CN111078262A - Application thermal restoration method and device - Google Patents
Application thermal restoration method and device Download PDFInfo
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- CN111078262A CN111078262A CN201811212976.XA CN201811212976A CN111078262A CN 111078262 A CN111078262 A CN 111078262A CN 201811212976 A CN201811212976 A CN 201811212976A CN 111078262 A CN111078262 A CN 111078262A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/65—Updates
- G06F8/656—Updates while running
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/50—Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems
- G06F21/57—Certifying or maintaining trusted computer platforms, e.g. secure boots or power-downs, version controls, system software checks, secure updates or assessing vulnerabilities
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The embodiment of the application discloses a thermal restoration method and device for an application, an electronic device and a computer readable medium. One specific embodiment of the thermal restoration method for the application comprises the following steps: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method. According to the implementation mode, the host software development kit does not need to be updated in the repairing process, and the imperceptible hot repairing can be realized; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
Description
Technical Field
The embodiment of the application relates to the technical field of computers, in particular to the technical field of software repair, and particularly relates to a hot repair method and device for an application.
Background
The android application repair technology is a technology for accurately realizing the functions of an application by repairing the vulnerabilities of the application. The hot repair technology is a technology for realizing bug repair by pulling the patch package without reinstalling the application software package in the repair process.
The current hot repair technology mainly adopts a real-time hot repair technology based on code repair or a cold start repair technology through a Java loading mechanism. The real-time hot repair technology based on code repair has certain compatibility problems due to the fact that the technology relates to replacement of logic fields or specific parameters of specific methods of the android platform, and the cold start repair technology based on the Java loading mechanism can take effect only after cold start and cannot meet real-time and imperceptible repair requirements.
Disclosure of Invention
The embodiment of the application provides a thermal restoration method and device for an application, an electronic device and a computer readable medium.
In a first aspect, an embodiment of the present application provides a thermal repair method for an application, including: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
In some embodiments, the patch file includes a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function; replacing a data structure to be repaired corresponding to the patch file in the memory with a repaired data structure corresponding to the patch file by adopting a file loading method, wherein the method comprises the following steps: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file is generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packing the target function and the identifier of the target function to generate a patch file.
In some embodiments, the above method further comprises: acquiring state information of an application to be repaired, and judging whether the state information of the application to be repaired meets a preset repairing condition; and loading a thermal repair insert, comprising: and loading the hot repair plug-in response to determining that the state information of the application to be repaired meets the preset repair condition.
In a second aspect, an embodiment of the present application provides a thermal repair method for an application, including: generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; integrating a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the method comprises the steps of sending a hot repair plug-in of an application to be repaired to a client, obtaining a patch file and a file loading method by the client through loading the hot repair plug-in, loading the patch file into a memory through the file loading method to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating a patch file according to a difference between a repaired version installation package and an unrepaired version installation package of an application to be repaired includes: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
In a third aspect, an embodiment of the present application provides an applied thermal repair device, including: the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is configured to acquire a hot repair plug-in of an application to be repaired, and the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and the loading unit is configured to load the thermal restoration plug-in, load the patch file into the memory according to a file loading method obtained by loading the thermal restoration plug-in to obtain a restored data structure corresponding to the patch file, and replace the data structure to be restored corresponding to the patch file in the memory with the restored data structure corresponding to the patch file by adopting the file loading method.
In some embodiments, the patch file includes a target function for repairing a function to be repaired in the application to be repaired and an identifier of the target function; and the loading unit is further configured to replace the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using a file loading method as follows: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file is generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packing the target function and the identifier of the target function to generate a patch file.
In some embodiments, the above apparatus further comprises: the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and the loading unit is further configured to load the hot repair plug-in response to the verification unit determining that the state information of the application to be repaired meets the preset repair condition.
In a fourth aspect, an embodiment of the present application provides an applied thermal repair device, including: the generating unit is configured to generate a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; the integrated unit is configured to integrate a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the client acquires a patch file and a file loading method by adopting the loaded hot repair plug-in, loads the patch file into the memory by adopting the file loading method to obtain a repaired data structure corresponding to the patch file, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating unit is further configured to generate the patch file as follows: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
In a fifth aspect, an embodiment of the present application provides an electronic device, including: one or more processors; a storage device for storing one or more programs which, when executed by one or more processors, cause the one or more processors to implement the method of thermal remediation of an application as provided in the first or second aspect.
In a sixth aspect, the present application provides a computer readable medium, on which a computer program is stored, where the program, when executed by a processor, implements the thermal remediation method for the application provided in the first or second aspect.
