CN111078262B - Application thermal restoration method and device - Google Patents
Application thermal restoration method and device Download PDFInfo
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- CN111078262B CN111078262B CN201811212976.XA CN201811212976A CN111078262B CN 111078262 B CN111078262 B CN 111078262B CN 201811212976 A CN201811212976 A CN 201811212976A CN 111078262 B CN111078262 B CN 111078262B
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Abstract
The embodiment of the application discloses a thermal restoration method and device for an application, an electronic device and a computer readable medium. One specific embodiment of the thermal restoration method for the application comprises the following steps: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plugin, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method. According to the implementation mode, the host software development kit does not need to be updated in the repairing process, and the imperceptible hot repairing can be realized; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
Description
Technical Field
The embodiment of the application relates to the technical field of computers, in particular to the technical field of software repair, and particularly relates to a hot repair method and device for an application.
Background
The android application repair technology is a technology for accurately realizing the functions of an application by repairing the vulnerabilities of the application. The hot repair technology is a technology for realizing bug repair by pulling a patch package without reinstalling an application software package in the repair process.
The current hot repair technology mainly adopts a real-time hot repair technology based on code repair or a cold start repair technology through a Java loading mechanism. The real-time hot repair technology based on code repair has certain compatibility problems due to the fact that the technology relates to replacement of logic fields or specific parameters of specific methods of the android platform, and the cold start repair technology based on the Java loading mechanism can take effect only after cold start and cannot meet real-time and imperceptible repair requirements.
Disclosure of Invention
The embodiment of the application provides a thermal restoration method and device for an application, an electronic device and a computer readable medium.
In a first aspect, an embodiment of the present application provides a thermal repair method for an application, including: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
In some embodiments, the patch file includes a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function; replacing a data structure to be repaired corresponding to the patch file in the memory with a repaired data structure corresponding to the patch file by adopting a file loading method, wherein the method comprises the following steps: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file is generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packaging the target function and the identification of the target function to generate a patch file.
In some embodiments, the above method further comprises: acquiring state information of an application to be repaired, and judging whether the state information of the application to be repaired meets a preset repairing condition; and loading a thermal repair insert, comprising: and loading the hot repair plug-in response to determining that the state information of the application to be repaired meets the preset repair condition.
In a second aspect, an embodiment of the present application provides a thermal repair method for an application, including: generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; integrating a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the method comprises the steps of sending a hot repair plug-in of an application to be repaired to a client, obtaining a patch file and a file loading method by the client through loading the hot repair plug-in, loading the patch file into a memory through the file loading method to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating a patch file according to a difference between a repaired version installation package and an unrepaired version installation package of an application to be repaired includes: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
In a third aspect, an embodiment of the present application provides an applied thermal repair device, including: the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is configured to acquire a hot repair plug-in of an application to be repaired, and the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and the loading unit is configured to load the hot repair plugin, load the patch file into the memory according to a file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replace the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
In some embodiments, the patch file includes a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function; and the loading unit is further configured to replace the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using a file loading method as follows: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file is generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packaging the target function and the identification of the target function to generate a patch file.
In some embodiments, the above apparatus further comprises: the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and the loading unit is further configured to load the hot repair plug-in response to the verification unit determining that the state information of the application to be repaired meets the preset repair condition.
In a fourth aspect, an embodiment of the present application provides an applied thermal repair device, including: the generating unit is configured to generate a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; the integrated unit is configured to integrate a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the client acquires a patch file and a file loading method by adopting the loaded hot repair plug-in, loads the patch file into the memory by adopting the file loading method to obtain a repaired data structure corresponding to the patch file, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating unit is further configured to generate the patch file as follows: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
In a fifth aspect, an embodiment of the present application provides an electronic device, including: one or more processors; a storage device for storing one or more programs which, when executed by one or more processors, cause the one or more processors to implement the method of thermal remediation of an application as provided by the first or second aspects.
In a sixth aspect, the present application provides a computer readable medium, on which a computer program is stored, where the program, when executed by a processor, implements the thermal remediation method for the application provided in the first or second aspect.
