CN111081616B - Wafer guide mechanism and wet method equipment applying same - Google Patents
Wafer guide mechanism and wet method equipment applying same Download PDFInfo
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- CN111081616B CN111081616B CN201911088268.4A CN201911088268A CN111081616B CN 111081616 B CN111081616 B CN 111081616B CN 201911088268 A CN201911088268 A CN 201911088268A CN 111081616 B CN111081616 B CN 111081616B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer guide mechanism and wet equipment applying the same, wherein the wafer guide mechanism comprises an installation shell, a clamping assembly and a link rod adjusting module used for adjusting the clamping assembly to enable the clamping assembly to perform arc-shaped opposite opening movement, the link rod adjusting module comprises an air cylinder fixed on the installation shell, a linkage assembly connected with a piston rod of the air cylinder and a rotating crank, one end of the rotating crank is fixed on the linkage assembly, and the other end of the rotating crank is connected with an end part of the clamping assembly, which extends out of the installation shell. According to the invention, the linkage adjusting module drives the clamping assembly to move in an arc-shaped opposite-opening manner so as to clamp the wafer, so that the problem that the wafer is broken due to impact and impact in all directions caused by the action of clamping the wafer after the wafer is vertically lifted can be avoided, the surface of the wafer is prevented from being abraded, and the cleanliness of a process environment is maintained.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a wafer guide mechanism and wet equipment using the same.
Background
In semiconductor processing equipment, for example, wet processing equipment, wafer baskets are exchanged between a wafer loading area and a wafer unloading area. In the process of exchanging the wafer baskets, the wafer guide mechanism is required to take out the wafer in one wafer basket and place the wafer in the other wafer basket. However, the conventional wafer guide mechanism is unstable in movement when exchanging wafers, and easily causes impact, abrasion, pressing, and the like to the wafers, thereby damaging the wafers.
Disclosure of Invention
In view of the above, the present invention provides a wafer guiding mechanism and a wet method apparatus using the same, so as to solve the above problems in the background art.
The utility model provides a wafer guide mechanism, is including installing the casing, for the centre gripping subassembly of centre gripping wafer and be used for adjusting the centre gripping subassembly and make the centre gripping subassembly carry out the arc to the link rod adjusting module who opens the motion, the centre gripping subassembly is fixed in the installation casing, and the link rod adjusting module is fixed in the outside of installing the casing, the link rod adjusting module is including fixing the cylinder on the installation casing, the linkage subassembly that links to each other with the piston rod of cylinder and crank handle, crank handle's one end is fixed on the linkage subassembly, and the other end links to each other with the tip that stretches out in the installation casing of the follow of centre gripping subassembly.
Preferably, the clamping assembly comprises two supporting plates, a clamping piece, a rotating shaft rod and a crank linkage shaft rod, the two supporting plates are arranged on the inner side of the mounting shell, the clamping piece is fixed on each supporting plate, the rotating shaft rod is fixed at two end parts of each supporting plate in a threaded manner, and the rotating shaft rod is connected with the mounting shell through a rotation blocking assembly; one end of the crank linkage shaft lever is fixed on the supporting plate in a threaded manner, and the other end of the crank linkage shaft lever penetrates through the mounting shell to be connected with the rotating crank.
Preferably, the mounting housing comprises two mounting plates arranged oppositely, side plates arranged on the side edges of the two mounting plates, and cover plates fixed to the top and the bottom of one of the mounting plates, one end of the crank linkage shaft rod is fixed on the support plate in a threaded manner, the other end of the crank linkage shaft rod extends out of the mounting plate provided with the cover plate and is connected with the rotating crank, and the rotating crank is connected with the linkage assembly.
Preferably, the rotation blocking assembly comprises a rotation support and a rotation blocking groove cover, the rotation shaft rod penetrates through the rotation support, the rotation support is arranged on the inner side of the mounting plate, the rotation blocking groove cover is arranged on the outer side of the mounting plate, and the rotation support and the rotation blocking groove cover are fixed through a fastener.