The application hot repair method and device, the electronic device and the computer readable medium according to the embodiments of the present application obtain the hot repair plugin of the application to be repaired, where the hot repair plugin is generated from the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; loading a hot repair plug-in, loading a patch file into a memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting the file loading method, so that plug-in application repair is realized, a host software development kit does not need to be updated in the repair process, and real-time and sensorless hot repair can be realized; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is an exemplary system architecture diagram to which embodiments of the present application may be applied;
FIG. 2 is a flow chart of one embodiment of a thermal remediation method according to an application of the present application;
FIG. 3 is a flow chart of another embodiment of a thermal remediation method according to an application of the present application;
FIG. 4 is a flow chart of yet another embodiment of a thermal remediation method according to an application of the present application;
FIG. 5 is a schematic structural view of one embodiment of a thermal remediation device for use with the present application;
FIG. 6 is a schematic structural view of one embodiment of a thermal remediation device for use with the present application;
FIG. 7 is a block diagram of a computer system suitable for use in implementing the electronic device of an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 illustrates an exemplary system architecture 100 of a thermal remediation device to which the applied thermal remediation method or application of the present application may be applied.
As shown in fig. 1, the system architecture 100 may include terminal devices 101, 102, 103, a network 104, and a server 105. The network 104 serves as a medium for providing communication links between the terminal devices 101, 102, 103 and the server 105. The network may include various connection types, such as wired, wireless communication links, or fiber optic cables, to name a few.
The terminal devices 101, 102, 103 may interact with the server 105 via the network 104 to receive or send messages or the like. Various applications, such as a search application, a life service application, a social platform application, a shooting application, etc., may be installed on the terminal devices 101, 102, 103.
The terminal devices 101, 102, 103 may be various electronic devices that support internet access including, but not limited to, smart speakers, smart phones, tablet computers, smart watches, notebook computers, laptop laptops, e-book readers, etc. Terminal devices 101, 102, 103 may be electronic devices that support the android system.
The application thermal recovery method provided by the embodiment of the application can be executed by the terminal device 101, 102, 103 or the server 105, and accordingly, the application thermal recovery device can be disposed in the terminal device 101, 102, 103 or the server 105.
It should be understood that the number of terminal devices, networks, servers in fig. 1 is merely illustrative. There may be any number of terminal devices, networks, servers, as desired for implementation.
With continued reference to FIG. 2, a flow 200 of one embodiment of a thermal remediation method in accordance with an application of the present application is illustrated. The thermal restoration method of the application comprises the following steps:
In this embodiment, the execution subject of the hot repair method for the application may be a terminal device, for example (the terminal device shown in fig. 1), where the application to be repaired is installed, and the execution subject may obtain a hot repair plug-in of the application to be repaired from a server connected to the execution subject through a network. The hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired.
The host program of the application to be repaired (i.e., the application program of the application to be repaired) may integrate a corresponding SDK (Software Development Kit), and the execution subject may pull the plug-in list through the SDK of the host program and extract the hot repair plug-in from the plug-in list.
The patch file may be a file for repairing the application to be repaired, and may include a function, a class, and the like for implementing a function of the application to be repaired. The patch file may be generated from fix code written by an application developer to fix the vulnerability of the application, which may include class replacement code and/or function replacement code.
In this embodiment, a file loading method for loading a patch file to repair an application to be repaired may be integrated with the patch file into a hot repair plug-in of the application to be repaired in advance. The file loading method for loading the patch file to repair the application to be repaired may include an implementation logic for loading the patch file, and specifically may include a program code for loading the patch file into the application to be repaired. In this way, the execution main body of the application hot repair method of the embodiment may obtain the hot repair plug-in integrated with the loading method of the patch file.
In an actual scenario, an application server may issue a hot repair plugin including a patch file and a loading method of the patch file to a client installed with the application through a configured issuing channel, and the client may receive the hot repair plugin. Or, the client may automatically detect whether the application version is updated, and if so, may initiate a plug-in acquisition request to the server, and receive a hot repair plug-in issued by the server of the application in response to the acquisition request.
In this embodiment, in the running process of the host program, the hot repair plug-in may be loaded through the SDK of the host program to obtain the patch file and the file loading method of the patch file. The obtained file loading method of the patch file can be adopted to load the patch file.
Specifically, the patch file may be loaded into the memory by using a file loading method obtained by loading the hot repair plug-in, so as to obtain a data structure corresponding to the patch file, which is used as the repaired data structure. And searching a data structure to be repaired corresponding to the patch file in the memory by adopting a file loading method obtained by loading the hot repair plug-in, replacing the corresponding data structure to be repaired by using the repaired data structure, namely writing the repaired data structure into the memory, and removing the data structure to be repaired from the memory. Thus, when a method or parameter in the patch file needs to be called after the application is repaired, the corresponding repaired data structure can be accessed to execute the corresponding method or read the corresponding parameter.
