CN111124088A - Control method and electronic equipment - Google Patents

Control method and electronic equipment Download PDF

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Publication number
CN111124088A
CN111124088A CN201911360975.4A CN201911360975A CN111124088A CN 111124088 A CN111124088 A CN 111124088A CN 201911360975 A CN201911360975 A CN 201911360975A CN 111124088 A CN111124088 A CN 111124088A
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temperature
electronic device
condition
heat dissipation
information
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CN111124088B (en
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金明
张靖瑶
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206—Monitoring of events, devices or parameters that trigger a change in power modality
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The application relates to a control method and electronic equipment, aiming at a first mode that the power consumption of the equipment is lower than that of the equipment in a normal operation mode, acquiring temperature information of a preset part of the electronic equipment under the condition that the electronic equipment acts, and correspondingly controlling a heat dissipation device of the electronic equipment under the condition that the temperature information meets a temperature condition, such as starting a fan of the equipment. According to the method and the device, the heat dissipation device of the equipment is controlled when the equipment acts and the temperature of the preset component of the equipment meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic mode like the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the preset component of the equipment (such as a CPU) can be combined to be matched in real time to execute related control on the heat dissipation device, and the burning risk of the component of the equipment is reduced.

Description

Control method and electronic equipment
Technical Field
The present application relates to the field of heat dissipation control of devices, and in particular, to a control method and an electronic device.
Background
In a low power consumption mode of an electronic device, components thereof are usually in a low power consumption standby state, for example, a modern standby mode, which is a form of computer sleep and essentially belongs to an energy-saving and low power consumption mode in a power-on state, in which the components of the device are in the low power consumption standby state, and in such a low power consumption standby state, if the electronic device needs to resume execution, the components of the device are quickly restored to an operating state.
At present, in low power consumption modes such as Modern Standby, a Central Processing Unit (CPU) fan operates once every fixed time, and the periodic starting of the fan leads to waste of equipment power consumption and poor user experience, and on the other hand, when the CPU is overheated, the fan cannot be matched in real time, so that the risk of burning the CPU exists.
Disclosure of Invention
In view of the above, an object of the present application is to provide a control method and an electronic device, which are used for performing heat dissipation control on the electronic device in combination with a device component temperature in a low power consumption mode of the electronic device, so as to reduce a risk of burning of the device component and improve user experience.
Therefore, the application discloses the following technical scheme:
a control method, comprising:
detecting motion information of the electronic equipment in a first mode; the equipment power consumption corresponding to the first mode is lower than the equipment power consumption corresponding to the electronic equipment in a normal operation mode;
determining whether the action information indicates that the electronic device generates an action;
if yes, acquiring temperature information of a preset part of the electronic equipment;
determining whether the temperature information satisfies a temperature condition;
and if so, controlling the heat dissipation device of the electronic equipment to be matched with the temperature condition.
Preferably, the method for detecting the operation information of the electronic device includes:
detecting the action of the electronic equipment by utilizing a south bridge chip of the electronic equipment to obtain an action detection signal;
the determining whether the action information indicates that the electronic device generates an action includes:
determining whether the motion detection signal has a predetermined signal characteristic;
and if so, determining that the electronic equipment generates the action.
Preferably, the acquiring temperature information of the predetermined component of the electronic device includes:
acquiring at least one piece of prestored temperature information;
the at least one temperature information is: and at least one piece of temperature information which is captured by the south bridge chip through a preset interface and is detected by a built-in temperature sensor of a central processing unit of the electronic equipment.
In the above method, preferably, the number of the temperature information is plural;
the determining whether the temperature information satisfies a temperature condition includes:
determining a temperature value of a central processing unit of the electronic device based on a plurality of temperature information;
determining whether the temperature value satisfies a first temperature condition or a second temperature condition;
the first temperature condition is a condition for representing that the heat dissipation device needs to be started, and the second temperature condition is a condition for representing that the rotating speed of the heat dissipation device needs to be adjusted.
In the method, preferably, the controlling the heat dissipation device of the electronic device according to the temperature condition includes:
if the temperature value meets the first temperature condition, starting the heat dissipation device;
and if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
An electronic device, comprising:
the heat dissipation device can be used for dissipating heat of the electronic equipment;
the electronic equipment comprises a detection component, a detection component and a control component, wherein the detection component is used for detecting action information of the electronic equipment in a first mode; the equipment power consumption corresponding to the first mode is lower than the equipment power consumption corresponding to the electronic equipment in a normal operation mode;
a memory for storing at least one set of instructions;
a first processor for invoking and executing the set of instructions in the memory, by executing the set of instructions:
determining whether the action information indicates that the electronic device generates an action;
if yes, acquiring temperature information of a preset part of the electronic equipment;
determining whether the temperature information satisfies a temperature condition;
and if so, controlling the heat dissipation device to be matched with the temperature condition.
In the electronic device, preferably, the detection component is a south bridge chip of the electronic device;
the south bridge chip can be used for detecting the action of the electronic equipment to obtain an action detection signal;
when determining whether the motion information indicates that the electronic device generates a motion, the first processor is specifically configured to: determining whether the motion detection signal has a predetermined signal characteristic; and if so, determining that the electronic equipment generates the action.
