CN111081617B - Device for high-speed transmission and automatic offset reset of chip product lifting basket - Google Patents
Device for high-speed transmission and automatic offset reset of chip product lifting basket Download PDFInfo
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- CN111081617B CN111081617B CN201911101625.6A CN201911101625A CN111081617B CN 111081617 B CN111081617 B CN 111081617B CN 201911101625 A CN201911101625 A CN 201911101625A CN 111081617 B CN111081617 B CN 111081617B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a device for high-speed transmission and automatic offset reset of a chip product lifting basket in the subsequent process, which comprises: the rack-type electric bicycle comprises a frame, wherein a first sliding rail and a rack which are parallel to each other are arranged on the frame; the horizontal moving module assembly comprises a mounting seat which is arranged on the first sliding rail in a sliding mode, a variable speed motor module is arranged on the mounting seat, a gear of the variable speed motor module can be matched with the rack, and a vertical lifting module is arranged on the mounting seat; and a horizontal split clasping module component. The invention improves the stability of the high-speed transmission wafer lifting basket.
Description
Technical Field
The invention belongs to the field of semiconductor production, and particularly relates to a device for high-speed transmission and automatic offset reset of a chip product lifting basket in the subsequent process.
Background
In semiconductor chip products or semi-finished products such as wafers, regardless of the material orientation, in various processing equipment, such as wet wafer equipment, which requires the transportation of loaded or unloaded wafer baskets, the module equipment for subsequent transportation is often used for installation in various types of processing equipment, and usually adopts independent transportation channels to separate different environmental requirements and the requirement configuration of dust-free clean environment. In a conventional wafer basket conveying module device, a frame with a fixed size and a specific motion module mechanism are mostly adopted to achieve the purpose that a basket for loading wafers can be conveyed to meet the action requirement of conveying a basket entity, and a subsequent conveying module device under the requirements needs to be matched with the size requirement and space configuration of combined process equipment, so that flexible configuration cannot be performed under the limitation of the overall external design requirement and the movement stroke in the equipment.
The conventional wafer basket post-conveying module device is configured as follows:
1. peripheral device frame: the frame, which is usually made of stainless steel 304, high carbon steel 316, aluminum alloy material, and the combined process equipment have the same peripheral dimension and are locked and combined by high-rigidity and strength bolts
2. The motion mechanism module: usually, a single-shaft robot or a combination of air cylinders is used to form a mechanism motion module for moving the basket vertically or horizontally
3. A basket placement buffer area: area for placing the basket in a temporary way by a buffer area when the process equipment carries out the back-end repeated transmission
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a device for high-speed transmission and automatic offset reset of a chip product lifting basket in the subsequent process.
In order to realize the purpose, the invention adopts the following technical scheme:
a device for high speed transfer and offset automatic reset of a chip product carrier back end, the device comprising: the rack-type electric bicycle comprises a frame, wherein a first sliding rail and a rack which are parallel to each other are arranged on the frame; the horizontal moving module assembly comprises a mounting seat which is arranged on the first sliding rail in a sliding mode, a variable speed motor module is arranged on the mounting seat, a gear of the variable speed motor module can be matched with the rack, and a vertical lifting module is arranged on the mounting seat; and
the level is to holding module subassembly, the level is to holding the subassembly including fixing to holding to open mounting panel on the removal portion of vertical lift module, be fixed with small-size unipolar motion cylinder and second slide rail on the mounting panel, it is provided with the level and opens the bracket to sliding on the second slide rail, the removal portion of small-size unipolar motion cylinder with the level is to opening bracket link connection.
Preferably, the frame is provided with a plurality of basket placing buffer areas.
Preferably, the basket placing buffer zone comprises a plurality of wafer basket pedestal sensors for detecting whether a basket is placed.
Preferably, the horizontal split bracket comprises a horizontal moving connecting block which is arranged on the second sliding rail in a sliding mode, the horizontal moving connecting block is connected with a first end of an L-shaped link rod, and a second end of the L-shaped link rod is fixedly connected with a moving portion of the small single-axial moving cylinder.
Preferably, a through hole is formed in the horizontal movement connecting block, a bearing is fixed in the through hole, a rotating shaft penetrates through the bearing, the rotating shaft penetrates through the through hole in the first end of the L-shaped link rod, and clamp springs are clamped at two ends of the rotating shaft.