The application hot repair method and device, the electronic device and the computer readable medium according to the embodiments of the present application obtain the hot repair plugin of the application to be repaired, where the hot repair plugin is generated from the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; loading a hot repair plug-in, loading a patch file into a memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting the file loading method, so that plug-in application repair is realized, a host software development kit does not need to be updated in the repair process, and real-time and sensorless hot repair can be realized; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is an exemplary system architecture diagram to which embodiments of the present application may be applied;
FIG. 2 is a flow chart of one embodiment of a thermal remediation method according to an application of the present application;
FIG. 3 is a flow chart of another embodiment of a thermal remediation method according to an application of the present application;
FIG. 4 is a flow chart of yet another embodiment of a thermal remediation method according to an application of the present application;
FIG. 5 is a schematic structural view of one embodiment of a thermal remediation device for use with the present application;
FIG. 6 is a schematic structural view of one embodiment of a thermal remediation device for use with the present application;
FIG. 7 is a schematic block diagram of a computer system suitable for use to implement the electronic device of an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 illustrates an exemplary system architecture 100 of a thermal remediation device to which the applied thermal remediation method or application of the present application may be applied.
As shown in fig. 1, the system architecture 100 may include terminal devices 101, 102, 103, a network 104, and a server 105. The network 104 serves as a medium for providing communication links between the terminal devices 101, 102, 103 and the server 105. The network may include various connection types, such as wired, wireless communication links, or fiber optic cables, to name a few.
The terminal devices 101, 102, 103 may interact with the server 105 via the network 104 to receive or send messages or the like. Various applications, such as a search application, a life service application, a social platform application, a shooting application, etc., may be installed on the terminal devices 101, 102, 103.
The terminal devices 101, 102, 103 may be various electronic devices that support internet access including, but not limited to, smart speakers, smart phones, tablet computers, smart watches, notebook computers, laptop laptops, e-book readers, etc. Terminal devices 101, 102, 103 may be electronic devices supporting the android system.
The application thermal recovery method provided by the embodiment of the application can be executed by the terminal device 101, 102, 103 or the server 105, and accordingly, the application thermal recovery device can be disposed in the terminal device 101, 102, 103 or the server 105.
It should be understood that the number of terminal devices, networks, servers in fig. 1 is merely illustrative. There may be any number of terminal devices, networks, servers, as desired for an implementation.
With continued reference to FIG. 2, a flow 200 of one embodiment of a thermal remediation method in accordance with an application of the present application is illustrated. The thermal restoration method of the application comprises the following steps:
In this embodiment, the execution subject of the hot repair method for the application may be a terminal device, for example (the terminal device shown in fig. 1), where the application to be repaired is installed, and the execution subject may obtain a hot repair plug-in of the application to be repaired from a server connected to the execution subject through a network. The hot-fix plug-in is generated by a patch file of the application to be fixed and a file loading method for loading the patch file to fix the application to be fixed.
The host program of the application to be repaired (i.e. the application program of the application to be repaired) may integrate a corresponding SDK (Software Development Kit), and the execution subject may pull the plug-in list through the SDK of the host program and extract the hot repair plug-in from the plug-in list.
The patch file may be a file for repairing the application to be repaired, and may include a function, a class, and the like for implementing a function of the application to be repaired. The patch file may be generated from fix code written by an application developer to fix the vulnerability of the application, which may include class replacement code and/or function replacement code.
In this embodiment, a file loading method for loading a patch file to repair an application to be repaired may be integrated with the patch file into a hot repair plug-in of the application to be repaired in advance. The file loading method for loading the patch file to repair the application to be repaired may include an implementation logic for loading the patch file, and specifically may include a program code for loading the patch file into the application to be repaired. In this way, the execution main body of the application hot repair method of the embodiment may obtain the hot repair plug-in integrated with the loading method of the patch file.
In an actual scenario, an application server may issue a hot repair plugin including a patch file and a loading method of the patch file to a client installed with the application through a configured issuing channel, and the client may receive the hot repair plugin. Or, the client may automatically detect whether the application version is updated, and if so, may initiate a plug-in acquisition request to the server, and receive a hot repair plug-in issued by the server of the application in response to the acquisition request.
In this embodiment, in the running process of the host program, the hot repair plug-in may be loaded through the SDK of the host program to obtain the patch file and the file loading method of the patch file. The obtained file loading method of the patch file can be adopted to load the patch file.