Preferably, the electronic device further includes a central processing unit and a predetermined interface for connecting the central processing unit and the south bridge chip, the central processing unit has a built-in temperature sensor therein, and the first processor is different from the central processing unit;
when the first processor obtains the temperature information of the predetermined component of the electronic device, the first processor is specifically configured to:
acquiring at least one piece of prestored temperature information;
the at least one temperature information is: and at least one piece of temperature information which is captured by the south bridge chip through the preset interface and is detected by a built-in temperature sensor of the central processing unit of the electronic equipment.
In the electronic device, preferably, the number of the temperature information is plural;
when determining whether the temperature information satisfies the temperature condition, the first processor is specifically configured to:
determining a temperature value of a central processing unit of the electronic device based on a plurality of temperature information;
determining whether the temperature value satisfies a first temperature condition or a second temperature condition;
the first temperature condition is a condition for representing that the heat dissipation device needs to be started, and the second temperature condition is a condition for representing that the rotating speed of the heat dissipation device needs to be adjusted.
In the electronic device, preferably, when the first processor performs control on the heat dissipation device of the electronic device, the first processor is specifically configured to:
if the temperature value meets the first temperature condition, starting the heat dissipation device;
and if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
According to the above scheme, in the control method and the electronic device provided by the application, for the first mode in which the power consumption of the device is lower than that in the normal operation mode, the temperature information of the predetermined component of the electronic device is acquired under the condition that the electronic device operates, and the heat dissipation device of the electronic device is controlled, such as the fan of the device is started, under the condition that the temperature information meets the temperature condition. According to the method and the device, the heat dissipation device of the equipment is controlled when the equipment acts and the temperature of the preset component of the equipment meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic mode like the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the preset component of the equipment (such as a CPU) can be combined to be matched in real time to execute related control on the heat dissipation device, and the burning risk of the component of the equipment is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic flow chart of a control method provided in an embodiment of the present application;
FIG. 2 is another schematic flow chart diagram of a control method provided by an embodiment of the present application;
FIG. 3(a) is a waveform diagram of a high-low level interaction signal with unstable time interval initially detected in the case of action generated by an electronic device according to an embodiment of the present application;
FIG. 3(b) is a schematic waveform diagram of a detected high-low level interaction signal with stable time intervals in the case of action generated by an electronic device according to an embodiment of the present application;
fig. 4 is a logic diagram illustrating the CPU temperature being read through the PCH and the heat dissipation device being controlled by the EC based on the CPU temperature according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In an alternative embodiment of the present application, a control method is disclosed, which may be applied to an electronic device including a heat dissipation device, such as a fan, and the electronic device may be, but is not limited to, a portable computer (such as a notebook), a desktop computer, a large and medium-sized computer, a server, and the like in a general/special purpose computing or configuration environment.
Referring to the flowchart of the control method shown in fig. 1, in this embodiment, the control method may include:
step 101, in a first mode, detecting motion information of an electronic device.
The first mode is a corresponding mode in which device power consumption is lower than that of the electronic device in the normal operation mode, and specifically, the first mode may be, but is not limited to, a Modern Standby mode.
The Modern Standby is a form of computer sleep, and essentially belongs to an energy-saving mode in a power-on state, and in this mode, components of a computer are usually in a non-active low-power Standby state, and in such a low-power Standby state, if the computer needs to be resumed, the components of the computer are quickly restored to an operating state.
In the first mode, detecting the motion information of the electronic device may refer to detecting the motion information of a system of the electronic device, such as specifically detecting the motion information of a CPU, a motherboard and/or corresponding components in peripheral circuits of the motherboard in the system of the electronic device.
Step 102, determining whether the action information indicates that the electronic equipment generates the action.
After detecting the action information of the electronic device, such as the action information of the corresponding component in the CPU, the main board and/or the peripheral circuit of the main board in the electronic device system, it is further analyzed whether the electronic device (the corresponding component) generates an action based on the detected information.
And 103, if so, acquiring temperature information of the preset part of the electronic equipment.
The predetermined component may be a high heat dissipation component of the electronic device, and more specifically, may be, for example, but not limited to, a CPU or the like of the electronic device.
In the first mode, for example, in the Modern Standby mode, if the system of the electronic device does not operate, conventionally, the temperature of the CPU will not rise, and the CPU will not be overheated and the risk of burning the CPU will not be caused, whereas if the system of the electronic device operates, for example, corresponding components in the CPU, the motherboard and/or the motherboard peripheral circuit start to operate (more specifically, for example, the device automatically updates/upgrades the driving/operating system when meeting the condition, so that corresponding components of the device operate), the temperature of the CPU will rise, and the risk of burning the CPU will probably be caused by overheating of the CPU.
And step 104, determining whether the temperature information meets a temperature condition.
Alternatively, the temperature condition may include a maximum allowable temperature (a maximum allowable temperature of the CPU in a case where the heat sink is not activated) set for a predetermined component such as the CPU as a temperature threshold value that triggers activation of the heat sink from the non-operating state to enter the operating state.
