CN111102230A - Integrated fan controller - Google Patents
Integrated fan controller Download PDFInfo
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- CN111102230A CN111102230A CN201911394020.0A CN201911394020A CN111102230A CN 111102230 A CN111102230 A CN 111102230A CN 201911394020 A CN201911394020 A CN 201911394020A CN 111102230 A CN111102230 A CN 111102230A
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- controller
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- 239000004065 semiconductor Substances 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000007664 blowing Methods 0.000 claims abstract 3
- 238000005057 refrigeration Methods 0.000 claims description 43
- 238000010926 purge Methods 0.000 claims description 26
- 230000007246 mechanism Effects 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 13
- 238000004659 sterilization and disinfection Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 4
- 239000003570 air Substances 0.000 description 89
- 238000009833 condensation Methods 0.000 description 12
- 230000005494 condensation Effects 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- 238000001914 filtration Methods 0.000 description 10
- 241000883990 Flabellum Species 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 241000894006 Bacteria Species 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007791 dehumidification Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Air Conditioning Control Device (AREA)
Abstract
The embodiment of the invention discloses an integrated fan controller, which comprises a control box and a controller main body, wherein the controller main body is arranged in the control box, a buffer box is fixedly arranged at the rear end of the control box, an air inlet valve is arranged at the upper end of the buffer box, an exhaust valve is arranged at the upper end of the control box, a semiconductor refrigerating sheet is arranged on the rear end surface of the control box, the cold end of the semiconductor refrigerating sheet is arranged in the buffer box, the hot end of the semiconductor refrigerating sheet is arranged in the control box, the air inlet of the air inlet valve faces to the cold end of the semiconductor refrigerating sheet, an air pump is arranged in the buffer box, a blowing device, a terminal pipe and a heating box are arranged in the control box, the blowing device is connected with one end of the terminal pipe, the other end of the terminal pipe is connected with the heating box, the, a humidity sensor and a control unit. The steam in the control box can be swept and discharged outwards, and the use stability of the integrated fan controller is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of fan control, in particular to an integrated fan controller.
Background
The fan is a driven fluid machine which increases the pressure of gas and discharges the gas by means of input mechanical energy. The blower is a short form of habit for gas compression and gas delivery machinery in China, and the blower generally comprises a ventilator, a blower, a wind driven generator and the like. Fans are widely used for ventilation, dust exhaust and cooling of factories, mines, tunnels, cooling towers, vehicles, ships and buildings, and for ventilation and draught of boilers and industrial furnaces and kilns; cooling and ventilation in air conditioning equipment and household appliances; drying and selecting grain, wind tunnel wind source and air cushion boat inflating and propelling.
In the prior art, a fan controller is required by a fan to control or monitor fan speed, starting time, stopping time, running stability and the like. The fan controller comprises a transformer, a fan capacitor, a main controller, a contactor, a circuit breaker and other components, and under the ordinary condition, the components are required to be placed in a large box body and connected in series or in parallel through guiding, so that the fan is controlled. Along with the development of science and technology, an integrated fan controller has appeared, so that the installation space can be greatly saved, and the operation intelligence of equipment monitoring is improved.
Because the integrated fan controller needs to be installed together with the fan, if the integrated fan controller is installed in a high-humidity environment, condensation, water drops and the like are easily generated in the control box, the integrated fan controller is difficult to dissipate outwards, long-time accumulation can cause corrosion of the wiring terminals and other positions of the controller, and serious direct damage or even fire of the controller can be caused.