Specifically, the patch file may be loaded into the memory by using a file loading method obtained by loading the hot repair plug-in, so as to obtain a data structure corresponding to the patch file, which is used as the repaired data structure. And searching the data structure to be repaired corresponding to the patch file in the memory by adopting a file loading method obtained by loading the hot repair plug-in, replacing the corresponding data structure to be repaired by using the repaired data structure, namely writing the repaired data structure into the memory, and removing the data structure to be repaired from the memory. Thus, when a method or parameter in the patch file needs to be called after the application is repaired, the corresponding repaired data structure can be accessed to execute the corresponding method or read the corresponding parameter.
It should be noted that the data structure to be repaired corresponding to the patch file may be a data structure corresponding to the patch data in the patch file in the memory before applying repair. The repaired structure corresponding to the patch file may be a data structure obtained by loading the patch file into the memory after the application is started. The data structure can be an array, a stack, a queue, a linked list and the like, the data structure to be repaired is the same as the repaired data structure in category, and therefore the repaired data structure in the same category can be adopted to replace the data structure to be repaired corresponding to the patch file in the memory, and consistency of the data structure in the memory before and after replacement is guaranteed.
According to the application hot-fix method in the embodiment of the application, after the host program integrates the corresponding SDK, when a bug needing to be fixed is found, all hot-fix functions are integrated in the plug-in unit for loading the SDK of the host program through integrating the patch file in the hot-fix plug-in unit and the file loading method of the patch file, and a new SDK package does not need to be released again. When other bugs are repaired subsequently, the file loading method in the hot-fix plug-in can be adjusted, the SDK of the host program does not need to be changed, the hot-fix process is simplified, the hot-fix can be effective without restarting the application, and real-time and non-perceptual hot-fix can be realized.
The application hot repair method of the embodiment of the application realizes repair by replacing the data structure to be repaired in the memory when the application is running, does not need to consider different organization modes in the data structures of different application versions, has good version compatibility, and can improve the success rate of hot repair.
In some optional implementation manners of this embodiment, the patch file may include an objective function used for repairing a function to be repaired in the application to be repaired, and an identifier of the objective function. The mark of the target function can be composed of a function name and a class name to which the function belongs; or the objective function may be an identification configured for the objective function when the patch package is generated. The identification of the target function may be used to identify the class and function pointed to by the data structure obtained after the patch file is loaded into memory.
At this time, the replacing, by the file loading method, the to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file may include: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
Specifically, the start address of the data structure of the corresponding function to be repaired in the memory may be found according to the identifier of the target function, then the start address is used as the start position of the memory address indicated by the target dest, the memory start address of the repaired data structure obtained by loading the patch file into the memory is used as the start position of the memory address indicated by the source src, and the size (i.e., the number of bytes) of the repaired data structure is n. And copying n bytes of data from the starting position of the memory address pointed by the source src to the starting position of the memory address pointed by the target dest by using a memory copy (memcpy) function. Thus, the coverage of the repaired data structure on the data structure to be repaired is realized through the memory copy. And when the system is executed next time, the memory address is accessed, so that a target function can be called, and the hot repair of the application is realized.
By integrating the target function and the identification of the target function in the hot repair plugin, the application program can acquire the repaired data structure of the target function when loading the hot repair plugin. In the repairing process, functions of different fields in the function do not need to be distinguished, for example, during the operation logic of the repairing function, attention does not need to be paid to which fields in the function are responsible for the operation logic of the function and which fields represent parameters called by the function, only the whole data structure of the function to be repaired needs to be accurately found through the identification of the target function and memory copy is carried out, corresponding hot repairing plug-ins do not need to be respectively developed for applications of different versions, and the compatibility of the applications of different versions to the hot repairing method is further improved.
In a further implementation manner, the patch file may be generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packaging the target function and the identification of the target function to generate a patch file.
Here, the patch file may be generated by a server of the application. The server can compare the new version of the apk (i.e. the repaired version installation package) with the old version of the apk (i.e. the to-be-repaired version installation package) of the to-be-repaired application, mark a function with a difference between the two versions, extract the function with the difference from the new version of the apk as a target function, and then obtain a function name and a class name of the target function as an identifier of the target function, or can configure an identifier for the target function, and can find the data structure corresponding to the target function through the identifier. And placing the target function and the identification of the target function under a specified directory, and packaging to generate a patch file.
Furthermore, the patch file and the file loading method of the patch file can be integrated into the hot repair plugin, so that the repaired data structure of the target function in the patch file can be obtained after the hot repair plugin is loaded, and then the to-be-repaired data structure is replaced based on the repaired data structure of the target function.