It is easily understood that, in other embodiments of the present application, the temperature condition is not limited to only include the form of the temperature threshold for triggering activation of the heat sink, but may also be set to include a graded condition composed of a plurality of temperature intervals, such as:
1)Tpredetermined partTo reach T1: starting the heat sink to rotate at a rotation speed V1Running;
2)T1≤Tpredetermined part＜T2: maintaining the rotational speed V1；
3)T2≤TPredetermined part＜T3: at a rotational speed V2Running;
4)T3≤Tpredetermined part＜T4: at a rotational speed V3Running;
……
wherein, TPredetermined partIndicating the temperature, T, of said predetermined part of the electronic device1、T2、T3、T4Respectively different temperature thresholds, and T1＜T2＜T3＜T4；V1、V2、V3Respectively different rotational speed values, and V1＜V2＜V3。
For example, on the basis that a temperature threshold for triggering the activation of the heat dissipation device is set for the temperature condition, a temperature-rotation speed condition in a functional relationship (e.g., a linear relationship) form may be further set, so that after the heat dissipation device is activated, the rotation speed of the heat dissipation device can be further controlled to increase along with the increase of the temperature of a predetermined component such as a CPU according to the temperature-rotation speed condition in the functional relationship form.
And 105, if so, controlling the heat dissipation device of the electronic equipment to be matched with the temperature condition.
If the temperature information of the predetermined component of the electronic device meets the predetermined condition, it indicates that the heat dissipation device of the electronic device needs to be controlled, and the control may be to control the heat dissipation device to start when the temperature of the predetermined component reaches a temperature threshold corresponding to "start control", or may also be to adjust the rotation speed of the heat dissipation device when the temperature of the predetermined component reaches a temperature threshold for adjusting the rotation speed of the predetermined component.
It is easy to understand that if the detected operation information indicates that the electronic device is not operating, or if the detected operation information indicates that the electronic device is operating but the temperature information of the predetermined component does not satisfy the temperature condition, the heat sink does not need to be controlled.
As can be seen from the foregoing solutions, in the control method provided in this embodiment of the present application, for a first mode in which the power consumption of the device is lower than the power consumption of the device in the normal operation mode, temperature information of a predetermined component of the electronic device is obtained when the electronic device is in operation, and only when the temperature information satisfies a temperature condition, a heat dissipation device of the electronic device is correspondingly controlled, such as a fan of the device is started. According to the method and the device, the heat dissipation device of the equipment is controlled when the equipment acts and the temperature of the preset component of the equipment meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic mode like the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the preset component of the equipment (such as a CPU) can be combined to be matched in real time to execute related control on the heat dissipation device, and the burning risk of the component of the equipment is reduced.
Referring to fig. 2, in an alternative embodiment of the present application, the control method may be further implemented by the following processing procedures:
step 201, in the first mode, detecting the motion of the electronic device by using the south bridge chip of the electronic device to obtain a motion detection signal.
The first mode may be a low power consumption mode such as a modem Standby mode of the electronic device, in which components of the electronic device are in a low power consumption Standby state, and in this embodiment, a south bridge chip (PCH) of the electronic device in this state is used to detect an action of the electronic device, for example, detect actions of components of a CPU, a motherboard, and/or a motherboard peripheral circuit in a system of the electronic device, so as to obtain an action detection signal.
When the system of the electronic device is not in action, the detection pin of the PCH is in a high level state, the signal waveform curve of the action detection signal generated by the PCH appears as a straight line in the high level state, when the system of the electronic device is operated, for example, when the electronic device triggers tasks such as system upgrade, driver upgrade, or system bug fix due to meeting the set conditions, components such as a CPU in the system will operate in response to the start of the tasks, as shown in fig. 3(a) -3 (b), initially, a signal of high-low level interaction with unstable time interval is detected, the waveform of the signal (i.e. SLP _ S0#) shows the effect as shown in fig. 3(a), and then a high-low level interactive signal with stable time interval is detected, and the waveform of the signal accordingly shows the effect as shown in fig. 3 (b).
Step 202, determining whether the motion information has a predetermined signal characteristic.
The predetermined signal characteristic may be a signal state in which the motion detection signal exhibits a high-low level interaction.
Whether the system of the electronic equipment generates the action or not can be determined by analyzing whether the signal characteristic of the action detection signal of the PCH detection pin conforms to the preset signal characteristic or not.
And step 203, if the temperature information is acquired, determining that the electronic equipment generates the action, and acquiring at least one piece of temperature information stored in advance.
If the motion detection signal of the PCH detection pin conforms to the predetermined signal characteristic, that is, the motion detection signal exhibits a high-low level interactive signal state, it indicates that the electronic device generates a motion, and otherwise, if the motion detection signal does not conform to the predetermined signal characteristic, it indicates that the electronic device does not generate a motion if the detected signal is in a continuous high level state.
In order to avoid the above phenomenon, in the case where it is determined that the electronic device is operated, the present embodiment continues to acquire temperature information of the CPU. It is easy to understand that, in the case where it is determined that the electronic device is not operating, the temperature information of the CPU is not acquired.
The obtained temperature information of the CPU is at least one, and the at least one temperature information is as follows: at least one temperature information detected by a built-in temperature sensor of the electronic device CPU captured by the PCH through a predetermined interface.