Therefore, how to improve the integrated fan controller in the prior art, so that the integrated fan controller can dehumidify automatically, and reduce the risk of the controller being damaged due to a high humidity environment is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
Therefore, the embodiment of the invention provides an integrated fan controller to solve the related technical problems in the prior art.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
an integrated fan controller comprises a control box and a controller main body, wherein the controller main body is arranged in the control box, the integrated fan controller also comprises a buffer box, an air inlet valve, an exhaust valve, a semiconductor refrigeration piece, an air pump, an air supply pipe, a temperature sensor, a humidity sensor, a control unit, a heating box, a terminal pipe and a purging device, the buffer box is fixedly arranged at the rear end of the control box, the upper end of the buffer box is provided with the air inlet valve, the upper end of the control box is provided with the exhaust valve, the semiconductor refrigeration piece is arranged on the rear end surface of the control box, the cold end of the semiconductor refrigeration piece is arranged in the buffer box, the hot end of the semiconductor refrigeration piece is arranged in the control box, the air inlet of the air inlet valve faces the cold end of the semiconductor refrigeration piece, the air pump is arranged in the buffer box, the purging device, the terminal pipe and the heating box, the heating cabinet is connected to the terminal pipe other end, the heating cabinet is located semiconductor refrigeration piece heat is served, blast pipe one end is connected to the air pump, the blast pipe other end is connected the heating cabinet, be equipped with temperature sensor, humidity transducer and the control unit in the control cabinet, the control unit electricity is connected temperature sensor, humidity transducer, semiconductor refrigeration piece and air pump.
Further, the purging device comprises a purging box, a first opening and a second opening, the first opening and the second opening are multiple in arrangement, the purging box is arranged at the rear end of the controller body, the purging box is right opposite to the first opening arranged on the face of the controller body, and the second opening is arranged on the outer edge of the side wall of the purging box.
Further, still include the carousel device, the carousel device is located in the baffle-box, just the carousel is located the semiconductor refrigeration piece cold junction outside.
Further, the carousel device includes center pin, flabellum and squeegee blade, the flabellum sets up a plurality ofly, and is a plurality of the flabellum evenly sets up around the center pin, the flabellum end is fixed with squeegee blade, squeegee blade with the semiconductor refrigeration piece cold junction rotates the contact.
Further, still include first pressure sensor and second pressure sensor, first pressure sensor locates in the control box, second pressure sensor locates in the baffle-box, first pressure sensor and second pressure sensor all electricity are connected the control unit.
Further, still include ultraviolet disinfection lamp, ultraviolet disinfection lamp locates in the baffle-box, ultraviolet disinfection lamp locates under the admission valve.
Further, still include the desicator, the desicator is located in the baffle-box, just the desicator is located on the blast pipe.
Further, still include filtering mechanism, filtering mechanism locates the admission valve top, filtering mechanism includes barrel, filtering material layer and intermediate layer net piece, the barrel cover is established on the admission valve, the barrel upper end is equipped with the intermediate layer net piece, be equipped with the filtering material layer between the intermediate layer net piece.
Further, still include drainage mechanism, drainage mechanism locates the baffle-box lower extreme.
Further, the intake valve and the exhaust valve are both one-way valves.
The embodiment of the invention has the following advantages:
1. this application is through setting up the baffle-box in the control box rear end, can introduce ambient air in the baffle-box, semiconductor refrigeration piece through between baffle-box and the control box handles the air, semiconductor refrigeration piece cold junction that sets up in the baffle-box is with air cooling in the baffle-box, vapor condensation in the air after the cooling is detained in the baffle-box for the water droplet, thereby the humidity of air in the baffle-box has been reduced, in sending to the heating cabinet through the air-supply pipe, the heating cabinet heats through semiconductor refrigeration piece hot junction, the air after the heating outwards sweeps, can blow off heating such as condensation on controller main part and the control box inner wall, and outwards discharge from discharge valve. Through the process, moisture in the control box is discharged outwards, and the influence of moisture accumulation on power components in the control box is reduced.
