CN111073530A - Conductive adhesive film for electroplating FPC and production process thereof - Google Patents
Conductive adhesive film for electroplating FPC and production process thereof Download PDFInfo
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/0806—Silver
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/0862—Nickel
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
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Abstract
The invention discloses a conductive adhesive film for electroplating of an FPC (flexible printed circuit), which is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 40-60 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2-4 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 1-3 parts of methacryloxypropyl triethoxysilane, 5-10 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 10-15 parts of superconducting carbon black, 5-10 parts of conductive micro powder and 0.8-1.3 parts of photoinitiator. The invention also discloses a production process of the conductive adhesive film for electroplating the FPC. The conductive adhesive film for FPC electroplating disclosed by the invention has the advantages of good conductivity, aging resistance, high peeling strength, good impact resistance, good damp-heat resistance, excellent electromagnetic wave shielding performance, high bending resistance and difficulty in moisture absorption.
Description
Technical Field
The invention relates to the technical field of conductive adhesive films, in particular to a conductive adhesive film for electroplating an FPC (flexible printed circuit) and a production process thereof.
Background
In recent years, with the progress of technology and the rapid development of electronic technology, the design of circuit boards tends to be more and more precise and more dense. As one of the circuit boards with more added functional values, a Flexible Printed Circuit (FPC) has high reliability, excellent flexibility, high wiring density, light weight, thin thickness, and good bending property, and thus has been widely used in the field of electronic products and has occupied an important position in electronic products.
In the process of manufacturing a Flexible Printed Circuit (FPC), an indispensable link is electroplating, which plays a leading role in the assembly of electronic components, however, the conventional electroplating process has the defects of poor environmental protection, complex process and the like, and as the electronic assembly is increasingly miniaturized and densified, a conductive adhesive film is often used in the electroplating process. The conductive adhesive film is used for realizing the functions of conductivity and gluing and fixing at the same time. The performance of the conductive adhesive film directly affects the electroplating effect, the service life of the FPC and the stability of normal use, so that the development of the conductive adhesive film with excellent comprehensive performance for electroplating the FPC is very important.
The conductive adhesive film in the prior art is mainly formed by taking matrix resin and conductive filler, namely conductive particles, as main components and adding a dispersing additive and other auxiliary agents. The conductive adhesive films combine the conductive particles together through the bonding action of the matrix resin to form a conductive path, so that the conductive connection of the bonded materials is realized. However, the conventional conductive adhesive on the market at present has some problems, such as high viscosity of the epoxy resin conductive adhesive, low heat resistance, poor chemical resistance and toughness, and expensive filler, and particularly, the conventional single metal powder or graphite conductive filler is difficult to uniformly coat, so that the coating operation is hindered, the product manufacturing efficiency is low, the product manufacturing efficiency cannot be further improved, and the production cost is high. Generally speaking, the existing conductive adhesive film generally has the technical problems of low bonding strength, poor heat resistance and the like after hot-pressing and curing.
The patent No. 201510129222.8 discloses a sheet/branch silver-plated copper powder and an economical conductive adhesive which can replace the traditional green halogen-free low silver content conductive adhesive with high silver content, and the patent uses a large amount of active diluent in order to reduce the reaction activity, thereby causing the heat-resistant temperature of the obtained conductive adhesive to be only 230 ℃, and being not suitable for lead-free welding with the temperature higher than 260 ℃.
Therefore, the conductive adhesive film for FPC electroplating, which has the advantages of good conductivity, aging resistance, high peel strength, good impact resistance, good humidity and heat resistance and excellent electromagnetic wave shielding performance, is developed to meet the market demand, has wide market value and application prospect, and has very important significance for promoting the development of the FPC field.
Disclosure of Invention
The invention mainly aims to provide a conductive adhesive film for FPC electroplating, which has the advantages of good conductive performance, aging resistance, high peeling strength, good impact resistance, good damp-heat resistance, excellent electromagnetic wave shielding performance, high bending resistance, difficult moisture absorption and flexibility; meanwhile, the invention also discloses a production process of the conductive adhesive film for electroplating the FPC, which has the advantages of short process flow, convenient operation, low price of production equipment, high production efficiency and high qualification rate of finished products and is suitable for continuous large-scale production.
