CN111101179B - Electrodeposition treatment method of copper foil and composite copper foil material - Google Patents
Electrodeposition treatment method of copper foil and composite copper foil material Download PDFInfo
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- CN111101179B CN111101179B CN201911389892.8A CN201911389892A CN111101179B CN 111101179 B CN111101179 B CN 111101179B CN 201911389892 A CN201911389892 A CN 201911389892A CN 111101179 B CN111101179 B CN 111101179B
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Abstract
The invention discloses an electrodeposition treatment method of a copper foil and a composite copper foil material. The electrodeposition processing method includes: at least enabling a copper foil as a cathode, an anode and an electrolyte to jointly construct an electrochemical reaction system, wherein the electrolyte comprises a mixed solution of cerium nitrate, saturated fatty acid and gluconic acid, and the saturated fatty acid comprises myristic acid; electrifying the electrochemical reaction system to perform an electrodeposition reaction, thereby forming Ce (CH) on the surface of the copper foil3(CH2)12COO)4A film layer; the electrolyte comprises a mixed solution of cerium nitrate, myristic acid and gluconic acid. Ce (CH) prepared by the invention3(CH2)12COO)4The film layer has the characteristics of large specific surface area and good surface corrosion and oxidation resistance effects, and meanwhile, the film layer formed on the surface of the copper foil is more uniform due to the added gluconic acid in the preparation process; compared with the traditional chemical method, the process does not contain toxic hexavalent chromium, has the advantages of quick reaction, uniform deposition effect, simple process and the like, and is a better copper foil surface treatment process.
Description
Technical Field
The invention belongs to the technical field of copper foil surface treatment, and particularly relates to an electrodeposition treatment method of a copper foil and a composite copper foil material.
Background
The fresh surface of the copper foil produced by electrolysis is easy to oxidize in the air under the condition of no surface protection. The copper foil surface treatment process can effectively improve the oxidation resistance of the copper foil, improve the storage time of the copper foil, reduce the requirement of the copper foil on a storage place, and ensure that the quality of the copper foil can meet the standard when in use.
The existing copper foil anticorrosion and oxidation resistant surface treatment process can be divided into two types from raw material sources, namely a chromium passivation process and a chromium-free passivation process. The chromium passivation process has the advantages that the oxidation resistance effect is good, the application is the most extensive, the defects are obvious, the raw materials used for chromium passivation are mostly dichromate, a chromium oxide layer is generated on the surface of the copper foil by adopting a chemical or electrochemical method, the chromium oxide has good corrosion resistance and high temperature resistance, and the good corrosion resistance and oxidation resistance effects can be achieved, but hexavalent chromium ions in the dichromate have toxicity and carcinogenicity, and can cause negative effects on a human body and the surrounding environment in the operation and discharge processes. In order to avoid the damage of hexavalent chromium to the environment and human bodies and reduce the environmental protection pressure of enterprises, many enterprises begin to research the passivation process of chromium-free copper foil, such as the passivation process mainly comprising tin, phytic acid or chitosan, and the like, which have more or less defects in some aspects, or cannot achieve the same level of anticorrosion and antioxidation effects as the chromium-containing passivation, or the formula composition is too complex, the components of the copper foil are difficult to stably control in the actual production, or the reaction speed is too slow, so that the requirement of performing rapid passivation treatment on the surface in the actual production of the copper foil is difficult to meet.
Disclosure of Invention
The invention mainly aims to provide an electrodeposition treatment method of a copper foil and a composite copper foil material, so as to overcome the defects of the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention comprises the following steps:
the embodiment of the invention provides an electrodeposition treatment method of a copper foil, which comprises the following steps:
at least enabling a copper foil as a cathode, an anode and an electrolyte to jointly construct an electrochemical reaction system, wherein the electrolyte comprises a mixed solution of cerium nitrate, saturated fatty acid and gluconic acid, and the saturated fatty acid comprises myristic acid;
electrifying the electrochemical reaction system to perform an electrodeposition reaction, thereby forming Ce (CH) on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
The embodiment of the invention also provides a composite copper foil material obtained by the method, and the composite copper foil material comprises a copper foil and Ce (CH) formed on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
The electrodeposition treatment method provided by the invention has the advantages that: adopting a water and ethanol mixed system; and (3) adding gluconic acid.