With continued reference to FIG. 3, shown is a flow chart of another embodiment of a thermal remediation method according to an application of the present application. The method for thermally repairing an application may be applied to a terminal device having an application to be repaired installed, where the process 300 of the method for thermally repairing an application may include:
In this embodiment, the execution main body of the hot repair method of the application may obtain a hot repair plug-in of the application to be repaired from a server connected to the execution main body through a network. Specifically, after the execution main body starts the application to be repaired, the host program of the application to be repaired may integrate the corresponding SDK. The execution body can read the plug-in list through the SDK and extract the hot repair plug-in from the plug-in list.
The patch file may be a file for repairing the application to be repaired, and may include a function, a class, and the like for implementing a function of the application to be repaired. The file loading method for loading the patch file to repair the application to be repaired may include an implementation logic for loading the patch file, and specifically may include a program code for loading the patch file into the application to be repaired.
Step 301 of the flow 300 of the thermal repair method applied in this embodiment is the same as step 201 of the foregoing embodiment, and the specific implementation manner of step 301 may also refer to the description of step 201, which is not described herein again.
The state information of the application to be repaired may include a version number of the application to be repaired, integrity information, application repair state information, and the like. Repair conditions may be set in advance, and when the state information of the application to be repaired satisfies the preset repair conditions, the thermal repair operation is performed.
Specifically, the preset repair condition may include, but is not limited to, any one of the following: the version number of the application to be repaired is the version number of the currently acquired hot repair plug-in, the integrity information of the application to be repaired represents whether the application to be repaired is complete or not, and the application repair state of the application to be repaired is an unrepaired state or not.
Then, it may be determined whether the version number (VersionCode or VersionName) of the application to be repaired is the version number targeted by the currently acquired hot repair plugin, whether integrity information of the application to be repaired represents that the application to be repaired is complete, whether an application repair state of the application to be repaired is an unrepaired state, and the like.
In some optional implementation manners of this embodiment, a corresponding repair condition may be set in advance according to a current thermal repair plug-in, and the execution main body may obtain the repair condition when obtaining the thermal repair plug-in, so as to determine whether current state information of the application to be repaired satisfies the repair condition.
When the state information of the application to be repaired meets the preset repairing condition, the hot repairing plug-in can be operated to execute the hot repairing operation. Specifically, when the application to be repaired meets the conditions that a version number (versiodincode or versioning name) is a version number targeted by the currently acquired hot repair plugin, integrity information represents whether the application to be repaired is complete, whether an application repair state is an unrepaired state, and the like, it may be determined that the state information of the application to be repaired meets a preset repair condition.
The thermal remediation operation may be performed as follows: and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
For specific implementation and optional implementation of the thermal repair operation, reference may be made to the description of step 202 in the foregoing implementation, and details are not described here.
According to the flow 300 of the application thermal repair method, the thermal repair operation is executed when the repair condition is met by additionally judging the repair condition according to the application state information of the application to be repaired, so that the validity verification of the thermal repair plug-in is realized, the application to be repaired can accurately load the thermal repair plug-in which the bug is repaired, and the success rate of loading the thermal repair plug-in can be increased when the state of the application to be repaired meets the repair condition, so that the success rate of thermal repair is increased.
Referring to FIG. 4, a flow chart of yet another embodiment of a thermal remediation method according to an application of the present application is shown. The application thermal repair method of the present embodiment may be applied to a server of an application (e.g., the server shown in fig. 1). As shown in fig. 4, the process 400 of the thermal repair method for the application of the present embodiment may include the following steps:
In this embodiment, an execution body of the application repairing method may obtain a repaired version apk generated by packaging after an application developer repairs a bug, and compare a difference between the repaired version apk and an unrepaired version apk of an application that has been released on an online platform. And packaging the difference of the two files to generate a patch file.
The application developer can also write implementation logic of a file loading method for loading a patch file to repair the application to be repaired, and integrate the implementation logic of the file loading method and the patch file into a hot repair plug-in of the application to be repaired. Specifically, the implementation logic of the file loading method may be encapsulated to generate a loading method file, the loading method file and the patch file are placed in a specified directory together, and the patch file and the loading method file are read in the specified directory when the hot repair plug-in is loaded by the SDK of the host program, so as to obtain the patch file and the file loading method.
