CN111081699A - Intelligent power module and equipment - Google Patents
Intelligent power module and equipment Download PDFInfo
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- CN111081699A CN111081699A CN202010004412.8A CN202010004412A CN111081699A CN 111081699 A CN111081699 A CN 111081699A CN 202010004412 A CN202010004412 A CN 202010004412A CN 111081699 A CN111081699 A CN 111081699A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
Abstract
The invention discloses an intelligent power module and equipment, which comprise a packaging body, an MCU (microprogrammed control unit), a driving module and a switching tube circuit, wherein a weak current input pin and a strong current output pin are led out of the packaging body, the MCU, the driving module and the switching tube circuit are packaged in the packaging body, a signal input pin of the MCU is connected with the weak current input pin, and a signal output pin of the MCU is connected with a signal input end of the driving module; the signal output end of the driving module is connected with the control end of the switching tube circuit, and the output end of the switching tube circuit is connected with the strong current output pin; the invention packages the MCU, the driving module and the switch tube circuit on the same chip, improves the integrated level of the electric control whole and the circuit reliability, reduces the electric control cost and simplifies the complexity of the electric control assembly process.
Description
Technical Field
The present invention relates to a motor control chip, and more particularly, to an intelligent power module and an apparatus.
Background
Adopt inverter motor to realize more complicated function among some domestic appliance at present, for example washing machine, washing machine based on full-automatic inverter motor can realize more laundry and dry clothing mode, and in practical application, full-automatic variable frequency actuating system comprises the module of a plurality of different functions usually, contains main control, drive and IPM etc. usually, independently installs between each module for whole automatically controlled volume is great, and the cost of automatically controlled accessories is higher, is unfavorable for improving the integrated level.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the intelligent power module and the equipment, the MCU, the driving module and the switch tube circuit are packaged on the same chip, the integration level and the reliability of electric control are improved, and the production difficulty and the production cost of the electric control are reduced.
The intelligent power module according to the embodiment of the first aspect of the invention comprises:
the packaging body is externally led out of a weak current input pin and a strong current output pin;
the MCU is packaged in the packaging body, and a signal input pin of the MCU is connected with the weak current input pin;
the driving module is packaged in the packaging body, and a signal output pin of the MCU is connected with a signal input end of the driving module;
the switch tube circuit is packaged in the packaging body, the signal output end of the driving module is connected with the control end of the switch tube circuit, and the output end of the switch tube circuit is connected with the strong current output pin.
The intelligent power module according to the embodiment of the invention at least has the following beneficial effects: the embodiment of the application integrates the MCU, the driving module and the switch tube circuit into the packaging body, and the packaging body is integrally packaged into an independent chip, so that the structural mode that the IPM chip is connected and driven by the external MCU in the traditional electric control is changed, the circuit connection between each independent spare part is omitted, and the electric control assembly can be completed by the weak current input pin and the strong current output pin reserved on the connection packaging body, so that the integrated level and the circuit reliability of the electric control assembly are improved, the electric control cost is reduced, and the complexity of the electric control assembly process is simplified. On the other hand, because MCU follows drive module and switch tube circuit and encapsulates the use together, consequently need not consider external MCU to drive module and switch tube circuit's adaptation debugging, the intelligent power module that encapsulates in this application has predetermined the chip model, and external control circuit adopts simple control instruction through the weak current input pin on the connection encapsulation body, can obtain the voltage output that wants at the strong current output pin.
According to some embodiments of the present invention, the switching tube circuit includes a first power switching tube, a second power switching tube, a third power switching tube, a fourth power switching tube, a fifth power switching tube and a sixth power switching tube, where the first power switching tube, the second power switching tube and the third power switching tube form a three-phase upper bridge arm circuit, and the fourth power switching tube, the fifth power switching tube and the sixth power switching tube form a three-phase lower bridge arm circuit.
According to some embodiments of the present invention, the first power switch tube, the second power switch tube, the third power switch tube, the fourth power switch tube, the fifth power switch tube and the sixth power switch tube are all RC-IGBT chips.