Firstly, a mixed reaction system of water and ethanol is adopted; this is because cerium nitrate is poorly soluble in ethanol, myristic acid is poorly soluble in water, and if prepared as a simple aqueous or ethanolic solution, it is highly likely to cause adverse results: in an ethanol system, the content of cerium nitrate is extremely low, which is not beneficial to the preparation of products; in an aqueous system, myristic acid forms flocculent insoluble matters, and the insoluble matters are not easy to participate in the reaction and are adsorbed on the surface of copper foil, so that the product quality is influenced. The invention adopts a mixing system of water and ethanol, which can solve the problem of the insolubility of cerium nitrate in ethanol and the insolubility of myristic acid in water; it should be noted that when ethanol and water are mutually soluble, ethanol molecules tend to be more combined with water molecules, so that myristic acid originally combined with the ethanol molecules is discarded by the ethanol molecules, and if the proportion of ethanol is not proper or the concentration of myristic acid in ethanol is too high, myristic acid insoluble substances can also appear in an electrolytic system, so that the control of the concentration of myristic acid and the proportion of ethanol and water is a very important link, and the problem of solubility of myristic acid and myristic acid in the electrolytic system can be better solved only if the proportion of ethanol and water is proper, so that a better guarantee is provided for the product quality.
Secondly, adding gluconic acid into an electrolytic system; under the action of an electric field, gluconic acid is a substance which is very easy to be uniformly distributed, and in the electrolytic process, Ce is3+By oxidation to Ce near the anode4+，Ce4+Can be combined with gluconic acid, and Ce is reacted under the action of the gluconic acid4+The Ce is distributed more uniformly on the surface of the cathode under the condition that4+The reaction with myristic acid can generate uniform Ce (CH) on the surface of the copper foil substrate3(CH2)12COO)4And (5) film layer.
Compared with the prior art, the invention has the beneficial effects that: the method adopts cerous nitrate and myristic acid as raw materials, and carries out electrodeposition in the presence of gluconic acid, thereby generating uniform Ce (CH) on the surface of the copper foil3(CH2)12COO)4A film layer; the invention is in the preparation of Ce (CH)3(CH2)12COO)4In the process of the film layer, the added gluconic acid enables the film layer formed on the surface of the copper foil to be more uniform, and the film layer can obviously improve the corrosion resistance and oxidation resistance of the surface of the copper foil; compared with the traditional chemical method, the process does not contain toxic hexavalent chromium, has the characteristics of quick reaction, uniform deposition effect, large specific surface area of the product, good surface corrosion and oxidation resistance effects, simple electrolyte composition and easy preparation, and is a better copper foil surface corrosion and oxidation resistance treatment process.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is an SEM photograph of the surface of a copper foil obtained after electrodeposition treatment in example 1 of the present invention;
FIG. 2 is an SEM photograph of the surface of a copper foil obtained after electrodeposition treatment in example 1 of the present invention;
FIG. 3 is an EDS chart of the surface of a copper foil obtained after electrodeposition treatment of example 1 of the present invention.
Detailed Description
In view of the defects of the prior art, the inventors of the present invention have made extensive studies and extensive practices to provide a solution of the present invention, which employs cerium nitrate and myristic acid as raw materials and performs electrodeposition in the presence of gluconic acid, thereby generating uniform Ce (CH) on the surface of a copper foil3(CH2)12COO)4The process is a better anticorrosion and antioxidation treatment process for the surface of the copper foil.
The technical solutions of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One aspect of the embodiments of the present invention provides a method for electrodeposition treatment of a copper foil, which includes:
at least a copper foil as a cathode, an anode and an electrolyte are used together to construct an electrochemical reaction system, wherein the electrolyte comprises a mixed solution of cerium nitrate, saturated fatty acid and gluconic acid, and the saturated fatty acid comprises myristic acid, but is not limited thereto;
electrifying the electrochemical reaction system to perform an electrodeposition reaction, thereby forming Ce (CH) on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
In the invention, the electrochemical treatment process of the copper foil can realize continuous production through the transmission device.