Preferably, the linkage assembly comprises an adjusting plate and a linkage mounting rod, the bottom of the adjusting plate is connected with a piston rod of the air cylinder, a plurality of groups of mounting holes are formed in the surface of the adjusting plate from top to bottom, the adjusting plate is fixed with the linkage mounting rod through fasteners arranged in any group of mounting holes, and two ends of the linkage mounting rod are respectively fixed with a rotating crank.
Preferably, a support seat is further arranged between the cylinder and the cover plate at the bottom of the mounting shell.
Preferably, the rotating crank comprises an upper crank and a lower crank, a groove and a first rotating groove for embedding the rotating bearing are arranged on the end face of the upper crank, and a stop groove is arranged on the bottom of the groove along the length direction of the groove;
the lower crank is buckled in the groove, the protruding part of the lower crank abuts against the end face of the upper crank, and the lower crank and the upper crank are locked and fixed through a fastener penetrating through the stopping groove and the stopping hole.
Preferably, the clamping piece is provided with a plurality of fixing holes, the upper end of the clamping plate is provided with a tooth groove structure, the tooth groove structure is composed of a plurality of continuous teeth, each tooth is provided with a tooth back, a tooth front and a tooth tip formed at the intersection of the tooth back and the tooth front, the tooth back is obliquely arranged, the tooth front comprises a first section, a second section and a third section, the second section is perpendicularly connected to the lower end of the first section, the third section is connected to the lower end of the second section, and the first section and the third section are obliquely arranged towards the direction deviating from the tooth back of the previous tooth.
Preferably, the inclination angle of the first section is larger than that of the third section, and the included angle between the third section and the tooth back of the previous tooth is 54 degrees.
The wet method equipment comprises the wafer guide mechanism.
The invention has the beneficial effects that:
this application drives the centre gripping subassembly through the linkage regulation module and carries out the arc and run from opposite directions the motion to realize the purpose of centre gripping wafer, the wafer more laminates with the holder contact, can avoid the wafer to make the cracked problem of wafer because of the impact and the striking of each direction that the action of centre gripping wafer brought behind the vertical lift, avoid the wafer surface wearing and tearing to appear, keep the cleanliness factor of technology environment. The wafer guide mechanism can be freely assembled on wet equipment needing wafer loading and unloading, is very wide in application range, can clamp wafers of various sizes, and is wide in application range and high in universality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a front view of a wafer guide mechanism.
Fig. 2 is a left side view of the wafer guide mechanism.
Fig. 3 is a right side view of the wafer guide mechanism.
Fig. 4 is a bottom view of the wafer guide mechanism.
Fig. 5 is a top view of the wafer guide mechanism.
Fig. 6 is a schematic structural view of the link adjustment module.
Fig. 7 is a schematic view of the structure of the crank.
Fig. 8 is an exploded view of the crank handle.
Fig. 9 is a schematic view of the structure of the clamp.
Fig. 10 is a partial view of a wafer clamped in a clamp.
FIG. 11 is a schematic view of the buckle.
Fig. 12 is a state diagram of the wafer guide mechanism in use.
The designations in the figures mean:
1 is an installation shell, 2 is a clamping component, 3 is a link rod adjusting module, 4 is a wafer, 5 is an installation plate, 6 is a side plate, 7 is a cover plate, 8 is a clamping piece, 9 is a supporting plate, 10 is a crank linkage shaft lever, 11 is a rotating shaft lever, 12 is a fixing hole, 13 is a tooth groove structure, 14 is a tooth back, 15 is a tooth front, 16 is a tooth tip, 17 is a first section, 18 is a second section, 19 is a third section, 20 is a rotating support, 21 is a rotating stop groove cover, 22 is a cylinder, 23 is a rotary crank, 24 is a supporting seat, 25 is an adjusting plate, 26 is a linkage mounting rod, 27 is a mounting hole, 28 is an upper crank, 29 is a lower crank, 30 is a groove, 31 is a first rotary groove, 32 is a stop groove, 33 is a stop hole, 34 is a boss, 35 is a second rotary groove, 36 is a groove, 37 is a rotary bearing, 38 is a retaining ring, 39 is an annular body, and 40 is a limiting part.
