CN111117506B - Copper foil adhesive tape with excellent heat conductivity and preparation method thereof - Google Patents
Copper foil adhesive tape with excellent heat conductivity and preparation method thereof Download PDFInfo
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- CN111117506B CN111117506B CN201911249798.2A CN201911249798A CN111117506B CN 111117506 B CN111117506 B CN 111117506B CN 201911249798 A CN201911249798 A CN 201911249798A CN 111117506 B CN111117506 B CN 111117506B
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- heat
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- copper foil
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a copper foil tape with excellent heat conductivity and a preparation method thereof, and the copper foil tape comprises the following components from top to bottom: the heat conducting layer, the copper foil, the insulating layer, the heat conducting glue and the release layer; the heat conduction layer comprises the following raw materials: the heat-conducting ink comprises heat-conducting ink, graphene, methyl zinc chloride and a curing agent; the heat-conducting glue comprises the following components: acrylate polymer, isocyanate curing agent and aluminum particle heat conducting powder; the particle size of the aluminum particle heat conducting powder is 1-3 mu m, and the molecular weight of the acrylate polymer is 2-5 ten thousand.
Description
Technical Field
The invention belongs to the field of film materials, and particularly relates to a copper foil tape with excellent heat conductivity and a preparation method thereof.
Background
With the rapid development of the computer field, more components are integrated on a circuit board with the same area, so that more heat can be generated in a unit area, the effect of an electronic product is influenced, and some potential safety hazards are caused. The market demand potential is very large. The heat conduction can meet the requirement on how to improve the safety of the product, and the material is easy to conduct electricity along with the improvement of the heat conductivity to cause potential safety hazards caused by short circuit of the PCB.
Disclosure of Invention
The invention provides a copper foil adhesive tape with excellent heat conductivity and a preparation method thereof, which are widely applied to the fields and scenes of surface heat conduction of electronic parts and PCB (printed Circuit Board) or other heat conduction requirements.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
a copper foil tape with excellent thermal conductivity, comprising from top to bottom: the heat conducting layer, the copper foil, the insulating layer, the heat conducting glue and the release layer; the heat conduction layer comprises the following raw materials: the heat-conducting ink comprises heat-conducting ink, graphene, methyl zinc chloride and a curing agent; the heat-conducting glue comprises the following components: acrylate polymer, isocyanate curing agent and aluminum particle heat conducting powder; the particle size of the aluminum particle heat conducting powder is 1-3 mu m, and the molecular weight of the acrylate polymer is 2-5 ten thousand.
Further, the proportion of the heat-conducting ink, the graphene, the methyl zinc chloride and the curing agent in the heat-conducting ink is 100: 3-4: 0.1-0.4: 3-5. .
Further, in the heat conductive adhesive, polyacrylate: isocyanate: aluminum particle heat-conducting powder is 100: 2.5-3: 5.5-6.5.
Further, the particle size of the aluminum particle heat conduction powder is 1-3 μm.
A preparation method of a copper foil adhesive tape with excellent heat conductivity is characterized by comprising the following steps:
(1) the rough surface of the inner surface of the copper foil is provided with an insulating coating, the process temperature of the insulating coating is 70-80 ℃, the thickness of the insulating coating is 3-4 mu m, and the insulating coating is baked until the insulating coating is completely dried and is tightly adhered to the copper foil.
(2) The formula of the heat-conducting glue is as follows: isocyanate curing agent: aluminum particle heat-conducting powder is 100: 2.5-3: 5.5-6.5, the particle size of the aluminum particle heat-conducting powder is 1-3 μm, the components of the heat-conducting glue are diluted by 50% with ethyl acetate after being mixed, and the revolution is 250 r/min;
(3) coating heat-conducting glue on the surface of the insulating coating, wherein the thickness of the glue is 18-20 mu, and the glue is coated on a commercially available 50-mu transparent release substrate;
(4) heat-conducting ink: graphene: methyl zinc chloride, curing agent 100: 3-4: 0.1-0.4: 3-5, the solid content of the printing ink is 36%, the printing ink is diluted by 50% of ethyl acetate after being filtered, a coating is made on the smooth surface of the copper foil, the thickness of the coating is 4-6 mu m, and the printing ink is baked for 3min at the temperature of 80-90 ℃.