In some more specific embodiments, the electrodeposition treatment method includes: and mixing cerium nitrate, gluconic acid and water to form a solution, and then adding an ethanol solution of myristic acid into the mixed solution to obtain the electrolyte.
Furthermore, the volume ratio of water to ethanol in the electrolyte is 1:100-50: 100.
Furthermore, the concentration of the cerium nitrate in the electrolyte is 0.001-0.05 mol/L.
Furthermore, the concentration of the myristic acid in the electrolyte is 0.02-1 mol/L.
Furthermore, the concentration of the gluconic acid in the electrolyte is 0.01-0.5 mol/L.
Further, the method comprises: when the electrodeposition reaction is carried out, the current density is 2-50A/m2The temperature of the electrolyte is 5-60 ℃.
Further, the copper foil is formed by electrolysis.
Further, the anode includes a titanium plate, and is not limited thereto.
Further, the surface of the titanium plate is coated with a protective coating.
In some more specific embodiments, the electrodeposition treatment method further comprises: after the electrodeposition reaction is completed, the obtained post-treated copper foil is subjected to washing, drying and foil winding treatment.
Further, the temperature of the drying treatment is 40-120 ℃.
In some more specific embodiments, the electrodeposition treatment method includes:
(1) dissolving cerium nitrate in water, then adding gluconic acid to form a solution, simultaneously dissolving myristic acid in ethanol to form a solution, and then mixing an aqueous solution of the cerium nitrate and the gluconic acid with an ethanol solution of the myristic acid to form an electrolyte, wherein the concentration of the cerium nitrate in the electrolyte is 0.001-0.05mol/L, the concentration of the myristic acid is 0.02-1mol/L, and the concentration of the gluconic acid is 0.01-0.5 mol/L;
(2) using the electrolyte obtained in the step (1), taking the copper foil obtained by electrolysis as a cathode, taking a metal titanium plate covered with a protective coating on the surface as an anode, and carrying out electrochemical deposition, wherein the current density is 2-50A/m2The temperature of the electrolyte is 5-60 ℃, and the copper foil cathode reacts as follows in the electrochemical deposition process.
First, trivalent cerium ions near the anode are oxidized to produce tetravalent cerium ions, i.e.:
Ce3+-e→Ce4+
because gluconic acid exists in an electrolytic system, the gluconic acid is a substance which is very easy to be uniformly distributed under the action of an electric field, and Ce is easy to be distributed in the electrolytic process3+By oxidation to Ce near the anode4+，Ce4+Can be combined with gluconic acid, and Ce is reacted under the action of the gluconic acid4+The distribution on the cathode surface is more uniform, so that the gluconic acid is adopted instead of the glucose, and the following two reasons are mainly considered: firstly, if glucose is added, the glucose is oxidized at the anode to generate gluconic acid, and the step can be omitted by directly adding the gluconic acid, so that the side reaction on the surface of the electrode is reduced, the current efficiency is improved, and the energy consumption is reduced; secondly, according to our experimental study, gluconic acid is more beneficial to improve Ce than glucose4+The dispersibility on the surface of the electrode, if glucose is added, the reaction is needed to generate gluconic acid, but the gluconic acid is directly added, so that the process is accelerated, and the quality of the product is favorably improved.
Ce4+A series of reactions take place on the surface of the cathode copper foil as follows:
myristic acid ionizes after dissolving in ethanol to produce hydrogen ions:
CH3(CH2)12COOH→CH3(CH2)12COO-+H+
the hydrogen ions generated by ionization are subjected to reduction reaction on the surface of the cathode copper foil by electrons to generate hydrogen:
2H++2e→H2↑
the hydrogen evolution reaction at the cathode, i.e., the copper foil surface, generates heat, which favors CH3(CH2)12COO-And Ce4+The endothermic reaction between the two generates the precipitate:
Ce4++4CH3(CH2)12COO-→Ce(CH3(CH2)12COO)4↓
in the reaction process, the gluconic acid in the electrolyte is beneficial to Ce4+Uniform distribution on the cathode surface, and finally the generated Ce (CH)3(CH2)12COO)4The film layer can be more uniformly covered on the surface of the copper foil, so that the corrosion resistance and the oxidation resistance of the copper foil are enhanced. The addition of the gluconic acid improves the uniformity of the deposited layer on the surface of the copper foil, so that the process has the possibility of being implemented in industrial production.