According to some embodiments of the present invention, the first power switch tube, the second power switch tube, the third power switch tube, the fourth power switch tube, the fifth power switch tube and the sixth power switch tube are all switch units formed by inverse parallel connection of a switch type IGBT and an FRD.
According to some embodiments of the invention, the driving module is an HVIC chip.
According to some embodiments of the invention, the number of the driving module and the number of the switching tube circuit are three, and the number of the weak current input pins and the number of the strong current output pins are three.
According to some embodiments of the invention, the package is a rectangular parallelepiped having four side surfaces, three groups of the weak current input pins are distributed on the same side surface of the package, and the other three side surfaces of the package are respectively provided with one group of the strong current output pins.
According to some embodiments of the invention, the weak current input pin comprises three pins distributed in a staggered manner, and the shortest distance between the tail ends of two adjacent pins is greater than the pin creepage distance.
According to some embodiments of the invention, the MCU is packaged close to the weak current input pin and the switching tube circuit is packaged close to the strong current output pin.
An apparatus according to an embodiment of the second aspect of the invention comprises a smart power module as described in any of the above.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic circuit module distribution diagram of an intelligent power module according to an embodiment of the present application;
fig. 2 is a circuit diagram of a three-phase inverter bridge of a switching transistor circuit according to an embodiment of the present application;
fig. 3 is a schematic diagram of a connection manner of an intelligent power module according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a pin on a package according to an embodiment of the present application;
fig. 5 is a schematic diagram of a connection relationship structure of a device according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
At present, many household appliances are all configured with inverter motors, for example, the compressor of a refrigerator, can carry out frequency conversion refrigeration, and like the frequency conversion rotating motor of a washing machine, the speed of a roller can be automatically adjusted, the inverter motors all need an intelligent power module to control the inverter motors, under the traditional electric control structure, the intelligent power module basically comprises a main control chip, a driving chip and an IPM chip, other parts matched with the intelligent power module comprise a filter circuit, a power circuit and the like, therefore, in order to be matched with each part, the electric control volume is usually large, the corresponding electric control cost is also high, in the electric control assembly process, technicians are required to match the motors to select the corresponding IPM chips, meanwhile, control programs corresponding to the IPM chips need to be written in the main control, and finally, the control performance is debugged, so the whole assembly process is.
Based on this, the application provides an intelligent power module and equipment, MCU, drive module and switch tube circuit are integrated in the same chip, and the circuit wiring of the traditional structure is replaced by the circuit form in the packaging body, so that the electric path among all modules is shortened, and the integration level and reliability of the intelligent power module are improved; the MCU is one of the integrated parts, so the model of the MCU can be selected in advance in a targeted manner according to the models of the driving module and the switching tube circuit, and the control program can be programmed in advance before assembly or can be brushed in after the electric control is assembled, thereby simplifying the flow of brushing in the control program after the model selection during the assembly, saving the assembly process of an external MCU and reducing the complexity of the electric control design.
The embodiments of the present application will be further explained with reference to the drawings.
Referring to fig. 1, fig. 1 is a schematic circuit structure diagram of an intelligent power module according to a first aspect of an embodiment of the present application. The intelligent power module of the present application includes:
the package 400, the weak current input pin 410 and the strong current output pin 420 are led out of the package 400;
the MCU100, the MCU100 is encapsulated in the packaging body 400, the signal input pin of the MCU100 is connected with the weak current input pin 410;
the driving module 200, the driving module 200 is packaged in the package 400, and a signal output pin of the MCU100 is connected to a signal input terminal of the driving module 200;
the switch tube circuit 300, the switch tube circuit 300 is packaged in the package 400, the signal output terminal of the driving module 200 is connected to the control terminal of the switch tube circuit 300, and the output terminal of the switch tube circuit 300 is connected to the strong current output pin 420.
In an embodiment of the present application, the package 400 is in the form of a small chip to improve the integration level, the package mode has multiple choices, and the package mode can be selected according to the number of the switching tube circuits 300 carried on the package 400, for example, only two rows of pins under DIP package, in order to ensure the creepage distance between the pins, in this package mode, only one switching tube circuit 300 is generally packaged, at this time, the package 400 correspondingly packages one MCU100 and one driving module 200, and one pin on one side of the package 400 is a weak current input pin 410 and the other pin on the other side is a strong current output pin 420.