2. Meanwhile, the temperature sensor, the humidity sensor, the first pressure sensor and the second pressure sensor are arranged, so that the temperature and humidity conditions in the control box can be monitored in real time, and the control unit can adaptively control the semiconductor refrigeration sheet and the air pump through pressure signals fed back by the first pressure sensor and the second pressure sensor in real time, and the intellectualization of the dehumidification process is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a front view of an integrated blower controller according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an open state of an integrated blower controller according to an embodiment of the present invention;
FIG. 3 is a rear view of an integrated blower controller according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a right-view internal structure of an integrated blower controller according to an embodiment of the present invention;
fig. 5 is a diagram illustrating a positional relationship between a semiconductor cooling plate and a turntable device in an integrated fan controller according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a filter mechanism of an integrated blower controller according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a purging device of an integrated blower controller according to an embodiment of the present invention;
in the figure:
1, a control box; 2 a controller main body; 3, a buffer box; 4 an air inlet valve; 5, exhausting the valve; 6, semiconductor refrigerating sheets; 7 air pump; 8 air supply pipes; 9 a temperature sensor; 10 a humidity sensor; 11 a control unit; 12 heating the box; 13 a terminal tube; 14 a purging device; 141 purging the tank; 142 first openings; 143 second openings; 15 a turntable device; 151 central axis; 152 fan blades; 153 a rubber blade; 16 a first pressure sensor; 17 a second pressure sensor; 18 ultraviolet disinfection lamps; 19 a dryer; 20 a filter mechanism; 201 a cylinder body; 202 a layer of filter material; 203 interlayer mesh sheet; 21 a drainage mechanism.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the related technical problems existing in the prior art, the embodiment of the application provides an integrated fan controller for controlling a fan in a high-humidity environment. As shown in fig. 1, including control box 1 and controller main part 2, controller main part 2 is located in control box 1, controller main part 2 passes through parts fixed mounting such as mounting panel and bolt on control box 1, and control box 1 front end sets up the switch door, sets up the rubber circle on the switch door inner wall, and the switch door is when closing, and the rubber circle can closely cooperate with control box 1 front end edge to after closing the switch door, control box 1 is in relative confined state, reduces that external humid air causes the influence to controller main part 2 in entering into control box 1.
Although the sealing effect is improved by arranging the sealing ring and other structures in the control box 1, damp air enters. In order to exhaust the humid air in the control box 1 and reduce the condensation of the humid air and the influence on the controller main body 2, further, as shown in fig. 2 to 7, a buffer box 3, an air inlet valve 4, an air outlet valve 5, a semiconductor cooling sheet 6, an air pump 7, an air supply pipe 8, a temperature sensor 9, a humidity sensor 10, a control unit 11, a heating box 12, a terminal pipe 13 and a purging device 14 are further provided. Buffer box 3 is a rectangle box, and it is through pasting, modes such as welding realize with being connected of control box 1, and is specific, buffer box 3 is fixed to be located 1 rear end of control box, and 3 rear end faces of buffer box and the 1 rear end face of control box closely laminate to do not produce the space. An air inlet valve 4 is arranged at the upper end of the buffer tank 3 and is used for introducing outside air into the buffer tank 3 and providing purge gas; an exhaust valve 5 is arranged at the upper end of the control box 1 and used for exhausting air in the control box 1 and exhausting damp air outwards. In this embodiment, the intake valve 4 and the exhaust valve 5 are both check valves.
In order to improve the cooling effect of the air entering the buffer box 3, the air inlet of the air inlet valve 4 faces the cold end of the semiconductor refrigeration sheet 6. The air pump 7 is arranged in the buffer box 3, an air inlet of the air pump 7 is communicated with the air environment in the buffer box 3, the air pump 7 is connected with one end of the air supply pipe, the other end of the air supply pipe is connected with the heating box 12, in the embodiment, the air supply pipe penetrates into the control box 1 from the buffer box 3 and is not exposed in the external environment, on one hand, the influence of the environment on the air supply pipe is reduced, and meanwhile, the length of the air supply pipe is reduced. Be equipped with in the control box 1 and sweep device 14, terminal pipe 13 and heating cabinet 12, sweep device 14 and connect 13 one end of terminal pipe, 13 other ends of terminal pipe are connected heating cabinet 12, heating cabinet 12 is located on the semiconductor refrigeration piece 6 hot end. Therefore, when using, the air through handling in the buffer tank 3 enters into heating cabinet 12 through air pump 7 and blast pipe, the temperature promotes after the heating effect through 6 hot junctions of semiconductor refrigeration piece, outwards sweep through first trompil 142 and the second trompil 143 that set up on sweeping box 141, can melt the condensation that becomes vapor on condensation and the control box 1 inner wall on the controller main part 2, outwards discharge through discharge valve 5, and simultaneously, through sweeping the higher and comparatively dry air of the continuous outside exhaust temperature of box 141, also can reduce the possibility of condensation on controller main part 2 and the control box 1 inner wall, the stability of integrated form fan controller use has been improved greatly.