The invention has the beneficial effects that:
products of the invention
1. The heat-resistant glue is used on a device with large heat quantity, and the proportion relation between the glue and the heat-conducting powder is also realized. The acrylate polymer needs to have a proper molecular weight and to be matched with the heat conducting powder with a proper particle size, so that the optimal heat conductivity is realized. The grain diameter of the heat-conducting powder is 1-3 μm, and the coating of the heat-conducting glue can ensure enough quantity, so as to avoid glue lines caused by overlarge particles on the glue surface.
2. Too large a thermally conductive ink particle can result in poor coatings. The solid content of the heat-conducting ink is 36%, the viscosity of the ink is high, the heat-conducting ink is firstly filtered and then diluted by a curing agent and ethyl acetate, a 300-mesh filter screen is used for filtering the heat-conducting coating and the heat-conducting glue when the glue is applied, and the phenomenon that glue lines or uneven granular feelings are generated on the layer surface and the glue surface is avoided.
3. According to the invention, methyl zinc chloride and graphene are added into the heat-conducting oil ink, and the graphene is a common additive of the heat-conducting oil ink, but the heat conductivity and the heat resistance are further improved in a synergistic manner by adding the methyl zinc chloride.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Any modifications that can be easily made by a person skilled in the art to the present invention without departing from the technical solutions of the present invention will fall within the scope of the claims of the present invention.
Example 1
A copper foil tape with excellent thermal conductivity, comprising from top to bottom: the heat conducting layer, the copper foil, the insulating layer, the heat conducting glue and the release layer; the heat conduction layer comprises the following raw materials: the heat-conducting ink comprises heat-conducting ink, graphene, methyl zinc chloride and a curing agent; the heat-conducting glue comprises the following components: acrylate polymer, isocyanate curing agent and aluminum particle heat conducting powder; the particle size of the aluminum particle heat conducting powder is 1-3 mu m, and the molecular weight of the polyacrylate is 2-5 ten thousand.
The proportion of the heat-conducting ink, the graphene, the zinc chloride and the curing agent in the heat-conducting ink is 100: 3.5: 0.15: 5.5. polyacrylate in the heat-conducting adhesive: isocyanate: aluminum particle heat-conducting powder is 100: 2.5: 5.5. the particle size of the aluminum particle heat conducting powder is 1-3 mu m.
A preparation method of a copper foil adhesive tape with excellent heat conductivity is characterized by comprising the following steps:
(1) the rough surface of the inner surface of the copper foil is coated with an insulating coating, the process temperature of the insulating coating is 70-80 ℃, the thickness of the insulating coating is 3-4 mu m, and the insulating coating is baked for one minute.
(2) The formula of the heat-conducting glue is as follows: isocyanate: aluminum particle heat-conducting powder is 100: 2.5: 5.5, the particle size of the aluminum particle heat conduction powder is 1-3 μm, the components of the heat conduction glue are diluted by 50% with ethyl acetate after being mixed, and the revolution is 250 r/min;
(3) coating heat-conducting glue on the surface of the insulating coating, wherein the thickness of the glue is 18-20 mu m, and the glue is coated on a commercially available 50-mu m transparent release film;
(4) heat-conducting ink: graphene: methyl zinc chloride, curing agent 100: 3.5: 0.15: 5.5, the solid content of the printing ink is 36 percent, the printing ink is diluted by adding 50 percent of ethyl acetate after being filtered, a coating is made on the smooth surface of the copper foil, the thickness of the coating is 6 mu m, and the printing ink is baked for 3min at the temperature of 80-90 ℃.
Comparative example 1
Same as example 1 except that no graphene was added, methyl zinc chloride.
Comparative example 2
Same as example 1 except that no graphene was added.
Comparative example 3
Same as example 1 except that methyl zinc chloride was not added.
Comparative example 4
The same as example 1, except that the particle diameter of the aluminum particle heat conductive powder was 10 μm, the molecular weight of the polyacrylate was 10 ten thousand.
Comparative example 5
The same as example 1, except that the particle diameter of the aluminum particle heat conductive powder was 0.1 μm, the molecular weight of the polyacrylate was 5000.
Comparative example 6
The same as example 1, except that the particle diameter of the aluminum particle heat conductive powder was 10 μm, the molecular weight of the polyacrylate was 3.5 ten thousand.