Obviously, the weak current input pin 410 and the strong current output pin 420 are lead frames on the package 400, if the package 400 has a built-in circuit connected to the lead frames, the MCU100, the driving module 200, and the switching tube circuit 300 are connected to the circuit in the package 400 by welding, pressing, and the like during the packaging process, and if the package 400 has no built-in circuit, the MCU100, the driving module 200, and the switching tube circuit 300 may connect their contacts to the lead frames by means of jumpers.
It can be understood that, in the present application, the numbers of the MCU100, the driving modules 200, and the switching tube circuits 300 are not limited, and on the premise of the MCU100 being packaged in a built-in manner, the collocation based on the numbers of the three may be applicable to more scenarios, for example, the number of the MCU100 is one, the number of the driving modules 200 is three, and the number of the switching tube circuits 300 is three, so that the intelligent power module of the present application can control three variable frequency motors at most, each driving module 200 controls one switching tube circuit 300 individually, the MCU100 transmits a control instruction to the three driving modules 200 as a total control, and a specific structure of this case will be described below.
Based on the above embodiments, in the present application, the MCU100, the driving module 200, and the switching tube circuit 300 are all integrated into the package 400, and are integrally packaged into an individual chip, thereby changing the structural mode of connecting the external MCU100 to the driver and then connecting the IPM chip in the conventional electronic control, eliminating the circuit connection between the individual components, and completing the electronic control assembly by connecting the weak current input pin 410 and the strong current output pin 420 reserved on the package 400, thereby improving the integration level and the circuit reliability of the electronic control assembly, reducing the electronic control cost, and simplifying the complexity of the electronic control process. On the other hand, since the MCU100 is used together with the driving module 200 and the switching tube circuit 300, it is not necessary to consider the adaptive debugging of the external MCU100 to the driving module 200 and the switching tube circuit 300, the packaged intelligent power module in the present application has a predetermined chip type, and the external control circuit can obtain the desired voltage output at the strong current output pin 420 by connecting the weak current input pin 410 of the package 400 and using a simple control command
In an embodiment, the switching tube circuit 300 includes a first power switching tube 310, a second power switching tube 320, a third power switching tube 330, a fourth power switching tube 340, a fifth power switching tube 350, and a sixth power switching tube 360, where the first power switching tube 310, the second power switching tube 320, and the third power switching tube 330 constitute a three-phase upper bridge arm circuit, and the fourth power switching tube 340, the fifth power switching tube 350, and the sixth power switching tube 360 constitute a three-phase lower bridge arm circuit.
In this embodiment, the switching tube circuit 300 adopts a three-phase inverter bridge circuit structure, wherein three power switching tubes of a three-phase upper bridge arm are respectively connected in series with three power switching tubes of a three-phase lower bridge arm, the output end of the switching tube circuit 300 is led out from three series points, which respectively correspond to U, V and W ends in fig. 2, and can output a strong voltage to the inverter motor, that is, to a strong voltage output pin 420, specifically, a first power switching tube 310 and a fourth power switching tube 340 are connected in series, then a U end is led out, a second power switching tube 320 and a fifth power switching tube 350 are connected in series, then a V end is led out, a third power switching tube 330 and a sixth power switching tube 360 are connected in series, and then a W end is led out, and in this circuit structure, the total input P end of the strong voltage is simultaneously connected with the first power switching tube 310, the second power switching tube 320 and the third power switching tube 330.
The power switch tubes are of various types, and usually adopt an IGBT-based structure, and in one embodiment, the six power switch tubes each include a switching type IGBT and an FRD (fast recovery diode), and the switching type IGBT and the FRD form an inverse parallel structure, which is equivalent to that the FRD provides a follow current channel when the switching type IGBT is in a switching state, thereby improving the reliability of the switching type IGBT during operation. Actually, the switching type IGBT and the FRD are connected in parallel in a reverse direction to form a three-phase inverter bridge circuit, which is suitable for the case of a small working current, that is, the control of a variable frequency motor with a small power, such as a fan, etc., and the general working current is 1 to 3 amperes.