In this embodiment, a temperature sensor 9, a humidity sensor 10 and a control unit 11 are arranged in the control box 1, the temperature sensor 9 is used for monitoring temperature change in the control box 1 and transmitting a temperature signal to the control unit 11, the humidity controller is used for monitoring humidity change in the control box 1 and transmitting a humidity signal to the control unit 11, and the control unit 11 is electrically connected with the temperature sensor 9, the humidity sensor 10, the semiconductor chilling plate 6 and the air pump 7. The control unit 11 makes a judgment according to the received temperature signal and the received humidity signal, and correspondingly controls the semiconductor refrigerating sheet 6 and the air pump 7.
In this embodiment, the purging device 14 includes a purging box 141, a first opening 142 and a second opening 143, the first opening 142 and the second opening 143 are provided in plurality, the purging box 141 is provided at the rear end of the controller main body 2, the first opening 142 is provided on a face of the purging box 141 facing the controller main body 2, the second opening 143 is provided on an outer edge of a side wall of the purging box 141, and the first opening 142 and the second opening 143 are uniformly arranged.
In order to better realize leading the air that enters into baffle-box 3 through admission valve 4, improve the heat transfer effect between air and the 6 cold junctions of semiconductor refrigeration piece. Further, still include carousel device 15, carousel device 15 locates in buffer tank 3, just the carousel is located the semiconductor refrigeration piece 6 cold junction outside. Specifically, the turntable device 15 includes a central shaft 151, fan blades 152 and rubber blades 153, the fan blades 152 are provided in plurality, the fan blades 152 are uniformly arranged around the central shaft 151, the rubber blades 153 are fixed at the tail ends of the fan blades 152, and the rubber blades 153 are in rotational contact with the cold end of the semiconductor chilling plate 6. Flabellum 152 can cushion the air that enters into, makes the air even and the contact of 6 cold junctions of semiconductor refrigeration piece, and the rubber scraper 153 that sets up simultaneously can clear up the condensation on 6 cold junctions of semiconductor refrigeration piece to can guarantee the stability of the result of use of semiconductor refrigeration piece 6.
In order to guarantee to be in the malleation state in the control box 1, prevent that the outside air from directly entering into in the control box 1, specifically, still include first pressure sensor 16 and second pressure sensor 17, first pressure sensor 16 locates in the control box 1, second pressure sensor 17 locates in the baffle-box 3, first pressure sensor 16 and the equal electricity of second pressure sensor 17 are connected the control unit 11. The first pressure sensor 16 monitors the air pressure in the control box 1, the second pressure sensor 17 monitors the air pressure in the buffer box 3, and it is required to ensure that the monitoring value of the first pressure sensor is greater than that of the second pressure sensor, so that the control box 1 is ensured to be in a positive pressure state. When the monitored value of the first pressure sensor 16 is smaller than the monitored value of the second pressure sensor 17, the control unit 11 needs to control the air pump 7 to increase the delivery amount.
In order to reduce the influence caused by the growth of bacteria in the buffer tank 3 caused by the bacteria and the like in the humid air entering the buffer tank 3. Further, still include ultraviolet disinfection lamp 18, ultraviolet disinfection lamp 18 locates in buffer box 3, ultraviolet disinfection lamp 18 locates under admission valve 4. Still include filtering mechanism 20, filtering mechanism 20 locates admission valve 4 top, filtering mechanism 20 includes barrel 201, filtering material layer 202 and intermediate layer net piece 203, barrel 201 cover is established on admission valve 4, barrel 201 upper end is equipped with intermediate layer net piece 203, be equipped with filtering material layer 202 between the intermediate layer net piece 203.
In the case of using the semiconductor cooling fins 6, the water content in the air is further reduced. A dryer 19 may be further provided, wherein the dryer 19 is provided in the buffer tank 3, and the dryer 19 is provided on the air supply pipe 8. The dryer 19 may be filled with a drying material.
Further, the buffer box further comprises a drainage mechanism 21, and the drainage mechanism 21 is arranged at the lower end of the buffer box 3. In this embodiment, the drain mechanism 21 may be a drain valve that is opened when drainage is required and closed when drainage is not required.