Detailed Description
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present application is described in further detail below by way of specific embodiments in conjunction with the following figures.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected", "fixed", and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right", and the like used in the description of the embodiments of the present application are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
The invention provides a wafer guide mechanism which can be freely installed on semiconductor process equipment. The semiconductor processing equipment comprises a wafer loading area and a wafer unloading area.
The wafer guide mechanism comprises a mounting shell 1, a clamping component 2 used for clamping a wafer 4, and a link rod adjusting module 3 used for adjusting the clamping component 2 to enable the clamping component 2 to perform arc-shaped bisection motion.
The mounting case 1 includes a mounting plate 5, a side plate 6, and a cover plate 7. The mounting panel 5 is provided with two, and two mounting panels 5 set up relatively. The side plates 6 are respectively installed on two sides of the mounting plates 5, so as to form a frame structure with the two mounting plates 5, the clamping component 2 is arranged in the frame structure, and the link rod adjusting module 3 is arranged on the outer side wall of the frame structure. The cover plate 7 is fixed on the top and the bottom of one of the mounting plates, in the embodiment, the cover plate 7 is fixed on the top and the bottom of the mounting plate on the left side, and the cover plate 7, the mounting plate 6 and the side plate 7 are all rectangular plates.
The clamping assembly 2 is disposed within the mounting housing 1. The clamping assembly 2 comprises a clamping member 8, a support plate 9, a crank linkage shaft 10 and a rotating shaft 11.
The clamping member 8 is fixed on the supporting plate 9, and the clamping member 8 is used for clamping the wafer 4. The clamping piece 8 is provided with a plurality of fixing holes 12, and the clamping piece 8 is fixedly connected with the supporting plate 9 through bolts fixed in the fixing holes 12.
The upper end part of the clamping piece 8 is provided with a tooth groove structure 13, and the wafer 4 is clamped in the tooth groove structure 13. The tooth groove structure 13 is composed of a plurality of continuous teeth, each tooth is provided with a tooth back 14, a tooth front 15 and a tooth tip 16 formed at the intersection of the tooth back 14 and the tooth front 15, and a tooth groove for clamping a wafer is formed between the tooth front of each tooth and the tooth back of the previous tooth.
The tooth backs 14 are arranged obliquely. The tooth front 15 comprises a first section 17, a second section 18 vertically connected to the lower end of the first section, and a third section 19 connected to the lower end of the second section, wherein the first section 17 and the third section 19 are both obliquely arranged towards the direction deviating from the tooth back of the previous tooth. The angle of inclination of the first section 17 is greater than the angle of inclination of the third section 19. In this embodiment, the tooth back 14 is inclined to the upper left, the first section 17 and the third section 19 are inclined to the upper right, and the angle between the third section 19 and the tooth back of the previous tooth is 54 °.
When the wafer 4 is placed in the gully structure 13, the tooth back 14 inclined to the upper left will move the wafer 4 to the opposite side, and the third segment 19 inclined to the upper right will push the wafer 4 upwards, causing the wafer 4 to move towards the second segment 18, so that the end face of the wafer 4 is attached to the vertical second segment 18, thereby stably clamping the wafer 4 in the gully between two teeth. In the process of moving the wafer 4, the wafer 4 can be always located at the original fixed position through the special tooth groove structure 13 on the upper part of the clamping piece, and the conditions of relative sliding or direction deviation and the like can not be generated, so that the wafer is prevented from being damaged due to position deviation or shaking.
In this embodiment, the clamping member 8 is made of a chemical resistant material, an alloy material or a non-metallic material by integral injection molding. The chemical resistance material is any one of teflon, polyvinylidene fluoride, polyether-ether-ketone, polyvinyl chloride, polypropylene, polyformaldehyde or polysulfone; the alloy material is any one of stainless steel, aluminum alloy, titanium alloy or tungsten alloy; the non-metallic material is quartz.
The supporting plates 9 are arranged in two, the two supporting plates 9 are oppositely arranged in the mounting shell 1, and a clamping piece 8 is fixed on each supporting plate 9.