In order to achieve the above purpose, the invention provides a conductive adhesive film for electroplating an FPC, which is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 40-60 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2-4 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 1-3 parts of methacryloxypropyl triethoxysilane, 5-10 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 10-15 parts of superconducting carbon black, 5-10 parts of conductive micro powder and 0.8-1.3 parts of photoinitiator.
Further, the photoinitiator is at least one of benzoin, benzoin ethyl ether, benzoin isopropyl ether and 2, 4-dihydroxy benzophenone.
Further, the conductive micro powder is at least one of silver powder, copper powder, nickel powder, carbon nano tubes, fullerene and graphene.
Further, the preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyltris (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, a catalyst and a polymerization inhibitor into an organic solvent, stirring and refluxing for reaction for 4-6 hours at 80-90 ℃ in the atmosphere of nitrogen or inert gas, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 3-6 times by using 1-3% by mass of sodium hydroxide aqueous solution, and removing the rest water by rotary evaporation to obtain the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde.
Preferably, the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the catalyst, the polymerization inhibitor and the organic solvent is 3:1 (0.8-1.2) to 0.2 (15-20).
Preferably, the catalyst is at least one of glacial acetic acid and p-toluenesulfonic acid; the polymerization inhibitor is at least one of chloranil and 1, 4-naphthoquinone; the organic solvent is one of ethanol, toluene and tetrahydrofuran; the inert gas is one of helium, neon and argon.
Further, the preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding the amino vinyl diethyl malonate and the epoxy cyclodextrin into ethyl acetate, stirring and reacting for 6-8 hours at the temperature of 30-50 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the amino vinyl diethyl malonate modified epoxy cyclodextrin.
Preferably, the mass ratio of the diethyl aminovinylmalonate, the epoxy cyclodextrin and the ethyl acetate is 1 (5-8) to (25-40).
Preferably, the epoxy cyclodextrin is prepared in advance, and the preparation method refers to: yellow morning, Zhao Shui Jing, synthesis of epoxy cyclodextrin and silk grafting [ J ], printing and dyeing, 2010(05) 9-13.
Further, the preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 8-12 hours at 30-40 ℃, then performing rotary evaporation to remove the solvent, washing the product with dichloromethane for 3-5 times, and performing rotary evaporation to remove the dichloromethane to obtain the 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate.
Preferably, the mole ratio of the hydroxyl-terminated polyurethane to the 2, 3-difluoro fumaric acid to the 4-dimethylamino pyridine to the N, N' -dicyclohexyl carbodiimide to the tetrahydrofuran is 1:1 (0.4-0.6) to 0.3 (7-11).
Preferably, the hydroxyl-terminated polyurethane is prepared in advance by the following preparation method: chinese patent application No. 201811513288.7, example 1.
Further, the base film is formed by coating a release agent with the thickness of 0.1-1.0 μm on the surface of a polyester base film and then curing at the temperature of 80-150 ℃.
Further, the thickness of the base film is 15 to 35 μm; the thickness of the conductive adhesive layer is 20-40 μm.
Another objective of the present invention is to provide a process for producing the conductive adhesive film for FPC plating, which comprises the following steps: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, conductive micro powder and a photoinitiator to form a mixture, adding the mixture into butanone which is 0.8-1.2 times of the mass of the mixture, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 25-30 minutes under the ultraviolet light with the wavelength of 200-250nm, and then baking for 2-5 minutes at the temperature of 110-120 ℃ to obtain the conductive adhesive film for FPC electroplating.
Due to the application of the technical scheme, the invention has the following beneficial effects:
(1) the production process of the conductive adhesive film for electroplating the FPC, disclosed by the invention, has the advantages of short flow, convenience in operation, low price of production equipment, high production efficiency and high qualification rate of finished products, is suitable for continuous large-scale production, and has higher economic value, social value and popularization and application values.
(2) The conductive adhesive film for FPC electroplating disclosed by the invention overcomes the technical problems of low bonding strength, poor heat resistance and the like commonly existing in the traditional conductive adhesive film, and has the advantages of good conductivity, aging resistance, high peeling strength, good impact resistance, good moisture and heat resistance, excellent electromagnetic wave shielding performance, high bending resistance, difficulty in moisture absorption, flexibility and high bonding strength.