The execution main body can configure information such as an issuing channel and a host version of the thermal restoration plugin, and then issues the thermal restoration plugin to the client side installed with the application to be restored according to the information such as the issuing channel and the host version.
When the client runs the application to be repaired, the host program can load the hot repair plug-in to obtain the patch file and the file loading method, namely the patch file and the file loading method under the specified directory can be read, the file loading method is run to load the patch file into the memory to obtain the corresponding repaired data structure, the data structure to be repaired in the memory is found when the host program of the application to be repaired runs, and the repaired data structure is adopted to replace the data structure to be repaired in the memory, so that the application to be repaired is repaired.
In the process 400 of the application thermal repair method according to the embodiment of the present application, the patch file is generated by comparing the differences of the unrepaired version installation packages of the repaired version installation packages, and the patch file and the configured file loading method for loading the patch file to repair the application to be repaired are integrated into the thermal repair plugin and are issued to the client, so that the client executes the file loading method by loading the thermal repair plugin, and the repaired data structure corresponding to the patch file is used to replace the data structure to be repaired in the memory when the application to be repaired runs, thereby implementing the thermal repair of the application in a plugin manner. Because the patch file and the loading method of the patch file are integrated in the plug-in, the application repair can be realized without changing the SDK of the host program of the client, and the bug repair can be realized for a plurality of times without updating the SDK in an iterative manner, thereby simplifying the hot repair method.
In some optional implementation manners of this embodiment, the step 401 of generating the patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired may include: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packaging the difference function and the identification of the difference function to generate a patch file.
Specifically, the repaired version installation package and the unrepaired version installation package may be compared, and a function having a difference between the repaired version installation package and the unrepaired version installation package may be found as a difference function. And then identifying the difference function, or acquiring a function name and a class name of the difference function as the identification of the difference function, and packaging the identification of the difference function and the identification of the difference function to generate a patch file. Therefore, when the client loads the patch file, the difference function can be loaded into the memory to obtain the corresponding data structure, the data structure of the function to be repaired in the memory is found through the identification of the difference function, and the data structure corresponding to the function to be repaired in the memory is replaced by the data structure corresponding to the difference function. Because the patch file comprises the difference function, the whole data structure of the function can be replaced during repair, the realization logic inside the function does not need to be concerned, and plug-ins do not need to be developed independently for applications of different versions, namely the plug-in for thermal repair can be universally used in the applications of different versions, and the compatibility of the thermal repair method is improved.
With further reference to fig. 5, as an implementation of the above method, the present application provides an embodiment of a thermal repair apparatus applied, which corresponds to the method embodiment shown in fig. 2 or fig. 3, and which can be applied in various electronic devices.
As shown in fig. 5, the applied thermal recovery apparatus 500 of the present embodiment includes an acquisition unit 501 and a loading unit 502. The obtaining unit 501 is configured to obtain a hot repair plug-in of an application to be repaired, where the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; the loading unit 502 is configured to load the thermal repair plug-in, load the patch file into the memory according to a file loading method obtained by loading the thermal repair plug-in to obtain a repaired data structure corresponding to the patch file, and replace a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using the file loading method.
In some embodiments, the patch file may include an objective function for repairing a function to be repaired in the application to be repaired and an identifier of the objective function; and the loading unit 502 may be further configured to replace the to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using a file loading method as follows: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file may be generated based on: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packing the target function and the identifier of the target function to generate a patch file.
In some embodiments, the apparatus 500 may further include: the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and the loading unit 502 may be further configured to load the hot repair plugin in response to the verification unit determining that the state information of the application to be repaired meets the preset repair condition.
It should be understood that the units recited in the apparatus 500 correspond to the various steps in the method described with reference to fig. 2 and 3. Thus, the operations and features described above with respect to the applied thermal remediation method flows 200 and 300 are equally applicable to the apparatus 500 and the units included therein and will not be described again here.
The hot repair apparatus 500 for an application according to the embodiment of the present application obtains a hot repair plug-in of an application to be repaired through an obtaining unit, where the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; the method comprises the steps that a loading unit loads a hot repair plug-in, a patch file is loaded into a memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, the data structure to be repaired in the memory corresponding to the patch file is replaced by the repaired data structure corresponding to the patch file by adopting a file loading method, plug-in application repair is achieved, a host software development kit does not need to be updated in the repair process, and non-perception hot repair can be achieved; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
With continuing reference to fig. 6, as an implementation of the above method, the present application provides another embodiment of a thermal remediation device for use with an embodiment of the apparatus corresponding to the embodiment of the method shown in fig. 4, which may be particularly applicable to a variety of electronic devices.