The rotating shaft levers 11 are respectively arranged at two end parts of the supporting plate 9, one end of each rotating shaft lever 11 is fixed on the supporting plate 9 through threads, the other end of each rotating shaft lever is fixed with the rotating blocking component, the rotating blocking components are fixed on the corresponding mounting plates, and namely the rotating blocking components are mounted on the left mounting plate and the right mounting plate.
The rotation blocking assembly includes a rotation support 20 and a rotation blocking groove cover 21. The rotation shaft 11 passes through the rotation support 20, the rotation support 20 is disposed at the inner side of the mounting plate 5, the rotation blocking slot cover 21 is disposed at the outer side of the mounting plate 5, and the rotation support 20 and the rotation blocking slot cover 21 are fixed by a fastener (e.g., a bolt). The rotating support 20 is used for supporting the rotating shaft rod 11, the rotating support 20 is of a round cake-shaped structure, a round hole used for enabling the rotating shaft rod 11 to penetrate through is formed in the center of the rotating support 20, and four bolt holes are formed in the periphery of the round hole. The rotation blocking groove cover 21 is a circular cover with a stand column in the center, four bolt holes are also formed in the circular cover, and after the rotation blocking groove cover 21 is fixed to the mounting plate from outside to inside, the rotation blocking groove cover 21 and the rotation support 20 are fixed into a whole through bolts.
The crank linkage shaft 10 is used for linking the two support plates 9 to enable the clamping pieces 8 on the two support plates to rotate, so that the wafer can be clamped or loosened. The crank linkage shaft lever 10 is arranged on one side of the supporting plate 9, one end of the crank linkage shaft lever 10 is fixed on the supporting plate 9 in a threaded mode, and the other end of the crank linkage shaft lever passes through a mounting plate (a mounting plate provided with a cover plate) of the mounting shell to be connected with the link rod adjusting module 3.
The link adjusting module 3 is disposed outside the installation housing 1, and specifically, the link adjusting module 3 is fixed on a bottom cover plate of the installation housing 1.
The link rod adjusting module 3 comprises an air cylinder 22 fixed on the bottom cover plate, a linkage assembly connected with a piston rod of the air cylinder 22 and a rotating crank 23, a supporting seat 24 can be further arranged between the air cylinder 22 and the cover plate at the bottom of the mounting shell, and the supporting seat 24 can be designed into a convex supporting seat.
The linkage assembly comprises an adjusting plate 25 and a linkage mounting rod 26, the bottom of the adjusting plate 25 is connected with a piston rod of the air cylinder 22, a plurality of groups of mounting holes 27 are formed in the surface of the adjusting plate 25 from top to bottom, and the adjusting plate 25 is fixed with the linkage mounting rod 26 through fastening bolts arranged in any group of mounting holes. Through the mounting hole site of the fastening bolt between the adjustment plate 25 and the linkage mounting rod 26, the distance between the left clamping piece and the right clamping piece can be adjusted, so that the wafer guide mechanism can be suitable for wafers of different sizes.
Two ends of the linkage mounting rod 26 are respectively provided with a rotating crank 23.
The crank handle 23 is fixed at one end to the linkage mounting bar 26 and at the other end to the end of the crank link shaft 10 that extends from the mounting housing (i.e., the end of the crank link shaft 10 that extends from the mounting plate to which the cover plate is mounted).
The crank 23 comprises an upper crank 28 and a lower crank 29, and the upper crank 28 is engaged with the lower crank 29.
The end surface of the upper crank 28 is provided with a groove 30 and a first rotating groove 31 for embedding a rotating bearing 37, and the bottom of the groove 30 is provided with a stop groove 32 along the length direction.
The end face of one end of the lower crank 29 is provided with a stop hole 33, the end face of the other end is provided with a boss 34, and the boss 34 is provided with a second rotating groove 35 for embedding a rotating bearing 37. The lower crank 29 is engaged in the recess 30 with its boss 34 abutting against the end face of the upper crank 28, and the lower crank 29 and the upper crank 28 are locked by a fastener (e.g., a stopper bolt) passing through the stopper groove 32 and the stopper hole 33.