(3) The invention discloses a conductive adhesive film for FPC electroplating, which is characterized in that conductive particles consist of amino ferrocene modified 4,4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black and conductive micro powder, wherein an alkynyl phenyl-containing ferrocene Schiff base structure is introduced into the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, and due to the existence of a conjugated structure of the alkynyl phenyl-containing ferrocene Schiff base structure, the conductive adhesive film plays a vital role in enhancing conductivity, and has a synergistic effect with the superconducting carbon black and the conductive micro powder, so that the conductive adhesive film has good conductivity.
(4) The invention discloses a conductive adhesive film for FPC electroplating, which takes 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate as a resin material, combines the excellent physical and chemical properties of the polyurethane material, introduces an ester-based structure containing vinyl and fluorine through polycondensation, and the vinyl provides an active site for subsequent curing and forming; fluorine can enhance the heat resistance and comprehensive performance of the conductive adhesive film; the introduction of ester groups can enable the adhesive film to have better adhesive property; adding amino vinyl diethyl malonate modified epoxy cyclodextrin, wherein firstly, the hydroxyl on the amino vinyl diethyl malonate can improve the bonding property; the vinyl can provide a reaction site for curing, and the cyclodextrin structure can perform host-guest interaction with ferrocene, so that all related components are connected together, and the comprehensive performance of the membrane is improved; the methacryloxypropyl triethoxysilane enters a film molecular chain during curing, and the ethoxysilicon structure can enhance the compatibility and the dispersibility of the superconducting carbon black, the conductive micro powder and the resin and further improve the comprehensive performance.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
In the embodiment of the invention, the raw materials are all purchased commercially; the epoxy cyclodextrin is prepared in advance, and the preparation method refers to the following steps: yellow morning, Zhao Shuhui, synthesis of epoxy cyclodextrin and silk grafting [ J ], printing and dyeing, 2010(05) 9-13; the hydroxyl-terminated polyurethane is prepared in advance, and the preparation method refers to the following steps: chinese patent application No. 201811513288.7, example 1.
Example 1
The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 40 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 1 part of methacryloxypropyl triethoxysilane, 5 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 10 parts of superconducting carbon black, 5 parts of silver powder and 0.8 part of benzoin.
The preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, glacial acetic acid and tetrachlorobenzoquinone into ethanol, stirring and refluxing at 80 ℃ for 4 hours under the nitrogen atmosphere, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 3 times by using 1% by mass of sodium hydroxide aqueous solution, and removing the residual water by rotary evaporation to obtain amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde; the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the glacial acetic acid, the chloranil and the ethanol is 3:1:0.8:0.2: 15.
The preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding 10g of diethyl aminomethylmalonate and 50g of epoxy cyclodextrin into 250g of ethyl acetate, stirring and reacting for 6 hours at 30 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the diethyl aminomethylmalonate modified epoxy cyclodextrin.
The preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 8 hours at 30 ℃, then performing rotary evaporation to remove the solvent, washing the product for 3 times by using dichloromethane, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, 2, 3-difluoro fumaric acid, 4-dimethylamino pyridine, N' -dicyclohexyl carbodiimide and tetrahydrofuran is 1:1:0.4:0.3: 7.
The base film is formed by coating a 0.1 mu m parting agent on the surface of a polyester base film and then curing at 80 ℃.
The thickness of the base film is 15 μm; the thickness of the conductive adhesive layer is 20 μm.
The production process of the conductive adhesive film for electroplating the FPC is characterized by comprising the following steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, silver powder and benzoin to form a mixture, adding the mixture into butanone which is 0.8 times of the mass of the mixture, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 25 minutes under ultraviolet light with the wavelength of 200nm, and then baking for 2 minutes at 110 ℃ to obtain the conductive adhesive film for FPC electroplating.
Example 2
The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 45 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2-4 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 1.5 parts of methacryloxypropyl triethoxysilane, 6 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 11 parts of superconducting carbon black, 6 parts of copper powder and 0.9 part of benzoin ethyl ether.
The preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, p-toluenesulfonic acid and 1, 4-naphthoquinone into toluene, stirring and refluxing at 82 ℃ for 4.5 hours in a helium atmosphere, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 4 times by using 1.5 mass percent of sodium hydroxide aqueous solution, and removing the rest water by rotary evaporation to obtain amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde; the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the p-toluenesulfonic acid, the 1, 4-naphthoquinone and the toluene is 3:1:0.9:0.2: 16.
The preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding 10g of diethyl aminomethylmalonate and 60g of epoxy cyclodextrin into 300g of ethyl acetate, stirring and reacting for 6.5 hours at 35 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the diethyl aminomethylmalonate modified epoxy cyclodextrin.
The preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 9 hours at 33 ℃, then performing rotary evaporation to remove the solvent, washing the product for 4 times by using dichloromethane, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, 2, 3-difluoro fumaric acid, 4-dimethylamino pyridine, N' -dicyclohexyl carbodiimide and tetrahydrofuran is 1:1:0.45:0.3: 8.
The base film is formed by coating a 0.3 mu m parting agent on the surface of a polyester base film and then curing at 95 ℃.
The thickness of the base film is 20 μm; the thickness of the conductive adhesive layer is 25 μm.
The production process of the conductive adhesive film for electroplating the FPC is characterized by comprising the following steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, copper powder and benzoin ethyl ether to form a mixture, adding the mixture into butanone which is 0.9 times of the mass of the mixture, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 27 minutes under ultraviolet light with the wavelength of 220nm, and then baking for 3 minutes at 113 ℃ to obtain the conductive adhesive film for FPC electroplating.
Example 3
The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 50 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 3 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 2 parts of methacryloxypropyl triethoxysilane, 7.5 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 13 parts of superconducting carbon black, 7 parts of nickel powder and 1 part of benzoin isopropyl ether.
The preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, glacial acetic acid and tetrachlorobenzoquinone into tetrahydrofuran, stirring and refluxing at 85 ℃ in a neon atmosphere for 5 hours, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 4 times by using 2% sodium hydroxide aqueous solution, and then removing the residual water by rotary evaporation to obtain amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde; the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the glacial acetic acid, the tetrachlorobenzoquinone and the tetrahydrofuran is 3:1:1:0.2: 17.
The preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding 10g of diethyl aminomethylmalonate and 65g of epoxy cyclodextrin into 330g of ethyl acetate, stirring and reacting for 7 hours at 40 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the diethyl aminomethylmalonate modified epoxy cyclodextrin.
The preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 10 hours at 35 ℃, then performing rotary evaporation to remove the solvent, washing the product for 4 times by using dichloromethane, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, 2, 3-difluoro fumaric acid, 4-dimethylamino pyridine, N' -dicyclohexyl carbodiimide and tetrahydrofuran is 1:1:0.5:0.3: 9.
The base film is formed by coating a 0.6 mu m parting agent on the surface of a polyester base film and then curing at 120 ℃.
The thickness of the base film is 27 μm; the thickness of the conductive adhesive layer is 30 μm.
The production process of the conductive adhesive film for electroplating the FPC is characterized by comprising the following steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, nickel powder and benzoin isopropyl ether to form a mixture, adding the mixture into butanone with the mass being 1 time of the mass of the mixture, and stirring uniformly to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 27 minutes under ultraviolet light with the wavelength of 230nm, and then baking for 3.5 minutes at 115 ℃ to obtain the conductive adhesive film for FPC electroplating.
Example 4
The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 57 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 3.5 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 2.5 parts of methacryloxypropyl triethoxysilane, 9 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 14 parts of superconducting carbon black, 9 parts of conductive micro powder and 1.2 parts of photoinitiator; the photoinitiator is prepared by mixing benzoin, benzoin ethyl ether, benzoin isopropyl ether and 2, 4-dihydroxy benzophenone in a mass ratio of 1:1:2: 3; the conductive micro powder is formed by mixing silver powder, copper powder, nickel powder, a carbon nano tube, fullerene and graphene according to a mass ratio of 1:2:3:2:1: 2.
The preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, a catalyst and a polymerization inhibitor into ethanol, stirring and refluxing for 5.7 hours at 88 ℃ in an argon atmosphere, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 5 times by using a sodium hydroxide aqueous solution with the mass fraction of 2.8%, and then removing the residual water by rotary evaporation to obtain amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde; the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the catalyst, the polymerization inhibitor and the ethanol is 3:1:1.1:0.2: 19; the catalyst is formed by mixing glacial acetic acid and p-toluenesulfonic acid according to the mass ratio of 3: 5; the polymerization inhibitor is formed by mixing tetrachlorobenzoquinone and 1, 4-naphthoquinone according to the mass ratio of 1: 3.
The preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding 10g of diethyl aminomethylmalonate and 75g of epoxy cyclodextrin into 380g of ethyl acetate, stirring and reacting at 48 ℃ for 7.8 hours, and then removing the ethyl acetate by rotary evaporation to obtain the epoxy cyclodextrin modified by the diethyl aminomethylmalonate.
The preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 11 hours at 38 ℃, then performing rotary evaporation to remove the solvent, washing the product for 5 times by using dichloromethane, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, 2, 3-difluoro fumaric acid, 4-dimethylamino pyridine, N' -dicyclohexyl carbodiimide and tetrahydrofuran is 1:1:0.55:0.3: 10.
The base film is formed by coating a 0.8 mu m parting agent on the surface of a polyester base film and then curing at 140 ℃.
The thickness of the base film is 33 μm; the thickness of the conductive adhesive layer is 36 μm.
The production process of the conductive adhesive film for electroplating the FPC is characterized by comprising the following steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, conductive micro powder and a photoinitiator to form a mixture, adding the mixture into butanone which is 1.1 times of the mixture in mass, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 29 minutes under ultraviolet light with the wavelength of 240nm, and then baking for 4.5 minutes at 118 ℃ to obtain the conductive adhesive film for FPC electroplating.
Example 5
The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 60 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2-4 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 3 parts of methacryloxypropyl triethoxysilane, 10 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 15 parts of superconducting carbon black, 10 parts of fullerene and 1.3 parts of 2, 4-dihydroxy benzophenone.
The preparation method of the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, glacial acetic acid and 1, 4-naphthoquinone into tetrahydrofuran, stirring and refluxing at 90 ℃ in a nitrogen atmosphere for 6 hours, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 6 times by using 3% sodium hydroxide aqueous solution, and removing the residual water by rotary evaporation to obtain amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde; the molar ratio of the amino ferrocene, the 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, the glacial acetic acid, the 1, 4-naphthoquinone and the tetrahydrofuran is 3:1:1.2:0.2: 20.
The preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding 10g of diethyl aminomethylmalonate and 80g of epoxy cyclodextrin into 400g of ethyl acetate, stirring and reacting for 8 hours at 50 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the epoxy cyclodextrin modified by the diethyl aminomethylmalonate.
The preparation method of the 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the following steps: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 12 hours at 40 ℃, then performing rotary evaporation to remove the solvent, washing the product for 5 times by using dichloromethane, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, 2, 3-difluoro fumaric acid, 4-dimethylamino pyridine, N' -dicyclohexyl carbodiimide and tetrahydrofuran is 1:1:0.6:0.3: 11.
The base film is formed by coating a release agent with the thickness of 1.0 mu m on the surface of a polyester base film and then curing at 150 ℃.
The thickness of the base film is 35 μm; the thickness of the conductive adhesive layer is 40 μm.
The production process of the conductive adhesive film for electroplating the FPC is characterized by comprising the following steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, fullerene and 2, 4-dihydroxy benzophenone to form a mixture, adding the mixture into butanone which is 1.2 times of the mass of the mixture, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive slurry on a base film, irradiating for 30 minutes under ultraviolet light with the wavelength of 250nm, and then baking for 5 minutes at 120 ℃ to obtain the conductive adhesive film for FPC electroplating.
Comparative example 1
The invention provides a conductive adhesive film for FPC electroplating, which has the same formula and preparation method as those of embodiment 1, and is different from the conductive adhesive film without adding amino vinyl diethyl malonate modified epoxy cyclodextrin and superconducting carbon black.
Comparative example 2
The invention provides a conductive adhesive film for FPC electroplating, which has the same formula and preparation method as those of example 1, except that methacryloxypropyltriethoxysilane and silver powder are not added.