In one embodiment, the six power switch tubes are RC-IGBT chips, namely, the reverse conduction type IGBT, the internal basic structure is that an n-type semiconductor material is embedded in a p region of a collector of the IGBT, so that the function of a reverse diode is added, thereby increasing the overall reverse conductivity, replacing the circuit structure formed by reversely connecting the switch type IGBT and the FRD in parallel, compared with the circuit structure formed by reversely connecting the switch type IGBT and the FRD in parallel, the RC-IGBT chip improves the power per unit area, increases the resistance ratio of the FRD and the IGBT, improves the parallel connection effect, reduces the temperature fluctuation of the chip, and the RC-IGBT chip is internally packaged, so that the reliability of the RC-IGBT chip is higher than that of an externally connected parallel structure, and the RC-IGBT chip can be suitable for a working environment with larger current and corresponds to a variable frequency motor with higher power, such as a compressor and the like.
It can be understood that, since the number of packages of the switching tube circuit 300 is not limited in the present application, the switching tube circuit 300 may be a mixture of multiple modes, for example, the power switching tube in one switching tube circuit 300 is a switching unit formed by anti-parallel connection of a switching type IGBT and an FRD, and the power switching tube in the other switching tube circuit 300 is an RC-IGBT chip, which may be specifically selected according to the performance of the inverter motor.
In an embodiment, the driving module 200 is an HVIC chip, i.e. a high voltage integrated circuit chip, and the HVIC chip is a high integration level chip, which can further reduce the space occupied by the package, improve the integration level of the intelligent power module of the present application, and thus reduce the volume of the electronic control.
In an embodiment, the package 400 is a rectangular parallelepiped having four side surfaces, the number of the driving module 200 and the number of the switching tube circuit 300 are three, the number of the weak current input pins 410 and the number of the strong current output pins 420 are three, the three groups of weak current input pins 410 are distributed on the same side surface of the package 400, and the other three side surfaces of the package 400 are respectively provided with one group of the strong current output pins 420.
In this embodiment, the package 400 is a common rectangular parallelepiped with four side surfaces, the internal package structure is distributed according to a rectangle, for example, three driving modules 200 are installed on the same side, three switching tube circuits 300 are installed on the other side, and then a space is divided to install the MCU100, because there are three switching tube circuits 300, three external inverter motors can be driven, as seen from the pins, three groups of strong current output pins 420 need to be arranged, in order to avoid interference between the strong current output pins 420, the strong current output pins 420 need to be separated, for example, in this embodiment, three groups of strong current output pins 420 are distributed on three different side surfaces of the rectangular package 400, and the remaining side surface of the package 400 is provided with a weak current input pin 410, thereby avoiding electrical interference between the pins. It should be understood that the pin form of the strong current output pin 420 and the weak current input pin 410 of the present application should be changed according to the packaging manner, if the package adopts an in-line pin, the strong current output pin 420 and the weak current input pin 410 may be L-shaped pins, and if the package adopts a J-shaped pin, the strong current output pin 420 and the weak current input pin 410 are arranged in a J-shape, which is not described herein.
In one embodiment, the packaging of the MCU100 is located near the weak current input pin 410 and the packaging of the switching tube circuit 300 is located near the strong current output pin 420. Since the weak current input pin 410 is a transmission pin of a control signal and the MCU100 operates under a low dc voltage, in order to reduce the wiring length of the circuit, the packaging position of the MCU100 is set close to the weak current input pin 410, and the strong current output pin 420 directly controls the inverter motor, which has a higher working voltage, so that the packaging position of the switching tube circuit 300, which can output the working voltage of the inverter motor, should be set close to the strong current output pin 420, thereby reducing the wiring length of the circuit.