The temperature of the CPU is detected, which is essentially aimed at reflecting the temperature of the CPU core as accurately as possible, in this embodiment, a temperature sensor is integrated inside the CPU, and the CPU temperature is detected by using a built-in sensor of the CPU, which can significantly improve the accuracy of the CPU temperature detection compared with a conventional method in which a temperature sensor is attached to the back of the CPU to monitor the CPU temperature (which has a problem of inaccurate temperature detection).
In the case where it is determined that the electronic device is acting, the PCH captures, through a predetermined interface, at least one piece of temperature information detected by a built-in temperature sensor of the CPU.
Referring to fig. 4, the predetermined Interface may be an Interface responsible for communication between the CPU and the PCH, and may be, for example and without limitation, a PECI (Platform Environment Control Interface). Optionally, in a specific implementation, when the signal state of the motion detection signal of the PCH is pulled high and is in a high state (i.e., SLP _ S0# is pulled high and is in a high state in a "high-low" level interaction state), the PCH can capture the CPU temperature transmitted by the PECI and store the CPU temperature in an EC-ROM (embedded Controller Read-Only memory of the embedded Controller) of the electronic device.
The temperature information in the EC-ROM may then be read to determine the CPU temperature. Theoretically, the CPU temperature can be determined by reading one temperature information, and in order to improve the accuracy of the determined CPU temperature, a plurality of temperature information can be read from the EC-ROM (the PCH reads the CPU temperature information from the PECI a plurality of times and stores the CPU temperature information in the EC-ROM), and the CPU temperature can be determined by integrating the plurality of temperature information.
And step 204, determining a temperature value of a central processing unit of the electronic equipment based on each temperature information.
Specifically, an average value of the temperature values represented by the plurality of temperature information may be calculated, and the calculated average value may be used as the temperature value of the CPU.
Step 205, determining whether the temperature value meets the first temperature condition or the second temperature condition.
The first temperature condition is a condition that characterizes the heat dissipation device to be activated, and the first temperature condition may include a maximum allowable temperature (the maximum allowable temperature of the CPU in the case that the heat dissipation device is not activated) set for the CPU, and the maximum allowable temperature is used as a temperature threshold value that triggers the heat dissipation device to be activated from an inactive state to an active state. The first temperature condition may thus be specifically set to: if the CPU temperature TPredetermined partReaches a temperature threshold T1Then, the heat dissipation device, such as a fan, is activated.
Usually, when the fan is started, it is controlled to rotate at a fixed speed (such as V)1) And (5) operating.
The second temperature condition is a condition that characterizes a need to adjust a rotational speed of the heat sink. Specifically, the second temperature condition may be a stepped rotation speed control condition corresponding to different temperature intervals in which the CPU temperature rises and reaches the set temperature threshold T as described in the above embodiment2When the temperature is higher than the set temperature, the rotating speed of the heat sink is required to be changed from V1Is lifted to V2Similarly, when the CPU temperature rises and reaches the set temperature threshold T3When the temperature is higher than the set temperature, the rotating speed of the heat sink is required to be changed from V2Is lifted to V3……
However, the second temperature condition is not limited to the above-mentioned hierarchical rotation speed control condition form corresponding to different temperature intervals, and in practical implementation, the temperature-rotation speed condition may be set to be a functional relationship (e.g. a linear relationship) (according to the increase of the rotation speed of the heat sink as the temperature of the CPU increases).
Step 206, if the temperature value meets the first temperature condition, starting the heat dissipation device.
If the temperature value of the CPU is determined to meet the first temperature condition, if so, the temperature value of the CPU is determined to reach the temperature threshold T1And starting the heat dissipation device to dissipate heat of the equipment.
And step 207, if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
And if the temperature value of the CPU is determined to meet the second temperature condition, adjusting the rotating speed of the heat dissipation device. Therein, in particular, if, for example, the CPU temperature rises to a temperature threshold T2Then the rotating speed of the heat dissipation device is changed from V1Adjusted to V2If the CPU temperature rises to the temperature threshold T3Then the rotating speed of the heat dissipation device is changed from V2Adjusted to V3。
It is easy to understand that if the CPU temperature exhibits a change opposite to the above temperature change, and decreases from a certain relatively high temperature to another relatively low temperature, the rotation speed of the heat sink may be gradually reduced along with the decrease of the CPU temperature, and the heat sink is turned off until the CPU temperature decreases to be lower than the temperature threshold corresponding to the start-up of the heat sink.
In this embodiment, optionally, the temperature information is read from the EC-ROM, the CPU temperature is calculated based on the temperature information, and then a processing procedure of performing relevant control on the heat dissipation device in combination with the CPU temperature may be executed by an embedded controller EC of the electronic device, and when the EC controls the heat dissipation device based on the calculated CPU temperature value, the EC may specifically write the calculated temperature value into a temperature control module of the heat dissipation device, and then trigger the temperature control module to control the start of the heat dissipation device or adjust the rotation speed of the heat dissipation device.
In the embodiment, the heat dissipation device of the electronic equipment is controlled when the electronic equipment acts and the temperature of the CPU meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic manner like the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the CPU core of the electronic equipment can be combined to perform related control on the heat dissipation device in real time, and the burning risk of the CPU of the equipment is reduced.
In response to the above control, the embodiments of the present application also disclose an electronic device, which may be, but is not limited to, a portable computer (e.g., a notebook), a desktop computer or a large and medium-sized computer, a server, etc. in a general/special purpose computing or configuration environment.