The invention also provides a composite copper foil material obtained by the method, and the composite copper foil material comprises a copper foil and Ce (CH) formed on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
The technical solutions of the present invention are further described in detail below with reference to several preferred embodiments and the accompanying drawings, which are implemented on the premise of the technical solutions of the present invention, and a detailed implementation manner and a specific operation process are provided, but the scope of the present invention is not limited to the following embodiments.
The experimental materials used in the examples used below were all available from conventional biochemical reagents companies, unless otherwise specified.
Example 1
Uniformly mixing an aqueous solution of cerium nitrate and gluconic acid with an ethanol solution of myristic acid to form an electrolyte, wherein the concentration of the cerium nitrate in the electrolyte is 0.001mol/L, the concentration of the myristic acid is 0.02mol/L, and the myristic acid isThe gluconic acid concentration is 0.5mol/L, and the volume ratio of the ethanol to the water is 1: 100; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 2A/m2The bath solution temperature is 60 ℃, the copper foil formed by electrolysis enters the passivation bath through a transmission device to be used as a cathode of the electrochemical reaction, and after the copper foil subjected to electrodeposition treatment leaves the passivation bath through the transmission device, a layer of Ce (CH) is formed on the surface of the copper foil3(CH2)12COO)4And (3) washing, drying and foil rolling the film layer to obtain a finished product, wherein the surface appearance of the finished product is good through detection, the deposited layer is uniformly distributed, and the product has good corrosion resistance and oxidation resistance. FIGS. 1 and 2 are SEM images of the surface of the copper foil after electrodeposition treatment in the present example; FIG. 3 is an EDS chart of the surface of the copper foil after electrodeposition treatment in this example, which can be derived from FIG. 3: the surface of the copper foil is formed by Ce (CH)3(CH2)12COO)4The distribution of the relief structure generated by deposition is uniform, and the specific surface area of the surface of the copper foil is obviously increased.
Example 2
Uniformly mixing an aqueous solution of cerium nitrate and gluconic acid with an ethanol solution of myristic acid to form an electrolyte, wherein the concentration of the cerium nitrate in the electrolyte is 0.05mol/L, the concentration of the myristic acid is 1mol/L, the concentration of the gluconic acid is 0.01mol/L, and the volume ratio of the ethanol to the water is 50: 100; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 50A/m2The bath solution temperature is 25 ℃, the copper foil formed by electrolysis enters the passivation bath through a transmission device to be used as a cathode of the electrochemical reaction, and after the copper foil subjected to electrodeposition treatment leaves the passivation bath through the transmission device, a layer of Ce (CH) is formed on the surface of the copper foil3(CH2)12COO)4And the film layer is washed, dried and rolled to form a finished product, and the finished product has good surface appearance, uniform distribution of a deposition layer, large specific surface area and good corrosion resistance and oxidation resistance after detection.
Example 3
Dissolving cerous nitrate, gluconic acid water solution and myristic acid ethanolUniformly mixing the solution to form electrolyte, wherein the concentration of cerium nitrate in the electrolyte is 0.02mol/L, the concentration of myristic acid is 0.6mol/L, the concentration of gluconic acid is 0.1mol/L, and the volume ratio of ethanol to water is 30: 100; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 10A/m2The bath solution temperature is 5 ℃, the copper foil formed by electrolysis enters the passivation bath through a transmission device to be used as a cathode of the electrochemical reaction, and after the copper foil subjected to electrodeposition treatment leaves the passivation bath through the transmission device, a layer of Ce (CH) is formed on the surface of the copper foil3(CH2)12COO)4And the film layer is washed, dried and rolled to form a finished product, and the finished product has good surface appearance, uniform distribution of a deposition layer, large specific surface area and good corrosion resistance and oxidation resistance after detection.
