CN111107711A

CN111107711A - PCB processing method and PCB

Info

Publication number: CN111107711A
Application number: CN202010027347.0A
Authority: CN
Inventors: 孟昭光; 赵南清; 曾国权
Original assignee: Dongguan Wuzhu Technology Co ltd
Current assignee: Dongguan Wuzhu Technology Co ltd
Priority date: 2020-01-10
Filing date: 2020-01-10
Publication date: 2020-05-05

Abstract

The invention discloses a PCB processing method and a PCB, and is particularly suitable for processing metal edge-covered technical products. The PCB processing method comprises the following steps: and carrying out whole-plate processing on the plate to be processed along the directions of the four plate edges of the single PCS plate. The PCB processing method has the advantages that the board to be processed is divided into a plurality of times of processing according to the number of the board edges of the single PCS board, only one board edge direction is processed each time, the processing precision is affected by the error of only one board edge direction, compared with the simultaneous processing in a plurality of board edge directions, the processing precision of the PCB processing method is higher, and the step of adjusting the coordinates of the machine is added between the processing steps in different board edge directions and between the processing steps in different rows or columns, so that the processing precision is further improved. The PCB manufactured by the method has higher yield, indirectly improves the processing efficiency and has good application prospect.

Description

PCB processing method and PCB

Technical Field

The invention belongs to the technical field of PCB manufacturing, and particularly relates to a PCB processing method and a PCB.

Background

In normal electric milling (or drilling) of a whole PNL (panel), due to factors such as expansion and shrinkage, uniformity of copper thickness, tool diameter compensation and the like of a product, the precision of the electric milling (or drilling) of four edges of the panel in different directions is different, so that the metal edge can be electrically milled (or the metal edge connection position can be drilled) while the metal edge cannot be electrically milled (or the metal edge connection position cannot be drilled).

Disclosure of Invention

The present invention provides a PCB processing method and a PCB, so as to solve the above technical problems.

In order to achieve the purpose, the invention adopts the following technical scheme:

in a first aspect, the present invention provides a PCB processing method, including:

carrying out whole board processing on a board to be processed along any board edge direction of the single PCS board;

after the whole board processing in any board edge direction is finished, carrying out whole board processing on the board to be processed along other board edge directions of the single PCS board;

wherein the board to be processed includes a plurality of the single PCS boards.

Optionally, the single PCS plate is rectangular in shape and includes four plate edge directions;

the PCB processing method comprises the following steps:

and carrying out whole-plate processing on the plate to be processed along the directions of the four plate edges of the single PCS plate.

Optionally, before performing the whole board processing on the board to be processed along the other board edge direction of the single PCS board, the method further includes:

acquiring a processing error of the single PCS plate in the edge direction of any plate;

and adjusting the coordinates of the machine according to the machining error.

Optionally, the plate to be processed comprises a plurality of rows or a plurality of columns of the single PCS plate;

the board of treating along arbitrary flange edge direction of single PCS board carries out whole board processing, includes:

processing the single PCS plate in any row or any column along the direction of any plate edge;

acquiring a processing error of the single PCS plate in any row or any column in the edge direction of any plate;

adjusting the coordinates of the machine table according to the machining error;

and processing the single PCS plates in other rows or other columns along the direction of any plate edge.

Optionally, the machining is electric milling.

Optionally, the machining is drilling.

In a second aspect, the invention further provides a PCB, which is manufactured by using the PCB processing method described above.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

according to the PCB processing method and the PCB provided by the embodiment of the invention, the board to be processed can be divided into a plurality of times of processing according to the number of the board edges of a single PCS board. Only one board edge direction is processed at each time, only the error (such as the harmomegathus error) of the board edge direction influences the processing precision, compared with the simultaneous processing of a plurality of board edge directions, the processing precision of the PCB processing method is higher, the yield of the PCB manufactured by the method is higher, the processing efficiency is indirectly improved, and the method has a good application prospect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.

Fig. 1 is a schematic processing diagram of a PCB processing method provided in the prior art;

fig. 2 is a schematic processing diagram of a PCB processing method according to an embodiment of the present invention;

fig. 3 is a flowchart of a PCB processing method according to an embodiment of the present invention.

Illustration of the drawings:

a board to be processed 10, a single PCS board 11.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Please refer to fig. 1.

Fig. 1 is a schematic processing diagram of a PCB processing method provided in the prior art, in which single PCS plates 11 are processed one by one, and during processing of each single PCS plate 11, processing is performed along four plate edge directions (four arrow directions in fig. 1) of the single PCS plate 11. Since the processing method is equivalent to simultaneous processing of four plate edge directions, errors (such as expansion and contraction errors) in the four plate edge directions comprehensively affect the processing precision of the processing method, and the processing precision is not high.

It should be noted that the "machining" proposed in the present embodiment includes, but is not limited to, electric milling, drilling, and other various machining methods.

In order to overcome the defect of low processing precision, the embodiment provides a high-precision PCB processing method, and a processing schematic diagram of the method is shown in fig. 2.

Specifically, referring to fig. 3, the high-precision PCB processing method includes the following steps:

s10, performing whole board processing on the board to be processed 10 (i.e. the whole PNL board) along the four board edges of the single PCS board 11, respectively, where the board to be processed 10 includes a plurality of single PCS boards 11.

The single PCS board 11 includes four board edge directions, which are a first board edge direction, a second board edge direction, a third board edge direction, and a fourth board edge direction, and are specifically illustrated as four arrow directions in fig. 1.

