading port may be moved through the source channel to the conveyor operating range in the buffer. The buffer may be a region where dies may be moved between a source channel and a target channel. For example, the conveyor may move the die from the die container in the source lane to the target lane in the staging area. In some embodiments, the buffer may be within a housing (e.g., a shell) accessible by the load port and/or the output port.

In operation 604B, the die container in the conforming output port may be moved through the conforming target channel to the staging area. More specifically, the die container in the conforming output port may be moved through the conforming target lane to a staging area within the conveyor operating envelope.

At operation 604C, the die containers in the non-conforming output ports may be moved to the staging area through the non-conforming target lanes. More specifically, a die container in a non-conforming output port may be moved through a non-conforming target lane to a staging area within the conveyor operating envelope.

At operation 606, a determination may be made as to whether the dies transferred from the source channel into the buffer are to be moved to the conforming target channel. For dies to be delivered to the conforming target channel, the die delivery process 600 may move to operation 608A. In addition, for dice that are not moved to a conforming target channel, the die transfer process 600 may move to operation 608B.

In some embodiments, the die may or may not be moved to a conforming target channel based on whether the die contains a defect. As described above, the conveyor may include at least one inspection sensor configured to generate sensor data that may be representative of dies conveyed by the die container within the source lane. The sensor data can be analyzed to determine whether the die includes defects, such as undesirable non-uniformities or undesirable artifacts and/or lack of desirable artifacts. Thus, for dies that pass inspection absent the inspected defects, the die transfer process 600 may move to operation 608A. Also, for dies that have been inspected for defects that have not passed the inspection, the die transfer process 600 may move to operation 608B.

In some embodiments, a die may be moved to a conforming target lane based on whether the die itself and/or a die container holding the die includes an indication that the die is to be moved to the particular target lane. As described above, the conveyor may include at least one inspection sensor configured to generate sensor data that may be representative of dies conveyed by the die container within the source lane. This sensor data may include, for example, a reading of an indicator (e.g., a code or other type of indication) that may indicate to which target lane or to which target lane (e.g., a conforming target lane or a non-conforming target lane) the conveyor is to move the die. For example, the indicator may be an index value that a die transport platform (e.g., a processor of the die transport platform) may cross-reference (e.g., using a lookup table) to determine which destination channel (e.g., a conforming destination channel or a non-conforming destination channel) to place one and/or each die that is to be viewed on a particular die container within the source channel.

At operation 608A, the die may be moved by the conveyor to the conforming target lane. The conforming target lane may include a die container within the conveyor operating envelope and a die may be placed on the die container by the conveyor. Further, at operation 608B, the die may be moved by the conveyor to a non-conforming target lane. The non-conforming target lane may include a die container within the conveyor operating envelope and a die may be placed on the die container by the conveyor. In some embodiments, the die may be held by an end effector of the conveyor and moved along the channel over the conveyor by a track.

In operation 610A, the die container within the conforming target channel may be moved to the conforming output port. Likewise, in operation 610B, die containers within non-conforming target lanes may be moved to non-conforming output ports. As described above, these output ports may be the interfaces with the die transfer platform, and more specifically, the buffers. Thus, dies (e.g., dies on respective die platforms on respective target lanes) may be moved from the die transport platform through respective output ports.

In some embodiments of the present disclosure, a wafer transport system is provided that includes a source lane, an inspection sensor, a conforming target lane, a non-conforming target lane, and a conveyor. The source channel is configured to move the first die container between the load port and the source channel buffer. The inspection sensor is configured to generate a sensor result based on the die on the first die container. The conforming target channel is configured to move the second die container between the conforming target channel output port and the conforming target channel buffer. The non-conforming target channel is configured to move the third die container between the non-conforming target channel output port and the non-conforming target channel buffer. The conveyor is configured to move dies from a first die container in the source lane buffer to a second die container in the conforming target lane buffer or a third die container in the non-conforming target lane buffer based on the sensor results.

In some embodiments, the source tunnel includes a conveyor belt, and the source tunnel buffer is the portion of the source tunnel in the operating range of the conveyor. In some embodiments, the first die container includes a bar code, and the vision sensor is configured to read the bar code. In some embodiments, the first die container comprises a plurality of receptacles, each of which is configured to receive a respective die. In some embodiments, each of the receptacles includes a cavity configured to contact a bottom surface of a respective die. In some embodiments, the conveyor includes a vacuum head configured to move between a source lane and a conforming target lane.