It should be noted that the data structure to be repaired corresponding to the patch file may be a data structure corresponding to the patch data in the patch file in the memory before applying repair. The repaired structure corresponding to the patch file may be a data structure obtained by loading the patch file into the memory after the application is started. The data structure can be an array, a stack, a queue, a linked list and the like, the data structure to be repaired is the same as the repaired data structure in category, and therefore the repaired data structure in the same category can be adopted to replace the data structure to be repaired corresponding to the patch file in the memory, and consistency of the data structure in the memory before and after replacement is guaranteed.
In the hot repair method for the application according to the embodiment of the application, after the host program integrates the corresponding SDKs, when a bug needing to be repaired is found, all hot repair functions are integrated in the plug-in by integrating the patch file in the hot repair plug-in and the file loading method of the patch file, so that the SDKs of the host program can be loaded without reissuing a new SDK package. When other bugs are repaired subsequently, the file loading method in the hot repair plug-in can be adjusted, the SDK of the host program does not need to be changed, the hot repair process is simplified, the repair can be enabled to take effect without restarting the application, and real-time and non-perception hot repair can be realized.
The application hot repair method of the embodiment of the application realizes repair by replacing the data structure to be repaired in the memory when the application is running, does not need to consider different organization modes in the data structures of different application versions, has good version compatibility, and can improve the success rate of hot repair.
In some optional implementation manners of this embodiment, the patch file may include an objective function used for repairing a function to be repaired in the application to be repaired and an identifier of the objective function. The mark of the target function can be composed of a function name and a class name to which the function belongs; or the target function may be an identification configured for the target function when the patch package is generated. The identification of the target function may be used to identify the class and function pointed to by the data structure obtained after the patch file is loaded into memory.
At this time, the replacing, by the file loading method, the to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file may include: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
Specifically, the start address of the data structure of the corresponding function to be repaired in the memory may be found according to the identifier of the target function, then the start address is used as the start position of the memory address indicated by the target dest, the memory start address of the repaired data structure obtained by loading the patch file into the memory is used as the start position of the memory address indicated by the source src, and the size (i.e., the number of bytes) of the repaired data structure is n. And copying n bytes of data from the starting position of the memory address pointed by the source src to the starting position of the memory address pointed by the target dest by using a memory copy (memcpy) function. Thus, the coverage of the repaired data structure on the data structure to be repaired is realized through the memory copy. And when the system is executed next time, the memory address is accessed, so that a target function can be called, and the hot repair of the application is realized.
By integrating the target function and the identification of the target function in the hot repair plugin, the application program can acquire the repaired data structure of the target function when loading the hot repair plugin. In the repairing process, functions of different fields in the function do not need to be distinguished, for example, during the operation logic of the repairing function, the operation logic of the function does not need to be concerned about which fields in the function are responsible for the operation logic of the function and which fields represent parameters called by the function, only the whole data structure of the function to be repaired needs to be accurately found through the identification of the target function and memory copy is carried out, corresponding hot repairing plug-ins do not need to be respectively developed for applications of different versions, and the compatibility of the applications of different versions to the hot repairing method is further improved.
In a further implementation manner, the patch file may be generated based on the following manner: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packing the target function and the identifier of the target function to generate a patch file.
Here, the patch file may be generated by a server of the application. The server may compare a new version of apk (i.e., a repaired version of an installation package) with an old version of apk (i.e., a to-be-repaired version of an installation package) of an application to be repaired, mark a function having a difference between the two versions, extract the function having the difference from the new version of apk as a target function, and then obtain a function name and a class name of the target function as an identifier of the target function, or may configure an identifier for the target function, and may find a data structure corresponding to the target function through the identifier. And placing the target function and the identification of the target function under a specified directory, and packaging to generate a patch file.
Furthermore, the patch file and the file loading method of the patch file can be integrated into the hot repair plugin, so that the repaired data structure of the target function in the patch file can be obtained after the hot repair plugin is loaded, and then the to-be-repaired data structure is replaced based on the repaired data structure of the target function.
With continued reference to FIG. 3, shown is a flow chart of another embodiment of a thermal remediation method according to an application of the present application. The method for thermally repairing an application may be applied to a terminal device having an application to be repaired installed, where the process 300 of the method for thermally repairing an application may include:
In this embodiment, the execution main body of the hot repair method of the application may obtain a hot repair plug-in of the application to be repaired from a server connected to the execution main body through a network. Specifically, after the execution main body starts the application to be repaired, the host program of the application to be repaired may integrate the corresponding SDK. The execution body can read the plug-in list through the SDK and extract the hot repair plug-in from the plug-in list.
The patch file may be a file for repairing the application to be repaired, and may include a function, a class, and the like for implementing a function of the application to be repaired. The file loading method for loading the patch file to repair the application to be repaired may include an implementation logic for loading the patch file, and specifically may include a program code for loading the patch file into the application to be repaired.