Referring to fig. 5, a schematic structural diagram of an electronic device is shown, the electronic device including: a heat sink 501, a detection component 502, a memory 503, and a first processor 504.
The heat dissipation device 501 can be used to dissipate heat of an electronic device.
The heat sink may be a fan in an electronic device.
A detecting unit 502 for detecting motion information of the electronic device in the first mode; the power consumption of the equipment corresponding to the first mode is lower than that of the equipment corresponding to the electronic equipment in a normal operation mode.
A memory 503 for storing at least one set of instructions.
A first processor 504 for invoking and executing the set of instructions in the memory, by executing the set of instructions:
determining whether the action information indicates that the electronic device generates an action;
if yes, acquiring temperature information of a preset part of the electronic equipment;
determining whether the temperature information satisfies a temperature condition;
and if so, controlling the heat dissipation device to be matched with the temperature condition.
The first mode is a corresponding mode in which device power consumption is lower than that of the electronic device in the normal operation mode, and specifically, the first mode may be, but is not limited to, a Modern Standby mode.
In the first mode, detecting the motion information of the electronic device may refer to detecting the motion information of a system of the electronic device, such as specifically detecting the motion information of a CPU, a motherboard and/or corresponding components in peripheral circuits of the motherboard in the system of the electronic device.
After detecting the action information of the electronic device, such as the action information of the corresponding component in the CPU, the main board and/or the peripheral circuit of the main board in the electronic device system, it is further analyzed whether the electronic device (the corresponding component) generates an action based on the detected information.
The predetermined component may be a high heat dissipation component of the electronic device, and more specifically, may be, for example, but not limited to, a CPU or the like of the electronic device.
In the first mode, for example, in the Modern Standby mode, if the system of the electronic device does not operate, conventionally, the temperature of the CPU will not rise, and the CPU will not be overheated and the risk of burning the CPU will not be caused, whereas if the system of the electronic device operates, for example, corresponding components in the CPU, the motherboard and/or the motherboard peripheral circuit start to operate (more specifically, for example, the device automatically updates/upgrades the driving/operating system when meeting the condition, so that corresponding components of the device operate), the temperature of the CPU will rise, and the risk of burning the CPU will probably be caused by overheating of the CPU.
Alternatively, the temperature condition may include a maximum allowable temperature (a maximum allowable temperature of the CPU in a case where the heat sink is not activated) set for a predetermined component such as the CPU as a temperature threshold value that triggers activation of the heat sink from the non-operating state to enter the operating state.
It is easily understood that, in other embodiments of the present application, the temperature condition is not limited to only include the form of the temperature threshold for triggering activation of the heat sink, but may also be set to include a graded condition composed of a plurality of temperature intervals, such as:
5)Tpredetermined partTo reach T1: starting the heat sink to rotate at a rotation speed V1Running;
6)T1≤Tpredetermined part＜T2: maintaining the rotational speed V1；
7)T2≤TPredetermined part＜T3: at a rotational speed V2Running;
8)T3≤Tpredetermined part＜T4: at a rotational speed V3Running;
……
wherein, TPredetermined partIndicating the temperature, T, of said predetermined part of the electronic device1、T2、T3、T4Respectively different temperature thresholds, and T1＜T2＜T3＜T4；V1、V2、V3Respectively different rotational speed values, and V1＜V2＜V3。
For example, on the basis that a temperature threshold for triggering the activation of the heat dissipation device is set for the temperature condition, a temperature-rotation speed condition in a functional relationship (e.g., a linear relationship) form may be further set, so that after the heat dissipation device is activated, the rotation speed of the heat dissipation device can be further controlled to increase along with the increase of the temperature of a predetermined component such as a CPU according to the temperature-rotation speed condition in the functional relationship form.
If the temperature information of the predetermined component of the electronic device meets the predetermined condition, it indicates that the heat dissipation device of the electronic device needs to be controlled, and the control may be to control the heat dissipation device to start when the temperature of the predetermined component reaches a temperature threshold corresponding to "start control", or may also be to adjust the rotation speed of the heat dissipation device when the temperature of the predetermined component reaches a temperature threshold for adjusting the rotation speed of the predetermined component.
It is easy to understand that if the detected operation information indicates that the electronic device is not operating, or if the detected operation information indicates that the electronic device is operating but the temperature information of the predetermined component does not satisfy the temperature condition, the heat sink does not need to be controlled.
According to the scheme, the electronic equipment provided by the embodiment of the application controls the heat dissipation device of the equipment when the equipment acts and the temperature of the preset component of the equipment meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic mode as in the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the preset component (such as a CPU) of the equipment can be combined to perform related control on the heat dissipation device in real time, and the burning risk of the component of the equipment is reduced.
In this embodiment of the application, optionally, the detecting component 502 is a south bridge chip PCH of an electronic device, and the electronic device further includes a CPU and a predetermined interface for connecting the CPU and the PCH, where the predetermined interface may be, but is not limited to, a PECI. The first processor 504 is different from the CPU, and in an implementation, the first processor 504 may be, but is not limited to, an EC of an electronic device, and the memory 503 may be, but is not limited to, an EC-ROM of the electronic device.
