CN111106080A - Heat radiating fin, processing method of heat radiating fin and three-dimensional packaging structure - Google Patents
Heat radiating fin, processing method of heat radiating fin and three-dimensional packaging structure Download PDFInfo
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- CN111106080A CN111106080A CN202010013931.0A CN202010013931A CN111106080A CN 111106080 A CN111106080 A CN 111106080A CN 202010013931 A CN202010013931 A CN 202010013931A CN 111106080 A CN111106080 A CN 111106080A
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- heat
- main board
- heat sink
- planes
- plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
The invention relates to the field of three-dimensional packaging, and discloses a radiating fin, a processing method of the radiating fin and a three-dimensional packaging structure. Through dividing the heat conduction part surface into a plurality of discontinuous planes, and set up the through-hole in the plane, reduced mainboard and resin in the thermal expansion accumulation distance of single side, resin and golden mainboard combination can not take place because the too big circumstances that leads to the adhesion to break away from and combine untight of thermal expansion difference.
Description
Technical Field
The invention relates to the field of three-dimensional packaging, in particular to a radiating fin, a processing method of the radiating fin and a three-dimensional packaging structure.
Background
SIP three-dimensional packaging is an emerging integrated circuit packaging technology in recent years, and breaks through the concept of traditional planar packaging; it is a packaging technique that achieves stacking of multiple chips (packaged chips or dies) within a single package in a three-dimensional space. The SIP three-dimensional packaging chip has the characteristics of high integration level, vibration impact resistance, radiation resistance, low power consumption and the like, and is widely applied to the fields of aviation and aerospace electronics in the future.
At present, the size of an IC device is continuously reduced, the operation speed of a computer is continuously improved, so that heat with large heat productivity and small volume is not easy to dissipate, and the heat is particularly difficult to dissipate in an SIP three-dimensional packaging process for stacking large-scale components. The problem of heat dissipation is solved and just can be with the inseparabler placing of the chip that calorific capacity is big inside the encapsulation can improve the performance of putting the encapsulation and reduce overall design volume. In the prior art, a large number of chips are packaged in a SIP structure with a small volume, and a large amount of resin is used for wrapping the packaged chips in the packaging process. The heat conductivity of the resin is low, the heat of the internally-sealed chip is mainly dissipated by depending on a welding substrate or exposed pins of the chip, the contact area of the heat dissipation point is small, and the effect is poor, so that the heat dissipation requirement of the chip with high heat generation cannot be met. A general metal heat sink cannot be applied to the SIP packaging technology, because the resin cannot be attached to a metal surface with a large area due to a large difference between the thermal expansion and contraction characteristics of the resin and the metal in the current SIP technology, which easily causes a void to be formed between the metal and the resin. Voids formed in SIP packages tend to cause corrosive gases and conductive materials to enter the interior of the package, which is unacceptable for SIP packages.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a radiating fin, a processing method of the radiating fin and a three-dimensional packaging structure.
According to a first aspect of embodiments of the present invention, a heat sink includes a main board, where the main board includes a heat conducting portion and a heat dissipating portion connected to each other, a surface of the heat conducting portion is composed of a plurality of discontinuous planes, and the planes are provided with through holes.
The heat sink according to the first aspect of the embodiments of the present invention has at least the following advantages: the radiating fin of the invention divides the surface of the heat conducting part into a plurality of discontinuous planes, and the through holes are arranged in the planes, thereby reducing the accumulated distance of thermal expansion of the main board and the resin in a single direction, and avoiding the occurrence of separation and untight combination caused by overlarge difference of thermal expansion when the resin is combined with the golden main board.
According to the heat sink in the first aspect of the embodiments of the present invention, the adjacent planes have different heights or the contact portions of the adjacent planes are provided with the grooves.
According to the first aspect of the embodiments of the present invention, the cross section of the through hole is a polygonal shape which gradually decreases from one side of the opening to the other side, and is rounded at the outlet.
According to the heat sink of the first aspect of the embodiments of the present invention, the through holes provided in the planes having different heights have the same shape and opposite directions.
According to the heat sink in the first aspect of the embodiments of the present invention, the heat sink portion is provided with a heat sink strip.
According to the first aspect of the embodiments of the present invention, the heat dissipation strip has a wave shape.
According to the first aspect of the embodiments of the present invention, the main board is a metal plate.
According to the first aspect of the embodiments of the present invention, the main board is a copper board, a tin board, an aluminum board, a titanium board, or a silver board.
According to a second aspect of the embodiments of the invention, a three-dimensional package structure includes at least two chip layers stacked on each other, each chip layer includes at least one chip, and the heat sink is disposed between at least one group of adjacent chip layers.
According to the second aspect of the embodiment of the invention, the three-dimensional packaging structure at least has the following beneficial effects: the three-dimensional packaging structure adopts the radiating fins of the first aspect of the embodiment of the invention, the radiating fins are arranged between the adjacent chips, the heat of the chips is led out through the radiating fins, the radiating performance of the package is greatly improved, the design of the SIP three-dimensional packaging is not limited by the heat productivity of the chips any more, and the design and the production can be more flexibly carried out.