In one embodiment, the weak current input pin 410 includes three pins distributed in a staggered manner, and the shortest distance between the ends of two adjacent pins is greater than the pin creepage distance. Because the pins of weak current input pin 410 are arranged side by side on the same side of rectangular package body 400, under the condition of high integration, the distance between adjacent pins needs to be guaranteed to be greater than the creepage distance of the pins, so the tail end of weak current input pin 410 needs to be avoided from being arranged side by side, the staggered arrangement is adopted to increase the distance between adjacent pins under the side by side condition, the staggered arrangement is more, under some conditions, the tail ends of three pins are sequentially far away from package body 400, and the stepped distribution is formed.
Referring to fig. 3 and 4, in one embodiment, the smart power module of the present application is used to drive a compressor, a fan, and a rotating electrical machine, and thus structurally takes the form of:
two switching tube circuits 300, each designated as IPM1 and IPM2, formed by RC-IGBTs; the number of the RC-IGBTs in the IPM1 and the IPM2 is six, and a three-phase inverter bridge circuit structure is formed;
a switching transistor circuit 300, labeled IPM3, formed by a switching IGBT and FRD connected in anti-parallel; the IPM3 is an independent chip and is internally provided with a driving circuit;
two driving modules 200, the type of which is HVIC, marked as HVIC1 and HVIC 2;
an MCU 100;
the package 400 is a rectangular parallelepiped having four sides, three sides of which are provided with outputs corresponding to IPM1, IPM2 and IPM3, i.e., three groups of strong current output pins 420, and the remaining one side is provided with a weak current input pin 410.
The HVIC1, the HVIC2 and the MCU100 are close to one side of the weak current input pin 410, the IPM1, the IMP2 and the IMP3 are close to one side of the strong current output pin 420, the weak current input pin 410 has six groups, each group has three pins, the end of each pin in the group is far away from the package 400 in sequence, each group of the strong current output pin 420 has six pins arranged side by side, and each pin is equal in length. In terms of circuit connection, the signal output terminal of the MCU100 is connected to the HVIC1, the HVIC2 and the IPM3, the HVIC1 is connected to the IPM1, the compressor is connected via the strong electric output pin 420, the HVIC2 is connected to the IPM2, the rotating electrical machine is connected via the strong electric output pin 420, and the IPM3 is connected to the blower via the strong electric output pin 420, in this way, considering that the operating current of the blower is lower than that of both the compressor and the rotating electrical machine, so that an integrated form of IPM chip can be used, and in order to accommodate the operating current of both the compressor and the rotating electrical machine, the IPM1 and the IPM2 are controlled by RC-IGBT, which is suitable for a.
The MCU100, the driving module 200 and the switch tube circuit 300 are integrated into the packaging body 400, and are integrally packaged into an independent chip, the structural mode that the traditional electric control external MCU100 is connected with a driver and then connected with an IPM chip is changed, the circuit connection among independent spare and accessory parts is omitted, the electric control assembly can be completed by connecting the weak current input pin 410 and the strong current output pin 420 reserved on the packaging body 400, so that the integrated level and the circuit reliability of the electric control whole body are improved, the electric control cost is reduced, and the complexity of the electric control process is simplified. On the other hand, since the MCU100 is used together with the driving module 200 and the switching tube circuit 300, it is not necessary to consider the adaptation and debugging of the external MCU100 to the driving module 200 and the switching tube circuit 300, the packaged intelligent power module in the present application determines the chip type in advance, and the external control circuit can obtain the desired voltage output at the strong current output pin 420 by connecting the weak current input pin 410 on the package 400 and using a simple control command.