Step 301 of the flow 300 of the thermal recovery method applied in this embodiment is the same as step 201 of the foregoing embodiment, and the specific implementation manner of step 301 may also refer to the description of step 201, which is not described herein again.
The state information of the application to be repaired may include a version number of the application to be repaired, integrity information, application repair state information, and the like. Repair conditions may be preset, and when the state information of the application to be repaired satisfies the preset repair conditions, a hot repair operation is performed.
Specifically, the preset repair condition may include, but is not limited to, any one of the following: the version number of the application to be repaired is the version number of the currently acquired hot repair plug-in, the integrity information of the application to be repaired represents whether the application to be repaired is complete or not, and the application repair state of the application to be repaired is an unrepaired state or not.
Then, it may be determined whether the version number (VersionCode or VersionName) of the application to be repaired is the version number targeted by the currently acquired hot repair plugin, whether integrity information of the application to be repaired represents that the application to be repaired is complete, whether an application repair state of the application to be repaired is an unrepaired state, and the like.
In some optional implementation manners of this embodiment, a corresponding repair condition may be set in advance according to a current thermal repair plug-in, and the execution main body may obtain the repair condition when obtaining the thermal repair plug-in, so as to determine whether current state information of the application to be repaired satisfies the repair condition.
When the state information of the application to be repaired meets the preset repairing condition, the hot repairing plug-in can be operated to execute the hot repairing operation. Specifically, when the application to be repaired meets the conditions that the version number (versioning code or versioning name) is the version number of the currently acquired hot repair plugin, the integrity information represents whether the application to be repaired is complete, whether the application repair state is an unrepaired state, and the like, it may be determined that the state information of the application to be repaired meets the preset repair condition.
The thermal remediation operation may be performed as follows: and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
For specific implementation and optional implementation of the thermal repair operation, reference may be made to the description of step 202 in the foregoing implementation, and details are not described here.
According to the flow 300 of the application thermal repair method, the thermal repair operation is executed when the repair condition is met by additionally judging the repair condition according to the application state information of the application to be repaired, so that the validity verification of the thermal repair plug-in is realized, the application to be repaired can accurately load the thermal repair plug-in which the bug is repaired, and the success rate of loading the thermal repair plug-in can be increased when the state of the application to be repaired meets the repair condition, so that the success rate of thermal repair is increased.
Referring to FIG. 4, a flow chart of yet another embodiment of a thermal remediation method according to an application of the present application is shown. The application thermal repair method of the present embodiment may be applied to a server of an application (e.g., the server shown in fig. 1). As shown in fig. 4, the flow 400 of the thermal repair method for the application of the present embodiment may include the following steps:
In this embodiment, an execution body of the application repairing method may obtain a repaired version apk generated by packaging after an application developer repairs a bug, and compare a difference between the repaired version apk and an unrepaired version apk of an application that has been released on an online platform. And packaging the difference of the two files to generate a patch file.
The application developer can also write implementation logic of a file loading method for loading a patch file to repair the application to be repaired, and integrate the implementation logic of the file loading method and the patch file into a hot repair plug-in of the application to be repaired. Specifically, the implementation logic of the file loading method may be encapsulated to generate a loading method file, the loading method file and the patch file are placed in a specified directory together, and the patch file and the loading method file are read in the specified directory when the hot repair plug-in is loaded by the SDK of the host program, so as to obtain the patch file and the file loading method.
The execution main body can configure information such as an issuing channel and a host version of the thermal restoration plugin, and then issues the thermal restoration plugin to the client side installed with the application to be restored according to the information such as the issuing channel and the host version.
When the client runs the application to be repaired, the host program can load the hot repair plug-in to obtain the patch file and the file loading method, namely the patch file and the file loading method under the specified directory can be read, the file loading method is run to load the patch file into the memory to obtain the corresponding repaired data structure, the data structure to be repaired in the memory is found when the host program of the application to be repaired runs, and the repaired data structure is adopted to replace the data structure to be repaired in the memory, so that the application to be repaired is repaired.
In the process 400 of the application thermal repair method according to the embodiment of the present application, the patch file is generated by comparing the differences of the unrepaired version installation packages of the repaired version installation packages, and the patch file and the configured file loading method for loading the patch file to repair the application to be repaired are integrated into the thermal repair plugin and are issued to the client, so that the client executes the file loading method by loading the thermal repair plugin, and the repaired data structure corresponding to the patch file is used to replace the data structure to be repaired in the memory when the application to be repaired runs, thereby implementing the thermal repair of the application in a plugin manner. Because the patch file and the loading method of the patch file are integrated in the plug-in, the application repair can be realized without changing the SDK of the host program of the client, and the bug repair can be realized for a plurality of times without updating the SDK in an iterative manner, thereby simplifying the hot repair method.