Preferably, a basket bracket is fixedly connected to the horizontal movement connecting block, and an inclined slope is arranged on the edge of the basket bracket for holding the basket.
Preferably, the inclined slope is a 45-degree oblique angle, the basket carrier is fixed on a reinforcing plate, and the reinforcing plate is fixed on the horizontal moving connecting block.
Preferably, a sensor group for detecting the displacement of the horizontal split bracket is arranged on the mounting plate.
Preferably, the device comprises a dust-proof containment shell disposed outside the frame.
Compared with the prior art, the invention has the beneficial effects that:
1. the stability of the high-speed horizontal movement of the wafer lifting basket is realized, and the gear combination of a rack/variable-speed motor on the frame body, the combination of a horizontal stabilizing plate and a slide rail group of the movement mechanism and the combination of a chain supporting fixer and the chain supporting combination on the frame body are matched to ensure that the movement mechanism can keep non-deflection, deflection and three-axial moment balance when performing horizontal movement and vertical lifting movement, and is different from a common transfer device which needs to keep stable through 2-4 slide rail groups and 2-4 groups of fixers, so that the combination capability and the applicability of the transfer device and process equipment can be effectively improved;
2. the wafer carrier has the advantages that the functionality of automatically resetting the wafer carrier in moving and non-moving processes is realized, in order to meet the requirement of maintaining the position stability of the wafer carrier in three-axial moving, the situation that when the carrier is transferred to other connected transfer devices, the carrier is dislocated or falls to cause the wafer loading to be improper and broken due to the fact that the position of the carrier deviates and deflects can be completely avoided, and the mechanism of the horizontally-split carrier bracket and the automatic reset inclined groove design on the bracket enable the clamping carrier to have higher stability, so that the accidental reduction of process equipment in transferring the wafer carrier is reduced;
3. the configuration flexibility and adaptability of the process equipment, the horizontally-split bracket mechanism device provides flexible selectivity for transferring and transferring the wafer basket, the horizontally-split mechanism forms a transfer method of horizontal movement and vertical lifting, the space configuration is more flexible when the horizontally-split mechanism is combined with the process equipment, the aluminum alloy frame body arranged on the process equipment is combined with common mounting components, the integration sum of the process equipment reaches the mounting method no matter at the top end, the front end, the left side surface, the right side surface, the rear side surface and the like, the diversified selection is provided for the selection scheme of the wafer basket needing to be transferred, the semiconductor equipment is not limited to the mounting of wet cleaning equipment, and the process equipment can be effectively configured with a larger number of process sections or the composition scheme of other transfer devices.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic diagram of the main structure in the frame.
Fig. 3 is a schematic view of a mechanism for vertical movement and clasping.
Fig. 4 is a schematic view of a state of holding a basket.
Fig. 5 is a schematic view of the mechanism on the mount.
Fig. 6 is an exploded view of the connection end of the horizontal motion connecting block and the link rod of the small single axial motion cylinder.
Fig. 7 is an exploded view of the body in a horizontal split cradle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
As shown in fig. 1 to 7, the present embodiment provides a device for high-speed transferring and automatic offset resetting of a chip product carrier, which comprises: the frame comprises a frame 1, wherein a first sliding rail 11 and a rack 12 which are parallel to each other are arranged on the frame 1; the horizontal moving module assembly 2 comprises a mounting base 21 which is arranged on the first sliding rail 11 in a sliding mode, a variable speed motor module 22 is arranged on the mounting base 21, a gear 221 of the variable speed motor module 22 can be matched with the rack 12, and a vertical lifting module 23 is arranged on the mounting base 21; and
the horizontal split clasping module assembly 3 comprises a mounting plate 31 fixed on the moving part of the vertical lifting module 23, a small single-axial moving cylinder 32 and a second sliding rail 33 are fixed on the mounting plate 31, a horizontal split bracket 34 is arranged on the second sliding rail 33 in a sliding manner, and the moving part of the small single-axial moving cylinder 32 is connected with the horizontal split bracket 34 through a connecting rod.
The frame 1 is provided with a plurality of basket placing buffer areas 13.
The basket placement buffer 13 includes a plurality of wafer basket pedestal sensors 131 for detecting whether a basket is placed thereon.
The horizontal split bracket 34 includes a horizontal movement connecting block 341 slidably disposed on the second slide rail 33, the horizontal movement connecting block 341 is connected to a first end of an L-shaped link, and a second end of the L-shaped link is fixedly connected to a moving portion of the small single axial movement cylinder 32.