In order to ensure the processing precision, specifically, the whole board processing in the first board edge direction is performed first, that is, the whole board processing in the second board edge direction is performed after the processing in the first board edge direction is completed, then the whole board processing in the third board edge direction is performed after the processing in the second board edge direction is completed, and finally the processing in the fourth board edge direction is performed after the processing in the third board edge direction is completed.

Therefore, the high-precision PCB processing method provided by the embodiment of the invention can divide the board 10 to be processed into four times. Only one board edge direction is processed at each time, only the error (such as the harmomegathus error) of the board edge direction influences the processing precision, compared with the simultaneous processing of four board edge directions, the high-precision PCB processing method is higher in processing precision, the PCB manufactured by the method is higher in yield, the processing efficiency is indirectly improved, and the method has a good application prospect.

To put it to another way, the high-precision PCB processing method provided by the embodiment of the present invention may be applied to a single PCS board 11 having a plurality of board edge directions, for example, a single PCS board having three or more board edge directions, that is, the shape of the single PCS board 11 is not limited to a quadrilateral, and the shape of the single PCS board 11 may also be other polygons. The board 10 to be processed is divided into a plurality of processes according to the number of board edges (number of polygonal edges) of the single PCS board 11. Only one board edge direction is processed each time, and only one board edge direction error (such as a harmomegathus error) affects the processing precision, so that the processing precision of the PCB is improved.

In another embodiment of the present application, the high-precision PCB processing method further includes the steps of:

after the whole board processing in any board edge direction is completed, a processing error of the single PCS board 11 in any board edge direction is obtained, and specifically, the processing error can be obtained by comparing the processed effect with a design value;

adjusting the coordinates of the machine according to the machining errors, namely, adjusting the coordinate values of the machine (namely, the machining platform) to eliminate or reduce the influence of the machining errors on subsequent machining;

and then, the board 10 to be processed is processed in a whole board along the other board edge directions of the single PCS board 11.

In the high-precision PCB processing method provided by this embodiment, a step of adjusting coordinates of the machine is added between processing steps in different board edge directions, so as to further improve the processing precision and reduce the influence of the previous processing error in the board edge direction on the subsequent processing precision in the board edge direction. It should be noted that, by adopting unidirectional processing, the processing precision can be improved more easily by adjusting the coordinates of the machine. The reason is that the machining error in one direction only needs to be considered when the machine coordinates are adjusted, and the machining error can be eliminated or reduced by adjusting the machine coordinates.

When four directions are adopted for simultaneous processing, the coordinate of the machine table needs to be adjusted to take the processing errors of the four directions into consideration. When the machine coordinate is adjusted, the processing errors in four directions can be restricted, so that the purpose of eliminating or reducing the processing errors is not easy to achieve, and the processing precision cannot be effectively improved.

Further, typically a plurality of individual PCS plates 11 are arranged in an array, divided into a plurality of rows and/or columns, on the plate 10 to be processed.

Therefore, the plate finishing process of the plate to be processed 10 along any plate edge direction of the single PCS plate 11 further includes the steps of:

processing the single PCS plate 11 in any row or any column along the direction of any plate edge;

obtaining a processing error of the single PCS plate 11 in any row or any column in any plate edge direction, and obtaining the processing error by comparing a processed effect with a design value;

adjusting the coordinates of the machine according to the machining errors, that is, adjusting the coordinate values of the machine (that is, the machining platform), so as to eliminate or reduce the influence of the machining errors on the machining of the subsequent single PCS plate 11 in a row or a column;

the single PCS plates 11 of other rows or other columns are processed in the direction of either plate edge.

Therefore, the machining precision can be further improved by adding the step of adjusting the coordinates of the machine between the machining steps in different plate edge directions and between the machining steps in different rows or columns, and the influence of the machining error in the previous plate edge direction (or the machining error in the previous row or column) on the machining precision in the subsequent plate edge direction (or the machining error in the subsequent row or column) can be reduced.

It should be noted that the high-precision PCB processing method provided by the above embodiment has a better effect when applied to processing metal edge covering process products. When the metal is used for edge covering, the side surface of the single PCS plate 11 is plated with metal (such as copper, tin, etc.), and the plating metal also causes errors, so that a thickness difference exists between the single PCS plates 11. Due to the thickness difference, if the single PCS plate 11 is processed in four directions simultaneously during the whole plate processing, the processing precision is not high, and the high-precision PCB processing method provided above processes the single PCS plate 11 in one direction and combines with the adjustment of the coordinates of the machine, so that the thickness difference can be effectively eliminated or reduced, and the processing precision can be improved.

In another embodiment of the present application, a PCB is further provided, and the PCB is manufactured by the above-mentioned high-precision PCB processing method, and the manufactured PCB has a higher yield and a good application prospect.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A PCB processing method is characterized by comprising the following steps:

after the whole plate processing in any plate edge direction is finished, carrying out whole plate processing on the plate to be processed along other plate edge directions of the single PCS plate;

2. The PCB processing method of claim 1, wherein the single PCS board comprises four board edge directions;

the PCB processing method comprises the following steps:

3. The PCB processing method according to claim 1, wherein before the board to be processed is subjected to the whole board processing along the other board edge direction of the single PCS board, the method further comprises the following steps:

and adjusting the coordinates of the machine according to the machining error.

4. The PCB processing method of claim 1, wherein the board to be processed comprises a plurality of rows or columns of the single PCS board;

5. The PCB processing method of claim 1, wherein the processing is electric milling.

6. The PCB processing method of claim 1, wherein the processing is drilling.

7. A PCB manufactured using the PCB manufacturing method of any one of claims 1 to 5.