In some optional implementation manners of this embodiment, the step 401 of generating the patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired may include: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
Specifically, the repaired version installation package and the unrepaired version installation package may be compared, and a function having a difference between the repaired version installation package and the unrepaired version installation package may be found as a difference function. And then identifying the difference function, or acquiring a function name and a class name of the difference function as the identification of the difference function, and packaging the identification of the difference function and the identification of the difference function to generate a patch file. Therefore, when the client loads the patch file, the difference function can be loaded into the memory to obtain the corresponding data structure, the data structure of the function to be repaired in the memory is found through the identification of the difference function, and the data structure corresponding to the function to be repaired in the memory is replaced by the data structure corresponding to the difference function. Because the patch file contains the difference function, the whole data structure of the function can be replaced during repair, the realization logic inside the function does not need to be concerned, and plug-ins do not need to be developed independently for the applications of different versions, namely the plug-in for thermal repair can be universally used in the applications of different versions, and the compatibility of the thermal repair method is improved.
With further reference to fig. 5, as an implementation of the above method, the present application provides an embodiment of a thermal repair apparatus applied, which corresponds to the method embodiment shown in fig. 2 or fig. 3, and which can be applied in various electronic devices.
As shown in fig. 5, the thermal remedying apparatus 500 applied in the present embodiment includes an acquiring unit 501 and a loading unit 502. The obtaining unit 501 is configured to obtain a hot repair plug-in of an application to be repaired, where the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; the loading unit 502 is configured to load the thermal repair plug-in, load the patch file into the memory according to a file loading method obtained by loading the thermal repair plug-in to obtain a repaired data structure corresponding to the patch file, and replace a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using the file loading method.
In some embodiments, the patch file may include an objective function for repairing a function to be repaired in the application to be repaired and an identifier of the objective function; and the loading unit 502 may be further configured to replace the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by using a file loading method as follows: and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
In some embodiments, the patch file may be generated based on: extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; and packing the target function and the identifier of the target function to generate a patch file.
In some embodiments, the apparatus 500 may further include: the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and the loading unit 502 may be further configured to load the thermal repair plug-in response to the verification unit determining that the state information of the application to be repaired satisfies the preset repair condition.
It should be understood that the elements recited in apparatus 500 correspond to various steps in the methods described with reference to fig. 2 and 3. Thus, the operations and features described above with respect to the applied thermal remediation method flows 200 and 300 are equally applicable to the apparatus 500 and the units included therein and will not be described again here.
The hot repair apparatus 500 for an application according to the embodiment of the present application obtains a hot repair plug-in of an application to be repaired through an obtaining unit, where the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; the method comprises the steps that a loading unit loads a hot repair plug-in, a patch file is loaded into a memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, the data structure to be repaired in the memory corresponding to the patch file is replaced by the repaired data structure corresponding to the patch file by adopting a file loading method, plug-in application repair is achieved, a host software development kit does not need to be updated in the repair process, and non-perception hot repair can be achieved; the data structure in the memory is replaced for repair, so that good compatibility and high success rate can be achieved.
With continuing reference to fig. 6, as an implementation of the above method, the present application provides another embodiment of a thermal remediation device for use with an embodiment of the apparatus corresponding to the embodiment of the method shown in fig. 4, which may be particularly applicable to a variety of electronic devices.
As shown in fig. 6, the applied thermal restoration apparatus 600 of the present embodiment includes a generation unit 601, an integration unit 602, and a transmission unit 603. The generation unit 601 is configured to generate a patch file according to a difference between a repaired version installation package and an unrepaired version installation package of an application to be repaired; the integration unit 602 is configured to integrate a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the sending unit 603 is configured to send a hot repair plugin of an application to be repaired to the client, where the client obtains a patch file and a file loading method by using the loaded hot repair plugin, loads the patch file into the memory by using the file loading method to obtain a repaired data structure corresponding to the patch file, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
In some embodiments, the generating unit 601 may be further configured to generate the patch file as follows: comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function; and packing the difference function and the identifier of the difference function to generate a patch file.
It should be understood that the elements described in apparatus 600 correspond to various steps in the method described with reference to fig. 4. Thus, the operations and features described above with respect to the applied thermal remediation method flow 400 are also applicable to the apparatus 600 and the units included therein, and are not described herein again.
The device 600 for thermal restoration of an application according to the embodiment of the present application generates a patch file by comparing differences between very unrepaired version installation packages of repaired version installation packages, integrates the patch file and a configured file loading method for loading the patch file to restore an application to be restored into a thermal restoration plugin, and issues the patch file and the configured file loading method to a client to enable the client to execute the file loading method by loading the thermal restoration plugin, so that the thermal restoration of the application can be realized in a plugin manner. Because the patch file and the loading method of the patch file are integrated in the plug-in, the application repair can be realized without changing the SDK of the host program of the client, and the bug repair can be realized for a plurality of times without updating the SDK in an iterative manner, thereby simplifying the hot repair method.