As shown in fig. 6, the applied thermal remediation device 600 of the present embodiment includes a generation unit 601, an integration unit 602, and a transmission unit 603. The generation unit 601 is configured to generate a patch file according to a difference between a repaired version installation package and an unrepaired version installation package of an application to be repaired; the integration unit 602 is configured to integrate a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the sending unit 603 is configured to send a hot repair plugin of an application to be repaired to the client, where the client obtains a patch file and a file loading method by using the loaded hot repair plugin, loads the patch file into the memory by using the file loading method to obtain a repaired data structure corresponding to the patch file, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating unit 601 may be further configured to generate the patch file as follows: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
It should be understood that the elements described in apparatus 600 correspond to various steps in the method described with reference to fig. 4. Thus, the operations and features described above with respect to the applied thermal remediation method flow 400 are also applicable to the apparatus 600 and the units included therein, and are not described herein again.
The application hot repair apparatus 600 according to the embodiment of the present application generates the patch file by comparing the difference between the very unrepaired version installation packages of the repaired version installation packages, integrates the patch file and the configured file loading method for loading the patch file to repair the application to be repaired into the hot repair plugin, and sends the patch file and the configured file loading method to the client side so that the client side can execute the file loading method by loading the hot repair plugin, thereby implementing the hot repair of the application in a plugin manner. Because the patch file and the loading method of the patch file are integrated in the plug-in, the application repair can be realized without changing the SDK of the host program of the client, and the bug repair can be realized for a plurality of times without updating the SDK iteratively, thereby simplifying the hot repair method.
An embodiment of the present application further provides an electronic device, which includes one or more processors and a storage device. The storage device is configured to store one or more programs which, when executed by the one or more processors, cause the one or more processors to implement the method for thermal remediation of an application described above with reference to fig. 2, 3, or 4.
Referring now to FIG. 7, shown is a block diagram of a computer system 700 suitable for use in implementing an electronic device of an embodiment of the present application. The electronic device shown in fig. 7 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present application.
As shown in fig. 7, the computer system 700 includes a Central Processing Unit (CPU) 701, which can perform various appropriate actions and processes in accordance with a program stored in a Read Only Memory (ROM) 702 or a program loaded from a storage section 708 into a Random Access Memory (RAM) 703. In the RAM 703, various programs and data necessary for the operation of the system 700 are also stored. The CPU 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input/output (I/O) interface 705 is also connected to bus 704.
The following components are connected to the I/O interface 705: an input portion 706 including a keyboard, a mouse, and the like; an output section 705 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section 708 including a hard disk and the like; and a communication section 709 including a network interface card such as a LAN card, a modem, or the like. The communication section 709 performs communication processing via a network such as the internet. A drive 710 is also connected to the I/O interface 705 as needed. A removable medium 711 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 710 as necessary, so that a computer program read out therefrom is mounted into the storage section 708 as necessary.
In particular, the processes described above with reference to the flow diagrams may be implemented as computer software programs, according to embodiments of the present disclosure. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication section 709, and/or installed from the removable medium 711. The computer program performs the above-described functions defined in the method of the present application when executed by the Central Processing Unit (CPU) 701. It should be noted that the computer readable medium of the present application can be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In this application, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations for aspects of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, smalltalk, C + +, or the like, as well as conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units described in the embodiments of the present application may be implemented by software or hardware. The described units may also be provided in a processor, which may be described as: a processor includes an acquisition unit and a loading unit. Or may be described as: a processor includes a generation unit, an integration unit, and a transmission unit. The names of these units do not in some cases form a limitation on the unit itself, and for example, the acquisition unit may also be described as a "unit that acquires a thermal repair plug-in of an application to be repaired".