The embodiment of the application applies the PCH to detecting the motion of the electronic device in the first mode, and obtains a corresponding motion detection signal.
The first mode may be a low power consumption mode such as a modem Standby mode of the electronic device, in which components of the electronic device are in a low power consumption Standby state, and in this embodiment, a south bridge chip (PCH) of the electronic device in this state is used to detect an action of the electronic device, for example, detect actions of components of a CPU, a motherboard, and/or a motherboard peripheral circuit in a system of the electronic device, so as to obtain an action detection signal.
When the system of the electronic device is not in action, the detection pin of the PCH is in a high level state, the signal waveform curve of the action detection signal generated by the PCH appears as a straight line in the high level state, when the system of the electronic device is operated, for example, when the electronic device triggers tasks such as system upgrade, driver upgrade, or system bug fix due to meeting the set conditions, components such as a CPU in the system will operate in response to the start of the tasks, as shown in fig. 3(a) -3 (b), initially, a signal of high-low level interaction with unstable time interval is detected, the waveform of the signal (i.e. SLP _ S0#) shows the effect as shown in fig. 3(a), and then a high-low level interactive signal with stable time interval is detected, and the waveform of the signal accordingly shows the effect as shown in fig. 3 (b).
On this basis, the first processor 504 can further realize its functions through the following processing procedures: determining whether the motion information has a predetermined signal characteristic; if yes, determining that the electronic equipment generates action, and acquiring at least one piece of prestored temperature information; determining a temperature value of a central processing unit of the electronic device based on a plurality of temperature information; determining whether the temperature value satisfies a first temperature condition or a second temperature condition; if the temperature value meets the first temperature condition, starting the heat dissipation device; and if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
The predetermined signal characteristic may be a signal state in which the motion detection signal exhibits a high-low level interaction.
Whether the system of the electronic equipment generates the action or not can be determined by analyzing whether the signal characteristic of the action detection signal of the PCH detection pin conforms to the preset signal characteristic or not.
If the motion detection signal of the PCH detection pin conforms to the predetermined signal characteristic, that is, the motion detection signal exhibits a high-low level interactive signal state, it indicates that the electronic device generates a motion, and otherwise, if the motion detection signal does not conform to the predetermined signal characteristic, it indicates that the electronic device does not generate a motion if the detected signal is in a continuous high level state.
In order to avoid the above phenomenon, in the case where it is determined that the electronic device is operated, the present embodiment continues to acquire temperature information of the CPU. It is easy to understand that, in the case where it is determined that the electronic device is not operating, the temperature information of the CPU is not acquired.
The acquired temperature information of the CPU is at least one, and the at least one temperature information is as follows: at least one temperature information detected by a built-in temperature sensor of the electronic device CPU captured by the PCH through a predetermined interface.
The temperature of the CPU is detected, which is essentially aimed at reflecting the temperature of the CPU core as accurately as possible, in this embodiment, a temperature sensor is integrated inside the CPU, and the CPU temperature is detected by using a built-in sensor of the CPU, which can significantly improve the accuracy of the CPU temperature detection compared with a conventional method in which a temperature sensor is attached to the back of the CPU to monitor the CPU temperature (which has a problem of inaccurate temperature detection).
In the case where it is determined that the electronic device is acting, the PCH captures, through a predetermined interface, at least one piece of temperature information detected by a built-in temperature sensor of the CPU.
Referring to fig. 4, the predetermined Interface may be an Interface responsible for communication between the CPU and the PCH, and may be, for example and without limitation, a PECI (Platform Environment Control Interface). Optionally, in a specific implementation, when the signal state of the motion detection signal of the PCH is pulled high and is in a high state (i.e., SLP _ S0# is pulled high and is in a high state in a "high-low" level interaction state), the PCH can capture the CPU temperature transmitted by the PECI and store the CPU temperature in an EC-ROM (embedded Controller Read-Only memory of the embedded Controller) of the electronic device.
The temperature information in the EC-ROM may then be read to determine the CPU temperature. Theoretically, the CPU temperature can be determined by reading one temperature information, and in order to improve the accuracy of the determined CPU temperature, a plurality of temperature information can be read from the EC-ROM (the PCH reads the CPU temperature information from the PECI a plurality of times and stores the CPU temperature information in the EC-ROM), and the CPU temperature can be determined by integrating the plurality of temperature information.
Specifically, an average value of the temperature values represented by the plurality of temperature information may be calculated, and the calculated average value may be used as the temperature value of the CPU.
The first temperature condition is a condition that characterizes the heat dissipation device to be activated, and the first temperature condition may include a maximum allowable temperature (the maximum allowable temperature of the CPU in the case that the heat dissipation device is not activated) set for the CPU, and the maximum allowable temperature is used as a temperature threshold value that triggers the heat dissipation device to be activated from an inactive state to an active state. The first temperature condition may thus be specifically set to: if the CPU temperature TPredetermined partReaches a temperature threshold T1Then, the heat dissipation device, such as a fan, is activated.
Usually, when the fan is started, it is controlled to rotate at a fixed speed (such as V)1) And (5) operating.