Comparative example 1
Uniformly mixing cerium nitrate, an ethanol solution of gluconic acid and an ethanol solution of myristic acid to form an electrolyte, wherein the concentration of the cerium nitrate in the electrolyte is 0.001mol/L, the concentration of the myristic acid is 0.02mol/L, the concentration of the gluconic acid is 0.002mol/L, and the volume ratio of the ethanol to the water is 1: 100; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 2A/m2The bath solution temperature is 60 ℃, the copper foil generated by electrolysis enters a passivation tank through a transmission device to be used as a cathode of the electrochemical reaction, the copper foil subjected to electrodeposition treatment leaves the passivation tank through the transmission device to obtain the copper foil subjected to electrodeposition treatment, the deposition distribution on the surface of the copper foil is uneven, and the corrosion resistance and the oxidation resistance of the product are lower than those of the copper foil prepared in the embodiment 1.
Comparative example 2
Uniformly mixing an aqueous solution of cerium nitrate and gluconic acid with an aqueous solution of myristic acid to form an electrolyte, wherein the concentration of the cerium nitrate in the electrolyte is 0.001mol/L, the concentration of the myristic acid is 0.02mol/L, and the concentration of the gluconic acid is 1 mol/L; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 2A/m2Temperature of bath solution 60The electrolytic copper foil enters the passivation tank through the transmission device and serves as a cathode of the electrochemical reaction, the copper foil subjected to electrodeposition treatment leaves the passivation tank through the transmission device to obtain the copper foil subjected to electrodeposition treatment, and the fact that the bath solution is easy to rot due to excessively high gluconic acid content is found in the implementation process, so that the control is very difficult, and the obtained copper foil product is unstable and fluctuates obviously.
Comparative example 3
Uniformly mixing a cerium nitrate aqueous solution and an ethanol solution of myristic acid to form an electrolyte, wherein the concentration of cerium nitrate in the electrolyte is 0.001mol/L, and the concentration of myristic acid is 0.02 mol/L; in the passivation tank, the electrolyte is used, a metal titanium plate with a protective coating covered on the surface is used as an anode, and the electrolytic current density is 2A/m2The temperature of the bath solution is 60 ℃, the copper foil generated by electrolysis enters a passivation bath through a transmission device to be used as a cathode of the electrochemical reaction, the copper foil subjected to electrodeposition treatment leaves the passivation bath through the transmission device, and then a finished product is obtained through washing, drying and foil rolling, and the detection shows that the uniformity of a surface deposition layer of the finished product is poor, and the corrosion resistance and the oxidation resistance of the finished product are far lower than those of the copper foil prepared in the embodiment 1, so that the finished product has no industrial feasibility.
In addition, the inventors of the present invention have also made experiments with other materials, process operations, and process conditions described in the present specification with reference to the above examples, and have obtained preferable results.
The aspects, embodiments, features and examples of the present invention should be considered as illustrative in all respects and not intended to be limiting of the invention, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
The use of headings and chapters in this disclosure is not meant to limit the disclosure; each section may apply to any aspect, embodiment, or feature of the disclosure.
Throughout this specification, where a composition is described as having, containing, or comprising specific components or where a process is described as having, containing, or comprising specific process steps, it is contemplated that the composition of the present teachings also consist essentially of, or consist of, the recited components, and the process of the present teachings also consist essentially of, or consist of, the recited process steps.
It should be understood that the order of steps or the order in which particular actions are performed is not critical, so long as the teachings of the invention remain operable. Further, two or more steps or actions may be performed simultaneously.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Claims (6)
1. An electrodeposition processing method of a copper foil, characterized by comprising:
at least enabling a copper foil as a cathode, an anode and an electrolyte to jointly construct an electrochemical reaction system, wherein the electrolyte comprises 0.001-0.05mol/L of cerium nitrate, 0.02-1mol/L of myristic acid and 0.01-0.5mol/L of gluconic acid, water and ethanol, and the volume ratio of the water to the ethanol is 1:100-50: 10;
electrifying the electrochemical reaction system to perform the electrodeposition reaction, wherein the adopted current density is 2-50A/m2The temperature of the electrolyte is 5-60 ℃, so that Ce (CH) is formed on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
2. The electrodeposition processing method according to claim 1, characterized by comprising: and mixing cerium nitrate, gluconic acid and water to form a solution, and then adding an ethanol solution of myristic acid into the mixed solution to obtain the electrolyte.