As another aspect, the present application also provides a computer-readable medium, which may be contained in the apparatus described in the above embodiments; or may be present separately and not assembled into the device. The computer readable medium carries one or more programs which, when executed by the apparatus, cause the apparatus to: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
The present application also provides a computer readable medium, which may be contained in the apparatus described in the above embodiments; or may be separate and not assembled into the device. The computer readable medium carries one or more programs which, when executed by the apparatus, cause the apparatus to: generating a patch file according to the difference between a repaired version installation package and an unrepaired version installation package of an application to be repaired; integrating a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the method comprises the steps of sending a hot repair plug-in of an application to be repaired to a client, obtaining a patch file and a file loading method by the client through loading the hot repair plug-in, loading the patch file into a memory through the file loading method to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
The foregoing description is only exemplary of the preferred embodiments of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements in which any combination of the features described above or their equivalents does not depart from the spirit of the invention disclosed above. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (12)
1. A method of thermal remediation of an application, comprising:
acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired;
loading the hot repair plugin, loading the patch file into a memory according to the file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replacing a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting the file loading method;
the patch file comprises a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function;
the replacing, by using the file loading method, the to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file includes:
and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
2. The method of claim 1, wherein the patch file is generated based on:
extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
and packaging the target function and the identifier of the target function to generate the patch file.
3. The method according to any one of claims 1-2, wherein the method further comprises:
acquiring the state information of the application to be repaired, and judging whether the state information of the application to be repaired meets a preset repairing condition; and
the loading the thermal repair insert, comprising: and loading the hot repair plug-in response to the fact that the state information of the application to be repaired meets the preset repair condition.
4. A method of thermal remediation of an application, comprising:
generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
integrating the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired;
sending a hot-repair plug-in of the application to be repaired to a client, wherein the client acquires the patch file and the file loading method by loading the hot-repair plug-in, loads the patch file into a memory by using the file loading method to obtain a repaired data structure corresponding to the patch file, replaces the repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file, wherein the patch file comprises a target function for repairing the function to be repaired in the application to be repaired and an identifier of the target function, finds out a memory address of the data structure of the corresponding function to be repaired according to the identifier of the target function, and copies the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by using a memory copy method.
5. The method of claim 4, wherein the generating a patch file according to a difference between a repaired version installation package and an unrepaired version installation package of the application to be repaired comprises:
comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function;
and packaging the difference function and the identification of the difference function to generate the patch file.
6. A thermal remediation device for use comprising:
the device comprises an acquisition unit and a processing unit, wherein the acquisition unit is configured to acquire a hot repair plugin of an application to be repaired, and the hot repair plugin is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired;
the loading unit is configured to load the hot repair plugin, load the patch file into a memory according to the file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replace a data structure to be repaired in the memory corresponding to the patch file with the repaired data structure corresponding to the patch file by adopting the file loading method;
the patch file comprises a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function; and
the loading unit is configured to replace a data structure to be repaired in the memory, which corresponds to the patch file, with a repaired data structure corresponding to the patch file by using the file loading method as follows:
and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
7. The apparatus of claim 6, wherein the patch file is generated based on:
extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
and packaging the target function and the identifier of the target function to generate the patch file.
8. The apparatus of any of claims 6-7, wherein the apparatus further comprises:
the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and
the loading unit is configured to load the hot repair plugin in response to the verification unit determining that the state information of the application to be repaired meets a preset repair condition.
9. A thermal remediation device for use comprising:
the generating unit is configured to generate a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
the integration unit is configured to integrate the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired;
the client obtains the patch file and the file loading method by adopting the hot repair plugin, obtains a repaired data structure corresponding to the patch file by adopting the file loading method to load the patch file into a memory, replaces the repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file, wherein the patch file comprises a target function for repairing the function to be repaired in the application to be repaired and an identification of the target function, finds out a memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copies the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
10. The apparatus of claim 9, wherein the generating unit is configured to generate the patch file as follows:
comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function;
and packaging the difference function and the identifier of the difference function to generate the patch file.
11. An electronic device, comprising:
one or more processors;
a storage device for storing one or more programs,
when executed by the one or more processors, cause the one or more processors to implement the method of any one of claims 1-5.
12. A computer-readable medium, on which a computer program is stored, wherein the program, when executed by a processor, implements the method of any one of claims 1-5.
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| CN113835741A (en) * | 2020-06-24 | 2021-12-24 | 中兴通讯股份有限公司 | Patch loading method, network element and computer readable storage medium |
| CN112068903B (en) * | 2020-09-21 | 2024-05-03 | 深圳市欢太科技有限公司 | Application program loading method, application program loading device, medium and equipment |
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