In this embodiment, the groove 30 is a rectangular groove, the first rotating groove 31 is a circular groove, the first rotating groove 31 is disposed above the groove 30, and the stopping groove 32 at the bottom of the groove 30 is a kidney-shaped groove. The lower crank 29 is composed of a rectangular plate section and a convex part connected to the end of the rectangular plate section, the thickness of the convex part is larger than that of the rectangular plate section, the rectangular plate section of the lower crank 29 is buckled in the groove, and the stop hole 33 on the rectangular plate section of the lower crank 29 is a circular hole.
Two grooves 36 for installing retaining rings are arranged on the groove walls of the first rotating groove 31 and the second rotating groove 35, the rotating bearing 37 is clamped between the upper retaining ring 38 and the lower retaining ring 38, the distance between the two grooves on the first rotating groove 31 and the second rotating groove 35 is matched with the thickness of the rotating bearing 37, and preferably, the distance between the two grooves 36 on the first rotating groove 31 and the second rotating groove 35 is set to be 8.4mm.
The retaining ring 38 includes a circular body 39, two end portions of the circular body 39 extend to form a limiting portion 40, the limiting portion 40 is disposed inward along a radial direction of the circular body 39, a gap is formed between the two limiting portions, and in this embodiment, the limiting portion 40 is a trapezoid block structure. The annular body 39 is clamped in the groove 36 and a stop portion 40 at the end thereof protrudes from the groove 36. The rotary bearing 37 in the first rotary groove 31 and the second rotary groove 35 are clamped between the upper and lower retaining rings 38, so that the potential risk of forward and backward sliding when the rotary bearing 37 rotates can be avoided.
When the clamping device is used, the piston rod of the air cylinder 22 drives the adjusting plate 25 and the linkage mounting rod 26 to move upwards, the left rotating crank 23 and the right rotating crank 23 can be rotated in the process that the linkage mounting rod 26 moves upwards, the two rotating cranks 23 can drive the crank linkage shaft rod 10 to rotate, the crank linkage shaft rod 10 drives the left supporting plate 9 and the right supporting plate 9 to be opened, and the two supporting plates 9 drive the clamping piece 8 to be opened in an arc shape. After the exchange wafer basket moves into the gap between the clamping pieces, the piston rod of the air cylinder 22 retracts, the piston rod drives the adjusting plate 25 and the linkage mounting rod 26 to move downwards, and the linkage mounting rod 26 drives the left rotating crank 23 and the right rotating crank 23 to rotate reversely, so that the two clamping pieces clamp the wafer.
In this embodiment, the mounting housing 1, the supporting plate 9, the rotating shaft 11, the crank linking shaft 10, the rotating support 20, the rotation blocking slot cover 21, the adjusting plate 25, the linking mounting rod 26, and the rotating crank 23 are made of stainless steel or anodized aluminum alloy, and the stainless steel may be SS304 stainless steel.
This application drives the centre gripping subassembly through the linkage regulation module and carries out the arc and run from opposite directions the motion to realize the purpose of centre gripping wafer, the wafer more laminates with the holder contact, can avoid the wafer to make the cracked problem of wafer because of the impact and the striking of all directions that the action of centre gripping wafer brought behind the vertical lift, avoid the wafer surface wearing and tearing to appear, keep the cleanliness factor of technology environment.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (8)
1. A wafer guide mechanism is characterized by comprising an installation shell, a clamping component for clamping a wafer and a link rod adjusting module for adjusting the clamping component to enable the clamping component to perform arc-shaped split movement, wherein the clamping component is fixed in the installation shell, the link rod adjusting module is fixed on the outer side of the installation shell, the link rod adjusting module comprises a cylinder fixed on the installation shell, a linkage component connected with a piston rod of the cylinder and a rotating crank, one end of the rotating crank is fixed on the linkage component, and the other end of the rotating crank is connected with the end part of the clamping component, which extends out of the installation shell;
the clamping assembly comprises two supporting plates, clamping pieces, a rotating shaft rod and a crank linkage shaft rod, the two supporting plates are arranged on the inner side of the mounting shell, each supporting plate is fixedly provided with the clamping piece, two ends of each supporting plate are fixedly provided with the rotating shaft rod in a threaded manner, and the rotating shaft rod is connected with the mounting shell through a rotation blocking assembly; one end of the crank linkage shaft lever is fixed on the supporting plate in a threaded manner, and the other end of the crank linkage shaft lever passes through the mounting shell and is connected with the rotating crank;
the linkage assembly comprises an adjusting plate and a linkage mounting rod, the bottom of the adjusting plate is connected with a piston rod of the air cylinder, a plurality of groups of mounting holes are formed in the surface of the adjusting plate from top to bottom, the adjusting plate is fixed with the linkage mounting rod through a fastener arranged in any group of mounting holes, and two ends of the linkage mounting rod are respectively fixed with a rotating crank.