3. The electrodeposition treatment method according to claim 1, wherein the anode is selected from a titanium plate.
4. The electrodeposition treatment method according to claim 3, wherein the surface of the titanium plate is coated with a protective coating.
5. The electrodeposition treatment method according to claim 1, wherein the copper foil is formed by electrolysis.
6. A composite copper foil material obtained by the method of any one of claims 1 to 5, characterized in that: the composite copper foil material comprises a copper foil and Ce (CH) formed on the surface of the copper foil3(CH2)12COO)4And (5) film layer.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002249723A (en) * | 2001-02-27 | 2002-09-06 | Nippon Paint Co Ltd | Leadless cationic electrodeposition coating composition |
| CN102345148A (en) * | 2011-07-28 | 2012-02-08 | 西北工业大学 | Method for rapidly preparing cathode super-hydrophobic surface coatings containing rare earth elements through electrodeposition |
| CN103643269A (en) * | 2013-11-11 | 2014-03-19 | 江西省首诺铜业有限公司 | Process of ultrasonic wave electroplating of copper foil |
| CN104120466A (en) * | 2014-07-06 | 2014-10-29 | 钢铁研究总院 | Weak acid chloride electroplating solution used for neodymium iron boron electroplating of zinc-iron alloy and preparation method |
| CN104264196A (en) * | 2014-09-30 | 2015-01-07 | 华南理工大学 | Method for preparing super-hydrophobic membrane layer on surface of magnesium alloy through one-step method as well as alloy and application of uper-hydrophobic membrane layer |
| CN106048685A (en) * | 2016-06-30 | 2016-10-26 | 上海电力学院 | Preparation method of super-hydrophobic surface of aluminum alloy |
| CN109234772A (en) * | 2018-09-10 | 2019-01-18 | 南亚电子材料(昆山)有限公司 | A kind of Zn-Cr antioxygen chemical plating solution preparation method and the application on lithium ion battery copper foil |
| CN110029391A (en) * | 2019-03-28 | 2019-07-19 | 中国恩菲工程技术有限公司 | Modified copper foil in surface and preparation method thereof |
-
2019
- 2019-12-30 CN CN201911389892.8A patent/CN111101179B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002249723A (en) * | 2001-02-27 | 2002-09-06 | Nippon Paint Co Ltd | Leadless cationic electrodeposition coating composition |
| CN102345148A (en) * | 2011-07-28 | 2012-02-08 | 西北工业大学 | Method for rapidly preparing cathode super-hydrophobic surface coatings containing rare earth elements through electrodeposition |
| CN103643269A (en) * | 2013-11-11 | 2014-03-19 | 江西省首诺铜业有限公司 | Process of ultrasonic wave electroplating of copper foil |
| CN104120466A (en) * | 2014-07-06 | 2014-10-29 | 钢铁研究总院 | Weak acid chloride electroplating solution used for neodymium iron boron electroplating of zinc-iron alloy and preparation method |
| CN104264196A (en) * | 2014-09-30 | 2015-01-07 | 华南理工大学 | Method for preparing super-hydrophobic membrane layer on surface of magnesium alloy through one-step method as well as alloy and application of uper-hydrophobic membrane layer |
| CN106048685A (en) * | 2016-06-30 | 2016-10-26 | 上海电力学院 | Preparation method of super-hydrophobic surface of aluminum alloy |
| CN109234772A (en) * | 2018-09-10 | 2019-01-18 | 南亚电子材料(昆山)有限公司 | A kind of Zn-Cr antioxygen chemical plating solution preparation method and the application on lithium ion battery copper foil |
| CN110029391A (en) * | 2019-03-28 | 2019-07-19 | 中国恩菲工程技术有限公司 | Modified copper foil in surface and preparation method thereof |
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Effective date of registration: 20230324 Address after: No.18 Xinning Road, Xining, Qinghai 810000 Patentee after: QINGHAI INSTITUTE OF SALT LAKES, CHINESE ACADEMY OF SCIENCES Address before: 313000 Industrial Park, Hong Qiao Town, Changxing County, Huzhou, Zhejiang Patentee before: Yuxiang copper foil (Zhejiang) Co.,Ltd. Patentee before: QINGHAI INSTITUTE OF SALT LAKES, CHINESE ACADEMY OF SCIENCES |