A second aspect of an embodiment of the present application provides an apparatus, including the smart power module described above. Referring to fig. 5, fig. 5 shows a connection schematic diagram of a device including the above-mentioned intelligent power module, generally speaking, a control program of a main control in an electronic control of the device needs to match a currently used inverter motor, and therefore, in an assembly process of the electronic control, a corresponding algorithm needs to be flushed into the main control, and the main control needs to execute a complex control instruction in an operation process, but with the intelligent power module in the embodiment of the present application, programming complexity and an operation load of the main control can be reduced, specifically, since the MCU100 is integrated with the intelligent power module of the present application, the MCU100 flushes the control program for the driving module 200 and the switching tube circuit 300 in advance internally, and provides a simple control instruction externally, the main control in the electronic control of the device only needs to send a simple control instruction to implement the inverter control, and the main control does not need to bear a large amount of computation and control requirements, and therefore, does not need, in addition, the device adopting the intelligent power module can reduce the self electric control volume, the electric control cost is correspondingly reduced, and the intelligent power module has the advantage of high integration level, so the circuit reliability in the intelligent power module is improved, the main control compiling flow is reduced, and the complexity of the electric control assembling process is simplified.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope of the present invention defined by the claims.
Claims (10)
1. A smart power module, comprising:
the packaging body is externally led out of a weak current input pin and a strong current output pin;
the MCU is packaged in the packaging body, and a signal input pin of the MCU is connected with the weak current input pin;
the driving module is packaged in the packaging body, and a signal output pin of the MCU is connected with a signal input end of the driving module;
the switch tube circuit is packaged in the packaging body, the signal output end of the driving module is connected with the control end of the switch tube circuit, and the output end of the switch tube circuit is connected with the strong current output pin.
2. The intelligent power module according to claim 1, wherein the switching tube circuit comprises a first power switching tube, a second power switching tube, a third power switching tube, a fourth power switching tube, a fifth power switching tube and a sixth power switching tube, the first power switching tube, the second power switching tube and the third power switching tube form a three-phase upper bridge arm circuit, and the fourth power switching tube, the fifth power switching tube and the sixth power switching tube form a three-phase lower bridge arm circuit.
3. The intelligent power module of claim 2, wherein the first power switch tube, the second power switch tube, the third power switch tube, the fourth power switch tube, the fifth power switch tube and the sixth power switch tube are all RC-IGBT chips.
4. The intelligent power module of claim 2, wherein the first power switch tube, the second power switch tube, the third power switch tube, the fourth power switch tube, the fifth power switch tube and the sixth power switch tube are all switch units formed by inverse parallel connection of a switch type IGBT and an FRD.
5. The intelligent power module as claimed in claim 1, wherein the driving module is an HVIC chip.
6. The intelligent power module as claimed in claim 1, wherein the number of the driving module and the number of the switching tube circuits are three, and the number of the weak current input pins and the strong current output pins are three.
7. The smart power module as claimed in claim 6, wherein the package is a rectangular parallelepiped having four sides, three sets of the weak current input pins are distributed on the same side of the package, and the other three sides of the package are respectively provided with one set of the strong current output pins.
8. The intelligent power module as claimed in claim 6, wherein the weak current input pins comprise three pins distributed in a staggered manner, and the shortest distance between the ends of two adjacent pins is greater than the pin creepage distance.
9. The intelligent power module as recited in claim 1, wherein the MCU is packaged in a position close to the weak current input pin and the switching tube circuit is packaged in a position close to the strong current output pin.
10. An apparatus comprising the smart power module of any one of claims 1 to 9.
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| CN202010004412.8A CN111081699A (en) | 2020-01-03 | 2020-01-03 | Intelligent power module and equipment |
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| CN202010004412.8A CN111081699A (en) | 2020-01-03 | 2020-01-03 | Intelligent power module and equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112046416A (en) * | 2020-09-02 | 2020-12-08 | 奇瑞商用车（安徽）有限公司 | Electric drive system for electric automobile and control method thereof |
| CN115939119A (en) * | 2022-11-17 | 2023-04-07 | 海信家电集团股份有限公司 | Power module and electronic device |
-
2020
- 2020-01-03 CN CN202010004412.8A patent/CN111081699A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112046416A (en) * | 2020-09-02 | 2020-12-08 | 奇瑞商用车（安徽）有限公司 | Electric drive system for electric automobile and control method thereof |
| CN115939119A (en) * | 2022-11-17 | 2023-04-07 | 海信家电集团股份有限公司 | Power module and electronic device |
| CN115939119B (en) * | 2022-11-17 | 2023-11-03 | 海信家电集团股份有限公司 | Power module and electronic equipment |
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