A through hole is formed in the horizontal moving connecting block 341, a bearing 3411 is fixed in the through hole, a rotating shaft 3412 penetrates through the bearing 3411, the rotating shaft 3412 penetrates through the through hole at the first end of the L-shaped link rod, and clamp springs 3413 are clamped at two ends of the rotating shaft 3412.
The basket bracket 342 is fixedly connected to the horizontal movement connecting block 341, and an inclined slope 3421 is provided at the edge of the basket bracket 342 for holding the basket.
The inclined surface 3421 is inclined at an angle of 45 °, the basket bracket 342 is fixed to the reinforcing plate 343, and the reinforcing plate 343 is fixed to the horizontally movable connecting block 341.
The mounting plate 31 is provided with a sensor group 35 for detecting the displacement of the horizontal split bracket 34.
The device comprises a dust-proof covering shell 4 arranged outside the frame 1.
In another embodiment, the wafer carrier back-end transfer module is different from a conventional wafer carrier back-end transfer module, and has 1, a peripheral frame 2, a motion mechanism module 3, and a carrier placing buffer zone.
1. Frame structure
The main structural components of the frame are composed of five basic elements, namely a frame body, a dustproof coating shell, a movement mechanism horizontal stabilizing plate, a drag chain fixer, an electric appliance control box area and the like.
1. A frame body: preferably, an aluminum extruded aluminum alloy is used, which may be stainless steel or engineering plastic member with specific functional requirements according to the requirement, and is changed according to the requirement of the clean room required by the semiconductor manufacturing environment. The frame body is made of aluminum extruded material, a square four-groove section member is adopted, the frame body is combined by using a specific bolt assembly, and the bolt assembly is arranged at intervals of 25-50cm, preferably 25cm, so that the frame body is convenient to mount.
2. Dustproof cladding shell: the design concept of the structure is mainly widely applied to the manufacturing environment of a semiconductor clean room, a design of a coating shell is established, the coating shell meets the requirement of a dust-free environment, a dust-free structural material is adopted, and the coating shell is preferably a sandwich stainless steel plate, a high alumina plate and an engineering plastic plate with specific functional requirements.
3. Horizontal stabilizer plate of motion: the assembly mainly has the advantages that the stable and fixed auxiliary assembly which can generate the phenomenon of Z-axis to x-y plane offset is provided when the movement mechanism module moves at a high speed, and the stable and fixed auxiliary assembly is different from a common horizontal movement assembly which is built and needs 2-4 running tracks to achieve stable horizontal movement.
4. Drag chain fixer: the assembly is an assembly combined with a drag chain with a designated length, and the combination of the assembly and the drag chain can generate a stable effect for shaking and deviation generated in the process of high-speed horizontal movement and vertical lifting movement of the movement mechanism, and the combination is shown in fig. 7.
5. An electric control box area: the component mainly utilizes effective space to set related electric appliance control elements and switches, is widely used for process equipment with various sizes, does not need to waste the placing space of redundant electric appliance control elements, and has more flexible configuration possibility in the design of a transmission channel for building the wafer basket.
2. Motion mechanism module
The main function of the forming module is to provide a device capable of vertically lifting and combining with the motion requirement of horizontal movement, and a device for transferring the wafer basket, which can realize no interference phenomenon and can horizontally move at high speed and achieve z-axis transmission action, is provided by a motion mechanism mode of the device, and the device can effectively form a specific stabilizing effect without deviation and deviation no matter the basket moves vertically or horizontally. The structure of the motion mechanism module is as follows:
1. horizontal migration module subassembly:
the assembly is composed of a plurality of sub-assemblies, is mainly used for meeting the requirement that the integral motion mechanism module needs to move at a high speed and bearing the vertical lifting motion mechanism, and utilizes a stable mounting assembly to mount a variable speed motor, and a gear and a rack of a frame body are mounted and matched with a slide rail assembly at the bottom to achieve the effects of moving at a high speed and stabilizing the bottom without shaking and offsetting. The constituent subassemblies of the present assembly are as follows:
a. mounting seat
The mounting seat is used for bearing the vertical lifting mechanism and the variable speed motor module for horizontal movement, and adopts the functions of using reinforcing ribs at two sides to stabilize the torque on the inner side without deflection and limiting the vertical lifting mechanism, and the material selection is preferably an anodic oxidation treatment aluminum alloy plate, and also can be a plate material which can provide high strength and rigidity, such as stainless steel, engineering plastics and the like.
b. Variable speed motor module
The assembly is combined with the mounting block on the mounting base through a variable speed motor module and a gear of a designated shape is mounted on the rotating shaft end of the motor for being combined with a rack mounted on the frame body.
c. Vertical lifting module
The module assembly is composed of a motion mechanism performing unidirectional axial motion, preferably a screw single-shaft robot moving bidirectionally, and also can be composed of a high-bearing capacity air cylinder module, and mainly provides the function of performing overall vertical lifting on the other modules such as a horizontal split clamping module.