2. The wafer guide mechanism of claim 1, wherein the mounting housing comprises two opposing mounting plates, side plates mounted on the sides of the two mounting plates, and cover plates fixed to the top and bottom of one of the mounting plates, wherein one end of the crank linkage shaft is threadedly fixed to the support plate, and the other end of the crank linkage shaft extends out of the mounting plate on which the cover plate is mounted and is connected to a crank, and the crank is connected to the linkage assembly.
3. The wafer guide mechanism of claim 2, wherein the rotation blocking assembly comprises a rotation support and a rotation blocking slot cover, the rotation shaft passes through the rotation support, the rotation support is disposed on an inner side of the mounting plate, the rotation blocking slot cover is disposed on an outer side of the mounting plate, and the rotation support and the rotation blocking slot cover are fixed by a fastener.
4. The wafer guide mechanism of claim 3, wherein a support seat is further disposed between the cylinder and a cover plate mounted to the bottom of the housing.
5. The wafer guide mechanism according to any of claims 1 or 2, wherein the rotary crank comprises an upper crank and a lower crank, the upper crank is provided with a groove on an end surface and a first rotary groove for embedding the rotary bearing, and a stop groove is provided on a bottom of the groove along a length direction thereof;
the lower crank is buckled in the groove, the protruding part of the lower crank abuts against the end face of the upper crank, and the lower crank and the upper crank are locked and fixed through a fastener penetrating through the stopping groove and the stopping hole.
6. The wafer guide mechanism of claim 1, wherein the clamping member has a plurality of fastening holes, the clamping plate has a tooth groove structure at an upper end thereof, the tooth groove structure is formed by a plurality of continuous teeth, each tooth has a tooth back, a tooth front, and a tooth tip formed at an intersection of the tooth back and the tooth front, the tooth back is disposed in an inclined manner, the tooth front includes a first section, a second section vertically connected to a lower end of the first section, and a third section connected to a lower end of the second section, and the first section and the third section are both disposed in an inclined manner toward a direction away from the tooth back of the previous tooth.
7. The wafer guide mechanism of claim 6, wherein the angle of inclination of the first segment is greater than the angle of inclination of the third segment, and the angle between the third segment and the tooth back of the previous tooth is 54 °.
8. A wet bench comprising a wafer guide mechanism as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911088268.4A CN111081616B (en) | 2019-11-08 | 2019-11-08 | Wafer guide mechanism and wet method equipment applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911088268.4A CN111081616B (en) | 2019-11-08 | 2019-11-08 | Wafer guide mechanism and wet method equipment applying same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111081616A CN111081616A (en) | 2020-04-28 |
| CN111081616B true CN111081616B (en) | 2022-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911088268.4A Active CN111081616B (en) | 2019-11-08 | 2019-11-08 | Wafer guide mechanism and wet method equipment applying same |
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| CN (1) | CN111081616B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736001B (en) * | 2020-12-31 | 2022-04-08 | 至微半导体(上海)有限公司 | High-efficiency wafer box conveying device of wet cleaning equipment |
| CN114562874B (en) * | 2022-03-02 | 2023-07-04 | 浙江光特科技有限公司 | Be used for wafer to wash back drying device |
| CN115070743A (en) * | 2022-08-18 | 2022-09-20 | 智程半导体设备科技(昆山)有限公司 | Semiconductor equipment mechanical arm |
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| CN111081616A (en) | 2020-04-28 |
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