An embodiment of the present application further provides an electronic device including one or more processors and a storage device. The storage device is configured to store one or more programs which, when executed by the one or more processors, cause the one or more processors to implement the method for thermal remediation of an application described above with reference to fig. 2, 3, or 4.
Referring now to FIG. 7, shown is a block diagram of a computer system 700 suitable for use in implementing the electronic device of an embodiment of the present application. The electronic device shown in fig. 7 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present application.
As shown in fig. 7, the computer system 700 includes a Central Processing Unit (CPU)701, which can perform various appropriate actions and processes in accordance with a program stored in a Read Only Memory (ROM)702 or a program loaded from a storage section 708 into a Random Access Memory (RAM) 703. In the RAM 703, various programs and data necessary for the operation of the system 700 are also stored. The CPU 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input/output (I/O) interface 705 is also connected to bus 704.
The following components are connected to the I/O interface 705: an input portion 706 including a keyboard, a mouse, and the like; an output section 705 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section 708 including a hard disk and the like; and a communication section 709 including a network interface card such as a LAN card, a modem, or the like. The communication section 709 performs communication processing via a network such as the internet. A drive 710 is also connected to the I/O interface 705 as needed. A removable medium 711 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 710 as necessary, so that a computer program read out therefrom is mounted into the storage section 708 as necessary.
In particular, according to an embodiment of the present disclosure, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication section 709, and/or installed from the removable medium 711. The computer program, when executed by a Central Processing Unit (CPU)701, performs the above-described functions defined in the method of the present application. It should be noted that the computer readable medium of the present application can be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In this application, however, a computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
Computer program code for carrying out operations for aspects of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C + +, or the like, as well as conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units described in the embodiments of the present application may be implemented by software or hardware. The described units may also be provided in a processor, and may be described as: a processor includes an acquisition unit and a loading unit. Or may be described as: a processor includes a generation unit, an integration unit, and a transmission unit. The names of these units do not in some cases form a limitation on the unit itself, and for example, the acquisition unit may also be described as a "unit that acquires a thermal repair plug-in of an application to be repaired".
As another aspect, the present application also provides a computer-readable medium, which may be contained in the apparatus described in the above embodiments; or may be present separately and not assembled into the device. The computer readable medium carries one or more programs which, when executed by the apparatus, cause the apparatus to: acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired; and loading the hot repair plug-in, loading the patch file into the memory according to a file loading method obtained by loading the hot repair plug-in to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting a file loading method.
The present application also provides a computer readable medium, which may be contained in the apparatus described in the above embodiments; or may be present separately and not assembled into the device. The computer readable medium carries one or more programs which, when executed by the apparatus, cause the apparatus to: generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired; integrating a patch file of an application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired; the method comprises the steps of sending a hot repair plug-in of an application to be repaired to a client, obtaining a patch file and a file loading method by the client through loading the hot repair plug-in, loading the patch file into a memory through the file loading method to obtain a repaired data structure corresponding to the patch file, and replacing the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (14)
1. A method of thermal remediation of an application, comprising:
acquiring a hot repair plug-in of an application to be repaired, wherein the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired;
and loading the hot repair plugin, loading the patch file into a memory according to the file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replacing a data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file by adopting the file loading method.
2. The method according to claim 1, wherein the patch file comprises an objective function for repairing a function to be repaired in the application to be repaired and an identification of the objective function;
the replacing, by using the file loading method, the to-be-repaired data structure corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file includes:
and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
3. The method of claim 2, wherein the patch file is generated based on:
extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
and packaging the target function and the identifier of the target function to generate the patch file.
4. The method according to any one of claims 1-3, wherein the method further comprises:
acquiring the state information of the application to be repaired, and judging whether the state information of the application to be repaired meets a preset repairing condition; and
the loading the thermal repair insert, comprising: and loading the hot repair plug-in response to the fact that the state information of the application to be repaired meets the preset repair condition.
5. A method of thermal remediation of an application, comprising:
generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
integrating the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired;
and sending the hot repair plug-in of the application to be repaired to a client, wherein the client acquires the patch file and the file loading method by loading the hot repair plug-in, loads the patch file into a memory by adopting the file loading method to obtain a repaired data structure corresponding to the patch file, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
6. The method of claim 5, wherein the generating a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired comprises:
comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function;
and packaging the difference function and the identifier of the difference function to generate the patch file.