The second temperature condition is a condition that characterizes a need to adjust a rotational speed of the heat sink. Specifically, the second temperature condition may be a stepped rotation speed control condition corresponding to different temperature intervals in which the CPU temperature rises and reaches the set temperature threshold T as described in the above embodiment2When the temperature is higher than the set temperature, the rotating speed of the heat sink is required to be changed from V1Is lifted to V2Similarly, when the CPU temperature rises and reaches the set temperature threshold T3When the temperature is higher than the set temperature, the rotating speed of the heat sink is required to be changed from V2Is lifted to V3……
However, the second temperature condition is not limited to the above-mentioned hierarchical rotation speed control condition form corresponding to different temperature intervals, and in practical implementation, the temperature-rotation speed condition may be set to be a functional relationship (e.g. a linear relationship) (according to the increase of the rotation speed of the heat sink as the temperature of the CPU increases).
If the temperature value of the CPU is determined to meet the first temperature condition, if so, the temperature value of the CPU is judged to reach the temperature threshold T1And starting the heat dissipation device to dissipate heat of the equipment.
And if the temperature value of the CPU is determined to meet the second temperature condition, adjusting the rotating speed of the heat dissipation device. Therein, in particular, if, for example, the CPU temperature rises to a temperature threshold T2Then the rotating speed of the heat dissipation device is changed from V1Adjusted to V2If the CPU temperature rises to the temperature threshold T3Then the rotating speed of the heat dissipation device is changed from V2Adjusted to V3。
It is easy to understand that if the CPU temperature exhibits a change opposite to the above temperature change, and decreases from a certain relatively high temperature to another relatively low temperature, the rotation speed of the heat sink may be gradually reduced along with the decrease of the CPU temperature, and the heat sink is turned off until the CPU temperature decreases to be lower than the temperature threshold corresponding to the start-up of the heat sink.
In this embodiment, the temperature information is read from the EC-ROM, the CPU temperature is calculated based on the temperature information, and then the processing procedure of performing the relevant control on the heat dissipation device in combination with the CPU temperature may be executed by an embedded controller EC of the electronic device, and when the EC controls the heat dissipation device based on the calculated CPU temperature value, the EC may specifically write the calculated temperature value into a temperature control module of the heat dissipation device, and then trigger the temperature control module to control the start or adjust the rotation speed of the heat dissipation device.
In the embodiment, the heat dissipation device of the electronic equipment is controlled when the electronic equipment acts and the temperature of the CPU meets the temperature condition, so that the heat dissipation device does not need to be continuously started and stopped in a periodic manner like the conventional technology, the power consumption of the equipment is effectively reduced, the user experience is improved, the actual temperature condition of the CPU core of the electronic equipment can be combined to perform related control on the heat dissipation device in real time, and the burning risk of the CPU of the equipment is reduced.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
For convenience of description, the above system or apparatus is described as being divided into various modules or units by function, respectively. Of course, the functionality of the units may be implemented in one or more software and/or hardware when implementing the present application.
From the above description of the embodiments, it is clear to those skilled in the art that the present application can be implemented by software plus necessary general hardware platform. Based on such understanding, the technical solutions of the present application may be essentially or partially implemented in the form of a software product, which may be stored in a storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, etc., and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method according to the embodiments or some parts of the embodiments of the present application.
Finally, it is further noted that, herein, relational terms such as first, second, third, fourth, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a preferred embodiment of the present application and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.

Claims (10)

1. A control method, comprising:
detecting motion information of the electronic equipment in a first mode; the equipment power consumption corresponding to the first mode is lower than the equipment power consumption corresponding to the electronic equipment in a normal operation mode;
determining whether the action information indicates that the electronic device generates an action;
if yes, acquiring temperature information of a preset part of the electronic equipment;
determining whether the temperature information satisfies a temperature condition;
and if so, controlling the heat dissipation device of the electronic equipment to be matched with the temperature condition.
2. The method of claim 1, the detecting motion information of an electronic device, comprising:
detecting the action of the electronic equipment by utilizing a south bridge chip of the electronic equipment to obtain an action detection signal;
the determining whether the action information indicates that the electronic device generates an action includes:
determining whether the motion detection signal has a predetermined signal characteristic;
and if so, determining that the electronic equipment generates the action.
3. The method of claim 2, the obtaining temperature information of the predetermined component of the electronic device, comprising:
acquiring at least one piece of prestored temperature information;
the at least one temperature information is: and at least one piece of temperature information which is captured by the south bridge chip through a preset interface and is detected by a built-in temperature sensor of a central processing unit of the electronic equipment.
4. The method of claim 3, the temperature information being plural in number;
the determining whether the temperature information satisfies a temperature condition includes:
determining a temperature value of a central processing unit of the electronic device based on a plurality of temperature information;
determining whether the temperature value satisfies a first temperature condition or a second temperature condition;
the first temperature condition is a condition for representing that the heat dissipation device needs to be started, and the second temperature condition is a condition for representing that the rotating speed of the heat dissipation device needs to be adjusted.