The application process of the embodiment of the invention is as follows:
the humidity in the control box 1 is monitored in real time through the humidity sensor 10, a humidity signal is transmitted to the control unit 11, and when the humidity exceeds a preset value, the control unit 11 controls the semiconductor refrigerating sheet 6 and the air pump 7 to be started. Outside air is under the attraction of air pump 7, form relative negative pressure in the baffle-box 3, outside air enters into the baffle-box 3 through admission valve 4, the air that gets into blows on carousel device 15, flabellum 152 cushions the air, make the air evenly blow at the 6 cold junctions of semiconductor refrigeration piece, the air carries out heat exchange with semiconductor refrigeration piece 6, vapor condenses into the water droplet after the air cooling, the air moisture content reduces, simultaneously at flabellum 152 rotation in-process, rubber scraper 153 scrapes the water droplet of condensing on with semiconductor refrigeration piece 6, the 6 cold junctions of semiconductor refrigeration piece after the clearance can realize good refrigeration effect. Air after the refrigeration drying enters the air pump 7, further enters the heating box 12 through the air feed pipe 8, after the air in the heating box 12 is heated through the hot end of the semiconductor refrigerating sheet 6, the air is fed into the purging box 141 through the terminal pipe 13, the purging box 141 purges hot air outwards through the first opening 142 and the second opening 143, condensation on the inner wall of the control box 1 and the controller main body 2 can be purged and evaporated, the condensation of water vapor can be prevented, and the purged wet air is discharged outwards through the exhaust valve 5.
1. This application is through setting up baffle-box 3 in 1 rear end of control box, can introduce ambient air in baffle-box 3, semiconductor refrigeration piece 6 through between baffle-box 3 and the control box 1 handles the air, 6 cold junctions of semiconductor refrigeration piece that set up in baffle-box 3 cool down the air in the baffle-box 3, vapor in the air after the cooling condenses to be detained in baffle-box 3 for the water droplet, thereby the humidity of air in baffle-box 3 has been reduced, send to in heating cabinet 12 through blast pipe 8, heating cabinet 12 heats through 6 hot junctions of semiconductor refrigeration piece, the air after the heating outwards sweeps, can blow away condensation heating such as on controller main part 2 and the 1 inner wall of control box, and outwards discharge from discharge valve 5. Through the process, the moisture in the control box 1 is discharged outwards, and the influence of moisture accumulation on electric power components in the control box 1 is reduced.
2. Meanwhile, the temperature sensor 9, the humidity sensor 10, the first pressure sensor 16 and the second pressure sensor 17 are arranged, so that the temperature and humidity conditions in the control box 1 can be monitored in real time, and the control unit 11 can perform adaptive control on the semiconductor refrigerating sheet 6 and the air pump 7 through pressure signals fed back by the first pressure sensor 16 and the second pressure sensor 17 in real time, so that the intellectualization of the dehumidification process is improved.
Simultaneously, this application still can carry out the partial improvement to integrated form fan controller's inner structure, specifically as follows:
1. by directly adopting the magnetic latching relay to replace any peripheral elements such as an alternating current contactor, KB0 and the like, the fan can be directly connected to operate, and the wiring is simple.
2. The single chip microcomputer is arranged in a circuit board inside the controller main body, the three-phase voltage and current real-time display is realized through the single chip microcomputer, the operation data is clear at a glance, the alarm output can be realized when overvoltage, undervoltage, open phase, overload and the like exist, the alarm lamp can be directly tripped if needed, and the alarm lamp is arranged in the controller main body.
3. The lower end of the controller main body is provided with a 485 communication interface, and the controller main body has a 485 communication function, and can be networked to realize remote platform control of the Internet of things.
4. The lower end of the product is provided with a fan fault input interface, when the fan has a fault, the product stops running, the alarm display is carried out, the buzzer is arranged in the product to send out alarm sound, the yellow fault indicator lamp is used for displaying, and the indicator lamp is arranged on the controller main body.
5. The lower end of the product is provided with a wind valve fault input interface, when the external temperature reaches 280 ℃, the wind valve can input signals into the interface, and alarm display and yellow indicator light display are carried out.