7. A thermal remediation device for use comprising:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is configured to acquire a hot repair plug-in of an application to be repaired, and the hot repair plug-in is generated by a patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired;
the loading unit is configured to load the hot repair plugin, load the patch file into the memory according to the file loading method obtained by loading the hot repair plugin to obtain a repaired data structure corresponding to the patch file, and replace a data structure to be repaired in the memory corresponding to the patch file with the repaired data structure corresponding to the patch file by using the file loading method.
8. The apparatus according to claim 7, wherein the patch file includes an objective function for repairing a function to be repaired in the application to be repaired and an identification of the objective function; and
the loading unit is further configured to replace the data structure to be repaired in the memory corresponding to the patch file with the repaired data structure corresponding to the patch file by using the file loading method as follows:
and finding out the memory address of the data structure of the corresponding function to be repaired according to the identification of the target function, and copying the repaired data structure to the memory address of the data structure corresponding to the function to be repaired by adopting a memory copying mode.
9. The apparatus of claim 7, wherein the patch file is generated based on:
extracting a target function for repairing a function to be repaired in the application to be repaired according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
and packaging the target function and the identifier of the target function to generate the patch file.
10. The apparatus of any of claims 7-9, wherein the apparatus further comprises:
the verification unit is configured to acquire the state information of the application to be repaired and judge whether the state information of the application to be repaired meets a preset repair condition; and
the loading unit is further configured to load the hot repair plugin in response to the verification unit determining that the state information of the application to be repaired meets a preset repair condition.
11. A thermal remediation device for use comprising:
the generating unit is configured to generate a patch file according to the difference between the repaired version installation package and the unrepaired version installation package of the application to be repaired;
the integration unit is configured to integrate the patch file of the application to be repaired and a file loading method for loading the patch file to repair the application to be repaired into a hot repair plug-in of the application to be repaired;
the client acquires the patch file and the file loading method by adopting loading of the hot repair plugin, obtains a repaired data structure corresponding to the patch file by adopting the file loading method to load the patch file into a memory, and replaces the data structure to be repaired corresponding to the patch file in the memory with the repaired data structure corresponding to the patch file.
12. The apparatus of claim 11, wherein the generating unit is further configured to generate a patch file as follows:
comparing the repaired version installation package and the unrepaired version installation package of the application to be repaired to obtain a difference function;
and packaging the difference function and the identifier of the difference function to generate the patch file.
13. An electronic device, comprising:
one or more processors;
a storage device for storing one or more programs,
when executed by the one or more processors, cause the one or more processors to implement the method of any one of claims 1-6.
14. A computer-readable medium, on which a computer program is stored, wherein the program, when executed by a processor, implements the method of any one of claims 1-6.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111752735A (en) * | 2020-05-22 | 2020-10-09 | 网宿科技股份有限公司 | SDK (software development kit) abnormity troubleshooting method and device and computer readable storage medium |
| CN112068903A (en) * | 2020-09-21 | 2020-12-11 | 深圳市欢太科技有限公司 | Application loading method, application loading device, medium and equipment |
| CN112650521A (en) * | 2020-12-28 | 2021-04-13 | 北京字节跳动网络技术有限公司 | Software development kit SDK (software development kit) hot repair method and device and electronic equipment |
| CN112667521A (en) * | 2021-01-19 | 2021-04-16 | 北京字节跳动网络技术有限公司 | Thermal restoration method and device |
| CN112905220A (en) * | 2021-03-16 | 2021-06-04 | 北京字节跳动网络技术有限公司 | Thermal restoration method, device, equipment and storage medium |
| WO2021259109A1 (en) * | 2020-06-24 | 2021-12-30 | 中兴通讯股份有限公司 | Patch loading method, network element, and computer-readable storage medium |