5. The method of claim 4, the controlling the heat sink of the electronic device to match the temperature condition, comprising:
if the temperature value meets the first temperature condition, starting the heat dissipation device;
and if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
6. An electronic device, comprising:
the heat dissipation device can be used for dissipating heat of the electronic equipment;
the electronic equipment comprises a detection component, a detection component and a control component, wherein the detection component is used for detecting action information of the electronic equipment in a first mode; the equipment power consumption corresponding to the first mode is lower than the equipment power consumption corresponding to the electronic equipment in a normal operation mode;
a memory for storing at least one set of instructions;
a first processor for invoking and executing the set of instructions in the memory, by executing the set of instructions:
determining whether the action information indicates that the electronic device generates an action;
if yes, acquiring temperature information of a preset part of the electronic equipment;
determining whether the temperature information satisfies a temperature condition;
and if so, controlling the heat dissipation device to be matched with the temperature condition.
7. The electronic device of claim 6, said detection component being a south bridge chip of said electronic device;
the south bridge chip can be used for detecting the action of the electronic equipment to obtain an action detection signal;
when determining whether the motion information indicates that the electronic device generates a motion, the first processor is specifically configured to: determining whether the motion detection signal has a predetermined signal characteristic; and if so, determining that the electronic equipment generates the action.
8. The electronic device of claim 7, further comprising a central processing unit and a predetermined interface for connecting the central processing unit and the south bridge chip, the central processing unit having a built-in temperature sensor therein, the first processor being different from the central processing unit;
when the first processor obtains the temperature information of the predetermined component of the electronic device, the first processor is specifically configured to:
acquiring at least one piece of prestored temperature information;
the at least one temperature information is: and at least one piece of temperature information which is captured by the south bridge chip through the preset interface and is detected by a built-in temperature sensor of the central processing unit of the electronic equipment.
9. The electronic device of claim 8, wherein the temperature information is plural in number;
when determining whether the temperature information satisfies the temperature condition, the first processor is specifically configured to:
determining a temperature value of a central processing unit of the electronic device based on a plurality of temperature information;
determining whether the temperature value satisfies a first temperature condition or a second temperature condition;
the first temperature condition is a condition for representing that the heat dissipation device needs to be started, and the second temperature condition is a condition for representing that the rotating speed of the heat dissipation device needs to be adjusted.
10. The electronic device according to claim 9, wherein the first processor, when performing control on the heat sink of the electronic device matching the temperature condition, is specifically configured to:
if the temperature value meets the first temperature condition, starting the heat dissipation device;
and if the temperature value meets the second temperature condition, adjusting the rotating speed of the heat dissipation device.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114706465A (en) * 2022-04-25 2022-07-05 紫光计算机科技有限公司 Method and device for adjusting performance of electronic equipment, electronic equipment and medium

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1828549A (en) * 2006-04-04 2006-09-06 威盛电子股份有限公司 Memory refreshing speed control device and method
US20100125743A1 (en) * 2008-11-20 2010-05-20 Micro-Star International Co., Ltd. Electronic device for reducing power consumption during off of computer motherboard
US20150378403A1 (en) * 2014-06-25 2015-12-31 International Business Machines Corporation Fan Control System and Method For A Computer System Based On A Time Variable Rate of Current
CN105811512A (en) * 2016-04-27 2016-07-27 珠海格力电器股份有限公司 Power supply method and device for cooling fan of household appliance and household appliance
CN106970692A (en) * 2017-03-31 2017-07-21 紫光华山信息技术有限公司 Rotation speed of the fan adjusting method and device
CN107390852A (en) * 2017-06-23 2017-11-24 联想(北京)有限公司 A kind of control method, electronic equipment and computer-readable recording medium
CN107515668A (en) * 2017-08-30 2017-12-26 联想(北京)有限公司 A kind of control method and device
KR101951012B1 (en) * 2018-10-12 2019-05-21 주식회사 메이커스테크놀로지 Computer power saving method and computer performing the same
CN110332140A (en) * 2019-08-01 2019-10-15 联想(北京)有限公司 The control method for fan and electronic equipment of a kind of electronic equipment

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1828549A (en) * 2006-04-04 2006-09-06 威盛电子股份有限公司 Memory refreshing speed control device and method
US20100125743A1 (en) * 2008-11-20 2010-05-20 Micro-Star International Co., Ltd. Electronic device for reducing power consumption during off of computer motherboard
US20150378403A1 (en) * 2014-06-25 2015-12-31 International Business Machines Corporation Fan Control System and Method For A Computer System Based On A Time Variable Rate of Current
CN105811512A (en) * 2016-04-27 2016-07-27 珠海格力电器股份有限公司 Power supply method and device for cooling fan of household appliance and household appliance
CN106970692A (en) * 2017-03-31 2017-07-21 紫光华山信息技术有限公司 Rotation speed of the fan adjusting method and device
CN107390852A (en) * 2017-06-23 2017-11-24 联想(北京)有限公司 A kind of control method, electronic equipment and computer-readable recording medium
CN107515668A (en) * 2017-08-30 2017-12-26 联想(北京)有限公司 A kind of control method and device
KR101951012B1 (en) * 2018-10-12 2019-05-21 주식회사 메이커스테크놀로지 Computer power saving method and computer performing the same
CN110332140A (en) * 2019-08-01 2019-10-15 联想(北京)有限公司 The control method for fan and electronic equipment of a kind of electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114706465A (en) * 2022-04-25 2022-07-05 紫光计算机科技有限公司 Method and device for adjusting performance of electronic equipment, electronic equipment and medium

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