According to the third aspect of the embodiment of the invention, the method for processing the radiating fin comprises the following steps: impressing, forming staggered impressions on the surface of the main board by a rolling machine, and staggering the surface of the main board into a plurality of discontinuous planes from a single surface; drilling, namely drilling on each discontinuous plane of the main board by using a drilling machine to form a staggered net-shaped structure; surface treatment, sand blasting or grinding are used for forming a frosting effect on the main board.
According to the processing method of the heat sink in the third aspect of the embodiment of the invention, at least the following beneficial effects are achieved: through impression, drilling and surface treatment, form the planar mainboard that has a plurality of discontinuities, reduced mainboard and the flexible accumulation distance of resin heat in single side, resin and golden mainboard combination can not lead to adhering to and break away from and combine untight condition to take place because of the flexible difference of heat greatly, and the adhesive force between mainboard and resin can be increased to the dull polish effect, makes its combination inseparabler.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a front side of a heat sink in an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic view of the reverse structure of a heat sink in an embodiment of the present invention;
FIG. 4 is a partial enlarged view of portion B of FIG. 2;
fig. 5 is a schematic structural diagram of a three-dimensional package structure according to an embodiment of the invention;
fig. 6 is a schematic structural view of the three-dimensional encapsulation structure in fig. 5 after encapsulation is completed.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the positional descriptions, such as positive, negative, upper, lower, etc., referred to the positional or positional relationships shown in the drawings are based on the positional or positional relationships shown in the drawings, and are for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
A heat sink of an embodiment of the present invention is described below with reference to fig. 1 to 4.
As shown in fig. 1 to 4, a heat sink includes a main board 1, the main board 1 includes a heat conducting portion 11 and a heat dissipating portion 12 connected to each other, a surface of the heat conducting portion 11 is composed of a plurality of discontinuous planes 111, and through holes 112 are formed on the planes 111. By dividing the surface of the heat conducting part 11 into a plurality of discontinuous planes 111 and arranging the through holes 112 in the planes 111, the accumulated distance of thermal expansion and contraction of the motherboard 1 and the resin in a single direction is reduced, and the resin and the golden motherboard 1 are combined without adhesion and untight combination caused by too large difference of thermal expansion and contraction. The heat conducting portion 11 is a portion in contact with a heat source, the heat source may be a heat generating chip such as a three-dimensional package, the heat radiating portion 12 does not need to be in contact with the chip, and heat is transferred from the heat conducting portion 11 to the heat radiating portion 12 and is radiated through the heat radiating portion 12.
In some embodiments of the present invention, the adjacent planes 111 have different heights or the contact portion of the adjacent planes 111 is provided with a groove 113, and the division is performed by providing the planes 111 with different height differences or providing the groove 113 between the different planes 111.
In some embodiments of the present invention, the cross-section of the through hole 112 is a polygon, such as a hexagon, a pentagon, a quadrangle, etc., which gradually decreases from one side of the opening to the other side, and decreases to a circle at the outlet. The through holes 112 formed in the planes 111 having different heights have the same shape and opposite directions.
Specifically, the front and back surfaces of the heat dissipating portion 12 are divided into a plurality of planes 111, the shapes of the planes 111 may be changed arbitrarily, in this embodiment, each plane 111 is a regular hexagon, each seven planes 111 are a unit, each unit includes six planes 111 enclosing the center of the plane 111 into a regular hexagon and one plane 111 located at the center thereof, the height of the center plane 111 is different from that of the other six planes 111, the other six planes 111 are provided with wedge-shaped grooves 113 on adjacent sides, and the shapes of the grooves 113 are not limited, such as rectangular, circular, and the like. Referring to fig. 2 and 4, six planes 111 are higher than the central plane 111 at the edge of each unit on the front side of the heat-radiating portion 12, and the central plane 111 is higher than the edge planes 111 on the back side. Each discontinuous hexagonal plane 111 is provided with a through hole 112, and the cross section of the through hole 112 is a hexagon gradually reduced from one side of the opening to the other side and is reduced to a circle at the outlet. The through holes 112 formed in the planes 111 having different heights have the same shape and opposite directions. If the through hole 112 on the central plane 111 and the through hole 112 on the edge plane 111 are the same shape in each cell, the directions are opposite.
In some embodiments of the present invention, the heat dissipation portion 12 is provided with a heat dissipation strip 121. One or more heat dissipation strips 121 can be provided, and the heat dissipation performance is improved by increasing the heat dissipation area of the heat dissipation strips 121.
In some embodiments of the present invention, the heat dissipation strip 121 is wavy, so that a larger contact surface can be formed in a smaller space, thereby improving heat dissipation performance.
In some embodiments of the present invention, the main board 1 is a metal plate with good heat dissipation. For example, a copper plate, a tin plate, an aluminum plate, a titanium plate, a silver plate, or the like. The metal plate, especially the copper plate, the tin plate, the aluminum plate, the titanium plate or the silver plate and the like, has good heat dissipation performance, good ductility and convenient processing.