2. Horizontal split holding module assembly
The module component mainly drives the wafer driven by the slide rail group connected to the backboard mounting plate through the small-sized cylinder with one-way motion and the L-shaped connecting rods on two sides to drive the two-side bracket of the wafer dragging basket, so that the horizontal split motion can be realized, the possibility of configuring more spaces for the clamping wafer dragging basket can be realized by the horizontal split motion mode, the horizontal bracket component has the function of automatic resetting, and the action of dislocation and deviation of the dragging basket in the moving process or the dragging basket transferring process can not be generated. The related subassemblies are as follows:
d. small-sized single axial motion cylinder
The sub-assembly is composed of a cylinder with a guide rod in the single axial direction, a mounting plate is mounted on a back mounting plate, a rotating shaft of a crank is arranged at the front end of the guide rod to be fixed quickly, and the single axial movement of the cylinder is realized to achieve the symmetrical movement that two L-shaped cranks can stably and non-deflectively move.
e. Cylinder mounting assembly
This installation group piece comprises clothing corrosion resistant plate, and its form is trapezoidal steel formula group piece of rolling over, provides the small-size single axial motion cylinder of firm installation in back mounting panel.
f. Back mounting plate
The assembly provides the entire installation method of the present level module, and is also connected to the load-bearing seat of the single-shaft robot of the vertical lifting module. The device is provided with a slide rail set used for the movement of the edible horizontal split bracket and a sensor set used for detecting the horizontal displacement positioning of the horizontal split brackets on two sides, the device preferably adopts an anodic oxidation aluminum alloy plate, the thickness is preferably 10-20mm, the length is preferably 300mm, the surface shape is in a convex shape, the utilization of space and the utilization of the distance interval between the towing bracket component and the highest point of the frame body after the towing basket is placed can be effectively strived for.
g. Slide rail group for moving horizontal split bracket
A slide rail group suitable for the horizontal split bracket to perform the horizontal motion of split on two sides is provided, and comprises a slide rail and a double slide block.
h. Sensor group
The assembly provides for the actual sensing of the initial and end positions of the horizontal bisecting motion of the horizontal bisecting bracket on both sides.
i. Horizontal split bracket
This sub-assembly drags the basket for realizing bearing the weight of the wafer and uses, and this bracket has automatic re-setting's function, can dispose 1 to 2 wafer hand-baskets according to the demand, and it can avoid the whole motion module to carry out rocking or the possibility micro-offset causes the interval error of accumulation and causes the wafer hand-basket to have the phenomenon of dislocation, and it has a scarf that resets, can get into the effectual accuracy of the handle of hand-basket both sides in the ditch inslot that the bracket set for. The material is selected according to the requirements of the process equipment, and is preferably polypropylene PP engineering plastic, or can be other engineering plastics or metal with rigidity or environmental resistance or other materials.
3. A basket placement buffer area:
the wafer basket has a temporary placement area controlled by a program during the transfer process, and 2 or more than two buffer areas can be configured by the configuration of the module.
The related subassemblies are constructed as follows:
j. wafer basket foot seat sensor
The configuration pedestal sensor detects whether the mounting seat is located at the configuration position of the buffer area.
k. Buffer area mounting plate
The mounting plate is mounted on the frame body, and the wafer basket foot seat sensor is mounted on the mounting plate by mounting the mounting plate on the frame body.
Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.