In some embodiments, the die transport system further comprises a vision sensor configured to generate sensor results based on the die on the first die container. In some embodiments, the inspection sensors are located between the load port and the conveyor operating range. In some embodiments, the inspection sensor is located on the conveyor. In some embodiments, the inspection sensor is configured to read the identifier on the first die container. In some embodiments, the inspection sensor is configured to determine whether the die has a defect. In some embodiments, the source lane is configured to move the first die container in a first direction, the conveyor is configured to move the die in a second direction, and the first direction is orthogonal to the second direction. In some embodiments, the conveyor includes a robotic arm configured to hold the die by a vacuum force.

In some embodiments, the die transfer method further comprises moving the die from the first die container to a second die container in the conforming target lane in response to the sensor result indicating that the die does not have a defect. In some embodiments, the die transfer method further comprises moving the die from the first die container to a second die container in a non-compliant target lane in response to the sensor result indicating that the die has a defect. In some embodiments, the die delivery method further comprises moving the die along the conforming target channel to the conforming target channel output port. In some embodiments, the die transfer method further comprises using a conveyor to move dies from a first die container at a source lane to a second die container at a conforming destination lane or at a non-conforming destination lane. In some embodiments, the die transfer method further comprises loading a second die container at an output port of the conforming target lane; and moving the second die container from the output port to the staging area through the conforming target lane under the conveyor.

The foregoing outlines features of many embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art may readily devise many other varied processes and structures that are equally effective to achieve the same objectives and/or achieve the same advantages of the embodiments of the invention without departing from the spirit and scope of the invention. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention and that such equivalents may be made without departing from the spirit and scope of the invention.

In this specification, the term "module" is used herein to represent software, firmware, hardware, and any combination of these elements for performing the relevant functions described in this specification. Furthermore, the various modules are described as discrete modules for ease of discussion. However, two or more modules may be combined into a single module that performs the relevant functions according to embodiments of the present disclosure, and will be apparent to those of ordinary skill in the art.

Those of ordinary skill would further appreciate that any of the various illustrative logical blocks, modules, processors, means, circuits, methods, and functions described in connection with the aspects disclosed herein may be implemented as electronic hardware (e.g., digitally implemented, analog implemented, or combinations thereof), firmware, various forms of program or design code containing instructions (which may be referred to herein, for convenience, as "software" or a "software module"), or any combination of the foregoing. To clearly illustrate this interchangeability of hardware, firmware, and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware, firmware, and software, or combinations of such technologies, depends upon the particular application and design constraints imposed on the overall system. Those of ordinary skill in the art may implement the described functionality in varying ways for each particular application without departing from the scope of the present disclosure.

Furthermore, those of ordinary skill in the art will appreciate that the various illustrative logical blocks, modules, devices, elements, and circuits described herein may be implemented or performed within an Integrated Circuit (IC) that may include a general purpose processor (general purpose processor), a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), other programmable logic devices, or any combination thereof. The logical blocks, modules, and circuits may also include antennas and/or transceivers to communicate with various components within the network or within the device. A general-purpose processor may be a microprocessor, or any conventional processor, controller or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other configuration suitable for performing the recited functions.

Conditional language such as "may," "can," and the like are generally understood herein to be used to convey that certain embodiments include, but are not limited to, particular features, elements, and/or steps unless otherwise specifically stated. Thus, such conditional language is generally not intended to imply that certain features, elements, and/or steps are required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without a user, whether such features, elements, and/or steps are included or are to be performed in a particular embodiment.

In addition, after reading this disclosure, one of ordinary skill in the art will be able to configure the functional entities to perform the operations described herein. As used herein, the term "configured" with respect to a specified operation or function refers to a system, device, component, circuit, structure, machine, etc., that is physically or virtually constructed, programmed, and/or arranged to perform the specified operation or function.

Unless explicitly stated otherwise, disjunctive language herein such as "X, Y, or at least one of Z" is generally used to represent that an item, phrase, etc. may be X, Y or Z, or any combination thereof (e.g., X, Y and/or Z). Thus, such disjunctive language is generally not representative and should not imply that some embodiments require the presence of at least one X, at least one Y, or at least one Z.

It should be emphasized that various changes and modifications may be made to the above-described embodiments, the elements of which are to be understood as other acceptable examples. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims

1. A pellet transport system comprising:

a source channel configured to move a first die container between a load port and a source channel buffer;

a view sensor configured to generate a sensor result based on a die on the first die container;

a conforming target channel configured to move a second die container between a conforming target channel output port and a conforming target channel buffer;

a non-conforming target channel configured to move a third die container between a non-conforming target channel output port and a non-conforming target channel buffer; and

a conveyor configured to move the die from the first die container in the source lane buffer to the second die container in the conforming target lane buffer or the third die container in the non-conforming target lane buffer based on the sensor results.