Referring to fig. 5, a three-dimensional package structure includes at least two chip layers 3 stacked on each other, each chip layer 3 includes at least one chip, and the heat sink is disposed between at least one group of adjacent chip layers 3. The three-dimensional packaging structure of the embodiment of the invention adopts the radiating fins of the first aspect of the embodiment of the invention, the radiating fins are arranged between the adjacent chip layers 3, the heat of the chip is led out through the radiating fins, so that the radiating performance of the package is greatly improved, the design of the SIP three-dimensional packaging is not limited by the heat productivity of the chip any more, and the design and the production can be more flexibly carried out. The three-dimensional package structure in this embodiment is subjected to resin potting treatment to form a product as shown in fig. 6, the heat dissipation plate is sealed inside the resin, and the heat of the chip is dissipated sequentially through the heat dissipation plate and the potting resin.
The embodiment of the invention also provides a processing method of the radiating fin, which comprises the following steps: impressing, forming staggered impressions on the surface of the main board 1 by a rolling machine, and staggering the surface of the main board 1 from a single surface into a plurality of discontinuous planes 111; drilling holes, namely drilling holes on each discontinuous plane 111 of the main board 1 by using a drilling machine to form a staggered net-shaped structure; surface treatment, sand blasting or sanding is used to create a frosted effect on the main plate 1. Wherein, the motherboard 1 is made of metal plate with good heat dissipation. For example, a copper plate, a tin plate, an aluminum plate, a titanium plate, a silver plate, or the like. The metal plate, especially the copper plate, the tin plate, the aluminum plate, the titanium plate or the silver plate and the like, has good heat dissipation performance, good ductility and convenient processing, and can also be polished to remove broken burrs in the processing process in rough surface treatment. Through impression, drilling and surface treatment, form mainboard 1 that has a plurality of discrete planes 111, reduced mainboard 1 and the flexible accumulation distance of resin heat on single orientation, resin and golden mainboard 1 combination can not be because of the flexible difference of heat is too big adhere to and cause to break away from and combine untight condition emergence, and the adhesive force between mainboard 1 and the resin can be increased to the dull polish effect, makes its combination inseparabler.
Claims (10)
1. A heat sink, characterized by: the heat-conducting heat dissipation structure comprises a main board (1), wherein the main board (1) comprises a heat-conducting part (11) and a heat-radiating part (12) which are connected with each other, the surface of the heat-conducting part (11) is composed of a plurality of discontinuous planes (111), and through holes (112) are formed in the planes (111).
2. A heat sink as claimed in claim 1, wherein: the adjacent planes (111) have different heights or the contact part of the adjacent planes (111) is provided with a groove (113).
3. A heat sink as claimed in claim 2, wherein: the cross section of the through hole (112) is a polygon gradually reduced from one side of the opening to the other side, and the cross section is reduced to be circular at the outlet.
4. A heat sink as claimed in claim 3, wherein: the through holes (112) arranged on the planes (111) with different heights are the same in shape and opposite in direction.
5. A heat sink as claimed in claim 1, wherein: the heat dissipation part (12) is provided with a heat dissipation strip (121).
6. A heat sink as claimed in claim 5, wherein: the heat dissipation strip (121) is wave-shaped.
7. A heat sink as claimed in claim 1, wherein: the main board (1) is a metal plate.
8. A heat sink as claimed in claim 7, wherein: the main board (1) is a copper plate, a tin plate, an aluminum plate, a titanium plate or a silver plate.
9. A three-dimensional packaging structure is characterized in that: comprising at least two chip layers (3) stacked on top of each other, each chip layer (3) comprising at least one chip, at least one group of adjacent chip layers (3) having a heat sink according to any of claims 1 to 8 arranged therebetween.
10. The processing method of the radiating fin is characterized by comprising the following steps of:
impressing, forming staggered impressions on the surface of the main board (1) by a rolling machine, and staggering the surface of the main board (1) from a single surface into a plurality of discontinuous planes (111);
drilling holes, namely drilling holes on each discontinuous plane (111) of the main board (1) by using a drilling machine to form a staggered net-shaped structure;
surface treatment, sand blasting or grinding are used for forming a frosting effect on the main board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013931.0A CN111106080A (en) | 2020-01-07 | 2020-01-07 | Heat radiating fin, processing method of heat radiating fin and three-dimensional packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010013931.0A CN111106080A (en) | 2020-01-07 | 2020-01-07 | Heat radiating fin, processing method of heat radiating fin and three-dimensional packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111106080A true CN111106080A (en) | 2020-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010013931.0A Pending CN111106080A (en) | 2020-01-07 | 2020-01-07 | Heat radiating fin, processing method of heat radiating fin and three-dimensional packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111106080A (en) |
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2020
- 2020-01-07 CN CN202010013931.0A patent/CN111106080A/en active Pending
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