Claims (4)
1. A device for high-speed transmission and automatic offset reset of a chip product carrier, which is characterized by comprising:
the device comprises a frame (1), wherein a first sliding rail (11) and a rack (12) which are parallel to each other are arranged on the frame (1);
the horizontal moving module assembly (2) comprises a mounting seat (21) which is arranged on the first sliding rail (11) in a sliding mode, a variable speed motor module (22) is arranged on the mounting seat (21), a gear (221) of the variable speed motor module (22) can be matched with the rack (12), and a vertical lifting module (23) is arranged on the mounting seat (21); and
the horizontal split clasping module assembly (3) comprises a mounting plate (31) fixed on a moving part of the vertical lifting module (23), a small single-axial moving cylinder (32) and a second sliding rail (33) are fixed on the mounting plate (31), a horizontal split bracket (34) is arranged on the second sliding rail (33) in a sliding manner, and the moving part of the small single-axial moving cylinder (32) is connected with the horizontal split bracket (34) through a connecting rod;
the horizontal split bracket (34) comprises a horizontal moving connecting block (341) which is arranged on the second sliding rail (33) in a sliding manner, the horizontal moving connecting block (341) is connected with a first end of an L-shaped link rod, and a second end of the L-shaped link rod is fixedly connected with a moving part of the small single-axial motion cylinder (32);
a through hole is formed in the horizontal moving connecting block (341), a bearing (3411) is fixed in the through hole, a rotating shaft (3412) penetrates through the bearing (3411), the rotating shaft (3412) penetrates through the through hole in the first end of the L-shaped link rod, and clamp springs (3413) are clamped at two ends of the rotating shaft (3412);
a basket bracket (342) is fixedly connected to the horizontal moving connecting block (341), and an inclined slope (3421) is arranged on the edge of the basket bracket (342) for holding a basket;
the inclined plane (3421) is an inclined angle of 45 degrees, the basket bracket (342) is fixed on a reinforcing plate (343), and the reinforcing plate (343) is fixed on the horizontal moving connecting block (341);
the mounting plate (31) is provided with a sensor group (35) for detecting the displacement of the horizontal split bracket (34).
2. The device for high-speed conveying and automatic offset resetting of chip product carrier as claimed in claim 1, characterized in that a plurality of carrier placing buffers (13) are arranged on the frame (1).
3. The apparatus for high speed transportation and automatic offset return of a carrier for chip products according to claim 2, wherein the carrier placement buffer (13) comprises a plurality of wafer carrier foot sensors (131) for detecting whether a carrier is placed thereon.
4. The device for high-speed conveying and automatic offset resetting of chip product carrier as claimed in claim 1, characterized in that the device comprises a dust-proof covering shell (4) arranged outside the frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911101625.6A CN111081617B (en) | 2019-11-12 | 2019-11-12 | Device for high-speed transmission and automatic offset reset of chip product lifting basket |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911101625.6A CN111081617B (en) | 2019-11-12 | 2019-11-12 | Device for high-speed transmission and automatic offset reset of chip product lifting basket |
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| CN111081617A CN111081617A (en) | 2020-04-28 |
| CN111081617B true CN111081617B (en) | 2022-12-13 |
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| CN110931407B (en) * | 2019-11-20 | 2022-10-18 | 上海至纯洁净系统科技股份有限公司 | Lifting module for holding wafer box |
| CN115458449B (en) * | 2022-11-11 | 2023-06-23 | 苏州智程半导体科技股份有限公司 | Wafer groove type cleaning machine with compact matching of mechanical swing arms and groove bodies |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336004A (en) * | 2018-04-18 | 2018-07-27 | 冠礼控制科技（上海）有限公司 | A kind of full-automatic wet process equipment of four gaily decorated basket of single batch synchronous operation |
| CN208093527U (en) * | 2018-01-12 | 2018-11-13 | 江西宝群电子科技有限公司 | A kind of Pneumatic driving type silicon chip baking oven gaily decorated basket conveying device |
| CN208385377U (en) * | 2018-07-11 | 2019-01-15 | 苏州映真智能科技有限公司 | Active gaily decorated basket load system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW461014B (en) * | 2000-10-11 | 2001-10-21 | Ind Tech Res Inst | A positioning method and device for wafer loading devices |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208093527U (en) * | 2018-01-12 | 2018-11-13 | 江西宝群电子科技有限公司 | A kind of Pneumatic driving type silicon chip baking oven gaily decorated basket conveying device |
| CN108336004A (en) * | 2018-04-18 | 2018-07-27 | 冠礼控制科技（上海）有限公司 | A kind of full-automatic wet process equipment of four gaily decorated basket of single batch synchronous operation |
| CN208385377U (en) * | 2018-07-11 | 2019-01-15 | 苏州映真智能科技有限公司 | Active gaily decorated basket load system |
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