| CN116257853A (en) * | 2023-05-15 | 2023-06-13 | 北京赛博昆仑科技有限公司 | Method and device for defending system vulnerabilities by using runtime memory patches |
| CN112068903B (en) * | 2020-09-21 | 2024-05-03 | 深圳市欢太科技有限公司 | Application program loading method, application program loading device, medium and equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140053145A1 (en) * | 2012-08-17 | 2014-02-20 | Tripwire, Inc. | Operating system patching and software update reconciliation |
| CN106095502A (en) * | 2016-06-13 | 2016-11-09 | 北京奇虎科技有限公司 | Hot restorative procedure, device, server and the system of a kind of Android application |
| CN106648724A (en) * | 2016-09-05 | 2017-05-10 | Tcl集团股份有限公司 | Application hotfix method and terminal |
| CN106845245A (en) * | 2016-12-21 | 2017-06-13 | 中国科学院信息工程研究所 | A kind of hot restorative procedure of leak based on Xen virtual platforms |
| CN107273151A (en) * | 2017-05-25 | 2017-10-20 | 西安理工大学 | A kind of safe Android App feature card methods |
| CN107451474A (en) * | 2016-05-31 | 2017-12-08 | 百度在线网络技术（北京）有限公司 | Software vulnerability restorative procedure and device for terminal |
| CN107622200A (en) * | 2016-07-14 | 2018-01-23 | 腾讯科技（深圳）有限公司 | The safety detecting method and device of application program |
| US20180165458A1 (en) * | 2016-12-12 | 2018-06-14 | Baidu Online Network Technology (Beijing) Co., Ltd. | Method and apparatus for repairing kernel vulnerability |
| CN108491216A (en) * | 2018-03-05 | 2018-09-04 | 北京指掌易科技有限公司 | A kind of method of android system unaware application installation upgrading |
| CN108536464A (en) * | 2018-04-26 | 2018-09-14 | 北京奇艺世纪科技有限公司 | A kind of hot restorative procedure and device of application program |
-
2018
- 2018-10-18 CN CN201811212976.XA patent/CN111078262B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140053145A1 (en) * | 2012-08-17 | 2014-02-20 | Tripwire, Inc. | Operating system patching and software update reconciliation |
| CN107451474A (en) * | 2016-05-31 | 2017-12-08 | 百度在线网络技术（北京）有限公司 | Software vulnerability restorative procedure and device for terminal |
| CN106095502A (en) * | 2016-06-13 | 2016-11-09 | 北京奇虎科技有限公司 | Hot restorative procedure, device, server and the system of a kind of Android application |
| CN107622200A (en) * | 2016-07-14 | 2018-01-23 | 腾讯科技（深圳）有限公司 | The safety detecting method and device of application program |
| CN106648724A (en) * | 2016-09-05 | 2017-05-10 | Tcl集团股份有限公司 | Application hotfix method and terminal |
| US20180165458A1 (en) * | 2016-12-12 | 2018-06-14 | Baidu Online Network Technology (Beijing) Co., Ltd. | Method and apparatus for repairing kernel vulnerability |
| CN106845245A (en) * | 2016-12-21 | 2017-06-13 | 中国科学院信息工程研究所 | A kind of hot restorative procedure of leak based on Xen virtual platforms |
| CN107273151A (en) * | 2017-05-25 | 2017-10-20 | 西安理工大学 | A kind of safe Android App feature card methods |
| CN108491216A (en) * | 2018-03-05 | 2018-09-04 | 北京指掌易科技有限公司 | A kind of method of android system unaware application installation upgrading |
| CN108536464A (en) * | 2018-04-26 | 2018-09-14 | 北京奇艺世纪科技有限公司 | A kind of hot restorative procedure and device of application program |
Non-Patent Citations (3)
| Title |
|---|
| JUNJIE ZHONG等: "Research on intelligent dynamic loading mechanism of mobile applications", 《2016 16TH INTERNATIONAL SYMPOSIUM ON COMMUNICATIONS AND INFORMATION TECHNOLOGIES(ISCIT)》 * |
| 张佳: "基于Android平台的智能出行APP的设计与实现", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
| 熊建芬: "Android APP功能插件化机制的研究与实现", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111752735A (en) * | 2020-05-22 | 2020-10-09 | 网宿科技股份有限公司 | SDK (software development kit) abnormity troubleshooting method and device and computer readable storage medium |
| WO2021259109A1 (en) * | 2020-06-24 | 2021-12-30 | 中兴通讯股份有限公司 | Patch loading method, network element, and computer-readable storage medium |
| CN112068903A (en) * | 2020-09-21 | 2020-12-11 | 深圳市欢太科技有限公司 | Application loading method, application loading device, medium and equipment |
| CN112068903B (en) * | 2020-09-21 | 2024-05-03 | 深圳市欢太科技有限公司 | Application program loading method, application program loading device, medium and equipment |
| CN112650521A (en) * | 2020-12-28 | 2021-04-13 | 北京字节跳动网络技术有限公司 | Software development kit SDK (software development kit) hot repair method and device and electronic equipment |
| CN112650521B (en) * | 2020-12-28 | 2023-11-10 | 抖音视界有限公司 | Software development kit SDK thermal restoration method and device and electronic equipment |
| CN112667521A (en) * | 2021-01-19 | 2021-04-16 | 北京字节跳动网络技术有限公司 | Thermal restoration method and device |
| CN112905220A (en) * | 2021-03-16 | 2021-06-04 | 北京字节跳动网络技术有限公司 | Thermal restoration method, device, equipment and storage medium |
| CN112905220B (en) * | 2021-03-16 | 2023-12-05 | 北京字节跳动网络技术有限公司 | Thermal restoration method, device, equipment and storage medium |
| CN116257853A (en) * | 2023-05-15 | 2023-06-13 | 北京赛博昆仑科技有限公司 | Method and device for defending system vulnerabilities by using runtime memory patches |
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