TABLE 1
| Heat conductivity coefficient W/m.K at 25 deg.C | 100 ℃ heat conductivity coefficient W/m.K | |
| Example 1 | 106 | 98 |
| Comparative example 1 | 65 | 41 |
| Comparative example 2 | 73 | 45 |
| Comparative example 3 | 86 | 68 |
| Comparative example 4 | 91 | 75 |
| Comparative example 5 | 87 | 89 |
| Comparative example 6 | 95 | 72 |
Claims (3)
1. A copper foil tape with excellent thermal conductivity is characterized in that: from top to bottom: the heat conduction layer, the copper foil, the insulation layer and the heat conduction glue; the heat conduction layer comprises the following raw materials: the heat-conducting ink comprises heat-conducting ink, graphene, methyl zinc chloride and a curing agent; the heat-conducting glue comprises the following components: acrylate polymer, isocyanate curing agent and aluminum particle heat conducting powder; the particle size of the aluminum particle heat conducting powder is 1-3 mu m, and the molecular weight of the acrylate polymer is 2-5 ten thousand;
the heat-conducting ink comprises heat-conducting ink, graphene, methyl zinc chloride and a curing agent in a ratio of 100: 3-4: 0.1-0.4: 3-5;
wherein, in the heat-conducting glue, polyacrylate: isocyanate curing agent: aluminum particle heat-conducting powder is 100: 2.5-3: 5.5-6.5.
2. The copper foil tape with excellent thermal conductivity according to claim 1, wherein: the particle size of the aluminum particle heat conducting powder is 1-3 mu m.
3. A preparation method of a copper foil adhesive tape with excellent heat conductivity is characterized by comprising the following steps:
(1) the rough surface of the inner surface of the copper foil is made into an insulating coating by using a special coating machine, the process temperature of the insulating coating is 70-80 ℃, the thickness of the insulating coating is 3-4 mu m, and the insulating coating is baked until the insulating coating is completely adhered firmly;
(2) the formula of the heat-conducting glue is as follows: isocyanate curing agent: aluminum particle heat-conducting powder is 100: 2.5-3: 5.5-6.5, the particle size of the aluminum particle heat-conducting powder is 1-3 μm, the components of the heat-conducting glue are diluted by 50% with ethyl acetate after being mixed, and the revolution is 250 r/min;
(3) coating heat-conducting glue on the surface of the insulating coating, wherein the thickness of the glue is 18-20 mu m, and the glue is coated on a commercially available transparent release substrate with the thickness of 50 mu m;
(4) heat-conducting ink: graphene: methyl zinc chloride: curing agent 100: 3-4: 0.1-0.4: 3-5, wherein the solid content of the ink is 36%, the ink is diluted by adding 50% of ethyl acetate after being filtered, a coating is made on the smooth surface of the copper foil, the thickness of the coating is 6 mu m, and the copper foil is baked for 3min at the temperature of 80-90 ℃ until the copper foil is completely dried.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249798.2A CN111117506B (en) | 2019-12-09 | 2019-12-09 | Copper foil adhesive tape with excellent heat conductivity and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249798.2A CN111117506B (en) | 2019-12-09 | 2019-12-09 | Copper foil adhesive tape with excellent heat conductivity and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111117506A CN111117506A (en) | 2020-05-08 |
| CN111117506B true CN111117506B (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911249798.2A Active CN111117506B (en) | 2019-12-09 | 2019-12-09 | Copper foil adhesive tape with excellent heat conductivity and preparation method thereof |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203715553U (en) * | 2013-12-31 | 2014-07-16 | 深圳市宏瑞新材料科技有限公司 | Graphene heat conducting membrane |
| CN105143381A (en) * | 2013-04-26 | 2015-12-09 | 3M创新有限公司 | Heat dissipating sheet |
| KR101706756B1 (en) * | 2015-04-21 | 2017-02-15 | 한국교통대학교산학협력단 | Heat-spreading adhesive tape and method of the same |
-
2019
- 2019-12-09 CN CN201911249798.2A patent/CN111117506B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105143381A (en) * | 2013-04-26 | 2015-12-09 | 3M创新有限公司 | Heat dissipating sheet |
| CN203715553U (en) * | 2013-12-31 | 2014-07-16 | 深圳市宏瑞新材料科技有限公司 | Graphene heat conducting membrane |
| KR101706756B1 (en) * | 2015-04-21 | 2017-02-15 | 한국교통대학교산학협력단 | Heat-spreading adhesive tape and method of the same |
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| Publication number | Publication date |
|---|---|
| CN111117506A (en) | 2020-05-08 |
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