6. The lower end of the product is provided with a fire-fighting cut-through interface, and the cut-through interface means that when a fire-fighting 24V signal is input, the singlechip detects the 24V signal input, so that the cut-through function is realized.
7. The product lower extreme has the fire control to open the interface by force, opens the interface by force and means when fire control 24V signal input, and the singlechip detects 24V signal input, realizes opening the function by force.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. An integrated fan controller comprises a control box and a controller main body, wherein the controller main body is arranged in the control box, and the integrated fan controller is characterized by further comprising a buffer box, an air inlet valve, an exhaust valve, a semiconductor refrigeration piece, an air pump, an air supply pipe, a temperature sensor, a humidity sensor, a control unit, a heating box, a terminal pipe and a purging device, wherein the buffer box is fixedly arranged at the rear end of the control box, the air inlet valve is arranged at the upper end of the buffer box, the exhaust valve is arranged at the upper end of the control box, the semiconductor refrigeration piece is arranged on the rear end surface of the control box, the cold end of the semiconductor refrigeration piece is arranged in the buffer box, the hot end of the semiconductor refrigeration piece is arranged in the control box, the air inlet of the air inlet valve faces towards the cold end of the semiconductor refrigeration piece, the air pump is arranged in the buffer box, the blowing device is connected with one end of the terminal pipe, the other end of the terminal pipe is connected with the heating box, the heating box is arranged on the hot end of the semiconductor refrigeration piece, one end of the air pump is connected with the air supply pipe, the other end of the air supply pipe is connected with the heating box, a temperature sensor, a humidity sensor and a control unit are arranged in the control box, and the control unit is electrically connected with the temperature sensor, the humidity sensor, the semiconductor refrigeration piece and the air pump.
2. The integrated fan controller according to claim 1, wherein the purging device comprises a plurality of purging boxes, a first opening and a second opening, the purging boxes are disposed at the rear end of the controller body, the first opening is disposed on a surface of the purging boxes facing the controller body, and the second opening is disposed on an outer edge of a side wall of the purging boxes.
3. The integrated fan controller of claim 2 further comprising a turntable device disposed within the buffer bin, the turntable being disposed outside the cold end of the semiconductor chilling plate.
4. The integrated fan controller of claim 3 wherein the turntable device comprises a central shaft, a plurality of fan blades and a plurality of rubber wiper blades, the plurality of fan blades are uniformly arranged around the central shaft, the rubber wiper blades are fixed at the ends of the fan blades, and the rubber wiper blades are in rotational contact with the cold ends of the semiconductor chilling plates.
5. The integrated fan controller of claim 4 further comprising a first pressure sensor and a second pressure sensor, the first pressure sensor disposed within the control box, the second pressure sensor disposed within the surge tank, the first pressure sensor and the second pressure sensor both electrically connected to the control unit.
6. The integrated fan controller of claim 5, further comprising an ultraviolet disinfection lamp disposed within the surge tank, the ultraviolet disinfection lamp disposed directly below the inlet valve.
7. The integrated fan controller of claim 6 further comprising a dryer disposed within the surge tank and on the air feed pipe.
8. The integrated fan controller according to claim 7, further comprising a filter mechanism disposed above the air inlet valve, wherein the filter mechanism comprises a cylinder, a filter material layer, and an interlayer mesh, the cylinder is sleeved on the air inlet valve, the interlayer mesh is disposed at an upper end of the cylinder, and the filter material layer is disposed between the interlayer meshes.
9. The integrated fan controller of claim 8 further comprising a drain mechanism disposed at a lower end of the surge tank.
10. The integrated fan controller of claim 9 wherein the inlet and exhaust valves are one-way valves.
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CN201911394020.0A CN111102230A (en) | 2019-12-30 | 2019-12-30 | Integrated fan controller |
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CN201911394020.0A CN111102230A (en) | 2019-12-30 | 2019-12-30 | Integrated fan controller |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113606158A (en) * | 2021-09-01 | 2021-11-05 | 镇江市丹徒区粮机厂有限公司 | Combined axial flow fan for large warehouse |
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