Comparative example 3
The invention provides a conductive adhesive film for FPC electroplating, which has the same formula and preparation method as those of embodiment 1, and is different from the conductive adhesive film prepared in the embodiment 1 in that amino ferrocene is not added to modify 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde and silver powder.
In order to further illustrate the beneficial technical effects of the embodiments of the present invention, the physical properties of the conductive adhesive films prepared in the embodiments 1 to 5 and the comparative examples 1 to 3 are tested, the test results are shown in table 1, and the test methods are as follows:
1. peel strength: the peel strength was tested according to the IPC-TM-6502.4.9 standard.
2. Thermal shock resistance: the prepared conductive adhesive film is pressed on a PI film of a single-sided copper-clad plate, cured for 1h at 160 ℃ in an oven, and soaked for 10S three times in a 300 ℃ tin furnace according to IPC-TM-6502.4.13 standard, and the conductive adhesive film is qualified for the non-layered blister.
3. And (3) pressing a resistor: cutting the prepared conductive adhesive film into a sample strip with the width of 8mm, pressing the sample strip on a single-sided board test piece with the covering film surface provided with two circular holes with the diameter of 2mm by a quick press, wherein the holes are insulated from one another, and the center distance of the single-sided board test piece is 3mm, and the pressing conditions are as follows: the temperature is 180 ℃, the pre-pressing is 10Sec, and the pressing is 90 Sec. After pressing, using a Changzhou homologous TH2510 direct current low resistance tester to measure the resistance at two ends of the test piece; the sample bar chart of the test stitching resistance is the same as the Chinese invention patent CN 108300345A.
4. Heat aging resistance: curing the test piece pressed with the conductive adhesive film in the step 3 in an oven at 160 ℃ for 1h, soaking in a tin furnace at 300 ℃ for 10S for three times, measuring the resistance at two ends of the test piece by using a Changzhou Tonghui TH2510 direct-current low-resistance tester, and representing the thermal aging resistance of the conductive adhesive according to the resistance change degree.
5. Storage property at room temperature: storing the prepared conductive adhesive film in a constant temperature and humidity machine for 10 x 24 hours under the following storage conditions: the temperature is 25 ℃ and the humidity is 50%. After the storage time is reached, a quick press is used for pressing the single-panel test piece. The pressing conditions are as follows: and (3) pre-pressing 10Sec at the temperature of 180 ℃, pressing 90Sec, measuring the resistance at two ends of the test piece by using a Changzhou homologous TH2510 direct-current low-resistance tester after pressing, and representing the room-temperature storage property of the conductive adhesive according to the resistance change degree.
As can be seen from table 1, the conductive adhesive film for FPC plating disclosed in the embodiments of the present invention has higher peel strength and conductivity, and more excellent heat resistance, aging resistance and storage stability, which are the result of synergistic effect of the raw materials.
TABLE 1
| Item | Peel strength | Heat resistance | Press-fit resistor | Resistance to thermal aging | Storage property at room temperature |
| Unit of | N/mm | — | mΩ | mΩ | mΩ |
| Example 1 | 0.67 | Qualified | 98 | 115 | 108 |
| Example 2 | 0.70 | Qualified | 96 | 110 | 104 |
| Example 3 | 0.74 | Qualified | 93 | 108 | 102 |
| Example 4 | 0.78 | Qualified | 91 | 105 | 99 |
| Example 5 | 0.83 | Qualified | 88 | 102 | 96 |
| Comparative example 1 | 0.58 | Layering | 113 | 129 | 120 |
| Comparative example 2 | 0.62 | Layering | 115 | 132 | 123 |
| Comparative example 3 | 0.65 | Qualified | 119 | 133 | 125 |
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The conductive adhesive film for electroplating the FPC is characterized by comprising a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 40-60 parts of 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, 2-4 parts of amino vinyl diethyl malonate modified epoxy cyclodextrin, 1-3 parts of methacryloxypropyl triethoxysilane, 5-10 parts of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 10-15 parts of superconducting carbon black, 5-10 parts of conductive micro powder and 0.8-1.3 parts of photoinitiator.
2. The conductive adhesive film for FPC plating according to claim 1, wherein the photoinitiator is at least one of benzoin, benzoin ethyl ether, benzoin isopropyl ether, 2, 4-dihydroxybenzophenone; the conductive micro powder is at least one of silver powder, copper powder, nickel powder, carbon nano tube, fullerene and graphene.
3. The conductive adhesive film for FPC electroplating according to claim 1, wherein the preparation method of amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyltris (acetylene-2, 1-diyl) ] triphenylformaldehyde comprises the following steps: adding amino ferrocene, 4 '- [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, a catalyst and a polymerization inhibitor into an organic solvent, stirring and refluxing for reaction for 4-6 hours at 80-90 ℃ in the atmosphere of nitrogen or inert gas, cooling to room temperature after the reaction is finished, removing the solvent by rotary evaporation, washing for 3-6 times by using 1-3% by mass of sodium hydroxide aqueous solution, and removing the rest water by rotary evaporation to obtain the amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde.
4. The conductive adhesive film for FPC electroplating according to claim 3, wherein the molar ratio of the amino ferrocene, 4' - [ benzene-1, 3, 5-triyl tris (acetylene-2, 1-diyl) ] triphenylformaldehyde, the catalyst, the polymerization inhibitor and the organic solvent is 3:1 (0.8-1.2):0.2 (15-20).
5. The conductive adhesive film for FPC plating according to claim 3, wherein the catalyst is at least one of glacial acetic acid, p-toluenesulfonic acid; the polymerization inhibitor is at least one of chloranil and 1, 4-naphthoquinone; the organic solvent is one of ethanol, toluene and tetrahydrofuran; the inert gas is one of helium, neon and argon.
6. The conductive adhesive film for FPC electroplating according to claim 1, wherein the preparation method of the amino vinyl diethyl malonate modified epoxy cyclodextrin comprises the following steps: adding the amino vinyl diethyl malonate and the epoxy cyclodextrin into ethyl acetate, stirring and reacting for 6-8 hours at the temperature of 30-50 ℃, and then removing the ethyl acetate by rotary evaporation to obtain the amino vinyl diethyl malonate modified epoxy cyclodextrin.
7. The conductive adhesive film for FPC electroplating according to claim 6, wherein the mass ratio of the diethyl aminomethylmalonate, the epoxy cyclodextrin and the ethyl acetate is 1 (5-8) to (25-40).
8. The conductive adhesive film for FPC plating according to claim 1, wherein the preparation method of the 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate comprises the steps of: adding hydroxyl-terminated polyurethane, 2, 3-difluorofumaric acid, 4-dimethylaminopyridine and N, N' -dicyclohexylcarbodiimide into tetrahydrofuran, stirring and reacting for 8-12 hours at 30-40 ℃, then performing rotary evaporation to remove the solvent, washing the product with dichloromethane for 3-5 times, and performing rotary evaporation to remove the dichloromethane to obtain a 2, 3-difluorofumaric acid/hydroxyl-terminated polyurethane polycondensate; the mole ratio of the hydroxyl-terminated polyurethane, the 2, 3-difluoro fumaric acid, the 4-dimethylamino pyridine, the N, N' -dicyclohexyl carbodiimide and the tetrahydrofuran is 1:1 (0.4-0.6) to 0.3 (7-11).
9. The conductive adhesive film for FPC electroplating according to claim 1, wherein the base film is formed by coating a release agent of 0.1-1.0 μm on the surface of a polyester base film and curing at 80-150 ℃; the thickness of the base film is 15-35 μm; the thickness of the conductive adhesive layer is 20-40 μm.
10. The conductive adhesive film for FPC plating according to any one of claims 1 to 9, wherein the production process of the conductive adhesive film for FPC plating comprises the steps of: mixing 2, 3-difluoro fumaric acid/hydroxyl-terminated polyurethane polycondensate, amino vinyl diethyl malonate modified epoxy cyclodextrin, methacryloxy propyl triethoxysilane, amino ferrocene modified 4,4' - [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, superconducting carbon black, conductive micro powder and a photoinitiator to form a mixture, adding the mixture into butanone which is 0.8-1.2 times of the mass of the mixture, and uniformly stirring to obtain conductive adhesive slurry; and then coating the conductive adhesive paste on a base film, irradiating for 25-30 minutes under the ultraviolet light with the wavelength of 200-250nm, and then baking for 2-5 minutes at the temperature of 110-120 ℃ to obtain the conductive adhesive film for FPC electroplating.
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